TWI674162B - Joined member manufacturing apparatus and method for manufacturing joined member - Google Patents

Abstract

The present invention provides a joining member manufacturing apparatus and a joining member manufacturing method that can quickly and appropriately join joining target members.

The joint member manufacturing apparatus 1 includes: a first holder 10; a second holder 20; and a moving device 30 that moves the first holder 10 relative to the second holder 20 within the reference plane H and is vertical The direction V moves back and forth relatively; the outline grasping unit 41 grasps the outline when the first joining target member S is projected on the reference plane H; and the control device 60 controls the moving device 30. The first holder 10 is configured to hold the first joining target member S with a part of the outline of the first joining target member S as a reference position, and the control device 60 is configured to make the first The holder 10 is relatively moved in the reference plane H relative to the second holder 20 to the first joining target member S held by the first holder 10 and the second joining target member held by the second holder 20. C is properly engaged.

Description

   Device for manufacturing joint member and method for manufacturing joint member   

The present invention relates to a joint member manufacturing apparatus and a joint member manufacturing method, and more particularly, to a joint member manufacturing apparatus and a joint member manufacturing method capable of quickly and appropriately joining joining target members.

An optical semiconductor is constituted by attaching a cap with a lens covering a device or the like to a stem on which a photoelectric conversion device or the like is mounted. As a device for welding the mandrel and the cover, there has been a method of clamping the mandrel to a lower electrode holder, and clamping the cover to an upper taper collet electrode, and pushing the The pressing means moves the upper electrode moving stage to which the upper tapered chuck electrode is fixed in a vertical direction to perform resistance welding (for example, refer to Patent Document 1).

    [Prior technical literature]         [Patent Literature]    

Patent Document 1: Japanese Patent Application Laid-Open No. 2003-154463

The lower electrode system can clamp the mandrel by approaching the holder which is divided into two, and release the clamp by leaving. At this time, after the mandrel is placed, in order to fix one of the holders at the clamping position and fix the other of the holders to the one of the holders, When the mandrel is clamped by using a fixed fixture as a reference, the center position of both the mandrel and the cover can be viewed while the core rod can be disassembled and mounted faster than when it is clamped, and the average per unit can be increased. The number of time splices can be increased, which can increase productivity. The welding of mandrels and caps for optical semiconductors requires extremely high alignment accuracy. However, there may be welding objects such as the dimensional deviation of the welding target member, the deviation of the plating thickness, or the like. Due to changes in the surrounding environment, such as temperature changes in the place where welding is performed, proper joining cannot be performed.

In view of the above problems, an object of the present invention is to provide a joint member manufacturing apparatus and a joint member manufacturing method that can quickly and appropriately join joint members.

In order to achieve the above-mentioned object, the first aspect of the present invention is a joint member manufacturing apparatus, for example, as shown in FIG. 1, a joint member D (the first joint target member S and the second joint target member C are joined ( For example, refer to FIG. 3) The device 1 includes: a first holder 10 for holding a first joining target member S; a second holder 20 for holding a second joining target member C; a moving device 30, The first holder 10 is relatively moved in the reference plane H relative to the second holder 20, and is relatively moved back and forth in a vertical direction V that is a direction perpendicular to the reference plane H; the contour grasping unit 41 is used to grasp the The outline of the first joining target member S held by the first holder 10 when projected on the reference plane H; and the control device 60 controls the moving device 30; the first holder 10 is configured to be the first joining target A part of the outline of the member S is the reference position Sp (for example, refer to FIG. 4), and the first engagement target member S is held; the control device 60 is configured to make the first holder 10 at the reference based on the outline grasped by the outline grasping unit 41. In the plane H with respect to the second holder 2 0, relatively moves to the first joining target member S held by the first holder 10 and the second joining target member C held by the second holder 20 because the first holder 10 is relative to the second holder 20 is a position where the vertical direction V is moved to be properly engaged.

When configured in this manner, even when the outline of the first joining target member changes, the first joining target member and the second joining target member can be joined quickly and appropriately.

In addition, the second aspect of the present invention of the bonded member manufacturing apparatus, for example, as shown in FIG. 1, is the above-mentioned first aspect of the present invention of the bonded member manufacturing apparatus 1, and includes a bonded member state grasping unit 41. The state grasping unit 41 grasps the outer edge and the contour when the second joining object member C in the joining member D (see, for example, FIG. 3) is projected on the reference plane H; the control device 60 is configured to grasp the joining member state grasping unit 41 Grasp the positional relationship between the outer edge and the contour, and adjust the relative movement of the first holder 10 relative to the second holder 20 in the reference plane H when the engaging member D (see, for example, FIG. 3) is to be manufactured next. .

When configured in this manner, the state of the joining members can be fed back to the alignment of the first joining target member and the second joining target member to be joined later, and the appropriateness of joining the two members can be satisfied.

In addition, the third aspect of the present invention is a bonding member manufacturing apparatus, as shown in FIG. 1, for example, as described in the first aspect or the second aspect of the present invention of the bonding member manufacturing apparatus 1, wherein the first holder The 10 series includes a holding mechanism 10c for holding the first joining target member S. The holding mechanism 10c includes a reference portion 11 that contacts the reference position Sp (see, for example, FIG. 4), and a pressing portion 12 that cooperates with the reference portion 11 The first joining target member S is sandwiched by work; the reference portion 11 and the pressing portion 12 are configured to move back and forth relative to each other.

When configured in this manner, it is possible to smoothly perform the holding of the first joining target member by the first holder.

In addition, the bonding member manufacturing apparatus of the fourth aspect of the present invention is, for example, as shown in FIG. 1, the bonding member manufacturing apparatus 1 of any one of the first aspect to the third aspect of the present invention, It includes a temperature change detection unit 46 that detects the structure that determines the position of the first joining target member S held by the first holder 10 and determines the structure of the second joining target member C held by the second holder 20 The temperature change of at least one of the position structures 28; the control device 60 is configured to adjust the first holder 10 in the reference plane H relative to the second holder in accordance with the temperature change detected by the temperature change detection unit 46. Relative movement of 20.

When configured in this manner, a positional shift accompanying a temperature change can be corrected.

