CN108687434B - Apparatus for manufacturing joint member and method for manufacturing joint member - Google Patents

Apparatus for manufacturing joint member and method for manufacturing joint member Download PDF

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Publication number
CN108687434B
CN108687434B CN201810212610.6A CN201810212610A CN108687434B CN 108687434 B CN108687434 B CN 108687434B CN 201810212610 A CN201810212610 A CN 201810212610A CN 108687434 B CN108687434 B CN 108687434B
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China
Prior art keywords
joined
joining
holder
target member
reference plane
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CN201810212610.6A
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Chinese (zh)
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CN108687434A (en
Inventor
西村博信
野崎修一
清水久
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Origin Electric Co Ltd
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Origin Electric Co Ltd
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Publication of CN108687434A publication Critical patent/CN108687434A/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K11/00Resistance welding; Severing by resistance heating
    • B23K11/002Resistance welding; Severing by resistance heating specially adapted for particular articles or work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K11/00Resistance welding; Severing by resistance heating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K11/00Resistance welding; Severing by resistance heating
    • B23K11/24Electric supply or control circuits therefor
    • B23K11/25Monitoring devices
    • B23K11/252Monitoring devices using digital means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K11/00Resistance welding; Severing by resistance heating
    • B23K11/30Features relating to electrodes
    • B23K11/3009Pressure electrodes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K11/00Resistance welding; Severing by resistance heating
    • B23K11/30Features relating to electrodes
    • B23K11/31Electrode holders and actuating devices therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/36Electric or electronic devices
    • B23K2101/40Semiconductor devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/18Dissimilar materials

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Resistance Welding (AREA)

Abstract

The invention relates to a device and a method for manufacturing a joint member, which can quickly and properly join members to be joined. The joint member manufacturing apparatus includes: a first holder; a second holder; a moving device that relatively moves the first holder with respect to the second holder in a reference plane and relatively reciprocates in a vertical direction; a contour grasping unit configured to grasp a contour of the first member to be joined when projected on the reference plane; and a control device for controlling the moving device. The first holder is configured to hold the first member to be joined with a part of the contour of the first member to be joined as a reference position; the control device is configured to move the first holder relative to the second holder in the reference plane to a position where the first member to be joined held by the first holder and the second member to be joined held by the second holder are properly joined, in accordance with the contour grasped by the contour grasping portion.

Description

Apparatus for manufacturing joint member and method for manufacturing joint member
Technical Field
The present invention relates to a joining member manufacturing apparatus and a joining member manufacturing method, and more particularly, to a joining member manufacturing apparatus and a joining member manufacturing method capable of quickly and appropriately joining members to be joined.
Background
The optical semiconductor is configured by mounting a cap (cap) with a lens (lens) for covering a plug (stem) on which a photoelectric conversion element or the like is mounted. As an apparatus for welding a mandrel and a cap, there is known an apparatus for performing resistance welding by clamping a mandrel to a lower electrode holder (holder) and clamping a cap to an upper tapered collet (electrode), and moving an upper electrode moving table to which an upper tapered collet electrode is fixed by a moving and pressing means in a vertical direction (for example, see patent document 1).
(Prior art document)
(patent document)
Patent document 1: japanese patent laid-open publication No. 2003-154463.
Disclosure of Invention
(problems to be solved by the invention)
The lower electrode can clamp the core rod by bringing the holder divided into two into proximity, and release the clamping by coming away. At this time, after the mandrel is set, in order to clamp the mandrel in such a manner that one of the holders is fixed in advance at the clamping position and the other holder is brought close to the one of the holders, when the mandrel is clamped with the holder fixed in advance as a reference, the central positions of both the mandrel and the cap are viewed while the speed of attaching and detaching the mandrel is increased more than that at the time of clamping, so that the number of welding possibilities per unit time can be increased on average, and the productivity can be improved. Welding of a plug and a cap for an optical semiconductor requires extremely high positioning accuracy, but sometimes cannot be properly joined due to a welding object such as dimensional variation of a welding object member or variation in thickness of a plating layer, or due to a change in the surrounding environment such as a temperature change of a place where welding is performed.
In view of the above problems, an object of the present invention is to provide a joined member manufacturing apparatus and a joined member manufacturing method capable of joining members to be joined quickly and appropriately.
(means for solving the problems)
In order to achieve the above object, a joined member manufacturing apparatus according to a first embodiment of the present invention is, for example, an apparatus 1 for manufacturing a joined member D (for example, see fig. 3a and 3B) in which a first member to be joined S and a second member to be joined C are joined, as shown in fig. 1, the apparatus 1 including: a first holder 10 for holding a first joining target member S; a second holder 20 for holding the second engagement object member C; a moving device 30 for relatively moving the first holder 10 with respect to the second holder 20 within the reference plane H and relatively reciprocating in a vertical direction V which is a direction perpendicular to the reference plane H; a contour grasping portion 41 for grasping a contour of the first member to be welded S when the portion held by the first holder 10 is projected on the reference plane H; and a control device 60 for controlling the moving device 30; the first holder 10 is configured to hold the first joining target member S with a part of the contour of the first joining target member S as a reference position Sp (see fig. 4, for example); the control device 60 is configured to relatively move the first holder 10 with respect to the second holder 20 in the reference plane H to a position where the first member to be joined S held by the first holder 10 and the second member to be joined C held by the second holder 20 are appropriately joined by the movement of the first holder 10 with respect to the second holder 20 in the relative vertical direction V, in accordance with the contour grasped by the contour grasping portion 41.
With this configuration, even when the contour of the first member to be joined is varied, the first member to be joined and the second member to be joined can be joined quickly and appropriately.
A joined member manufacturing apparatus according to a second embodiment of the present invention is, for example, as shown in fig. 1, the joined member manufacturing apparatus 1 according to the first embodiment of the present invention, and includes a joined member state grasping portion 41 for grasping an outer edge and a contour of a joined member D (see, for example, fig. 3(a) and 3(B)) when a second joining target member C is projected on a reference plane H; the control device 60 is configured to adjust the relative movement of the first holder 10 with respect to the second holder 20 in the reference plane H when the engaging member D (see, for example, fig. 3a and 3B) is to be manufactured next, in accordance with the positional relationship between the outer edge and the contour grasped by the engaging member state grasping portion 41.
When the structure is formed in this way, the state of the bonding member can be fed back to the alignment of the first bonding object member and the second bonding object member to be bonded later, and the bonding adequacy of the two members can be satisfied.
