AR034549A1 - Modulo de extremo delantero para un aparato de comunicaciones movil - Google Patents

Modulo de extremo delantero para un aparato de comunicaciones movil

Info

Publication number
AR034549A1
AR034549A1 ARP010101572A ARP010101572A AR034549A1 AR 034549 A1 AR034549 A1 AR 034549A1 AR P010101572 A ARP010101572 A AR P010101572A AR P010101572 A ARP010101572 A AR P010101572A AR 034549 A1 AR034549 A1 AR 034549A1
Authority
AR
Argentina
Prior art keywords
input stage
circuit
band
communications device
mobile communications
Prior art date
Application number
ARP010101572A
Other languages
English (en)
Original Assignee
Tdk Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2000250393A external-priority patent/JP3750792B2/ja
Application filed by Tdk Corp filed Critical Tdk Corp
Publication of AR034549A1 publication Critical patent/AR034549A1/es

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/40—Circuits
    • H04B1/44—Transmit/receive switching
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/40—Circuits
    • H04B1/50—Circuits using different frequencies for the two directions of communication
    • H04B1/52—Hybrid arrangements, i.e. arrangements for transition from single-path two-direction transmission to single-direction transmission on each of two paths or vice versa
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/46—Networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Transceivers (AREA)
  • Filters And Equalizers (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

El módulo de etapa de entrada está compuesto por un sustrato de múltiples capas y por componentes montados en la superficie. El módulo de etapa de entrada constituye conmutadores de antena, filtros, y un circuito de alta frecuencia que comprende un circuito divisor de banda así como el etapa de entrada del circuito transceptor equipado con una pluralidad de características de transmisión/recepción, cuyos sistemas de comunicaciones son diferentes. El substrato de múltiples capas dispone un patrón de circuito divisor de banda en el centro en la dirección del plano y dispone simétricamente una pluralidad de patrones de conductores de conmutador de antena, cuyos sistemas de comunicaciones son diferentes, con respecto al patrón para el circuito divisor de banda.
ARP010101572A 2000-08-21 2001-04-03 Modulo de extremo delantero para un aparato de comunicaciones movil AR034549A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000250393A JP3750792B2 (ja) 1999-10-04 2000-08-21 移動体通信機器用フロントエンドモジュール

Publications (1)

Publication Number Publication Date
AR034549A1 true AR034549A1 (es) 2004-03-03

Family

ID=18739969

Family Applications (1)

Application Number Title Priority Date Filing Date
ARP010101572A AR034549A1 (es) 2000-08-21 2001-04-03 Modulo de extremo delantero para un aparato de comunicaciones movil

Country Status (6)

Country Link
US (1) US6600385B2 (es)
EP (1) EP1182790A3 (es)
KR (1) KR100611421B1 (es)
CN (1) CN1180560C (es)
AR (1) AR034549A1 (es)
BR (1) BR0101369A (es)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6865376B2 (en) * 2001-07-03 2005-03-08 Kyocera Wireless Corp. System and method for a GPS enabled antenna
US7383058B2 (en) * 2002-07-16 2008-06-03 Intel Corporation RF/microwave system with a system on a chip package or the like
US6816032B1 (en) * 2002-09-03 2004-11-09 Amkor Technology, Inc. Laminated low-profile dual filter module for telecommunications devices and method therefor
US7376440B2 (en) * 2003-04-16 2008-05-20 Kyocera Wireless Corp. N-plexer systems and methods for use in a wireless communications device
US7167688B2 (en) * 2003-07-30 2007-01-23 Chi Mei Communication Systems, Inc. RF transceiver module formed in multi-layered ceramic
JP4182160B2 (ja) * 2005-04-28 2008-11-19 株式会社村田製作所 高周波スイッチングモジュール及び高周波回路の周波数特性調整方法
KR100747978B1 (ko) * 2005-06-17 2007-08-08 엘지이노텍 주식회사 프론트 앤드 모듈 및 그 제조방법
CN100356629C (zh) * 2005-07-01 2007-12-19 清华大学 移动终端多天线系统
JP4441886B2 (ja) * 2006-03-31 2010-03-31 Ｔｄｋ株式会社 高周波モジュール
US9705558B2 (en) * 2011-02-08 2017-07-11 Qorvo Us, Inc. Harmonic rejected antenna switch

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0585469B1 (en) * 1992-03-19 1998-11-04 TDK Corporation Hybrid coupler
JPH05335183A (ja) * 1992-05-28 1993-12-17 Murata Mfg Co Ltd 多層基板を備えた電子部品及びその製造方法
JPH06232005A (ja) * 1993-02-01 1994-08-19 Tdk Corp Ｌｃ複合部品
JP3031178B2 (ja) 1994-09-28 2000-04-10 株式会社村田製作所 複合高周波部品
JPH09261110A (ja) 1996-03-21 1997-10-03 Tdk Corp アンテナスイッチ
US5999065A (en) 1995-08-24 1999-12-07 Murata Manufacturing Co., Ltd. Composite high-frequency component
JPH11112264A (ja) * 1997-10-08 1999-04-23 Murata Mfg Co Ltd フィルタ
JPH11168303A (ja) * 1997-12-05 1999-06-22 Hitachi Metals Ltd 高周波スイッチモジュール
JP2983016B2 (ja) 1997-12-03 1999-11-29 日立金属株式会社 マルチバンド用高周波スイッチモジュール
JP3322199B2 (ja) * 1998-01-06 2002-09-09 株式会社村田製作所 多層セラミック基板およびその製造方法
JP3304901B2 (ja) 1998-11-27 2002-07-22 株式会社村田製作所 複合高周波部品及びそれを用いた移動体通信装置
JP3304931B2 (ja) 1998-10-27 2002-07-22 株式会社村田製作所 複合高周波部品及びそれを用いた移動体通信装置
DE69930453T2 (de) 1998-10-27 2006-09-28 Murata Manufacturing Co., Ltd., Nagaokakyo Zusammengestellte Hochfrequenzkomponente und damit ausgerüstetes mobiles Kommunikationsgerät
JP3304900B2 (ja) 1998-11-25 2002-07-22 株式会社村田製作所 複合高周波部品及びそれを用いた移動体通信装置
JP3304898B2 (ja) 1998-11-20 2002-07-22 株式会社村田製作所 複合高周波部品及びそれを用いた移動体通信装置
JP3304902B2 (ja) 1998-12-14 2002-07-22 株式会社村田製作所 複合高周波部品及びそれを用いた移動体通信装置

Also Published As

Publication number Publication date
KR100611421B1 (ko) 2006-08-09
KR20020015260A (ko) 2002-02-27
EP1182790A2 (en) 2002-02-27
CN1180560C (zh) 2004-12-15
CN1339886A (zh) 2002-03-13
US20020021182A1 (en) 2002-02-21
BR0101369A (pt) 2004-05-25
US6600385B2 (en) 2003-07-29
EP1182790A3 (en) 2006-03-08

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