In addition, the fifth aspect of the present invention is a bonding member manufacturing apparatus, for example, as shown in FIG. 3) A device 1 comprising: a first holder 10 for holding a first joining target member S; a second holder 20 for holding a second joining target member C; a moving device 30 for holding a first The 1 holder 10 relatively moves in the reference plane H relative to the second holder 20 and relatively moves back and forth in a direction perpendicular to the direction perpendicular to the reference plane H; the temperature change detection unit 46 detects that the Temperature change of at least one of the structure of the position of the first joining target member S held by the 1 holder 10 and the structure of the position of the second joining target member C held by the second holder 20; and the control device 60 The control device 60 controls the moving device 30; the control device 60 is configured to perform a change in the temperature detected by the temperature change detection unit 46, and perform the first joining target member S held by the first holder 10 and the cover at a reference temperature. The second holder is guaranteed by 20 The standard position of engagement of the second engaging member C of the objects, the first adjustment holder within the reference plane H 10 relative to the second holder 20 move relative.

When configured in this manner, a positional shift accompanying a temperature change can be corrected.

In order to achieve the above object, a method for manufacturing a joint member according to a sixth aspect of the present invention refers to, for example, as shown in FIG. 1 and FIG. 6, a method of manufacturing a joint by a first joint target member S and a second joint target member C. A method for joining a completed joining member D (see, for example, FIG. 3). The method includes: a contour grasping step (S3), which grasps the outline when the first joining target member S is projected on the reference plane H; The moving step (S5) is to move the first joining target member S to a joining position where the second joining target member C is to be engaged when viewed on the reference plane H; the second joining target member moving step (S6) , The second joining object member C is moved in a direction perpendicular to the reference plane H, that is, the vertical direction V is separated from the first joining object member S and moved to the joining position when viewed on the reference plane H; and joining In step (S7), the first joining target member S and the second joining target member C, which are located away from each other in the vertical direction V and projected onto the reference plane H, are positioned in the joining position when they are viewed in the vertical direction V and are joined to produce a joint Component D (example (Refer to FIG. 3); the first joining target member moving step (S5) is configured to adjust the relative of the first joining target member S relative to the second joining target member C based on the outline grasped in the outline grasping step (S3). Mobile.

When configured in this manner, even when the outline of the first joining target member changes, the first joining target member and the second joining target member can be joined quickly and appropriately.

In order to achieve the above object, a method for manufacturing a joint member according to a seventh aspect of the present invention refers to, for example, as shown in FIG. 1, a joint member manufactured by joining a first joining target member S and a second joining target member C. Method D (see, for example, FIG. 3), which includes a temperature detection step of detecting a temperature around at least one of the first joining target member S and the second joining target member C; and the first joining target member moves. The step is to move the first joining target member S to a joining position where the second joining target member C is to be joined when viewed on the reference plane H, and the second joining target member moving step is to move the second joining target. The member S moves away from the first joining target member S in a vertical direction V that is a direction perpendicular to the reference plane H, and moves to the joining position when viewed on the reference plane H; and the joining step moves away from the vertical direction Furthermore, the first joining target member S and the second joining target member C, which are located at the joining position when projected on the reference plane H, are approached in the vertical direction V and are joined to produce the joining member D; The joining target member moving step is configured to adjust the relative movement of the first joining target member S relative to the second joining target member C based on the temperature detected in the temperature detection step.

When configured in this manner, a positional shift accompanying a temperature change can be corrected.

According to the present invention, the joining target members can be joined quickly and appropriately.

1‧‧‧ Welding device

10‧‧‧Lower electrode

10b‧‧‧electrode body

10c‧‧‧Clamp

10f‧‧‧Top

10h‧‧‧ Mandrel Hole

11‧‧‧ benchmark

12‧‧‧Tightening section

20‧‧‧upper electrode

21‧‧‧ Ontology

21A‧‧‧Squeezed electrode

21B‧‧‧Main Department

21h‧‧‧Hollow

21p‧‧‧ protrusion

21w‧‧‧external thread

22‧‧‧ Airbag

23‧‧‧electrode chip

24‧‧‧ fixed nut

24h‧‧‧through hole

24w‧‧‧internal thread

28‧‧‧ Gate Post

30‧‧‧ mobile device

31‧‧‧ Lower mobile device

32‧‧‧ Upper mobile device

41‧‧‧ Mandrel Camera

42‧‧‧Temporary stand

46‧‧‧Temperature Sensor

51A‧‧‧The first mandrel handling machine

51B‧‧‧ 2nd Mandrel Conveyor

52A‧‧‧1st rotation axis

52B‧‧‧ 2nd rotation axis

53A‧‧‧1st arm

53B‧‧‧ 2nd arm

54A‧‧‧1 mandrel grip

54B‧‧‧ 2nd mandrel grip

56‧‧‧Capping Conveyor

57‧‧‧ support shaft

58‧‧‧Cap holding section

60‧‧‧Control device

81‧‧‧ abutment

83‧‧‧ Mandrel Supporting Plate

84‧‧‧ Mandrel pallet support

84a‧‧‧ main track

84b‧‧‧ branch track

85‧‧‧ Covering pallet

86‧‧‧Capping pallet support department

86a‧‧‧ main track

86b‧‧‧Cap moving guide

AX‧‧‧ axis

C‧‧‧Cap

Ce‧‧‧Edge

Cm‧‧‧Cap mark

Cn‧‧‧ lens

Cp‧‧‧ Peripheral Department

D‧‧‧device

F‧‧‧gas

H‧‧‧ datum plane

S‧‧‧ mandrel

Sb‧‧‧Base

Sd‧‧‧Wire

Sm‧‧‧ Mandrel Marker

Sp‧‧‧ reference position

St‧‧‧Mounting Department

V‧‧‧ vertical

Fig. 1 is a longitudinal sectional view showing a schematic configuration of a welding apparatus according to an embodiment of the present invention.

Fig. 2 is a plan view showing a schematic configuration of a welding apparatus according to an embodiment of the present invention.

FIG. 3 is a view showing an example of a joining member, (A) is a perspective view, and (B) is a side view of an exploded partial cross section.

FIG. 4 is a plan view showing a schematic configuration of a clamper included in a lower electrode of a welding device according to an embodiment of the present invention.

Fig. 5 is a partial vertical cross-sectional view showing a schematic configuration of an upper electrode of a welding apparatus according to an embodiment of the present invention.

Fig. 6 is a flowchart showing a procedure of a method for manufacturing a joint member according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, the same or similar members are assigned the same or similar members in each of the drawings, and redundant descriptions are omitted.