A bonding member manufacturing apparatus according to a third embodiment of the present invention is, for example, the bonding member manufacturing apparatus 1 according to the first or second embodiment of the present invention as shown in fig. 1, wherein the first holder 10 includes a gripping mechanism 10c for gripping the first bonding target member S, and the gripping mechanism 10c includes: a reference portion 11 for contacting the reference position Sp (see fig. 4, for example); and a pressing portion 12 for sandwiching the first joining target member S in cooperation with the reference portion 11; the reference portion 11 and the pressing portion 12 are configured to reciprocate relatively to approach and separate from each other.
With this configuration, the first joining target member can be smoothly gripped by the first holder.
A joining member manufacturing apparatus according to a fourth embodiment of the present invention is, for example, a joining member manufacturing apparatus 1 according to any one of the first to third embodiments of the present invention, as shown in fig. 1, and includes: a temperature change detection unit 46 that detects a change in temperature of at least one of the structure that determines the position of the first welding-target member S held by the first holder 10 and the structure 28 that determines the position of the second welding-target member C held by the second holder 20; the controller 60 is configured to adjust the relative movement of the first holder 10 with respect to the second holder 20 in the reference plane H in accordance with the change in temperature detected by the temperature change detecting unit 46.
When constituted in this manner, positional deviation accompanying temperature change can be corrected.
A joined member manufacturing apparatus according to a fifth embodiment of the present invention is, for example, an apparatus 1 for manufacturing a joined member D (for example, see fig. 3a and 3B) in which a first member to be joined S and a second member to be joined C are joined, as shown in fig. 1, the apparatus 1 including: a first holder 10 for holding a first joining target member S; a second holder 20 for holding the second engagement object member C; a moving device 30 for relatively moving the first holder 10 with respect to the second holder 20 within the reference plane H and relatively reciprocating in a vertical direction belonging to a direction perpendicular to the reference plane H; a temperature change detection unit 46 for detecting a change in temperature of at least one of a structure for determining the position of the first welding target member S held by the first holder 10 and a structure for determining the position of the second welding target member C held by the second holder 20; and a control device 60 for controlling the moving device 30; the controller 60 is configured to adjust the relative movement of the first holder 10 with respect to the second holder 20 in the reference plane H with respect to the reference position at which the first joining target member S held by the first holder 10 and the second joining target member C held by the second holder 20 are to be joined at the reference temperature, based on the change in temperature detected by the temperature change detecting unit 46.
When constituted in this manner, positional deviation accompanying temperature change can be corrected.
In order to achieve the above object, a method for manufacturing a joined member according to a sixth embodiment of the present invention is a method for manufacturing a joined member D (see, for example, fig. 3(a) and 3(B)) in which a first member to be joined S and a second member to be joined C are joined, as shown in, for example, fig. 1 and 6, the method including: a contour grasping step (S3) for grasping a contour of the first joining target member (S) when projected on the reference plane (H); a first joining target member moving step (S5) of moving the first joining target member S to a joining position at which joining with the second joining target member C is to be performed when viewed as being projected on the reference plane H; a second joining target member moving step (S6) of moving the second joining target member C away from the first joining target member S in a direction perpendicular to the reference plane H, that is, in the perpendicular direction V, and to a joining position when viewed as being projected on the reference plane H; and a joining step (S7) of joining the first joining-object member S and the second joining-object member C, which are located at the joining positions when viewed as being apart from and projected onto the reference plane H in the vertical direction V, to approach each other in the vertical direction V to produce a joined member D (see, for example, fig. 3(a) and 3 (B)); the first joining target member moving step (S5) is configured to adjust the relative movement of the first joining target member S with respect to the second joining target member C in accordance with the contour grasped in the contour grasping step (S3).
With this configuration, even when the contour of the first member to be joined is varied, the first member to be joined and the second member to be joined can be joined quickly and appropriately.
In order to achieve the above object, a method for manufacturing a joined member according to a seventh embodiment of the present invention is a method for manufacturing a joined member D (see, for example, fig. 3a and 3B) in which a first member to be joined S and a second member to be joined C are joined, as shown in, for example, fig. 1, the method including: a temperature detection step of detecting a temperature around at least one of the first joining target member S and the second joining target member C; a first joining target member moving step of moving the first joining target member S to a joining position at which joining with the second joining target member C is to be performed when viewed as being projected on the reference plane H; a second joining target member moving step of moving the second joining target member S away from the first joining target member S in a vertical direction V which is a direction perpendicular to the reference plane H, and moving to a joining position when viewed as being projected on the reference plane H; and a joining step of joining the first joining target member S and the second joining target member C, which are located at the joining positions when viewed as being apart from and projected on the reference plane H in the vertical direction, to approach each other in the vertical direction V to produce a joined member D; the first joining target member moving step is configured to adjust the relative movement of the first joining target member S with respect to the second joining target member C in accordance with the temperature detected in the temperature detecting step.
When constituted in this manner, positional deviation accompanying temperature change can be corrected.
(efficacy of the invention)
According to the present invention, the members to be joined can be joined quickly and appropriately.
Drawings
Fig. 1 is a longitudinal sectional view showing a schematic configuration of a welding apparatus according to an embodiment of the present invention.
Fig. 2 is a plan view showing a schematic configuration of a welding apparatus according to an embodiment of the present invention.
Fig. 3(a) and 3(B) are views showing an example of the joining member, fig. 3(a) is a perspective view, and fig. 3(B) is an exploded partial sectional side view.
Fig. 4 is a plan view showing a schematic configuration of a clamper (clamp) provided in a lower electrode of a fusion apparatus according to an embodiment of the present invention.
Fig. 5 is a partial vertical sectional view showing a schematic configuration of an upper electrode of a welding apparatus according to an embodiment of the present invention.
Fig. 6 is a flowchart showing a procedure of a method of manufacturing a joined member according to the embodiment of the present invention.
Description of the symbols
1 welding device
10 lower electrode
10b electrode body
10c clamping device
10f top surface
Hole for 10h core rod
11 reference part
12 pressing part
20 upper electrode
21 body
21A compacted electrode
21B main part
Hollow part of 21h
21p protrusion
21w external thread
22 air bag
23 electrode wafer
24 fixing nut
Through the hole for 24h
24w internal thread
28 door post
30 moving device
31 lower moving device
32 upper moving device
41 core rod camera
42 temporary placing table
46 temperature sensor
51A first mandrel conveyer
51B second mandrel transporter
52A first rotation axis
52B second axis of rotation
53A first arm
53B second arm
54A first mandrel grip
54B second mandrel bar holding part
56 closure carrier
57 support shaft
58 cover gripping portion
60 control device
81 base station
83 core rod supporting plate
84 mandrel pallet support
84a main track
84b branch track
85 sealing cover supporting plate
86 seal cover supporting plate supporting part
86a main track
86b closure moving guide
AX axis
C-shaped seal cover
Edge of Ce
Cm closure mark
Cn lens
Cp outer periphery
D device
F gas
H reference plane
S-shaped core rod
Sb base
Sd conductor
Sm core rod mark
Sp reference position
St mounting part
H reference plane
V vertical direction.
