WO2019065533A1

WO2019065533A1 - Cutting device for glass substrate, cutting method, program, and storage medium

Info

Publication number: WO2019065533A1
Application number: PCT/JP2018/035188
Authority: WO
Inventors: 淳史井村
Original assignee: 三星ダイヤモンド工業株式会社
Priority date: 2017-09-27
Filing date: 2018-09-21
Publication date: 2019-04-04
Also published as: TW201920021A; CN111108072A; CN111108072B; JPWO2019065533A1; KR20200058380A

Abstract

Provided is a device that cuts a glass substrate by projecting light, and projects the light efficiently onto a location on the glass substrate where a cut line is to be formed. A cutting device 100 for a glass substrate G is provided with a light projecting device 1 and a light scanning device 3. The light projecting device 1 outputs cutting light L that cuts the glass substrate G. The light scanning device 3 moves a spot S of the cutting light L back and forth along the cutting direction of the glass substrate G. The light scanning device 3 limits the range in which the spot S of the cutting light L moves back and forth to a non-cut region, which is a region of the glass substrate G where no cut line C crack has been formed yet.

Description

Glass substrate cutting apparatus, cutting method, program, and storage medium

The present invention relates to a glass substrate cutting apparatus, a cutting method, a program that causes a computer to execute the cutting method, and a storage medium that stores the program.

Conventionally, a cutting device is known which generates a cutting line by scanning a laser beam along the cutting direction of the glass substrate, and cuts the glass substrate along the cutting line (for example, Patent Document 1). This device can cut a large glass substrate relatively quickly.

Unexamined-Japanese-Patent No. 4-224091

In the above-described apparatus, when cutting the glass substrate, only the laser beam is reciprocated on the glass substrate, and no other control is performed on the laser beam irradiated to the glass substrate. For example, in the above-described apparatus, the scanning range of the laser light on the glass substrate is considered to be unchanged regardless of whether or not the cutting line is formed on the glass substrate. As a result, the laser beam was continued to be radiated wastefully to the portion where the cutting line was formed by the irradiation of the sufficient laser beam.

An object of the present invention is to efficiently irradiate the light to a portion where the cutting line of the glass substrate is desired to be formed, in an apparatus for cutting the glass substrate by irradiating the light.

Below, a plurality of modes are explained as a means to solve a subject. These aspects can be arbitrarily combined as needed.
An apparatus for cutting a glass substrate according to an aspect of the present invention includes a light generating device and an optical scanning device. The light generator outputs cutting light for cutting the glass substrate. The light scanning device is a device that reciprocates the spot of the cutting light along the cutting direction of the glass substrate. The optical scanning device limits the range of reciprocating movement of the spot of the cutting light to the uncut area where the cutting line of the glass substrate is not formed.

In the above-described glass substrate cutting apparatus, the light scanning device performs an area of reciprocation of the spot of the cutting light for cutting the glass substrate on the glass substrate, an uncut area where the cutting line of the glass substrate is not formed. Restricted to Thereby, cutting light can be irradiated only to the field which should form a cutting line of a glass substrate. As a result, the cutting light generated from the light generator can be efficiently applied to the area where the cutting line of the glass substrate is to be formed without wasting the energy of the cutting light.

The glass substrate cutting device may further include a lens device. The lens arrangement adjusts the size of the spot of the cutting light on the glass substrate. Thereby, the cutting light which has the optimal energy density which can form a cutting line efficiently can be efficiently irradiated to the area | region which should form a cutting line of a glass substrate.

The lens apparatus may change the size of the spot of the cutting light on the glass substrate according to the length in the cutting direction of the uncut area. Thereby, the cutting light which has the optimal energy density which can form a cutting line efficiently can be efficiently irradiated to the area | region which should form a cutting line of a glass substrate.

The lens apparatus may increase the size of the spot of the cutting light as the length of the uncut area in the cutting direction decreases, thereby cutting the uncut area in which the length in the cutting direction decreases. It can suppress that light is irradiated by excess energy density.

