KR101998277B1 - Joined member manufacturing apparatus and method for manufacturing joined member - Google Patents

Abstract

A joining member manufacturing apparatus and a joining member manufacturing method capable of joining members to be joined quickly and appropriately are provided. The joining member manufacturing apparatus 1 includes a first holding tool 10, a second holding tool 20 and a first holding tool 10 with respect to a second holding tool 20, (30) relatively moving in the vertical direction (V) relative to the reference plane (H) while projecting the first object member (S) onto the reference plane (H) And a control device 60 for controlling the moving device 30. The control device 60 controls the moving device 30 so that the moving device 30 can be moved to a desired position. The first holding tool 10 holds the first joining member S with a part of the contour of the first joining member S as a reference position and the control device 60 performs the contour grasping The first bonding target member S held by the first holding tool 10 and the second bonding target member S held by the second holding tool 20 are held in correspondence with the outline detected by the holding portion 41, The first holding tool 10 is relatively moved in the reference plane H with respect to the second holding tool 20 at a position where the first holding tool C is appropriately joined.

Description

Technical Field [0001] The present invention relates to a joining member manufacturing apparatus and a joining member manufacturing method,

The present invention relates to a joining member manufacturing apparatus and a joining member manufacturing method, and more particularly, to a joining member manufacturing apparatus and a manufacturing method of a joining member that can quickly and appropriately join members to be joined.

The optical semiconductor is constituted by mounting a lens portion cap which covers an element or the like to a stem on which a photoelectric conversion element or the like is mounted. The cap is fixed to the upper tapered collet electrode, and the upper electrode movable base on which the upper tapered collet electrode is fixed is moved in the vertical direction by the movement pressing means, and the resistance welding (See, for example, Patent Document 1).

Japanese Patent Application Laid-Open No. 2003-154463

The lower electrode can release the clamp by clamping and separating the stem by approaching the two divided holders. If the stem is clamped with respect to the fixed holder first, such as by clamping the stem by setting one of the holders to the clamp position first and then approaching the other holder to one holder after setting the stem, The speed of desorption of the stem can be increased and the number of times of welding per unit time can be increased as compared with the case of clamping while observing the center position of both the stem and the cap, thereby improving the productivity. High alignment accuracy is required for welding the stem for the optical semiconductor and the cap. However, due to the object to be welded, such as the dimensional deviation of the member to be welded or the thickness variation of the plating layer, There has been a case where proper bonding can not be carried out due to a change in the environment.

In view of the above-described problems, it is an object of the present invention to provide a joining member manufacturing apparatus and a joining member manufacturing method which can quickly and appropriately join members to be joined.

In order to achieve the above object, a joining member manufacturing apparatus according to a first aspect of the present invention is a joining member manufacturing apparatus according to the first aspect of the present invention, for example, as shown in Fig. 1, in which a first joining object member S and a second joining member member C (For example, see Fig. 3) to which a joining member D is bonded; A first holding member (10) for holding a first member to be joined (S); A second holding member (20) for holding a second member to be joined (C); The first holding tool 10 is relatively moved in the reference plane H with respect to the second holding tool 20 and is moved in the vertical direction V perpendicular to the reference plane H. [ A moving device (30) for reciprocating relative movement with respect to the moving device (30); An outline grasping portion 41 for grasping the outline of a portion of the first member to be joined S projected on the reference plane H, the portion being held by the first retention hole 10; And a control device (60) for controlling the mobile device (30); The first holding tool 10 is configured such that a part of the contour of the first joining member S is set at the reference position Sp (see Fig. 4, for example) and the first joining member S is held ≪ / RTI > The controller 60 controls the first joining member S held by the first retaining mouth 10 and the second retaining mouth 20 held by the contour grasping portion 41 The held second member to be joined C is properly bonded to the first holding tool 10 by the movement of the first holding tool 10 in the vertical direction V relative to the second holding tool 20, The holding member 10 of the second holding member 20 is relatively moved in the reference plane H with respect to the second holding member 20.

With this configuration, even if the contour of the first joining member fluctuates, the first joining target member and the second joining target member can be joined quickly and appropriately.