Detailed Description
Embodiments of the present invention are described below with reference to the drawings. In the drawings, the same or similar components are denoted by the same or similar reference numerals, and redundant description thereof is omitted.
First, a welding apparatus 1 as a joining member manufacturing apparatus according to an embodiment of the present invention will be described with reference to fig. 1 and 2. Fig. 1 is a vertical cross-sectional view showing a schematic configuration of a welding apparatus 1. Fig. 2 is a plan view showing a schematic configuration of the welding apparatus 1. The welding apparatus 1 is an apparatus for welding the cap C and the plug S in the present embodiment. The welding apparatus 1 includes: a lower electrode 10; an upper electrode 20; a moving device 30 for moving the lower electrode 10 and the upper electrode 20; the mandrel camera 41, which photographs the mandrel S: and a control device 60. Before describing the welding apparatus 1, a joint member manufactured by welding the cap C and the plug S will be described.
Fig. 3(a) is a perspective view of a device (device) D as a joint member, and fig. 3(B) is an exploded partial sectional side view of the device D. The device D of the present embodiment is described as an optical semiconductor. The device D is formed by joining the cap C to the plug S. In fig. 3(B), the cap C is shown in cross section and the mandrel bar S is shown in side view in order to show a state in which the cap C is separated from the mandrel bar S before the device D is formed. The plug S is configured such that an electrode, a transistor (transistor), or the like (hereinafter referred to as "mounting portion St") constituting the photoelectric conversion element is mounted on the base (base) Sb, and the lead (lead) Sd extends from the base Sb. The base Sb is formed in a disc shape in the present embodiment. A mandrel mark (stem mark) Sm for specifying the position in the circumferential direction is provided on the outer peripheral portion of the surface of the base Sb on which the mounting portion St is provided. The wire Sd extends from the base Sb to the opposite side of the mounting portion St. The base Sb and the conductive line Sd are formed of metal. The cap C is configured to be attached to the base Sb so as to cover the attachment portion St of the mandrel S. The cap C is configured to have a substantially cylindrical appearance, and the mounting portion St can be accommodated in the cylindrical interior. The cap C is an outer peripheral portion Cp corresponding to a cylindrical side surface, one end surface of which is open, and the other end surface of which is closed. In the present embodiment, the diameter of the outer peripheral portion Cp in the axial right-angle cross section is 5 mm. The lens Cn for transmitting laser light in the cover C is provided on the top surface of the end face belonging to the one to be closed. The cap C is slightly expanded outward to ensure a surface to which the edge Ce of the end face of the opened one is pressurized at the time of welding. The outer periphery of the edge Ce is formed in a circular shape having a size equal to or smaller than the outer periphery of the base Sb in the present embodiment. In the edge Ce, a cap mark (cap mark) Cm specifying a position in the cylinder circumferential direction is formed. The cap mark Cm is formed in such a manner that a part of the edge Ce protrudes outside. The cap C is formed of metal except for the lens Cn. The metal portions of the mandrel bar S and the cap C are typically formed of stainless steel, iron-nickel-chromium alloy (Kovar), or the like, but may be formed of metals other than these metals. The metal portions of the mandrel S and the cap C are typically different types of metals, but may be the same type of metal. The device D is configured such that the mounting portion St is covered with the cap C and then the edge Ce is welded to the base Sb. In this case, in the present embodiment, the cap mark Cm and the plug mark Sm are aligned, and thus the device D that exhibits a desired function is manufactured. In the present embodiment, the plug S corresponds to a first member to be welded, and the cap C corresponds to a second member to be welded.
The configuration of the welding apparatus 1 will be described with reference to fig. 1 and 2. The lower electrode 10 is used to hold the mandrel S, and corresponds to a first holder. The lower electrode 10 includes: an electrode body 10b and a holder 10 c. The electrode body 10b is formed of a block (metal). The electrode body 10b is typically formed of a highly conductive metal. The electrode body 10b is mostly formed so that the top surface 10f is flat. In the present embodiment, the top surface 10f is horizontally expanded, and a virtual horizontal plane including the top surface 10f expanded on the same plane as the top surface 10f outside the top surface 10f is set as a reference plane H. The electrode body 10b is formed with a plug hole 10h capable of accommodating the lead wire Sd in the depth direction from the top surface 10 f. The plug hole 10h is formed to have a diameter smaller than the outer diameter of the base Sb so as to accommodate all the wires Sd, and is formed to have a depth capable of accommodating the longest wire Sd when the base Sb is placed on the top surface 10 f. The clamper 10c is used for accommodating the lead wire Sd in the hole 10h for the mandrel and clamping and holding the base Sb placed on the top surface 10f, and corresponds to a holding mechanism. The holder 10c has a reference portion 11 and a pressing portion 12, and is configured to be capable of sandwiching the mandrel S (base portion Sb) by the reference portion 11 and the pressing portion 12.
The details of the clamper 10c will be described herein with reference to fig. 4. Fig. 4 is a schematic plan view of a holder 10c provided in the lower electrode 10 constituting the welding apparatus 1. As described above, the clamper 10c has the reference portion 11 and the pressing portion 12. The reference portion 11 and the pressing portion 12 are both provided on the top surface 10f (see fig. 1) of the electrode body 10 b. The reference portion 11 and the pressing portion 12 are arranged such that the lead wire Sd is accommodated in the hole for mandrel 10h and the base portion Sb (mandrel S) placed on the top surface 10f is sandwiched between the reference portion 11 and the pressing portion 12 in a plan view, the reference portion 11 is arranged on one side of the mandrel S and the pressing portion 12 is arranged on the opposite side thereof. The reference portion 11 and the pressing portion 12 are configured to be reciprocally movable along the top surface 10f in directions (Y direction in fig. 4) in which they approach and separate from each other. The reference portion 11 is configured to be movable to a position to grip the mandrel S before the pressing portion 12 after the mandrel S is placed on the top surface 10f of the electrode main body 10b, and to determine a reference position Sp when the gripper 10c grips the mandrel S (the lower electrode 10 grips the mandrel S). The clamper 10c is configured to be able to grip the mandrel bar S by bringing the pressing section 12 close to the reference section 11 located at a position where the mandrel bar S is to be gripped, and to release the holding of the mandrel bar S by moving the pressing section 12 away. In the direction in which the pressing section 12 moves, the portion of the mandrel S that is in contact with the reference section 11 located at the position where the mandrel S is to be gripped, which portion is located farthest from the pressing section 12, becomes the reference position Sp at which the gripper 10c holds the mandrel S.