The glass substrate cutting device may further include a light correction device. The light correction device moves the spot of the cutting light in a correction direction perpendicular to the cutting direction. Thus, the spot of the cutting light can be reciprocated along the appropriate cutting direction by moving the spot of the cutting light whose movement direction is deviated from the cutting direction in the correction direction.

The optical scanning device may narrow the range of reciprocating movement of the spot of the cutting light according to the formation of the cutting line. Thereby, the cutting light can be efficiently irradiated to the uncut region without wasting the energy of the cutting light.

The cutting method according to another aspect of the present invention is a method of cutting a glass substrate by reciprocating a spot of cutting light for cutting the glass substrate along the cutting direction of the glass substrate. The cutting method comprises the following steps.
ステップ Step of outputting cutting light.
ステップ Limiting the range of reciprocation of the spot of the cutting light to the uncut area where the cutting line of the glass substrate is not formed.

Thus, the cutting light can be irradiated only to the region where the cutting line of the glass substrate is to be formed, and the energy of the cutting light can be efficiently irradiated to the glass substrate without wasting it.

The cutting light generated from the light generator can be efficiently applied to the area where the cutting line of the glass substrate is to be formed without wasting the energy of the cutting light.

The top view of the cutting device concerning a 1st embodiment. FIG. 7 is a view showing an example of a moving method of the cutting light by the light scanning device. FIG. 8 is a view showing another example of the moving method of the cutting light by the light scanning device. FIG. 7 is a view schematically showing how the optical path length in the x-axis direction of the cutting light L changes. The side view when the cutting device is seen from the x-axis direction. The figure which shows an example of a movement of the cutting light by a light correction apparatus. The figure which shows another example of a movement of the cutting light by a light correction apparatus. The figure which shows typically the irradiation method of the cutting light to the glass substrate by the cutting device which concerns on 1st Embodiment. The figure which shows an example of the locus | trajectory on the glass substrate of the cutting light which remove | deviated from the original reciprocating movement locus | trajectory. The figure which shows typically an example of the correction method of the locus | trajectory of reciprocation of cutting light.

1. First Embodiment (1) Cutting Device Hereinafter, the entire configuration of a glass substrate G cutting device 100 according to an embodiment of the present invention will be described with reference to FIG. FIG. 1 is a top view of the cutting device according to the first embodiment. The cutting apparatus 100 is configured to cut the glass substrate G along the cutting direction by irradiating light having a predetermined spot size along the cutting direction of the glass substrate G (hereinafter, referred to as cutting light L). It is an apparatus which forms a crack of line C. The glass substrate G is cut by the crack of the cutting line C.

Examples of the glass substrate G include soda glass and alkali-free glass used for displays and instrument panels, but the type is not limited thereto. The glass substrate G is cut by the cutting device 100 while being transferred by the substrate transfer device 10. Therefore, when cutting the glass substrate G, the cutting apparatus 100 of the present embodiment moves in the same direction as the conveyance direction of the glass substrate G at the same speed as the conveyance speed of the glass substrate G. The conveyance direction of the glass substrate G is, for example, the negative direction of the y-axis in FIG. 1 (in the downward direction of the paper surface in FIG. 1).

In the present embodiment, the cutting direction of the glass substrate G is a direction parallel to the x-axis direction as shown in FIG. That is, the cutting device 100 of the present embodiment is applied to, for example, crossing (cutting in the width direction of the glass substrate G) the glass substrate G manufactured by the down flow.

The cutting device 100 includes a light generating device 1, a light scanning device 3, a lens device 5, and a light correcting device 7. The cutting light L generated by the light generating device 1 is transmitted to the lens device 5, the light scanning device 3 and the light correcting device. The spot S of the cutting light L is formed on the surface of the glass substrate G by irradiating the glass substrate G through 7 and the spot S of the cutting light L is moved along the cutting direction of the glass substrate G.

The light generator 1 is a device that generates the cutting light L described above. As the light generation device 1, for example, a light source capable of outputting a cutting light L having an energy enough to form a crack of the cutting line C capable of cutting the glass substrate G to the glass substrate G can be used. As such a light source, for example, there is a CO ₂ laser oscillator.