First, a welding apparatus 1 as a welding member manufacturing apparatus according to an embodiment of the present invention will be described with reference to FIGS. 1 and 2. FIG. 1 is a longitudinal cross-sectional view showing a schematic configuration of the fusion welding device 1. FIG. 2 is a plan view showing a schematic configuration of the welding device 1. The welding device 1 is a device for welding the cover C and the core rod S in this embodiment. The welding device 1 includes a lower electrode 10, an upper electrode 20, a moving device 30 to move the lower electrode 10 and the upper electrode 20, a mandrel camera 41, and a mandrel S: and a control device 60. Here, before explaining the welding apparatus 1, a joining member manufactured by welding the cover C and the core rod S will be described.

FIG. 3 (A) is a perspective view of a device D as a bonding member, and FIG. 3 (B) is an exploded partial cross-sectional side view of the device D. The device D of this embodiment is described using an optical semiconductor as a form. The device D is formed by joining the cover C and the core rod S. In FIG. 3 (B), the state where the cover C and the core rod S are separated before the device D is shown. The cover C is shown in a cross section, and the core rod S is shown in a side view. The core rod S is configured such that electrodes, transistors, and the like (hereinafter referred to as "mounting portions St") constituting the photoelectric conversion element are mounted on the base Sb, and the lead Sd extends from the base Sb. The base portion Sb is formed in a disc shape in this embodiment. A stem mark Sm is provided on the outer peripheral portion of the surface on which the base portion Sb of the mounting portion St is provided, which specifically specifies a position in the peripheral direction. The lead Sd extends from the base portion Sb to the opposite side of the mounting portion St. The base Sb and the lead Sd are formed of a metal. The cover C is configured to cover the attachment portion St of the mandrel S and be attached to the base portion Sb. The cover C is configured to have a substantially cylindrical appearance, and the mounting portion St can be accommodated inside the cylindrical shape. The cover C is open to one of the end faces of the outer peripheral portion Cp corresponding to the cylindrical side surface, and the other end face is closed. In this embodiment, the diameter in the axial orthogonal cross section of the outer peripheral portion Cp is configured to be 5 mm. The lens Cn in the cover C for transmitting laser light is provided on the top surface of the end surface that belongs to the closed side. The cover C is expanded slightly to the outside in order to ensure that the edge Ce of one of the end faces which is open is subjected to pressure during welding. In the present embodiment, the outer periphery of the edge Ce is formed into a circle having a size equal to or smaller than the outer periphery of the base Sb. In the edge Ce, a cap mark Cm that specifically specifies a position in the direction around the cylinder is formed. The cover mark Cm is formed so that a part of the edge Ce protrudes to the outside. The cover C is made of metal other than the lens Cn. The metal parts of the core rod S and the cover C are typically formed of stainless steel, iron-nickel-chromium alloy (Kovar), or the like, but may be formed of metals other than these. The metal parts of the core rod S and the cover C are typically different types of metals, but they can also be the same type of metals. The device D is configured such that the mounting portion St is covered with the cover C, and then the edge Ce is fused to the base portion Sb. At this time, in this embodiment, the cap mark Cm and the mandrel mark Sm are aligned to align, so that a device D exhibiting a desired function can be manufactured. In this embodiment, the mandrel S corresponds to the first joining target member, and the cover C corresponds to the second joining target member.

The structure of the fusion splicing device 1 will be described with reference back to FIGS. 1 and 2. The lower electrode 10 is for holding the mandrel S, and corresponds to the first holder. The lower electrode 10 includes an electrode body 10b and a holder 10c. The electrode body 10b is composed of a metal block. The electrode body 10b is typically formed of a highly conductive metal. In many cases, the electrode body 10b has a flat top surface 10f. In this embodiment, the top surface 10f expands horizontally, and a virtual horizontal plane extending outside the top surface 10f toward the same plane as the top surface 10f is used as the reference plane H, including the top surface 10f. The electrode body 10b is formed in a depth direction from the top surface 10f, and a mandrel hole 10h is formed in which the lead Sd can be accommodated. The core rod hole 10h can accommodate all the wires Sd, and on the other hand is formed to have a smaller diameter than the outer diameter of the base Sb, and is formed to accommodate the longest wire Sd when the base Sb is placed on the top surface 10f depth. The holder 10c is a gripping mechanism that accommodates the lead wire Sd in the mandrel hole 10h and sandwiches the base Sb placed on the top surface 10f to hold it. The holder 10c includes a reference portion 11 and a pressing portion 12, and is configured to sandwich the core rod S (base portion Sb) between the reference portion 11 and the pressing portion 12.

Here, the details of the holder 10c will be described with reference to FIG. 4. FIG. 4 is a schematic plan view of a holder 10c included in the lower electrode 10 of the welding device 1. FIG. As described above, the holder 10c includes the reference portion 11 and the pressing portion 12. The reference portion 11 and the pressing portion 12 are both provided on the top surface 10f (see FIG. 1) of the electrode body 10b. The reference portion 11 and the pressing portion 12 are accommodated in the core rod hole 10h with the lead wire Sd in a plan view, and the base portion Sb (the core rod) placed on the top surface 10f is sandwiched between the reference portion 11 and the pressing portion 12. In the method S), the reference portion 11 is disposed on one side and the pressing portion 12 is disposed on the opposite side of the core rod S. Each of the reference portion 11 and the pressing portion 12 is configured to be capable of reciprocating in a direction (Y direction in FIG. 4) that can approach and leave each other individually along the top surface 10 f. The reference portion 11 is configured so that after the core rod S is placed on the top surface 10f of the electrode body 10b, the reference portion 11 can be moved to a position where the core rod S is to be held before the pressing portion 12 and the holder 10c is determined to hold the core rod. S (the lower electrode 10 holds the mandrel S) as the reference position Sp. The gripper 10c is configured to be able to hold the mandrel S with respect to the reference portion 11 located at the position where the mandrel S is to be held, and to release the mandrel S by moving the pressing portion 12 away. maintain. In the direction in which the pressing portion 12 moves, the core rod S which is in contact with the reference portion 11 located at the position where the core rod S is to be held, reaches the portion farthest from the pressing portion 12 and is held by the holder 10c. The reference position Sp at the time of the mandrel S.

The entire lower electrode 10 including the electrode body 10b and the holder 10c is configured to be able to move back and forth (the Y direction) and the direction orthogonal to the reference portion 11 and the pressing portion 12 by the lower moving device 31 ( X direction) reciprocates, and rotates in a direction (θ direction) along an arc that is in contact with the core rod S of the reference portion 11. As described above, the lower electrode 10 as a whole is configured to be capable of reciprocating linear movement and rotational movement in two directions within the reference plane H by the lower moving device 31. The details of the lower electrode 10 will be continued to describe the details of the upper electrode 20.