The entire lower electrode 10 including the electrode body 10b and the clamper 10c is configured to be reciprocally movable by the lower moving device 31 in a direction (Y direction) in which the reference part 11 and the pressing part 12 are reciprocally moved and in a direction (X direction) orthogonal thereto, and to be rotationally moved in a direction (θ direction) along an arc contacting the core rod S of the reference part 11. In this way, the entire lower electrode 10 can be linearly moved and rotationally moved back and forth in two directions within the reference plane H by the lower moving device 31. The upper electrode 20 will be described in detail with reference to the lower electrode 10.
The details of the upper electrode 20 will be described mainly with reference to fig. 1 and 5. Fig. 5 is a partial vertical sectional view showing a schematic configuration of the upper electrode 20. The upper electrode 20 is used to hold the cap C, and corresponds to a second holder. The upper electrode 20 generally has: a cylindrical body 21; a balloon (balloon)22 in the shape of a circular ring (donghut); an electrode wafer (chip) 23; and a wafer fixing nut (nut)24 for fixing the electrode wafer 23, which is sandwiched between the body 21 and the bladder 22, to the body 21. The body 21 includes the chucking electrode 21A and the main portion 21B, and is integrally formed with a hollow portion 21h extending along the cylindrical axis AX. In the present embodiment, the main body 21 is provided above the lower electrode 10 in a direction in which the axis AX extends vertically. A projection 21p into which the bladder 22 is fitted is formed in the center of the surface of the lower end (the end on the side close to the lower electrode 10) of the main body 21. The hollow portion 21h of the body 21 in the present embodiment has a reduced diameter near the protrusion 21p and penetrates through the lower end surface of the body 21. The airbag 22 is attached to the outside of the projection 21p so as to cover the outer periphery of the projection 21 p. The bladder 22 is an elastic member such as silicone rubber, and is formed in a hollow shape into which a gas (typically air) can be injected like a swim ring. The bladder 22 is sandwiched between the lower end face of the body 21 and the electrode wafer 23. A gap for accommodating the bladder 22 is formed between the lower end surface of the body 21 and the electrode wafer 23, and the bladder 22 is configured to be inflated inward toward the axis AX, so that the bladder 22 enters the hollow portion 21 h.
The electrode wafer 23 is formed in a disk shape having a step. The electrode wafer 23 is formed with a through hole communicating with the hollow portion 21h of the body 21 and the annular center hole of the bladder 22. The through-hole of the electrode wafer 23 is formed to be larger in outer diameter than the outer peripheral portion Cp of the cap C and smaller in outer diameter than the edge Ce of the cap C. The thickness of the periphery of the through-hole of the electrode wafer 23 is formed to such an extent that the outer peripheral portion Cp of the cap C penetrates the center hole of the bladder 22 when the cap C is inserted into the through-hole until the edge Ce touches the electrode wafer 23. The wafer retaining nut 24 has an outer diameter that is larger than the outer diameter of the body 21. The wafer fixing nut 24 is recessed from an upper surface thereof toward the inside in the direction in which the axis AX extends so as to accommodate the electrode wafer 23. The wafer fixing nut 24 is formed with a female screw 24w on an inner wall of a portion recessed inward, and is configured to be screwed into a male screw 21w formed on a lower portion of a side surface of the body 21. The wafer fixing nut 24 is formed at a central portion thereof with a through hole 24h, and the through hole 24h is used for passing a portion having a larger diameter than the through hole of the electrode wafer 23. Typically, the upper electrode 20 is formed of a highly conductive metal such as a body 21, an electrode chip 23, and a chip mounting nut 24. The upper electrode 20 is configured to concentrically arrange the body 21, the bladder 22, the electrode wafer 23, and the wafer fixing nut 24 about the axis AX.
The upper electrode 20 is configured to supply the gas F into the bladder 22 after the cap C is inserted into the through hole of the electrode wafer 23 until the edge Ce contacts the electrode wafer 23, so that the outer peripheral portion Cp of the cap C is held by the bladder 22 expanding toward the axis AX. At this time, since the balloon 22 is inflated inward uniformly over the entire circumference, the cap C is held by the upper electrode 20 in a state where the axis of the cap C coincides with the axis AX of the upper electrode 20. The upper electrode 20 is fixed to the upper moving device 32. The upper electrode 20 is configured to be capable of reciprocating toward and away from the lower electrode 10 by the operation of the upper moving device 32. In other words, the upper electrode 20 is configured to be reciprocally movable in the vertical direction V by the operation of the upper moving device 32.
The structure of the welding apparatus 1 will be described again mainly with reference to fig. 1 and 2. The lower electrode 10 and the upper electrode 20 are connected to a power source (not shown) via a cable (not shown). The welding apparatus 1 is configured to apply a voltage by turning on a power supply (not shown) after a plug S held by a lower electrode 10 and a cap C held by an upper electrode 20 are brought into contact with each other, thereby causing a current to flow through the lower electrode 10, the plug S, the cap C, and the upper electrode 20.
The moving means 30 in the present embodiment is composed of a lower moving means 31 for moving the lower electrode 10 on the reference plane H and an upper moving means 32 for moving the upper electrode 20 in the vertical direction V. In other words, the lower moving device 31 and the upper moving device 32 are collectively referred to as a moving device 30. The lower moving device 31 is attached to a base 81 fixed to the frame of the welding apparatus 1. The base 81 is a horizontally extending table having a surface. The upper moving device 32 is fixed to the upper portion of the gate post 28 fixed to the base 81. The upper moving device 32 supports the upper electrode 20 so as to be movable back and forth in the vertical direction V. The gate post 28 cooperates with the upper electrode 20 and the upper moving device 32 to define the position of the cap C (member to be bonded) held by the upper electrode 20. As described above, the structure for determining the position of the member to be joined typically is a structure such as a holder or a support for supporting the holder.