The light scanning device 3 reciprocates the spot S of the cutting light L output from the light generating device 1 along the cutting direction. The light scanning device 3 of the present embodiment is a device having a mirror that reflects the cutting light L, and a rotation mechanism that rotates the mirror about the z axis. The above-mentioned rotation mechanism is, for example, a motor in which an output rotation axis is connected to an axis extending in the z-axis direction from the mirror. As such an apparatus, there is a galvano scanner, for example.

The above-described light scanning device 3 is provided on the light path of the cutting light L. Therefore, as shown in FIG. 1, the cutting light L is reflected by the mirror of the light scanning device 3. The light scanning device 3 rotates the above mirror about the z axis to change the incident angle of the cutting light L on the mirror (that is, the reflection angle of the cutting light L at the mirror), thereby the incident angle The spot S of the cutting light L can be irradiated to the position on the glass substrate G determined by the above.

Specifically, for example, as shown in FIG. 2A, when the mirror of the light scanning device 3 is rotated to the right around the z axis, the incident angle of the cutting light L on the mirror (ie, the cutting light L on the mirror The reflection angle increases. Thereby, the cutting light L is incident on the negative direction (left direction of the paper surface of FIG. 2A) of the x axis of the mirror of the light correction device 7.

When the cutting light L is incident on the negative direction side of the x axis of the mirror of the light correction device, the cutting light L is reflected to the negative direction side of the x axis by the mirror as shown in FIG. 2A. As a result, the spot S of the cutting light L reaches the negative direction side of the x axis on the glass substrate G. FIG. 2A is a diagram showing an example of a moving method of the cutting light by the light scanning device.

On the other hand, as shown in FIG. 2B, when the mirror of the light scanning device 3 is rotated counterclockwise around the z axis, the incident angle of the cutting light L on the mirror decreases. Thereby, the cutting light L is incident on the positive direction (right direction of the paper surface of FIG. 2A) of the x axis of the mirror of the light correction device 7.

As shown in FIG. 2B, the cutting light L is reflected by the mirror in the positive direction side of the x axis by the cutting light L being incident on the positive direction side of the x axis of the mirror of the light correction device. As a result, the spot S of the cutting light L reaches the positive direction side of the x axis on the glass substrate G. FIG. 2B is a view showing another example of the method of moving the cutting light by the light scanning device.

The spot S of the cutting light L on the glass substrate G can be obtained by rotating the mirror of the light scanning device 3 right and left at high speed around the z axis within a predetermined angle range using the above principle. It can reciprocate at high speed on the reciprocating movement locus (FIG. 1) of the cutting light along the cutting direction.

The lens device 5 is a device that adjusts the focal position of the cutting light L on the glass substrate G side to form a spot S of the cutting light L on the glass substrate G. Specifically, the lens device 5 has a first lens 51 and a second lens 53.

The first lens 51 is a lens that expands the diameter of the cutting light L output from the light generating device 1. As shown in FIG. 1, the light generator 1 of the present embodiment outputs the cutting light L in the x-axis direction. Therefore, the first lens 51 is movable along the x-axis direction in which the cutting light L propagates. The first lens 51 is, for example, a diverging lens. The second lens 53 receives the cutting light L that has passed through the first lens 51, and focuses the cutting light L at a predetermined position on the optical path on the opposite side of the first lens 51.

Specifically, the lens device 5 having the first lens 51 and the second lens 53 described above changes the position of the first lens 51 in the x-axis direction, and the cutting light L by the first lens 51 is changed. The focal position of the cutting light L on the opposite side to the first lens 51 with respect to the second lens 53 is changed by changing the focal position of the lens.

For example, in FIG. 1, the first lens 51 is moved in the negative direction of the x axis to move the first lens 51 closer to the second lens 53, and the focal position of the cutting light L by the first lens 51 is set to the second lens 53. By bringing the second lens 53 close to the second lens 53, the cutting light L can be focused at a position farther from the first lens 51 on the optical path opposite to the first lens 51.