The details of the upper electrode 20 will be described mainly with reference to FIGS. 1 and 5. FIG. 5 is a partial vertical cross-sectional view showing a schematic configuration of the upper electrode 20. The upper electrode 20 is for holding the cover C, and is equivalent to a second holder. The upper electrode 20 is roughly provided with: a cylindrical body 21; a ring-shaped (doughnut-shaped) balloon 22; an electrode chip 23; and a wafer fixing nut 24. The electrode wafer 23 with the airbag 22 sandwiched between the electrode wafer 23 and the body 21 is fixed to the body 21. The main body 21 includes a pressing electrode 21A and a main portion 21B, and a hollow portion 21h extending along a cylindrical axis AX is formed as a whole. In the present embodiment, the main body axis AX is provided above the lower electrode 10 in a direction extending vertically. A protrusion 21 p into which the airbag 22 is fitted is formed in the central portion of the surface of the lower end of the body 21 (the end near the lower electrode 10). In the present embodiment, the hollow portion 21h of the main body 21 is reduced in diameter near the protrusion 21p and penetrates the lower end surface of the main body 21. The airbag 22 is attached to the outside of the protrusion 21p so as to cover the outer periphery of the protrusion 21p. The airbag 22 is an elastic member such as silicone rubber, and is formed into a hollow shape that can inject a gas (typically, air) into the inside like a swimming ring. The airbag 22 is sandwiched between the lower end surface of the main body 21 and the electrode wafer 23. Between the lower end surface of the body 21 and the electrode wafer 23, a gap is formed to accommodate the airbag 22, and the airbag 22 expands inward toward the axis AX, thereby allowing the airbag 22 to enter the hollow portion 21h.

The electrode wafer 23 is formed in a disc shape having a step. The electrode wafer 23 is formed with a through hole that communicates with the hollow portion 21h of the main body 21 and the annular central hole of the airbag 22. The through-hole of the electrode wafer 23 is formed to have a larger outer diameter than the outer peripheral portion Cp of the cover C and a smaller outer diameter than an edge Ce of the cover C. The thickness around the through hole of the electrode wafer 23 is such that when the cover C is inserted into the through hole until the edge Ce touches the electrode wafer 23, the outer peripheral portion Cp of the cover C will penetrate the center hole of the airbag 22. The wafer fixing nut 24 has an outer diameter larger than that of the main body 21. The wafer fixing nut 24 is recessed in the direction extending from the upper surface toward the axis AX so as to accommodate the electrode wafer 23. The wafer fixing nut 24 is configured such that an internal thread 24w is formed on an inner wall of a portion that is recessed toward the inside, and the external thread 21w that can be screwed into a lower portion of a side surface of the body 21 is screwed. The wafer fixing nut 24 has a through hole 24h formed in the central portion, and the through hole 24h is used to pass a portion having a larger diameter than the through hole of the electrode wafer 23. Typically, the upper electrode 20 is a main body 21, an electrode wafer 23, and a wafer fixing nut 24 formed of a highly conductive metal. The upper electrode 20 is configured such that the main body 21, the bladder 22, the electrode wafer 23, and the wafer fixing nut 24 are arranged concentrically about the axis AX.

The upper electrode 20 is configured to supply the gas F into the airbag 22 after inserting the cover C into the through hole of the electrode wafer 23 until the edge Ce contacts the electrode wafer 23, so that the airbag 22 is inflated toward the axis AX. The outer peripheral portion Cp of the cover C is held. At this time, since the airbag 22 expands inwardly and uniformly over the entire periphery, the cover C is held on the upper electrode 20 in a state where the axis of the cover C and the axis AX of the upper electrode 20 coincide. The upper electrode 20 is fixed to the upper moving device 32. The upper electrode 20 is configured to move back and forth to and from the lower electrode 10 by the operation of the upper moving device 32. In other words, the upper electrode 20 is configured to be movable back and forth in the vertical direction V by the operation of the upper moving device 32.

The configuration of the fusion splicing device 1 will be described with reference again mainly to FIGS. 1 and 2. The lower electrode 10 and the upper electrode 20 are connected to a power source (not shown) through a cable (not shown). The welding device 1 is configured to apply a voltage by turning on a power source (not shown) after the core rod S held by the lower electrode 10 is brought into contact with the cover C held by the upper electrode 20, thereby allowing current to flow through the lower electrode 10 and the core. The rod S, the cover C, and the upper electrode 20.

The moving device 30 in this embodiment is composed of a lower moving device 31 that moves the lower electrode 10 on the reference plane H, and an upper moving device 32 that moves the upper electrode 20 in the vertical direction V. In other words, the lower mobile device 31 and the upper mobile device 32 are collectively referred to as a mobile device 30. The lower moving device 31 is mounted on a base 81 fixed to the frame of the welding device 1. The abutment 81 is a table having a surface that expands in the horizontal direction. The upper moving device 32 is fixed to the upper part of the gate post 28 fixed to the base 81. The upper moving device 32 supports the upper electrode 20 so as to be movable back and forth in the vertical direction V. The gate post 28 operates in cooperation with the upper electrode 20 and the upper moving device 32 to form a structure that determines the position of the cover C (joining target member) held by the upper electrode 20. As described above, the structure that determines the position of the members to be joined is typically a structure such as a holder or a pillar supporting the holder.

The mandrel camera 41 is separated from the lower electrode 10 in the horizontal direction and is provided above the temporary stage 42 provided on the base 81. The temporary table 42 is a table on which the mandrel S (see FIG. 3) is temporarily installed. The temporary table 42 is configured to support the base portion Sb at a height with the lead wire Sd suspended in the air with the mounting portion St facing upward. The mandrel camera 41 provided above the temporary table 42 is configured to be able to grasp the outline of the base Sb of the mandrel S and the position of the mandrel mark Sm by photographing the mandrel S placed on the temporary table 42 from above. The base Sb is a portion held by the lower electrode 10 when being transported to the lower electrode 10, and the outline of the base Sb is the outline of the mandrel S when the mandrel S is projected onto the reference plane H. In other words, the mandrel camera 41 is capable of grasping the outline of the mandrel S projected on the reference plane H, and corresponds to a contour grasping section. Here, the contour of the core rod S when the core rod S is projected on the reference plane H refers to the contour of the core rod S when viewed in a direction perpendicular to the reference plane H. In addition, a device D manufactured by fusing the cover C to the core rod S may be placed on the temporary table 42 (see FIG. 3 (A)). The mandrel camera 41 captures the device D placed on the temporary table 42 and can grasp the outer edge of the cover C in the device D when projected on the reference plane H and the outline of the mandrel S, and also has the joint Component status control section.