The mandrel camera 41 is provided above a temporary table 42 provided on the base 81, apart from the lower electrode 10 in the horizontal direction. The temporary stand 42 is a stand on which the mandrel bar S (see fig. 3a and 3B) is temporarily set. The table 42 is configured to support the base Sb at a height at which the lead Sd floats in the air with the mounting portion St facing upward. The mandrel bar camera 41 provided above the temporary table 42 is configured to capture an image of the mandrel bar S placed on the temporary table 42 from above, thereby grasping the contour of the base Sb of the mandrel bar S and the position of the mandrel bar mark Sm. The base Sb is a portion held by the lower electrode 10 when being conveyed to the lower electrode 10, and the contour of the base Sb is the contour of the mandrel S when the mandrel S is projected on the reference plane H. In other words, the mandrel bar camera 41 is a device capable of grasping the contour of the mandrel bar S projected on the reference plane H, and corresponds to the contour grasping portion. Here, the contour of the mandrel S when the mandrel S is projected on the reference plane H means the contour of the mandrel S when viewed in a direction perpendicular to the reference plane H. Further, on the temporary placement stage 42, a device D (see fig. 3 a) manufactured by welding the cap C to the plug S may be placed. The mandrel bar camera 41 can capture an image of the device D placed on the stage 42, thereby grasping the outer edge of the cap C and the contour of the mandrel bar S in the device D when projected on the reference plane H, and also having a joint member state grasping portion.
The welding apparatus 1 of the present embodiment further includes: a mandrel pallet (stem pallet)83, a cap pallet (cappallet)85, a first mandrel conveyor 51A and a second mandrel conveyor 51B for conveying the mandrels S, and a cap conveyor 56 for conveying the caps C. The mandrel pallet 83 has a plurality of pallets of mandrels S arranged therein. The mandrel blade 83 is formed so that a plurality of recesses (not shown) for receiving the lead wires Sd of the mandrels S are arranged. Below the mandrel pallet 83, a camera (not shown) is provided to recognize the absence of the wire Sd. The mandrel blade 83 is provided on the side opposite to the lower electrode 10 with respect to the temporary stand 42 in a plan view. The mandrel pallet 83 is attached to be detachable from the mandrel pallet support portion 84. The mandrel blade support portion 84 includes: a main rail 84a extending in a direction (X direction) in which the mandrel pallet 83 approaches the lower electrode 10; and a branch track 84b extending in a direction (Y direction) orthogonal to the direction in which the main track 84a extends. The mandrel blade 83 is configured to be movable in the X direction and the Y direction in accordance with movement along the branch rail 84b of the mandrel blade 83 itself and movement along the main rail 84a of the branch rail 84 b. The cover pallet 85 has a plurality of pallets of covers C arranged therein. The cover pallet 85 is formed so that a plurality of recesses (not shown) into which the edges Ce can be fitted are arranged. The concave portion (not shown) formed in the cap receiving plate 85 has a shape corresponding to the cap mark Cm, so that the position (direction) of the cap C disposed on the cap receiving plate 85 can be determined. The recess (not shown) formed in the cover pallet 85 is formed to a depth at which the outer peripheral portion Cp is not buried when the edge Ce is fitted. The cover blade 85 is attached to be detachable from the cover blade support portion 86. The cover pallet support portion 86 includes: a main rail 86a extending in a direction (X direction) in which the cap blade 85 approaches the lower electrode 10; and a cap moving guide (guide)86b extending in a direction (Y direction) orthogonal to the direction in which the main rail 86a extends. The cap blade 85 is configured to be movable in the X direction and the Y direction in accordance with the movement of the cap moving guide 86b along the cap blade 85 itself and the movement of the main rail 86a along the cap moving guide 86 b.
The first mandrel conveyor 51A is provided between the lower electrode 10 and the temporary placement table 42, and is a machine that conveys the mandrel bar S and the device D between the lower electrode 10 and the temporary placement table 42. The first mandrel transporter 51A includes: a first rotation shaft 52A and a first arm 53A. The first rotation axis 52A is provided to extend vertically at a midpoint of a virtual straight line connecting the hole 10h for the mandrel of the lower electrode 10 and the hole for accommodating the lead wire Sd formed on the temporary stage 42. The first arm 53A is an elongated plate-like member, and a longitudinal midpoint portion is attached to the first rotation shaft 52A so as to be rotatable. First mandrel gripping portions 54A capable of gripping the mandrel S are formed at both ends of the first arm 53A. The first mandrel grasping portions 54A are formed on the lower surface of the first arm 53A, and one is formed at a position facing the mandrel hole 10h formed in the lower electrode 10, and the other is formed at a position facing the hole for accommodating the lead Sd formed in the temporary placement stage 42.
The second mandrel conveyor 51B is provided between the mandrel pallet 83 and the temporary table 42, and is a machine that conveys the mandrel S and the device D between the mandrel pallet 83 and the temporary table 42. The second mandrel bar handler 51B has a second rotation shaft 52B and a second arm 53B. The second rotation axis 52B is provided to extend vertically at a midpoint of a virtual straight line connecting the mandrel pallet 83 and a hole for accommodating the lead wire Sd formed on the temporary table 42. The second arm 53B is an elongated plate-like member, and a longitudinal midpoint portion is rotatably attached to the second rotation shaft 52B. Second mandrel bar gripping portions 54B capable of gripping the mandrel bar S are formed at both ends of the second arm 53B. The second mandrel grasping portions 54B are formed on the lower surface of the second arm 53B, and one is formed at a position facing the mandrel blade 83 and the other is formed at a position facing the hole for accommodating the lead wire Sd formed on the temporary holding table 42.
The lid carrier 56 is provided away from the lower electrode 10 and on the opposite side of the lower electrode 10 from the stage 42 in a plan view. The lid carrier 56 includes: a cap holding portion 58 for holding the cap C; and a support shaft 57 for supporting the cap holding portion 58. The cap gripping portion 58 is supported by the support shaft 57 in a reversible manner. The support shaft 57 is configured to be reciprocally movable between a lower side of the upper electrode 20 and an upper side of the cap holder plate 85 along a direction in which the cap movement guide 86b extends. The lid carrier 56 is configured to: the cap gripper 58 can grip one of the caps C placed on the cap pallet 85 downward, turn the cap gripper 58 upward while moving the cap gripper toward the upper electrode 20 along the cap movement guide 86b, and insert the cap C into the center hole of the airbag 22 of the upper electrode 20 from below.
The control device 60 is used to control the operation of the welding apparatus 1. The control device 60 is configured to transmit control signals to the lower electrode 10 and the upper electrode 20 in a wired or wireless manner, respectively, so that the holding and releasing of the mandrel S in the lower electrode 10 and the holding and releasing of the cap C in the upper electrode 20 can be individually performed. The control device 60 is configured to transmit control signals to the lower moving device 31 and the upper moving device 32 by wire or wirelessly, so that the lower electrode 10 and the upper electrode 20 can be moved in the reference plane H and the vertical direction V by the lower moving device 31 and the upper moving device 32, respectively. The control device 60 is electrically connected to the mandrel camera 41 by wire or wirelessly, and is configured to receive an image captured by the mandrel camera 41. The control device 60 is configured to appropriately move the first mandrel conveyer 51A, the second mandrel conveyer 51B, the cap conveyer 56, the mandrel pallet 83, and the cap pallet 85, respectively. The control device 60 is electrically connected to a power source (not shown) by wire or wirelessly, and can control whether or not a voltage is applied between the lower electrode 10 and the upper electrode 20.