1, a joining member manufacturing apparatus according to a second embodiment of the present invention is such that, in the joining member manufacturing apparatus 1 according to the first embodiment of the present invention, An outer edge when the second object member C is projected on the reference plane H and a joint member state recognition section 41 for grasping the contour in the first and second embodiments (see FIG. 3) ; The control device 60 determines whether or not the reference member D (for example, see FIG. 3) is manufactured next in accordance with the positional relationship between the outer edge and the contour, And is configured to control the relative movement of the first holding tool 10 with respect to the second holding tool 20 in the plane H.

With this configuration, the state of the joining member can be fed back to the alignment of the first joining target member and the second joining target member to be joined from now on, so that the appropriateness of the joining of both members can be satisfied.

1, a joining member manufacturing apparatus according to a third embodiment of the present invention is a joining member manufacturing apparatus 1 according to the first or second embodiment of the present invention, , Wherein the first holding tool (10) has a holding mechanism (10c) for holding the first object to be bonded (S); The gripping mechanism 10c includes a reference portion 11 that contacts the reference position Sp (see Fig. 4, for example), and a second joining member S And the reference portion 11 and the pressing portion 12 are structured so as to reciprocate relatively to each other and away from each other.

With this configuration, it is possible to smoothly grasp the first member to be joined by the first holding tool.

Further, a joining member manufacturing apparatus according to a fourth aspect of the present invention is a joining member manufacturing apparatus according to any one of the first to third aspects of the present invention, as shown in Fig. 1, for example. The structure of the apparatus 1 for determining the position of the first object S to be bonded held in the first holding tool 10 and the structure for determining the position of the first object S to be bonded held by the second holding tool 20 (46) for detecting a change in temperature of at least one of the structures (28) for determining the position of the member (C); The control device 60 controls the temperature of the second holding tool 20 of the first holding tool 10 in the reference plane H in accordance with the temperature detected by the temperature change detecting part 46, And is configured to control relative movement.

With such a configuration, the positional deviation accompanying the temperature change can be corrected.

1, the joining member manufacturing apparatus according to the fifth embodiment of the present invention is a joining member manufacturing apparatus according to the fifth embodiment of the present invention in which a joining member in which a first joining object member S and a second joining member member C are joined 1. An apparatus (1) for producing a member (D) (see for example Fig. 3); A first holding member (10) for holding a first member to be joined (S); A second holding member (20) for holding a second member to be joined (C); The first holding tool 10 is relatively moved in the reference plane H with respect to the second holding tool 20 and is relatively moved in the vertical direction which is the direction perpendicular to the reference plane H A reciprocating movement device (30); The structure for determining the position of the first object member S held by the first holding tool 10 and the structure for determining the position of the second object member C held by the second holding tool 20 A temperature change detection unit (46) for detecting a change in temperature of at least one of the structures to be determined; And a control device (60) for controlling the mobile device (30); The control device 60 controls the temperature of the first bonding target member S held in the first holding tool 10 and the temperature of the second bonding target member S held in the second holding tool 10 at the reference temperature, Of the first holding tool 10 in the reference plane H with respect to the standard position where bonding with the second bonding target member C held in the holding tool 20 of the first holding tool 10 is performed, (20).

With such a configuration, the positional deviation accompanying the temperature change can be corrected.

In order to achieve the above object, a method of manufacturing a joining member according to a sixth aspect of the present invention is described with reference to Figs. 1 and 6, for example, As a method for manufacturing a joining member D (for example, see Fig. 3) to which a target member C is bonded, An outline grasping step (S3) of grasping an outline of projection of the first joining member (S) onto the reference plane (H); A first joining member moving step (S5) in which the first joining object member S is moved to the joining position where joining with the second joining target member C is performed when the first joining target member S is projected onto the reference plane H )and; The second object member C to be bonded is spaced apart from the first object member S in the vertical direction V perpendicular to the reference plane H and projected onto the reference plane H A second joining member moving step (S6) for moving to a joining position at the time of joining; The first object member S and the second object member C which are spaced apart from each other in the vertical direction V and projected on the reference plane H are placed in the vertical direction V And a bonding step (S7) for bonding and joining members (D) (see FIG. 3, for example); The first joining member moving step (S5) is a step of moving the first joining target member (S) relative to the second joining target member (C) in accordance with the outline detected in the outline grasping step (S3) .

With this configuration, even if the contour of the first joining member fluctuates, the first joining target member and the second joining target member can be joined quickly and appropriately.

