AT263081B - Halbleitervorrichtung mit mehr als einem Halbleiterschaltelement in einem Körper - Google Patents

Halbleitervorrichtung mit mehr als einem Halbleiterschaltelement in einem Körper

Info

Publication number
AT263081B
AT263081B AT855365A AT855365A AT263081B AT 263081 B AT263081 B AT 263081B AT 855365 A AT855365 A AT 855365A AT 855365 A AT855365 A AT 855365A AT 263081 B AT263081 B AT 263081B
Authority
AT
Austria
Prior art keywords
switching element
semiconductor
semiconductor device
semiconductor switching
switching
Prior art date
Application number
AT855365A
Other languages
English (en)
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Application granted granted Critical
Publication of AT263081B publication Critical patent/AT263081B/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/13—Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
    • H10D62/137—Collector regions of BJTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/69—Etching of wafers, substrates or parts of devices using masks for semiconductor materials
    • H10P50/691—Etching of wafers, substrates or parts of devices using masks for semiconductor materials for Group V materials or Group III-V materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/01—Manufacture or treatment
    • H10W10/011—Manufacture or treatment of isolation regions comprising dielectric materials
    • H10W10/019—Manufacture or treatment of isolation regions comprising dielectric materials using epitaxial passivated integrated circuit [EPIC] processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/10—Isolation regions comprising dielectric materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W15/00—Highly-doped buried regions of integrated devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W15/00—Highly-doped buried regions of integrated devices
    • H10W15/01—Manufacture or treatment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/037—Diffusion-deposition
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/049—Equivalence and options
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/085—Isolated-integrated
AT855365A 1964-09-23 1965-09-20 Halbleitervorrichtung mit mehr als einem Halbleiterschaltelement in einem Körper AT263081B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL646411057A NL144775B (nl) 1964-09-23 1964-09-23 Halfgeleiderinrichting met meer dan een halfgeleiderschakelelement in een lichaam.

Publications (1)

Publication Number Publication Date
AT263081B true AT263081B (de) 1968-07-10

Family

ID=19791081

Family Applications (1)

Application Number Title Priority Date Filing Date
AT855365A AT263081B (de) 1964-09-23 1965-09-20 Halbleitervorrichtung mit mehr als einem Halbleiterschaltelement in einem Körper

Country Status (8)

Country Link
US (1) US3614558A (de)
AT (1) AT263081B (de)
BE (1) BE670038A (de)
CH (1) CH436508A (de)
FR (1) FR1456952A (de)
GB (1) GB1124801A (de)
NL (1) NL144775B (de)
SE (1) SE314441B (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3800195A (en) * 1972-08-09 1974-03-26 Motorola Inc Method of making semiconductor devices through overlapping diffusions
US3865649A (en) * 1972-10-16 1975-02-11 Harris Intertype Corp Fabrication of MOS devices and complementary bipolar transistor devices in a monolithic substrate
US4261003A (en) * 1979-03-09 1981-04-07 International Business Machines Corporation Integrated circuit structures with full dielectric isolation and a novel method for fabrication thereof
US4446476A (en) * 1981-06-30 1984-05-01 International Business Machines Corporation Integrated circuit having a sublayer electrical contact and fabrication thereof
US4649630A (en) * 1985-04-01 1987-03-17 Motorola, Inc. Process for dielectrically isolated semiconductor structure
JPH0638424B2 (ja) * 1986-07-31 1994-05-18 株式会社日立製作所 半導体装置の製造方法
US4794093A (en) * 1987-05-01 1988-12-27 Raytheon Company Selective backside plating of gaas monolithic microwave integrated circuits
US4839309A (en) * 1988-03-30 1989-06-13 American Telephone And Telegraph Company, At&T Technologies, Inc. Fabrication of high-speed dielectrically isolated devices utilizing buried silicide outdiffusion
US5459346A (en) * 1988-06-28 1995-10-17 Ricoh Co., Ltd. Semiconductor substrate with electrical contact in groove
DE102004050740A1 (de) * 2004-10-19 2006-04-20 Atmel Germany Gmbh Halbleitergegenstand und Verfahren zur Herstellung
CN103137547A (zh) * 2011-11-28 2013-06-05 中国科学院上海微系统与信息技术研究所 一种绝缘体上Si/NiSi2衬底材料及其制备方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE603293A (de) * 1960-05-02
GB948238A (en) * 1961-09-25 1964-01-29 Raytheon Co Improvements in or relating to switching circuits
BE632105A (de) * 1962-05-09
US3323071A (en) * 1964-07-09 1967-05-30 Nat Semiconductor Corp Semiconductor circuit arrangement utilizing integrated chopper element as zener-diode-coupled transistor
US3381182A (en) * 1964-10-19 1968-04-30 Philco Ford Corp Microcircuits having buried conductive layers
US3368113A (en) * 1965-06-28 1968-02-06 Westinghouse Electric Corp Integrated circuit structures, and method of making same, including a dielectric medium for internal isolation

Also Published As

Publication number Publication date
NL144775B (nl) 1975-01-15
SE314441B (de) 1969-09-08
NL6411057A (de) 1966-03-24
CH436508A (de) 1967-05-31
FR1456952A (fr) 1966-07-08
GB1124801A (en) 1968-08-21
US3614558A (en) 1971-10-19
BE670038A (de) 1966-03-23

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