Next, a method for manufacturing a joined member according to an embodiment of the present invention will be described with reference to fig. 6.
Fig. 6 is a flowchart showing a procedure of manufacturing the device D as the joining member. A method of manufacturing the device D (a method of manufacturing the device D) to be described below is typically performed by the fusion bonding apparatus 1 described so far. The method for manufacturing the device D to be described below is a description of the function of the fusion bonding apparatus 1. In the following description of the method of manufacturing the device D, when referring to the structure of the fusion bonding apparatus 1 or the structure of the device D, reference is made to fig. 1 to 5 as appropriate. Typically, the fusion bonding apparatus 1 places the lower electrode 10 at a position where a virtual straight line extending from the axis AX of the upper electrode 20 passes through the center of the mandrel hole 10h (a circular space for holding the mandrel S) of the lower electrode 10 before the device D is manufactured.
When manufacturing the device D, the mandrel pallet 83 on which the plurality of mandrels S are arranged and the cap pallet 85 on which the plurality of caps C are arranged are carried into the welding apparatus 1 (S1). The mandrel blade 83 carried into the welding apparatus 1 is attached to the mandrel blade support portion 84, and the cap blade 85 is attached to the cap blade support portion 86. Next, the control device 60 temporarily places one of the mandrels S placed on the mandrel pallet 83 on the temporary table 42 using the second mandrel transporter 51B (S2). At this time, the control device 60 moves the mandrel pallet 83 by the mandrel pallet support portion 84 so that the mandrel S to be gripped comes to the position of the second mandrel gripping portion 54B of the second mandrel conveyor 51B. The control device 60 holds one mandrel bar S by the second mandrel bar holding portion 54B, and then mounts the second arm 53B on the temporary stand 42 by rotating it 180 degrees in the horizontal direction. When a defective mandrel bar S is found by a camera (not shown) provided below the mandrel bar holding plate 83, the control device 60 places the defective mandrel bar S on a small pallet (not shown) provided separately without placing it on the temporary stand 42. The defective core rod S placed on the small holder is carried out later, and is reused after the defect is corrected separately.
When the mandrel bar S is placed on the rest 42, the control device 60 images the mandrel bar S by the mandrel camera 41 (S3). In this way, the contour of the mandrel S can be grasped, and therefore the step of capturing the image of the mandrel S by the mandrel camera 41 (S3) corresponds to the contour grasping step. Further, by imaging the mandrel S with the mandrel camera 41, the position of the mandrel mark Sm can be grasped. The image of the mandrel S captured by the mandrel camera 41 is transmitted to the control device 60 as data. Next, the control device 60 conveys the mandrel bar S placed on the temporary stand 42 to the position of the lower electrode 10 by using the first mandrel conveyor 51A and holds the mandrel bar S on the lower electrode 10 (S4). At this time, the control device 60 separates the reference portion 11 and the pressing portion 12 of the clamper 10c constituting the lower electrode 10 from each other, holds the mandrel S placed on the temporary table 42 by the first mandrel holding portion 54A, then conveys the mandrel S between the reference portion 11 and the pressing portion 12 by rotating the first arm 53A 180 degrees in the horizontal direction, moves the reference portion 11 to a position at which the mandrel S is to be held, and then moves the pressing portion 12 toward the reference portion 11, thereby clamping and holding the mandrel S by the reference portion 11 and the pressing portion 12.
In the step (S4) of holding the mandrel S by the lower electrode 10, if the size of the outline of the mandrel S to be held does not differ from the size assumed in advance, the positional relationship in a plan view between the cap C held by the upper electrode 20 and the mandrel S held by the lower electrode 10 is an appropriate positional relationship. However, when the contour size of the mandrel bar S differs from a previously assumed size due to, for example, a difference in the thickness of the plating applied to the mandrel bar S, the positional relationship in a plan view between the cap C held by the upper electrode 20 and the mandrel bar S held by the lower electrode 10 becomes an inappropriate positional relationship. This is caused by the lower electrode 10 setting the contact portion between the reference portion 11 and the mandrel S as the reference position Sp. When the cap C held by the upper electrode 20 and the plug S held by the lower electrode 10 are bonded in a state where the positional relationship in a plan view is inappropriate, an unmatched device D is manufactured. In order to avoid such a problem, in the welding apparatus 1, after the mandrel S is held by the lower electrode 10(S4), the control device 60 moves the lower electrode 10 holding the mandrel S to a position (bonding position) where the position of the mandrel S held by the lower electrode 10 and the position of the cap C held by the upper electrode 20 are appropriate, based on the image data of the mandrel S obtained in the step (S3) of capturing the image of the mandrel S by the mandrel camera 41 (first bonding target member moving step: S5). In the present embodiment, the lower electrode 10 is rotationally moved in the θ direction (see fig. 4) based on the image data of the mandrel bar S so that the mandrel mark Sm is positioned to coincide with the cap mark Cm. When the mandrel S is held by the lower electrode 10 using the first mandrel conveyer 51A (S4), the position of the lower electrode 10 in the XY direction and/or the θ direction may be pre-adjusted based on the image data of the mandrel S obtained in the step (S3) of capturing the mandrel S by the mandrel camera 41, so as to shorten the time required for the position adjustment in the first welding target member moving step (S5).
Next, the controller 60 is configured to convey one of the caps C placed on the cap pallet 85 to the upper electrode 20 by using the cap conveyor 56, and hold the cap C on the upper electrode 20 (S6). At this time, the controller 60 moves the cap palette 85 via the cap palette support portion 86 so that the cap C to be gripped comes to the position of the cap gripping portion 58 of the cap carrier 56, and grips one cap C by the cap gripping portion 58. Thereafter, the cap gripping portion 58 is turned upside down while the support shaft 57 is moved toward the upper electrode 20 along the cap movement guide 86b, and the cap C is conveyed to a position just below the center hole of the airbag 22 of the upper electrode 20. In this case, the position of the cap C in the θ direction may be adjusted. Further, the outer peripheral portion Cp of the cap C is inserted into the center hole of the bladder 22 until the edge Ce touches the electrode wafer 23, and the bladder 22 is inflated to hold the cap C. Since the upper electrode 20 holds the cap C by inflating the balloon 22, the balloon 22 uniformly contacts substantially the entire periphery of the outer peripheral portion Cp of the cap C, the cap C is centered in a plan view, and the axis AX of the upper electrode 20 penetrates the center of the cap C. In the present embodiment, the upper electrode 20 is supported by the gate post 28 and is configured to be movable in the vertical direction but not movable in the horizontal direction, and therefore the cap C is moved to the bonding position in a plan view while being held by the upper electrode 20. Therefore, in the present embodiment, the step of conveying the cap C from the cap tray 85 to the upper electrode 20 and holding the cap C on the upper electrode 20(S6) corresponds to the second joining target member moving step. In fig. 6, for convenience of explanation, the cap C is held by the upper electrode 20(S6) after the movement from the temporary position (S2) of the mandrel S to the bonding position (S5) of the mandrel S, but may be held before or simultaneously with the movement from the temporary position (S2) of the mandrel S to the bonding position (S5) of the mandrel S.