In order to achieve the above object, a manufacturing method of a joining member according to a seventh aspect of the present invention is a manufacturing method of a joining member, for example, referring to Fig. 1, in which a first joining object member S and a second joining member member C) is joined to the joint member D (see Fig. 3, for example); A temperature detecting step of detecting a temperature around at least one of the first joining object member (S) and the second joining object member (C); A first joining target member moving step of moving the first joining target member S to a joining position where joining with the second joining target member C is performed when the first joining target member S is projected on the reference plane H; The second object member S to be bonded is spaced apart from the first object member S in the vertical direction V perpendicular to the reference plane H and projected onto the reference plane H A second joining member moving step of moving to a joining position at the time of joining; The first object member S and the second object member C to be joined at the bonding position when they are projected on the reference plane H in the vertical direction are moved in the vertical direction V, And a joining step of manufacturing the joining member (D); The first joining member moving process is configured to control the relative movement of the first joining target member S to the second joining target member C in response to the temperature detected in the temperature detecting process .

With such a configuration, the positional deviation accompanying the temperature change can be corrected.

According to the present invention, it is possible to quickly and suitably join the members to be joined.

1 is a longitudinal sectional view showing a schematic structure of a welding apparatus according to an embodiment of the present invention.
2 is a plan view showing a schematic configuration of a welding apparatus according to an embodiment of the present invention.
Fig. 3 is a view showing an example of a joining member, and Fig. 3 (A) is a perspective view and Fig.
4 is a plan view showing a schematic configuration of a clamper of a lower electrode of a welding apparatus according to an embodiment of the present invention.
5 is a partial vertical sectional view showing a schematic structure of an upper electrode of a welding apparatus according to an embodiment of the present invention.
Fig. 6 is a flowchart showing a procedure of a method of manufacturing a bonding member according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings, the same or similar members are denoted by the same or similar reference numerals, and redundant explanations are omitted.

First, a welding apparatus 1 as a welding member manufacturing apparatus according to an embodiment of the present invention will be described with reference to Figs. 1 and 2. Fig. 1 is a longitudinal sectional view showing a schematic structure of a welding apparatus 1. Fig. Fig. 2 is a plan view showing a schematic configuration of the welding apparatus 1. Fig. The welding apparatus 1 is a device for welding the cap C and the stem S in this embodiment. The welding apparatus 1 includes a lower electrode 10, an upper electrode 20, a moving device 30 for moving the lower electrode 10 and the upper electrode 20, A camera 41, and a control device 60. [ Prior to the description of the welding apparatus 1, a welding member manufactured by welding the cap C and the stem S will be described.

Fig. 3 (A) is a perspective view of a device D as a joining member, and Fig. 3 (B) is an exploded partial sectional side view of the device D. Fig. The device D in the present embodiment is assumed to be a photo semiconductor. The device D is constituted by bonding a cap C and a stem S to each other. 3B shows a state in which the cap C and the stem S are separated before the device D is formed and the cap C is shown in cross section and the stem S is shown in the side view . The stem S is constituted by mounting an electrode or a transistor (hereinafter referred to as " mounting portion St ") constituting the photoelectric conversion element in the base Sb and extending the lead Sd from the base Sb, . The base Sb is formed into a disc shape in the present embodiment. A stem mark Sm specifying the position in the circumferential direction is provided on the outer peripheral portion of the surface of the base Sb provided with the mounting portion St. The lead Sd extends from the base Sb to the opposite side of the mounting portion St. The base Sb and the lead Sd are formed of a metal. The cap C is configured to be mounted on the base Sb to cover the mounting portion St of the stem S. The cap C has a generally cylindrical outer shape and is configured to accommodate the mounting portion St in the cylindrical shape. In the cap C, one end face is opened and the other end face is closed with respect to the peripheral portion Cp corresponding to the cylindrical side face. In the present embodiment, the outer peripheral portion Cp has a diameter of about 5 mm at a right-angled axial section. The cap C is provided on the top surface which is a section of the side where the lens Cn for transmitting the laser light is blocked. The edge Ce of the cross section of the side where the cap C is opened slightly extends to the outside in order to secure the surface to be pressed at the time of welding. The outer periphery of the edge Ce is formed in a circular shape having a size smaller than the outer periphery of the base Sb in the present embodiment. The edge Ce is formed with a cap mark Cm specifying the position in the circumferential direction of the cylinder. The cap mark Cm is formed such that a part of the edge Ce protrudes outward. The portion of the cap C other than the lens Cn is formed of a metal. The metal parts of the stem S and the cap C are typically formed of stainless steel or Kovar, but they may be formed of metals other than these. The portion of the metal of the stem S and the cap C is typically a different kind of metal, but may be the same kind of metal. The device D is constituted by covering the mounting portion St with the cap C and then welding the edge Ce to the base Sb. At this time, according to the present embodiment, the device D that exhibits the desired performance is manufactured by aligning the cap mark Cm and the stem mark Sm so as to be aligned. In the present embodiment, the stem S corresponds to the first object to be bonded and the cap C corresponds to the second object to be bonded.