The welding device 1 of this embodiment further includes a stem pallet 83, a cap pallet 85, a first core rod conveyer 51A and a second core rod for conveying the core rod S. The conveyor 51B and a capping conveyor 56 for transporting the cap C. The mandrel holder 83 is a holder in which a plurality of mandrels S are arranged. The mandrel holder 83 is formed so as to have a plurality of pits (not shown) in which the lead wires Sd of the mandrel S can be accommodated. Below the mandrel holder plate 83, a camera (not shown) capable of recognizing the absence of the wire Sd is provided. The mandrel holder 83 is provided on the side opposite to the lower electrode 10 with respect to the temporary stage 42 in a plan view. The mandrel holder plate 83 is detachably attached to the mandrel holder support portion 84. The mandrel holder support portion 84 includes: a main rail 84a extending in a direction (X direction) where the mandrel holder 83 approaches the lower electrode 10; and a branch rail 84b extending in a direction extending from the main rail 84a. The orthogonal direction (Y direction) extends. The mandrel holder 83 is configured to move in the X direction and the Y direction along with the movement along the branch rail 84b of the mandrel holder 83 itself and the main rail 84a along the branch rail 84b. The cover tray 85 is a tray in which a plurality of covers C are arranged. The lid support plate 85 is formed by arranging a plurality of recesses (not shown) capable of being embedded in the edge Ce. A recess (not shown) formed in the lid support plate 85 has a shape corresponding to the lid mark Cm, and a position (direction) of the lid C disposed on the lid support plate 85 can be determined. A recess (not shown) formed in the lid support plate 85 is formed to a depth such that the outer peripheral portion Cp is not buried when the edge Ce is fitted. The lid support plate 85 is detachably attached to the lid support plate 86. The lid support plate 86 includes a main rail 86a extending toward the direction (X direction) where the lid support 85 approaches the lower electrode 10, and a lid moving guide 86b facing the main rail. The direction in which 86a extends is an orthogonal direction (Y direction). The lid support plate 85 is configured to be able to move in the X direction and the Y direction along with the movement of the lid moving guide 86b along the lid supporting plate 85 and the main rail 86a along the lid moving guide 86b. mobile.

The first mandrel transporter 51A is a device provided between the lower electrode 10 and the temporary table 42, and is a device that transfers the mandrel S and the device D between the lower electrode 10 and the temporary table 42. The first mandrel transporter 51A includes a first rotation shaft 52A and a first arm 53A. The first rotation axis 52A is provided at a midpoint of a virtual straight line so as to extend vertically, and the virtual straight line connects the hole 10h for the core rod of the lower electrode 10 and the hole for accommodating the wire Sd formed on the temporary table 42. The first arm 53A is an elongated plate-like member, and a midpoint portion in the longitudinal direction is rotatably attached to the first rotation shaft 52A. At both ends of the first arm 53A, a first mandrel holding portion 54A capable of holding the mandrel S is formed. Each of the first mandrel holding portions 54A is formed on the lower side of the first arm 53A, and one of them is formed at a position facing the hole 10h for the mandrel of the lower electrode 10, and the other is formed at a position facing the housing. The position of the hole of the wire Sd in the temporary table 42.

The second mandrel carrier 51B is a device provided between the mandrel holder 83 and the temporary table 42, and is a device that transfers the mandrel S and the device D between the mandrel holder 83 and the temporary table 42. The second mandrel conveyor 51B includes a second rotation shaft 52B and a second arm 53B. The second rotation axis 52B is provided at a midpoint of a virtual straight line in a vertically extending manner, and the virtual straight line is a hole that connects the core rod holder 83 and the wire Sd formed in the temporary table 42. The second arm 53B is an elongated plate-shaped member, and a midpoint portion in the longitudinal direction is rotatably attached to the second rotation shaft 52B. A second mandrel holding portion 54B capable of holding the mandrel S is formed at both ends of the second arm 53B. Each of the second mandrel holding portions 54B is formed on the lower surface of the second arm 53B, and one of the second mandrel holding portions 54B is formed opposite to the mandrel holder 83 and the other is formed on the temporary table 42 opposite to the accommodation. The position of the hole of the lead Sd.

The capping conveyor 56 is located away from the lower electrode 10 and viewed from above, and is provided on the opposite side of the temporary stage 42 from the lower electrode 10. The capping conveyor 56 includes a capping holding portion 58 capable of gripping the cap C, and a support shaft 57 which supports the capping gripping portion 58. The cover holding portion 58 is supported on the support shaft 57 in a reversible manner. The support shaft 57 is configured to be movable back and forth between the lower portion of the upper electrode 20 and the upper portion of the lid support plate 85 in a direction in which the lid moving guide 86b extends. The capping conveyor 56 is configured such that one of the caps C placed on the capping tray 85 can be gripped downward by the capping holding portion 58 and moved along the cap moving guide 86b toward the upper electrode 20 The cover holding portion 58 is reversed to face upward, and the cover C is inserted into the center hole of the airbag 22 of the upper electrode 20 from the lower side.

The control device 60 controls an operator of the fusion splicing device 1. The control device 60 is configured to transmit a control signal to the lower electrode 10 and the upper electrode 20 by a wired or wireless method, respectively, thereby holding and releasing the core rod S in the lower electrode 10 and the upper electrode 20 individually. The cover C is held and released. In addition, the control device 60 is configured to transmit a control signal to the lower mobile device 31 and the upper mobile device 32 by a wired or wireless method, respectively, whereby the presence of the lower electrode 10 by the lower mobile device 31 can be performed individually. The movement of the reference plane H and the movement of the upper electrode 20 in the vertical direction V by the upper moving device 32. In addition, the control device 60 is configured to be electrically connected to the mandrel camera 41 in a wired or wireless manner, and can receive an image captured by the mandrel camera 41. The control device 60 is configured to appropriately move the first mandrel carrier 51A, the second mandrel carrier 51B, the capping conveyor 56, the mandrel holder 83, and the capping holder 85, respectively. In addition, the control device 60 is configured to be electrically connected to a power source (not shown) in a wired or wireless manner, and can control whether a voltage is applied between the lower electrode 10 and the upper electrode 20.