After the lower electrode 10 and the cap C are held by the upper electrode 20 after the mandrel S is held, the upper electrode 20 holding the cap C is lowered, the edge Ce of the cap C is brought into contact with the base Sb of the mandrel S, and the cap C and the mandrel S are joined to each other to produce a device D (joining step: S7). After the edge Ce is brought into contact with the base Sb, the upper electrode 20 is further pressed toward the lower electrode 10, whereby resistance welding is performed by energizing the projected portion (not shown) while applying pressure to the contact portion (projected portion) between the base Sb of the mandrel S and the edge Ce of the cap C, and thereby the cap C and the mandrel S are joined. When the plug S and the cap C are joined, the upper electrode 20 releases the holding of the cap C (S8), and moves upward so as to be separated from the lower electrode 10. Next, the control device 60 releases the holding of the plug S (S9). Next, the control device 60 is configured to convey the device D positioned on the lower electrode 10 to the stage 42 using the first mandrel transporter 51A (S10).
When the device D is mounted on the stage 42, the control device 60 images the device D by the mandrel camera 41 (S11). With this, it is possible to grasp the outer edge of the cap C and the contour of the plug S in the state of the device D, and to grasp whether or not the positions of the cap C and the plug S are offset in a plan view (typically, whether or not the centers of the cap C and the plug S are offset). The image of the device D captured by the mandrel camera 41 is transmitted as data to the control device 60, and when the positions of the cap C and the mandrel S are shifted, the position is fed back to the alignment of the mandrel S and the cap C to be bonded. Once the device D is imaged by the mandrel camera 41 (S11), the control device 60 uses the second mandrel conveyor 51B to convey the device D mounted on the stage 42 to the storage position of the device D (S12). In the present embodiment, the device D on the temporary table 42 is conveyed to the mandrel bar pallet 83, and the device D is accommodated in the mandrel bar pallet 83. At this time, the device D is accommodated in the position of the mandrel bar S removed for bonding in the mandrel palette 83 or the position where the mandrel bar S is not originally placed. Thus, the manufacture of one device D is completed. Next, when the device D is to be newly manufactured, the above-described flow shown in fig. 6 is repeated.
As described above, according to the present embodiment, even when the size of the contour of the mandrel S varies, the position of the lower electrode 10 on the reference plane H is adjusted before the mandrel S is held by the lower electrode 10, and therefore, the mandrel S to be bonded and the cap C can be positioned. Further, since the position of the lower electrode 10 on the reference plane H is adjusted based on the image captured by the mandrel camera 41, the position of the lower electrode 10 can be adjusted immediately after the mandrel S is held by the lower electrode 10 or while the reference portion 11 and/or the pressing portion 12 are moved, and the time required for the position adjustment can be reduced, thereby improving the manufacturing efficiency of the device D.
In the above description, the positional adjustment of the lower electrode 10 holding the mandrel S is performed by feeding back the displacement of the mandrel S and the cap C in the device D imaged by the mandrel camera 41, but a temperature sensor 46 (shown by a chain line of two dots in the drawing) for detecting the temperature near the upper electrode 20 may be provided, and the positional adjustment of the lower electrode 10 may be performed by feeding back the temperature detected by the temperature change detection unit 46 instead of the displacement of the mandrel S and the cap C in the device D imaged by the mandrel camera 41. In this case, the following structure is possible. Typically, the temperature sensor 46 uses a thermocouple. The temperature sensor 46 is attached to the door post 28 and detects a temperature change of the door post 28. The doorpost 28 is mounted with an upper moving device 32 that supports the upper electrode 20, and may be referred to as a structure that determines the position of the cover C held on the upper electrode 20. Therefore, the temperature sensor 46 corresponds to a temperature change detecting portion. The control device 60 is electrically connected to the temperature sensor 46 in a wired or wireless manner, and receives a temperature change detected by the temperature sensor 46 as a signal. The controller 60 also stores in advance an offset amount of the gate post 28 with respect to a temperature change detected by the temperature sensor 46, with respect to a standard position at which the mandrel S and the cap C are appropriately joined at a reference temperature. The gate post 28 supporting the upper electrode 20 may expand or contract with a temperature change, and the bonding position of the upper electrode 20 may be displaced. The control device 60 is configured to compare the temperature detected by the temperature sensor 46 with the previously stored relationship of the amount of deviation of the gate post 28 with respect to the temperature change detected by the temperature sensor 46, and to add the amount of deviation of the gate post 28 with respect to the temperature change in the step (S5) of moving the core rod S held by the lower electrode 10 to the bonding position in the flowchart shown in fig. 6. At this time, the temperature sensor 46 detects the temperature before the step (S5) of moving the mandrel S held by the lower electrode 10 to the bonding position, and the step (S5) of moving the mandrel S held by the lower electrode 10 to the bonding position reflects the temperature detected by the temperature sensor 46, and the step (S11) of imaging the device D by the mandrel camera 41 is omitted from the flowchart shown in fig. 6.
In the above description, the reference portion 11 and the pressing portion 12 are configured to be capable of reciprocating so as to approach and separate from each other along the top surface 10f, respectively, but the reference portion 11 may be fixed to the electrode main body 10b, and only the pressing portion 12 may be configured to reciprocate so as to approach and separate from the reference portion 11. However, when the reference section 11 and the pressing section 12 are both configured to move, it is preferable to avoid interference of the mandrel S with the clamper 10c when the mandrel S is placed on the lower electrode 10.