On the other hand, by moving the first lens 51 in the positive direction of the x axis, the first lens 51 is moved away from the second lens 53, and the focal position of the cutting light L by the first lens 51 is moved away from the second lens 53. The cutting light L can be focused at a position closer to the second lens 53 on the optical path opposite to the first lens 51.

As shown in FIG. 3, for example, the optical path length of the cutting light L in the x-axis direction from the lens device 5 to the surface of the glass substrate G is perpendicular to the z-axis direction (height direction) from the light scanning device 3 to the glass substrate G. Is lowered at the position in the x-axis direction of the point where the perpendicular intersects the glass substrate G. Moreover, the optical path length in the x-axis direction of the cutting light L becomes larger as it is closer to the end of the glass substrate G in the x-axis direction. FIG. 3 is a view schematically showing how the optical path length in the x-axis direction of the cutting light L changes, and the light correction device 7 is omitted for convenience of explanation.

As a result, for example, when the focal position of the cutting light L is adjusted so that the size of the spot S of the cutting light L on the surface of the glass substrate G becomes optimal when the optical path length is minimum, this focal position is cut When the light L reaches another position on the glass substrate G, the spot S having the optimum size is not formed at the other position on the glass substrate G.

Therefore, in the present embodiment, the controller 9 (described later) moves the first lens 51 in accordance with the position of the spot S of the cutting light L on the glass substrate G to adjust the focal position of the cutting light L. . Thereby, the size of the spot S of the cutting light L on the glass substrate G can be always optimized regardless of the position of the spot S of the cutting light L on the glass substrate G.

The light correction device 7 is a device having a mirror that reflects the cutting light L, and a rotation mechanism that rotates the mirror about the x axis. The rotation mechanism described above is, for example, a motor in which an output rotation shaft is connected to an axis extending in the x-axis direction from the mirror. As such an apparatus, for example, a galvano scanner can be used.

As shown in FIG. 1, the light correction device 7 is disposed at the same position as the arrangement position of the light scanning device 3 in the x-axis direction in the x-axis direction. Also in the z-axis direction (height direction), it is disposed at substantially the same position as the light scanning device 3. On the other hand, in the y-axis direction, it is disposed at a position separated from the light scanning device 3 by a predetermined distance. Furthermore, as shown in FIG. 4, the mirror of the light correction device 7 is inclined by a predetermined angle so that the normal of the reflecting surface is directed in the negative direction (downward direction) in the z-axis direction. FIG. 4 is a side view of the cutting device as viewed from the x-axis direction.

The light correction device 7 thus arranged reflects the cutting light L incident from the light scanning device 3 by the mirror, and causes the spot S of the cutting light L to reach the glass substrate G.

The mirror of the light correction device 7 is rotatable around the x axis. Therefore, the light correction device 7 can move the spot S of the cutting light L in the y-axis direction by changing the rotation angle of the mirror about the x-axis. In the present embodiment, the y-axis direction is perpendicular to the x-axis direction which is the cutting direction of the glass substrate G. Hereinafter, the y-axis direction of the present embodiment will be referred to as the “correction direction”.

Specifically, for example, when the rotation angle of the mirror of the light correction device 7 is changed from the angle shown in FIG. 4 by right rotation, as shown in FIG. 5A, incidence of the cutting light L on the mirror The corners get bigger. As a result, the spot S of the cutting light L moves from the position shown in FIG. 4 in the negative direction of the y axis (in the left direction in the drawing in FIG. 5A). FIG. 5A is a view showing an example of the movement of the cutting light by the light correction device.

On the other hand, when the rotation angle of the mirror of the light correction device 7 is changed from the angle shown in FIG. 4 by left rotation, the incident angle of the cutting light L on the mirror decreases as shown in FIG. 5B. As a result, the spot S of the cutting light L moves from the position shown in FIG. 4 in the positive direction of the y axis (in the right direction in FIG. 5B). FIG. 5B is a view showing another example of the movement of the cutting light by the light correction device.

