AT259626B - Process for the production of pure surface semiconductor bodies - Google Patents
Process for the production of pure surface semiconductor bodiesInfo
- Publication number
- AT259626B AT259626B AT571864A AT571864A AT259626B AT 259626 B AT259626 B AT 259626B AT 571864 A AT571864 A AT 571864A AT 571864 A AT571864 A AT 571864A AT 259626 B AT259626 B AT 259626B
- Authority
- AT
- Austria
- Prior art keywords
- production
- semiconductor bodies
- surface semiconductor
- pure surface
- pure
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE1963S0086211 DE1521956C2 (en) | 1963-07-17 | 1963-07-17 | Process for producing clean surfaces of semiconductor bodies with the aid of a gas mixture containing hydrogen halide |
Publications (1)
Publication Number | Publication Date |
---|---|
AT259626B true AT259626B (en) | 1968-01-25 |
Family
ID=7512852
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT571864A AT259626B (en) | 1963-07-17 | 1964-07-03 | Process for the production of pure surface semiconductor bodies |
Country Status (2)
Country | Link |
---|---|
AT (1) | AT259626B (en) |
DE (1) | DE1521956C2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005032737A1 (en) * | 2005-07-08 | 2007-01-11 | Infineon Technologies Ag | Dry-etching silicon-containing substrates, especially wafers for semiconductor elements, contains silicon component, e.g. silane, to form side-wall passivation layer |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE966879C (en) * | 1953-02-21 | 1957-09-12 | Standard Elektrik Ag | Process for cleaning and / or removal of semiconductor material, in particular germanium and silicon substances |
-
1963
- 1963-07-17 DE DE1963S0086211 patent/DE1521956C2/en not_active Expired
-
1964
- 1964-07-03 AT AT571864A patent/AT259626B/en active
Also Published As
Publication number | Publication date |
---|---|
DE1521956B1 (en) | 1970-01-15 |
DE1521956C2 (en) | 1970-09-17 |
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