AR246386A1 - Aparato de soldadura de onda selectiva. - Google Patents

Aparato de soldadura de onda selectiva.

Info

Publication number
AR246386A1
AR246386A1 AR92323941A AR32394192A AR246386A1 AR 246386 A1 AR246386 A1 AR 246386A1 AR 92323941 A AR92323941 A AR 92323941A AR 32394192 A AR32394192 A AR 32394192A AR 246386 A1 AR246386 A1 AR 246386A1
Authority
AR
Argentina
Prior art keywords
upper opening
welding
depression
extended
coupled
Prior art date
Application number
AR92323941A
Other languages
English (en)
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Application granted granted Critical
Publication of AR246386A1 publication Critical patent/AR246386A1/es

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06Solder feeding devices; Solder melting pans
    • B23K3/0646Solder baths
    • B23K3/0653Solder baths with wave generating means, e.g. nozzles, jets, fountains

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)

Abstract

UN APARATO DE SOLDADURA DE ONDA SELECTIVA PARA CREAR UNA ONDA ESTRECHA DE SOLDADURA FUNDIDA, PARA APLICAR A COMPONENTES DE UN CIRCUITO IMPRESO, INCLUYENDO EL APARATO: UNA CAMARA IMPELENTE, QUE TIENE UNA ABERTURA INFERIOR Y UNA SUPERIOR, PARA CONDUCIR LA SOLDADURA FUNDIDA DESDE LA ABERTURA INFERIOR HASTA LA SUPERIOR, QUE TIENE 3 LADOS EXTENDIDOS EN UN LADO INFERIOR. UN ELEMENTO PARA BOMBEAR LA SOLDADURA FUNDIDA DESDE LA ABERTURA INFERIOR A TRAVES DE LA SUPERIOR; UN LABIO EXTENDIDO, ACOPLADO CON UN PRIMER LADO EXTENDIDO DE LA ABERTURA SUPERIOR OPUESTO AL LADO INFERIOR Y ANGULADO HACIA ABAJO DESDE LA ABERTURA SUPERIOR, PARA CREAR UN PRIMER BORDE EN LA SOLDADURA FUNDIDA; UNA DEPRESION QUE TIENE UN FONDO ACOPLADO CON EL LADO INFERIOR DE LA ABERTURA SUPERIOR, UN PRIMER LADO ACOPLADO CON UN SEGUNDO LADO EXTENDIDO DE LA ABERTURA SUPERIOR; Y UN SEGUNDO LADO ACOPLADO CON UN TERCER LADO EXTENDIDO DE LA ABERTURA SUPERIOR, TENIENDO LA DEPRESION UN TERCER LADO ACOPLADO CON EL FONDO DE LA DEPRES ION, Y EN ANGULOS RECTOS A LOS PRIMERO Y SEGUNDO LADOS DE LA DEPRESION, SEPARANDO UN HUECO AL TERCER LADO DE LOS PRIMERO Y SEGUNDO LADOS, CREANDO LA DEPRESION UN SEGUNDO BORDE EN LA SOLDADURA FUNDIDA, FORMANDO LOS PRIMERO Y SEGUNDO BORDES JUNTOS LA ONDA ESTRECHA DE SOLDADURA FUNDIDA.
AR92323941A 1991-12-23 1992-12-18 Aparato de soldadura de onda selectiva. AR246386A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/812,338 US5148961A (en) 1991-12-23 1991-12-23 Selective wave solder apparatus

Publications (1)

Publication Number Publication Date
AR246386A1 true AR246386A1 (es) 1994-07-29

Family

ID=25209277

Family Applications (1)

Application Number Title Priority Date Filing Date
AR92323941A AR246386A1 (es) 1991-12-23 1992-12-18 Aparato de soldadura de onda selectiva.

Country Status (2)

Country Link
US (1) US5148961A (es)
AR (1) AR246386A1 (es)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5238175A (en) * 1992-07-29 1993-08-24 At&T Bell Laboratories Method and apparatus for selective soldering
US5439158A (en) * 1994-02-22 1995-08-08 Sund; William Atmosphere controlled soldering apparatus with incorporated solder pump
US5560537A (en) 1995-04-11 1996-10-01 Vlt Corporation Automatic soldering
US5617990A (en) * 1995-07-03 1997-04-08 Micron Electronics, Inc. Shield and method for selective wave soldering
DE19623421C2 (de) * 1996-06-12 1999-10-28 Hofsaes Geb Zeitz Vorrichtung, Lötschablone und Verfahren zum Löten von Temperaturwächtern
US6085960A (en) * 1997-03-04 2000-07-11 Samsung Electronics Co., Ltd. Apparatus for measuring the height of a solder wave
US6142357A (en) * 1998-10-15 2000-11-07 Mcms, Inc. Molded selective solder pallet
US6367677B1 (en) 1999-09-28 2002-04-09 Hill-Rom Services, Inc. Wave solder apparatus and method
US6581818B1 (en) * 2001-12-27 2003-06-24 Yu-Chen Tu Trough device in a soldering furnace
US6913183B2 (en) * 2002-09-30 2005-07-05 Speedline Technologies, Inc. Selective gas knife for wave soldering
US20080223429A1 (en) * 2004-08-09 2008-09-18 The Australian National University Solar Cell (Sliver) Sub-Module Formation
JP2008544502A (ja) * 2005-06-17 2008-12-04 ジ・オーストラリアン・ナショナル・ユニバーシティー 太陽電池の相互接続プロセス

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2428143A1 (de) * 1974-06-11 1976-01-02 Zevatron Gmbh Schlepploetmaschine
JPS59153570A (ja) * 1983-02-22 1984-09-01 Kenji Kondo はんだ槽
US4684056A (en) * 1985-05-03 1987-08-04 Electrovert Limited Vibratory wave soldering
US4682723A (en) * 1986-06-16 1987-07-28 Ncr Corporation Mask for wave soldering machine
NL8701237A (nl) * 1987-05-22 1988-12-16 Soltec Bv Inrichting voor het aanbrengen van geleidend hechtmiddel, zoals soldeer, op een kaart met bedrukte bedrading.
JPH0787266B2 (ja) * 1988-05-18 1995-09-20 松下電器産業株式会社 半田付け装置
JPH0666544B2 (ja) * 1988-06-11 1994-08-24 太陽誘電株式会社 回路基板の製造方法

Also Published As

Publication number Publication date
US5148961A (en) 1992-09-22

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