The cutting device 100 includes a controller 9. The controller 9 is a computer having a processor (for example, CPU), a storage device (for example, ROM, RAM, HDD, SSD, etc.), and various interfaces (for example, A / D converter, D / A converter, communication interface, etc.) It is a system. The controller 9 performs various control operations by executing the program stored in the storage unit (corresponding to a part or all of the storage area of the storage device).

The controller 9 may be configured by a single processor, but may be configured by a plurality of independent processors for each control.

The controller 9 can control the light generation device 1, the light scanning device 3, the first lens 51 of the lens device 5, and the light correction device 7. Further, the controller 9 may control movement of the substrate transfer apparatus 10 and the cutting apparatus 100.

Although not shown, the controller 9 is connected with sensors and switches for detecting the state of each device, and an information input device. Further, although not shown, a sensor and / or a camera for detecting the length of the crack of the cutting line C formed in the glass substrate G may be connected to the controller 9.

By having the above configuration, the cutting device 100 can move the spot S of the cutting light L generated from the light generating device 1 in the three axial directions of the x axis, the y axis, and the z axis. That is, the cutting device 100 can cause the spot S of the cutting light L forming the crack of the cutting line C on the glass substrate G to reach a desired position on the glass substrate G with a desired size.

(2) Operation of Cutting Device Hereinafter, the operation of the cutting device 100 when cutting the glass substrate G conveyed by the substrate conveyance device 10 will be described.
First, at the end of the glass substrate G in the cutting direction (x-axis direction), a crack called “initial crack” is formed as a start point of cutting of the glass substrate G by the cutting light L. The initial crack is physically formed, for example, using a cutter such as a diamond cutter or a ceramic cutter.

Alternatively, the initial crack can also be formed by intensively irradiating the spot S of the cutting light L with high energy density on the side of the end in the cutting direction of the glass substrate G on which the initial crack is to be formed. Specifically, for example, the controller 9 controls the first lens 51 so that the cutting light L focuses in the vicinity of the end portion of the glass substrate G before the crack of the cutting line C is fully formed. Adjust the position and then control the light scanning device 3 to reciprocate the spot S of the cutting light L in a narrow range in the x-axis direction near the end of the glass substrate G, or Stop at the end of the substrate G.

After an initial crack is formed at the end of the glass substrate G, the spot of the cutting light L is from the end where the initial crack is formed on the reciprocating movement trajectory parallel to the cutting direction (x-axis direction) to the opposite end The heat is moved back and forth to heat the glass substrate G, and a thermal stress is generated on the glass substrate G to propagate a crack from the initial crack to form a crack of the cutting line C in the glass substrate G.

When the spot S of the cutting light L is reciprocated in the cutting direction, the range of the reciprocating movement of the spot S of the cutting light L is narrowed in a range in which the crack of the cutting line C is not formed. The range of reciprocation of the spot S of the cutting light L may be determined by detecting the range in which the crack of the cutting line C is formed, or the speed at which the crack of the cutting line C develops is measured in advance by experiment. Alternatively, the cutting apparatus 100 may be operated so as to gradually narrow the range of the reciprocation of the spot S of the cutting light L based on the measurement result.

Specifically, the controller 9 grasps the length of the crack of the cutting line C currently formed in the glass substrate G. The crack length of the cutting line C is, for example, after photographing the glass substrate G in which the crack of the cutting line C is being formed with a camera or the like, the crack of the cutting line C is identified by image recognition or the like, and image processing etc. It can grasp by measuring the length of the crack of cutting line C by this.

In another embodiment, the controller 9 uses, for example, an optical sensor to measure the intensity of light having passed through the crack of the cutting line C (where the glass substrate G is not present) and the intensity of light having passed through the glass substrate G. The crack length of the cutting line C may be grasped based on the difference of.

In yet another embodiment, for example, the crack formation process of the cutting line C by the cutting device 100 is grasped in advance by simulation or experiment, and the elapsed time from the start of the crack formation of the cutting line C and the cutting line C The relationship with the crack (crack growth rate) is calculated, and from the elapsed time since the controller 9 started reciprocating movement of the spot S of the cutting light L and the above relationship (ie, crack growth rate) The length of the crack of the formed cutting line C may be calculated.