Next, a method for manufacturing a joint member according to an embodiment of the present invention will be described with reference to FIG. 6. FIG. 6 is a flowchart showing a procedure for manufacturing the device D as a bonding member. The manufacturing method of the device D (manufacturing method of the device D) to be described below is typically performed by the welding apparatus 1 described so far. The manufacturing method of the device D to be described below is an explanation of the function of the welding device 1 as well. In the following description of the manufacturing method of the device D, when referring to the configuration of the welding device 1 or the structure of the device D, it is appropriate to refer to FIGS. 1 to 5. Typically, before welding device 1 starts, the welding device 1 passes through a mandrel hole 10h of the lower electrode 10 (a circular space for holding the mandrel S) by a virtual straight line extending from the axis AX of the upper electrode 20. At the center, a lower electrode 10 is placed.

When the device D is manufactured, a mandrel holder 83 in which a plurality of mandrels S are arranged and a lid holder 85 in which a plurality of covers C are arranged are carried into the welding device 1 (S1). The mandrel holder 83 carried into the welding device 1 is attached to the mandrel holder support portion 84, and the capping plate 85 is attached to the capping plate support portion 86. Next, the control device 60 uses the second mandrel carrier 51B to temporarily place one of the mandrels S placed on the mandrel holder 83 on the temporary table 42 (S2). At this time, the control device 60 moves the mandrel holder 83 by the mandrel holder support portion 84 so that the mandrel S to be held comes to the position of the second mandrel holding portion 54B of the second mandrel carrier 51B. . After the control device 60 holds one mandrel S by the second mandrel holding portion 54B, the second arm 53B is rotated 180 degrees in the horizontal direction and placed on the temporary table 42. In addition, when a defective mandrel S is found by a camera (not shown) provided below the mandrel holder 83, the control device 60 does not temporarily place the defective mandrel S on the temporary table 42 and loads it. Placed in a separate tray (not shown). The defective mandrel S placed in the small bracket will be carried out later, and will be used again after the defect is corrected separately.

As soon as the mandrel S is placed on the temporary table 42, the control device 60 captures the mandrel S by the mandrel camera 41 (S3). Thereby, the outline of the mandrel S can be grasped. Therefore, the step (S3) of photographing the mandrel S by the mandrel camera 41 is equivalent to the outline grasping step. In addition, by shooting the mandrel S with the mandrel camera 41, the position of the mandrel mark Sm can be grasped. The image of the mandrel S captured by the mandrel camera 41 is transmitted to the control device 60 as data. Next, the control device 60 uses the first mandrel carrier 51A to carry the mandrel S placed on the temporary table 42 to the position of the lower electrode 10 and holds the mandrel S at the lower electrode 10 (S4). At this time, the control device 60 separates the reference portion 11 and the pressing portion 12 constituting the holder 10c of the lower electrode 10 from each other, and the core rod S placed on the temporary table 42 is passed through the first core rod holding portion 54A. After holding, the first arm 53A is rotated 180 degrees in the horizontal direction to be transported between the reference portion 11 and the pressing portion 12, and the reference portion 11 is first moved to a position where the core rod S is to be held, and then the pressing is performed by pressing The portion 12 is moved toward the reference portion 11, and the core rod S is sandwiched and held by the reference portion 11 and the pressing portion 12.

In the step (S4) of holding the mandrel S by the lower electrode 10, when the size of the contour of the held mandrel S is not different from the expected size, the cover C held by the upper electrode 20 and the The positional relationship in plan view of the core rod S held on the lower electrode 10 becomes an appropriate positional relationship. However, when the outline size of the core rod S is different from the expected size due to the thickness of the plating applied to the core rod S, etc., the cover C held by the upper electrode 20 and the lower electrode are held by the lower electrode. The positional relationship of the core rod S of 10 in a plan view becomes an inappropriate positional relationship. This is because the lower electrode 10 sets the contact portion between the reference portion 11 and the core rod S as the reference position Sp. When the cover C held by the upper electrode 20 and the mandrel S held by the lower electrode 10 are in an inappropriate positional relationship in plan view, the cover C is bonded, and a mismatched device D is manufactured. In order to avoid such a bad situation, in the welding device 1, after the core rod S is held by the lower electrode 10 (S4), the control device 60 is based on the step (S3) of shooting the core rod S by the core rod camera 41. With the obtained image data of the core rod S, the lower electrode 10 holding the core rod S is moved to the position of the core rod S in the state where the core rod S is held on the lower electrode 10 and held on the upper electrode. The position of the cover C of 20 becomes an appropriate position (joining position) (first joining target member moving step: S5). Furthermore, in this embodiment, based on the image data of the core rod S, the lower electrode 10 is rotated and moved in the θ direction (refer to FIG. 4) so that the core rod mark Sm coincides with the cap mark Cm. . In addition, when the mandrel S is held on the lower electrode 10 using the first mandrel carrier 51A (S4), the mandrel obtained in step (S3) of the mandrel S photographed by the mandrel camera 41 may be used. In the image data of the rod S, the position of the lower electrode 10 in the XY direction and / or the θ direction is pre-adjusted first to shorten the time required for the position adjustment in the first step (S5) of moving the object to be joined.

Next, the control device 60 uses the capping conveyor 56 to transfer one of the caps C placed on the capping tray 85 to the upper electrode 20 and holds the cap C on the upper electrode 20 (S6). At this time, the control device 60 moves the capping tray 85 by the capping tray support portion 86 so that the cap C to be held comes to the position of the cap holding portion 58 of the capping conveyor 56 and moves one The cap C is held by the cap holding portion 58. Then, while moving the support shaft 57 along the cover moving guide 86b toward the upper electrode 20, the cover holding portion 58 is turned upside down, and the cover C is transferred to the center hole of the airbag 22 of the upper electrode 20. Directly below. At this time, the position adjustment in the θ direction of the cover C may be performed. Further, the outer peripheral portion Cp of the cover C is inserted into the center hole of the airbag 22 until the edge Ce touches the electrode wafer 23, and the airbag 22 is expanded to hold the cover C. The upper electrode 20 expands the airbag 22 and keeps the cover C. Therefore, the airbag 22 contacts the entire circumference of the outer peripheral portion Cp of the cover C evenly, and the cover C is located at the center in a plan view. The axis AX of the upper electrode 20 Then the center of the cover C is penetrated. In this embodiment, the upper electrode 20 is supported by the gate post 28, and although it can move in the vertical direction, it cannot move in the horizontal direction. Therefore, when the cover C is held by the upper electrode 20, it will be viewed from above. Move to the engaged position under observation. Therefore, in this embodiment, the step (S6) of conveying the cover C from the cover holder 85 to the upper electrode 20 and holding it at the upper electrode 20 corresponds to the second joining target member moving step. In FIG. 6, for convenience of explanation, it is assumed that the cover C is held on the upper electrode 20 after the core rod S is moved from the temporary position (S2) of the core rod S to the joining position (S5) of the core rod S (S6). ), But it may be performed before or at the same time as the movement from the temporary setting (S2) of the core rod S to the joining position (S5) of the core rod S.