Returning to Figs. 1 and 2, the configuration of the welding apparatus 1 will be described. The lower electrode 10 holds the stem S and corresponds to the first holding member. The lower electrode 10 has an electrode body 10b and a clamper 10c. The electrode main body 10b is made of a metal block. The electrode body 10b is typically formed of a metal having high electrical conductivity. The electrode main body 10b is uniformly and flatly formed on the top surface 10f. In the present embodiment, the top surface 10f is horizontally expanded, and a virtual horizontal surface including the top surface 10f and spreading on the same plane as the top surface 10f on the outside of the top surface 10f is referred to as a reference plane H . The electrode body 10b has a stem hole 10h capable of receiving the lead Sd in the depth direction from the top surface 10f. The stem hole 10h is formed to have a diameter smaller than the outer diameter of the base Sb while being capable of accommodating all the leads Sd and in the case where the base Sb is mounted on the ceiling surface 10f And is formed to a depth capable of accommodating the longest lead Sd. The clamper 10c holds the lead Sd in the stem hole 10h and sandwiches and holds the base Sb mounted on the top face 10f and corresponds to a holding mechanism. The clamper 10c has a reference portion 11 and a pressing portion 12 and is configured such that the stem S (base Sb) can be sandwiched by the reference portion 11 and the pressing portion 12 .

Hereinafter, with reference to FIG. 4, the details of the clamper 10c will be described. Fig. 4 is a schematic plan view of the clamper 10c of the lower electrode 10 constituting the welding apparatus 1. Fig. The clamper 10c has the reference portion 11 and the pressing portion 12 as described above. The reference portion 11 and the pressing portion 12 are provided together on the ceiling surface 10f of the electrode body 10b (see Fig. 1). The reference portion 11 and the pressing portion 12 are formed so that the lead Sd is accommodated in the hole 10h for the stem and the base Sb mounted on the ceiling surface 10f The reference portion 11 is disposed on one side of the stem S and the pressing portion 12 is disposed on the opposite side of the stem S with respect to the reference portion 11 and the pressing portion 12 . The reference portion 11 and the pressing portion 12 are configured to individually perform reciprocal movement in the direction of approaching and separating (Y direction in Fig. 4) along the top face 10f. The reference portion 11 moves to the position where the stem S is held before the pressing portion 12 after the stem S is mounted on the ceiling surface 10f of the electrode body 10b and the clamper 10c, It is possible to determine the reference position Sp when the stem S is held (the lower electrode 10 holds the stem S). The clamper 10c grips the stem S by the pressing part 12 approaching the reference part 11 at a position where the stem S is gripped and the pressing part 12 is separated from the reference part 11 So that the maintenance of the stem (S) can be released. The portion of the stem S which is in contact with the reference portion 11 at the position for gripping the stem S and which is located at the most distant position from the pressing portion 12 in the direction in which the pressing portion 12 moves , And the reference position Sp when the clamper 10c holds the stem S becomes the reference position Sp.

The entire lower electrode 10 including the electrode body 10b and the clamper 10c is moved in the direction in which the reference portion 11 and the pressing portion 12 reciprocate (Y direction) by the lower moving device 31, And in a direction (X direction) orthogonal thereto, and is configured to be capable of rotating and moving in a direction (? Direction) along an arc in contact with the stem S of the reference portion 11. Thus, the entire lower electrode 10 can be reciprocated linearly and rotationally in two directions within the reference plane H by the lower mobile device 31. [ Details of the upper electrode 20 will be described in detail below with reference to the lower electrode 10 in detail.