In the above description, the lower electrode 10 is moved in the reference plane H (horizontal plane) and the upper electrode 20 is moved in the vertical direction V (vertical direction), but the lower electrode 10 may be moved in the vertical direction V (vertical direction) and the upper electrode 20 may be moved in the reference plane H (horizontal plane). Alternatively, the lower electrode 10 may not be moved, the upper electrode 20 may be moved in both the reference plane H (horizontal plane) and the vertical direction V (vertical direction), or conversely, the upper electrode 20 may not be moved, the lower electrode 10 may be moved in both the reference plane H (horizontal plane) and the vertical direction V (vertical direction), the lower electrode 10 may be moved in either the reference plane H (horizontal plane) or the vertical direction V (vertical direction), the upper electrode 20 may be moved in both the reference plane H (horizontal plane) and the vertical direction V (vertical direction), the upper electrode 20 may be moved in either the reference plane H (horizontal plane) or the vertical direction V (vertical direction), the lower electrode 10 may be moved in both the reference plane H (horizontal plane) and the vertical direction V (vertical direction), or both the lower electrode 10 and the upper electrode 20 may be moved in both the reference plane H (horizontal plane) and the vertical direction V (vertical direction) To) both sides.
In the above description, the bonding member (device D) is assumed to be an optical semiconductor, but may be a sensor product manufactured by bonding two members.

Claims (8)

1. A joined member manufacturing apparatus for manufacturing a joined member in which a first member to be joined and a second member to be joined are joined, the joined member manufacturing apparatus comprising:
a first holder for holding the first engagement subject member;
a second holder for holding the second engagement object member;
moving means for relatively moving the first holder with respect to the second holder within a reference plane and relatively reciprocating in a vertical direction belonging to a direction perpendicular to the reference plane;
a contour grasping portion configured to grasp a contour of the first member to be joined at a position separated from the first holder when the contour is projected onto the reference plane and viewed when a portion of the first member to be joined held by the first holder is projected onto the reference plane; and
control means for controlling the moving means;
the first holder is configured to hold the first member to be welded at a reference position of a part of the contour of the first member to be welded;
the control device is configured to relatively move the first holder with respect to the second holder in the reference plane to a position where the first member to be joined held by the first holder and the second member to be joined held by the second holder are appropriately joined by the relative movement in the vertical direction of the first holder with respect to the second holder, in accordance with the contour grasped by the contour grasping portion.
2. The joined member manufacturing apparatus according to claim 1, further comprising a joined member state grasping portion for grasping an outer edge of the joined member when the second member to be joined is projected on the reference plane and the contour of the first member to be joined;
the control device is configured to adjust relative movement of the first holder with respect to the second holder within the reference plane when the joining member is subsequently manufactured, in accordance with a positional relationship between the outer edge of the second joining target member and the contour of the first joining target member, which is grasped by the joining member state grasping portion.
3. The joining member manufacturing apparatus according to claim 1, wherein the first holder has a gripping mechanism that grips the first joining target member;
the gripping mechanism includes: a reference portion that contacts the reference position; and a pressing portion that cooperates with the reference portion to clamp the first member to be joined; the reference portion and the pressing portion are configured to reciprocate relatively to approach and separate from each other.
4. The joining member manufacturing apparatus according to claim 2, wherein the first holder has a gripping mechanism that grips the first joining target member;
the gripping mechanism includes: a reference portion that contacts the reference position; and a pressing portion that cooperates with the reference portion to clamp the first member to be joined; the reference portion and the pressing portion are configured to reciprocate relatively to approach and separate from each other.
5. The joining member manufacturing apparatus according to any one of claims 1 to 4, further comprising a temperature change detecting portion for detecting a change in temperature of at least one of a structure for determining a position of the first joining target member held by the first holder and a structure for determining a position of the second joining target member held by the second holder;
the control device is configured to adjust relative movement of the first holder with respect to the second holder in the reference plane in accordance with a change in the temperature detected by the temperature change detecting unit.
6. A joined member manufacturing apparatus for manufacturing a joined member in which a first member to be joined and a second member to be joined are joined, the joined member manufacturing apparatus comprising:
a first holder for holding the first engagement subject member;
a second holder for holding the second engagement object member;
moving means for relatively moving the first holder with respect to the second holder within a reference plane and relatively reciprocating in a vertical direction belonging to a direction perpendicular to the reference plane;
a temperature change detection unit configured to detect a change in temperature of at least one of a structure for determining a position of the first member to be welded held by the first holder and a structure for determining a position of the second member to be welded held by the second holder; and
control means for controlling the moving means;
the control device is configured to preliminarily store, for a reference position at which the first joining target member held by the first holder and the second joining target member held by the second holder are to be joined at a reference temperature, a deviation amount of the structure with respect to a change in temperature detected by the temperature change detecting unit, and adjust a relative movement of the first holder with respect to the second holder in the reference plane with reference to a relationship between the preliminarily stored reference position and the deviation amount of the structure with respect to the change in temperature detected by the temperature change detecting unit.
7. A method for manufacturing a joined member in which a first member to be joined and a second member to be joined are joined, the method comprising:
an outline grasping step of grasping an outline of the first joining target member when projected on a reference plane;
a first joining target member moving step of moving the first joining target member to a joining position at which joining with the second joining target member is to be performed when viewed as being projected on the reference plane;
a second joining target member moving step of moving the second joining target member away from the first joining target member in a vertical direction which is a direction perpendicular to the reference plane, and moving the second joining target member to the joining position when viewed as being projected on the reference plane; and
a joining step of joining the first joining target member and the second joining target member, which are located at the joining position when viewed as being apart from and projected onto the reference plane in the vertical direction, to approach each other in the vertical direction to join each other to manufacture the joining member;
the outline grasping step is configured to grasp the outline at a position away from the joining position when the reference plane is projected and viewed;
the first joining target member moving step is configured to adjust a relative movement of the first joining target member with respect to the second joining target member in accordance with the contour grasped in the contour grasping step.
8. A method for manufacturing a joined member in which a first member to be joined and a second member to be joined are joined, the method comprising:
a temperature detection step of detecting a temperature of at least one of a structure for determining a position of the first member to be welded and a structure for determining a position of the second member to be welded;
a first joining target member moving step of moving the first joining target member to a joining position at which joining with the second joining target member is to be performed when viewed as being projected on a reference plane;
a second joining target member moving step of moving the second joining target member away from the first joining target member in a vertical direction which is a direction perpendicular to the reference plane, and moving the second joining target member to the joining position when viewed as being projected on the reference plane; and
a joining step of joining the first joining target member and the second joining target member, which are located at the joining position when viewed as being apart from and projected onto the reference plane in the vertical direction, to approach each other in the vertical direction to join each other to manufacture the joining member;
the first joining target member moving step is configured to grasp in advance a deviation amount of the structure with respect to a change in the temperature detected in the temperature detecting step with respect to a reference position at which the joining of the first joining target member and the second joining target member is to be performed at a reference temperature, and to adjust the relative movement of the first joining target member with respect to the second joining target member in comparison with a relationship between the change in the temperature detected in the temperature detecting step and the deviation amount of the structure grasped in advance.
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