After the mandrel S is held on the lower electrode 10 and the cover C is held on the upper electrode 20, the upper electrode 20 holding the cover C is lowered, and the edge Ce of the cover C contacts the base Sb of the mandrel S. , And the cover C and the core rod S are joined to manufacture the device D (joining step: S7). After the edge Ce is brought into contact with the base Sb, the upper electrode 20 is pushed further toward the lower electrode 10, thereby the contact portion (projection) of the base Sb of the core rod S and the edge Ce of the cover C is added. When the power supply (not shown) is turned on, resistance welding is performed to energize the projection part while pressing the cover, thereby bonding the cover C and the core rod S. As soon as the core rod S and the cover C are joined, the upper electrode 20 releases the holding of the cover C (S8), and moves upward to move away from the lower electrode 10. Next, the control device 60 releases the holding of the mandrel S (S9). Next, the control device 60 uses the first mandrel transporter 51A to transport the device D located at the lower electrode 10 to the temporary table 42 (S10).

As soon as the device D is placed on the temporary table 42, the control device 60 captures the device D by the mandrel camera 41 (S11). In this way, the outer edge of the cover C and the profile of the core rod S in the state of the device D can be grasped, and whether the positions of the cover C and the core rod S are offset in a plan view (typically, Whether the centers of the two are offset). The image of the device D captured by the mandrel camera 41 is transmitted as data to the control device 60. When the position of the cover C and the mandrel S is offset, it is fed back to the mandrel to be joined next. S is aligned with cover C. When the device D is captured by the mandrel camera 41 (S11), the control device 60 uses the second mandrel carrier 51B to transfer the device D placed on the temporary table 42 to the storage position of the device D (S12). In this embodiment, the device D of the temporary table 42 is transferred to the core rod holder 83, and the device D is stored in the core rod holder 83. At this time, the device D is stored in the position of the core rod S which is removed for the bonding of the core rod holder 83 or the position where the core rod S is not originally placed. In this way, the manufacture of one device D is completed. When the device D is to be remanufactured next, the above-mentioned flow shown in FIG. 6 is repeated.

In summary, according to this embodiment, even if the size of the contour of the core rod S is changed, the position of the lower electrode 10 on the reference plane H can be adjusted before the core rod S is held on the lower electrode 10, so that the desired bonding can be performed. The core rod S is aligned with the cover C. In addition, the position of the lower electrode 10 in the reference plane H is adjusted based on the image captured by the mandrel camera 41. Therefore, the reference portion can be moved immediately after the mandrel S is held by the lower electrode 10 or while the mandrel S is held. 11 and / or the pressing portion 12 can adjust the position of the lower electrode 10 while reducing the time required for the position adjustment and improving the manufacturing efficiency of the device D.

In the above description, although it is assumed that the deviation between the core rod S and the cover C in the device D captured by the core rod camera 41 is fed back to the position adjustment of the lower electrode 10 holding the core rod S, A temperature sensor 46 (shown by a two-dot chain line in the figure) that detects the temperature near the upper electrode 20 can also be provided instead of the deviation between the core rod S and the cover C in the device D captured by the core rod camera 41 And adjusts the position of the lower electrode 10 by feeding back the temperature detected by the temperature change detection unit 46. In this case, it can be structured as follows. Typically, the temperature sensor 46 uses a thermocouple. The temperature sensor 46 is configured to be mounted on the door post 28 and can detect a temperature change of the door post 28. The gate post 28 is provided with an upper moving device 32 supporting the upper electrode 20, and may be referred to as a structure that determines the position of the cover C to be held at the upper electrode 20. Therefore, the temperature sensor 46 corresponds to a temperature change detection unit. The control device 60 is configured to be electrically connected to the temperature sensor 46 in a wired or wireless manner, and receives a temperature change detected by the temperature sensor 46 as a signal. In addition, the control device 60 stores in advance a shift amount of the gate post 28 with respect to the temperature change detected by the temperature sensor 46 for a standard position, and the standard is a set of the core rod S and the cover C at the reference temperature The position where the joining will proceed appropriately. The gate post 28 supporting the upper electrode 20 may expand or contract in accordance with a change in temperature, and the joint position of the upper electrode 20 may be shifted. The control device 60 compares the temperature detected by the temperature sensor 46 with the shifted amount of the gate post 28 memorized with respect to the temperature change detected by the temperature sensor 46 in advance. In the flow chart shown in the step (S5) of moving the core rod S held by the lower electrode 10 to the joining position, the shift amount of the gate post 28 with respect to the temperature change is added. At this time, the temperature is detected by the temperature sensor 46 until the step (S5) of moving the core rod S held at the lower electrode 10 to the joining position, and the temperature detected by the temperature sensor 46 is reflected. The step (S5) of moving the mandrel S held by the lower electrode 10 to the joining position, and the step of photographing the device D by the mandrel camera 41 from the flowchart shown in FIG. 6 (S11).

In the above description, although the reference portion 11 and the pressing portion 12 are configured to be able to move back and forth to and from each other along the top surface 10f, the reference portion 11 may be fixed to the electrode body 10b. Only the pressing portion 12 moves back and forth with respect to the reference portion 11. However, when the reference portion 11 and the pressing portion 12 are configured to move, it is preferable to prevent the core rod S from interfering with the holder 10c when the core rod S is placed on the lower electrode 10.