After grasping the current length of the crack of the formed cutting line C, the controller 9 determines the range in which the spot S of the cutting light L is reciprocated on the reciprocating movement trajectory. The controller 9 detects the spot of the cutting light L from the x-coordinate value of the end of the glass substrate G on the side where the initial crack is not formed to the x-coordinate value of the end of the crack of the cutting line C formed. It is determined as the range of reciprocating movement in the cutting direction (x-axis direction) of S. That is, the controller 9 sets the range of the reciprocation of the spot S of the cutting light L as a range in which the crack of the cutting line C of the glass substrate G is not formed (referred to as an uncut area).

The x-coordinate value of the end of the crack of the formed cutting line C is, for example, the x-coordinate value of the side of the glass substrate G on which the initial crack is formed, and the current length of the crack calculated above. It can be calculated as the difference between

In another embodiment, the range in which the spot S of the cutting light L reciprocates may overlap with a part of the crack of the cutting line C already formed. That is, the controller 9 may make the range for reciprocating the spot S of the cutting light L slightly larger than the length of the uncut area in the x-axis direction. Thereby, the cutting light L can be reliably irradiated to the uncut area in which the crack of the cutting line C is not formed.

After calculating the x-coordinate values of both ends of the range for reciprocating the spot S of the cutting light L, the controller 9 calculates the rotation angle range of the mirror of the optical scanning device 3 from the x-coordinate values of the both ends, and the rotation angle range Output control signal to the light scanning device 3 to reverse the mirror forward and reverse. Thereby, the spot S of the cutting light L reciprocates along the cutting direction in the uncut area.

The crack length of the cutting line C, the determination of the reciprocating movement range of the spot S of the cutting light L, and the change of the reciprocating movement range of the spot S of the cutting light L are described above. Repeat until almost the entire area of G in the x-axis direction (width direction).

Thereby, as shown in (1) to (4) of FIG. 6, the controller 9 sets the range of reciprocating movement of the spot S of the cutting light L according to the formation of the crack of the cutting line C from L1 to L4 (L1> It can be narrowed to L2> L3> L4). That is, the range of reciprocating movement of the cutting light L on the glass substrate G can be limited to only the uncut region. As a result, the cutting light L generated from the light generation device 1 can be efficiently concentrated on the area of the cutting line C of the glass substrate G where the crack should be formed, without wasting the energy of the cutting light L. FIG. 6: is a figure which shows typically the irradiation method of the cutting light to a glass substrate by the cutting device which concerns on 1st Embodiment.

In the present embodiment, the controller 9 reciprocates the spot S of the cutting light L at a constant speed on the glass substrate G by rotating the mirror of the light scanning device 3 at a fixed rotation speed. Therefore, by narrowing the range of reciprocating movement of the spot S of the cutting light L in accordance with the formation of the crack of the cutting line C, it is possible to increase the passing frequency of the spot S of the cutting light L at a predetermined position in the uncut area. That is, as the uncut region becomes narrower, the cutting light L can be irradiated to the surface of the glass substrate G at a higher energy density.

The cutting apparatus 100 according to the present embodiment particularly starts cutting the glass substrate G because the surface of the glass substrate G can be irradiated with the cutting light L at a higher energy density as the uncut region becomes narrower. As time passes from the point of time, the growth rate of the crack in the cutting line C can be increased. As a result, even if a crack of the cutting line C is formed, the glass substrate G can be cut in a shorter time as compared with the case where the whole area in the width direction of the glass substrate is irradiated with the cutting light.

However, when the cutting light L is irradiated to the uncut area at an excess energy density, the excess energy may cause an unintended damage to the glass substrate G. Therefore, in the cutting apparatus 100 of the present embodiment, the controller 9 changes the size of the spot S of the cutting light L on the glass substrate G according to the length of the uncut area in the cutting direction (x-axis direction). The lens 51 is moved.