In the above description, the lower electrode 10 is moved in the reference plane H (horizontal plane) and the upper electrode 20 is moved in the vertical direction V (vertical direction). However, the lower electrode 10 may be moved in the vertical direction V (lead). (Vertical direction), and the upper electrode 20 moves within the reference plane H (horizontal plane). Alternatively, the lower electrode 10 may not be moved, and the upper electrode 20 may be moved in both the reference plane H (horizontal plane) and the vertical direction V (vertical direction). Conversely, the upper electrode 20 may not be moved, and The lower electrode 10 moves in both the reference plane H (horizontal plane) and the vertical direction V (vertical direction). It can also be assumed that the lower electrode 10 moves in the reference plane H (horizontal plane) or in the vertical direction V (vertical direction). On one side, the upper electrode 20 moves in both the reference plane H (horizontal plane) and the vertical direction V (vertical direction). The upper electrode 20 can also move in the reference plane H (horizontal plane) or in the vertical direction V (vertical direction). Either the lower electrode 10 moves in both the reference plane H (horizontal plane) and the vertical direction V (vertical direction). The lower electrode 10 and the upper electrode 20 can also move in the reference plane H (horizontal plane) and the vertical direction. V (vertical direction) both sides.

In the above description, although the bonding member (device D) is an optical semiconductor, it may also be a sensor article or the like manufactured by bonding two members.

Claims (8)

An apparatus for manufacturing a joining member is an apparatus for manufacturing a joining member formed by joining a first joining object member and a second joining object member. The joining member manufacturing apparatus is provided with a first holder to hold the first joining object member ; The second holder, which holds the second member to be joined; the moving device, which moves the first holder relative to the second holder in a reference plane, and in a direction perpendicular to the reference plane The vertical direction moves relatively back and forth; the contour grasping part is the position away from the first holder when viewing on the reference plane, and grasps the portion of the first joining object member held by the first holder The contour when projected on the reference plane; and a control device that controls the moving device; the first holder is configured to hold the first bonding target member with a part of the contour of the first bonding target member as a reference position The control device is configured to make the first retainer in accordance with the contour grasped by the contour grasping part With respect to the second holder, the relative movement between the first bonding object member held by the first holder and the second bonding object member held by the second holder in the reference plane may cause The position where the first holder is properly engaged with respect to the movement of the second holder relative to the vertical direction. The joint member manufacturing apparatus as described in item 1 of the patent application scope includes a joint member state grasping unit that grasps when the second joint object member of the joint members is projected on the reference plane The outer edge and the contour; the control device is configured to adjust the position of the outer edge and the contour grasped by the joint member state grasping portion to adjust the joint member in the reference plane when the joint member is to be manufactured 1 The relative movement of the holder relative to the aforementioned second holder. The joint member manufacturing apparatus according to item 1 of the patent application range, wherein the first holder has a grip mechanism that grips the first joint object member; the grip mechanism includes a reference portion that contacts the reference position; And the pressing portion cooperate with the reference portion to sandwich the first member to be joined; the reference portion and the pressing portion are configured to move back and forth relatively close to and away from each other. The joint member manufacturing apparatus according to item 2 of the patent application range, wherein the first holder has a grip mechanism that grips the first joint object member; the grip mechanism includes: a reference portion that contacts the reference position; And the pressing portion cooperate with the reference portion to sandwich the first member to be joined; the reference portion and the pressing portion are configured to move back and forth relatively close to and away from each other. The joint member manufacturing apparatus according to any one of claims 1 to 4 includes a temperature change detection unit that detects the first item determined to be held by the first holder 1. The structure of the position of the bonding target member, and the temperature change of at least one of the structures that determine the position of the second bonding target member held by the second holder; the control device is configured to be based on the temperature change detection section The detected temperature change adjusts the relative movement of the first holder relative to the second holder in the reference plane. An apparatus for manufacturing a joining member is an apparatus for manufacturing a joining member formed by joining a first joining object member and a second joining object member. The joining member manufacturing apparatus is provided with a first holder to hold the first joining object member A second holder, which holds the second member to be joined; a moving device, which moves the first holder relative to the second holder in a reference plane, and toward the direction perpendicular to the reference plane The vertical direction relatively moves back and forth; the temperature change detection unit detects the structure that determines the position of the first joining object member held by the first holder, and determines the second member held by the second holder A change in temperature of at least one of the structures of the positions of the joining target members; and a control device that controls the moving device; the control device is configured to perform the first holding by the first holder at the reference temperature The standard position of the joining of the joining object member and the second joining object member held by the second holder is memorized in advance The deviation amount of the aforementioned structure with respect to the temperature change detected by the aforementioned temperature change detection section, and the deviation of the temperature detected by the aforementioned temperature change detection section against the previously memorized deviation of the standard position from the aforementioned structure Adjust the relative movement of the first holder in the reference plane relative to the second holder. A method of manufacturing a joining member is a method of manufacturing a joining member formed by joining a first joining object member and a second joining object member. The joining member manufacturing method includes: a contour grasping step to grasp the first joining The contour of the object member when projected on the reference plane; the first step of moving the object member is to move the first object to be joined to the second object to be joined when viewed on the reference plane Position; the second joining object member moving step is to move the second joining object member away from the first joining object member in a vertical direction that belongs to a direction perpendicular to the reference plane, and to view when projected on the reference plane Moving to the joining position; and the joining step of approaching the first joining object member and the second joining object member at the joining position when viewed away from the vertical direction and projected on the reference plane, and approaching in the vertical direction Instead, they are joined to produce the aforementioned joining member; the aforementioned outline grasping step configuration In order to grasp the contour when the projection is projected on the reference plane and away from the joining position, the first joining object member moving step is configured to adjust the first contour according to the contour grasped in the contour grasping step The relative movement of the member to be joined relative to the aforementioned second member to be joined. A method for manufacturing a joining member is a method of manufacturing a joining member formed by joining a first joining object member and a second joining object member. The joining member manufacturing method includes: a temperature detection step that detects and determines the first The structure of the position of the joining object member and the temperature of at least one of the structures determining the position of the second joining object member; the first joining object member moving step is to move the first joining object member to be projected on the reference plane When viewing, the bonding position with the second bonding target member is to be performed; the second bonding target member moving step is to move the second bonding target member in a vertical direction that belongs to a direction perpendicular to the reference plane relative to the first The member to be joined moves away, and moves to the joining position when viewed while projecting on the reference plane; and the joining step is to move the first joint located at the joining position when viewed away from the vertical direction and projected on the reference plane The target member and the second bonding target member are approached in the vertical direction The joint member is manufactured together; the first joint object member moving step is configured to: relative to the reference temperature, the standard position at which the first joint object member and the second joint object member are joined, and the relative position of the structure in advance The offset of the change in temperature detected in the temperature detection step, and the change in temperature detected in the temperature detection step is adjusted according to the relationship between the standard position and the offset of the structure previously grasped. The relative movement of the first joining object member relative to the second joining object member.