Specifically, as shown in (1) to (4) of FIG. 6, the controller 9 sets the size of the spot S of the cutting light L constant regardless of the position of the spot S in the x-axis direction, but does not cut it. The position of the first lens 51 so that the size of the spot S of the cutting light L is increased from S1 to S4 (S1 <S2 <S3 <S4) as the length in the cutting direction of the region decreases from L1 to L4 Adjust the Thereby, it is possible to suppress the irradiation of the cutting light L with an excessive energy density to the uncut area in which the length in the cutting direction is shortened, and to prevent the glass substrate G from being unintentionally damaged. .

2. Second Embodiment The light correction device 7 included in the cutting apparatus 100 according to the first embodiment described above reaches the spot S of the cutting light L on the surface of the glass substrate G in the step of cutting the glass substrate G. It was only However, as described in the first embodiment, the light correction device 7 can move the spot S of the cutting light L in the y-axis direction perpendicular to the forming direction (cutting direction) of the crack of the cutting line C.

In the cutting device 100, the mirror of the light scanning device 3 is reversed in a predetermined angle range and / or the position of the first lens 51 is adjusted to cut the spot S of the cutting light L on the glass substrate G When reciprocated along the direction, the spot S of the cutting light L may deviate from the original reciprocating movement trajectory as shown in FIG. Specifically, the locus of the reciprocating movement of the spot S of the cutting light L is deviated in the y-axis direction from the original reciprocating locus. FIG. 7 is a view showing an example of a locus on the glass substrate of the spot S of the cutting light deviated from the original reciprocal movement locus.

The deviation of the locus is caused by the installation situation of the light scanning device 3 and / or the lens device 5, an error in the structure, etc. and can be resolved only by adjusting the light scanning device 3 and / or the lens device 5. It is difficult or takes a lot of time to adjust.

Therefore, in the second embodiment, in the step of cutting the glass substrate G, the controller 9 determines the amount of deviation between the original reciprocating movement trajectory and the actual trajectory when the spot S of the cutting light L reciprocates. In response, the spot S of the cutting light L is moved in the correction direction to correct the deviation of the trajectory.

Specifically, the deviation of the trajectory of the spot S of the cutting light L is corrected as follows. First, for example, after fixing the angle of the mirror of the light correction device 7 with the deviation amount between the trajectory when the cutting light L is not moved in the y-axis direction and the original reciprocal movement trajectory, the mirror of the light scanning device 3 is The position of the first lens 51 is adjusted while rotating forward and reverse in a predetermined angle range, and the spot S of the cutting light L is grasped by actually reciprocating in the cutting direction.

After grasping the deviation amount of the spot S of the cutting light L in the y-axis direction as described above, the x coordinate value of the spot S of the cutting light L and the y axis direction of the spot S of the cutting light L at each x coordinate value The relationship with the amount of deviation is calculated, for example, as a function of the x-coordinate value.

After calculating the above relationship, the controller 9 reciprocates the cutting light L in order to cut the glass substrate G, while using the current x-coordinate value of the spot S of the cutting light L and the above function, The amount of deviation of the spot S of the cutting light L at the x-coordinate value in the y-axis direction is calculated.

Thereafter, while reciprocating the spot S of the cutting light L, the controller 9 rotates the mirror of the light correction device 7 by an angle according to the displacement amount in the y-axis direction calculated above, and the spot of the cutting light L By moving S in the y-axis direction, as shown in FIG. 8, the spot S of the cutting light L can be reciprocated on the original reciprocating movement trajectory. FIG. 8 is a view schematically showing an example of a method of correcting a trajectory of reciprocating movement of cutting light.

In this manner, in the second embodiment, the deviation of the locus of the spot S of the cutting light L in the y-axis direction due to the installation situation of the light scanning device 3 and / or the lens device 5, a structural error, etc. Can be corrected. As a result, the spot S of the cutting light L can be reciprocated along the appropriate cutting direction without adjusting the light scanning device 3 and / or the lens device 5.

3. Common Items of Embodiments The first and second embodiments have the following configurations and functions in common.
An apparatus 100 for cutting a glass substrate G (an example of a glass substrate) according to the first embodiment and the second embodiment (an example of a cutting apparatus) includes a light generator 1 (an example of a light generator) and an optical scanning device 3 An example of an optical scanning device). The light generator 1 outputs a cutting light L (an example of a cutting light) for cutting the glass substrate G. The optical scanning device 3 is a device that reciprocates the spot S of cutting light L (an example of a spot of cutting light) along the cutting direction of the glass substrate G. The light scanning device 3 limits the range of the reciprocation of the spot S of the cutting light L to the uncut area where the crack (an example of the cutting line) of the cutting line C of the glass substrate G is not formed.

In the cutting apparatus 100, a crack of the cutting line C of the glass substrate G is formed in the range of reciprocating movement of the spot S of the cutting light L for cutting the glass substrate G on the glass substrate G in the cutting apparatus 100. Not limited to uncut area. Thereby, the cutting light L can be irradiated only to the area | region which should form the crack of the cutting line C of the glass substrate G. As shown in FIG. As a result, the cutting light L generated from the light generation device 1 can be efficiently irradiated to the area of the cutting line C of the glass substrate G where the crack should be formed without wasting the energy of the cutting light L.

4. Other Embodiments Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the invention. In particular, the embodiments and modifications described herein may be arbitrarily combined as needed.
(A) The lens device 5 may be configured of one lens as long as the focal position of the cutting light L can be changed. As such a lens capable of changing the focal position (focal length) of light, it is possible to use, for example, an electric variable focus lens in which the focal length is variable by changing the curvature of the lens by an electric signal or the like.

(B) In the first and second embodiments described above, along with the movement of the glass substrate G in the y-axis direction by the substrate transfer apparatus 10, the cutting device 100 is moved in the y-axis direction. However, the present invention is not limited thereto. For example, when the glass substrate G can be cut by irradiation of the cutting light L for a short time (for example, when the width dimension of the glass substrate G is small, the conveyance speed of the glass substrate G is slow) The light correction device 7 may move the spot S of the cutting light L in the y-axis direction according to the conveyance of the glass substrate G in the y-axis direction. This eliminates the need to move the cutting device 100 in the y-axis direction.

The present invention can be widely applied to a glass substrate cutting device.

100 cutting device 1 light generating device 3 light scanning device 5 lens device 51 first lens 53 second lens 7 light correction device 9 controller 10 substrate conveyance device C cutting line G glass substrate L cutting light S spot

Claims

A light generator for outputting a cutting light for cutting a glass substrate and an apparatus for reciprocating the spot of the cutting light along the cutting direction of the glass substrate, wherein the range of the reciprocating movement of the spot of the cutting light is An optical scanning device that restricts to a non-cut area where a cut line of the glass substrate is not formed;
A glass substrate cutting apparatus comprising:
The apparatus for cutting a glass substrate according to claim 1, further comprising a lens device that adjusts the size of the spot of the cutting light on the glass substrate.
The apparatus for cutting a glass substrate according to claim 2, wherein the lens device changes the size of the spot of the cutting light on the glass substrate in accordance with the length of the uncut area in the cutting direction.
The apparatus for cutting a glass substrate according to claim 2, wherein the lens apparatus increases the size of the spot of the cutting light as the length of the uncut area in the cutting direction decreases.
The apparatus for cutting a glass substrate according to any one of claims 1 to 4, further comprising a light correction device for moving the spot of the cutting light in a correction direction perpendicular to the cutting direction.
The apparatus for cutting a glass substrate according to any one of claims 1 to 5, wherein the light scanning device narrows the range of reciprocating movement of the spot of the cutting light according to the formation of the cutting line.
A method of cutting the glass substrate by reciprocating a spot of cutting light for cutting the glass substrate along the cutting direction of the glass substrate,
Outputting the cutting light;
Restricting the range of reciprocation of the spot of the cutting light to an uncut area where the cutting line of the glass substrate is not formed;
And a method of cutting a glass substrate.
A program that causes a computer to execute the disconnection method according to claim 7.
A storage medium storing the program according to claim 8.