The upper electrode 20 will be described in detail with reference to Figs. 1 and 5. Fig. 5 is a partial vertical cross-sectional view showing a schematic structure of the upper electrode 20. The upper electrode 20 holds the cap C and corresponds to the second holding port. The upper electrode 20 generally includes a columnar body 21, a balloon 22 of a circular ring shape (donut shape), an electrode tip 23, And a tip fixing nut (24) for fixing the electrode tip (23) sandwiching the balloon (22) to the main body (21). The main body 21 includes a pressing electrode 21A and a main portion 21B and is formed with a hollow portion 21h extending entirely along the circumferential axis AX . In the present embodiment, the main body 21 is provided above the lower electrode 10 in the direction in which the axis AX extends vertically vertically. A projecting portion 21p is formed at a central portion of a surface of the main body 21 at the lower end (the end closer to the lower electrode 10) to which the balloon 22 is fitted. The hollow portion 21h of the main body 21 passes through the lower end surface of the main body 21 with a reduced diameter in the vicinity of the projection 21p in the present embodiment. The balloon 22 is mounted on the outer side of the projection 21p so as to cover the outer periphery of the projection 21p. The balloon 22 is an elastic member such as a silicone rubber or the like and is formed in a hollow shape such as a tube into which a gas (typically, air) can be injected. The balloon 22 is sandwiched between the lower end surface of the main body 21 and the electrode tip 23. A gap for receiving the balloon 22 is formed between the lower end surface of the main body 21 and the electrode tip 23 and the balloon 22 expands inward toward the axis AX, 22 can enter the hollow portion 21h.

The electrode tip 23 is formed in a disc shape with a step. The electrode tip 23 is formed with a hollow portion 21h of the main body 21 and a through hole for communicating with the annular center hole of the balloon 22. The insertion hole of the electrode tip 23 is formed to be larger than the outer diameter of the outer peripheral portion Cp of the cap C and smaller than the outer diameter of the edge Ce of the cap C. [ The thickness of the electrode tip 23 around the insertion hole is set such that the outer peripheral portion Cp of the cap C is located at the center of the electrode tip 23 when the cap C is inserted into the insertion hole until the edge Ce touches the electrode tip 23 And is formed so as to pass through the center hole of the balloon 22. The tip fixing nut 24 has an outer diameter larger than the outer diameter of the main body 21. The tip fixing nut 24 is recessed toward the inside in the direction in which the axis AX extends from the upper surface so that the electrode tip 23 can be received. The tip fixing nut 24 is provided with an inner screw 24w on the inner wall of the portion recessed toward the inside and can be screwed to the outer thread 21w formed on the lower side of the main body 21 have. The tip fixing nut 24 has a through hole 24h formed at its center portion for passing a portion of a diameter larger than the insertion hole of the electrode tip 23. The upper electrode 20 includes a main body 21, an electrode tip 23, and a tip fixing nut 24, which are typically formed of a metal having high electrical conductivity. The upper electrode 20 has a main body 21, a balloon 22, an electrode tip 23 and a tip fixing nut 24 arranged concentrically around the axis AX.

The upper electrode 20 is formed by inserting the cap C into the insertion hole of the electrode tip 23 until the edge Ce makes contact with the electrode tip 23 and then inserting the gas F into the balloon 22, So that the outer peripheral portion Cp of the cap C can be held by the balloon 22 swollen toward the axis AX. At this time, since the balloon 22 swells inward uniformly all over the entire circumference, the cap C comes into contact with the upper portion of the upper electrode 20 in a state in which the axis of the cap C coincides with the axis AX of the upper electrode 20 And is held by the electrode 20. The upper electrode 20 is fixed to the upper moving device 32. The upper electrode 20 is configured to be capable of reciprocating movement toward and away from the lower electrode 10 by operation of the upper moving device 32. In other words, the upper electrode 20 is configured to be capable of reciprocating in the vertical direction (V) by the operation of the upper moving device 32.

With reference mainly to Figs. 1 and 2 again, the description of the configuration of the welding apparatus 1 will be continued. The lower electrode 10 and the upper electrode 20 are connected to a power source (not shown) through a cable (not shown). The welding apparatus 1 has a structure in which a stem S held by the lower electrode 10 is brought into contact with a cap C held by the upper electrode 20 and then a power source The lower electrode 10, the stem S, the cap C, and the upper electrode 20, as shown in Fig.

The moving device 30 includes a lower moving device 31 for moving the lower electrode 10 in the reference plane H and a lower moving device 31 for moving the upper electrode 20 in the vertical direction V Device 32 as shown in FIG. In other words, the generic name of the lower mobile device 31 and the upper mobile device 32 is the mobile device 30. The lower moving device 31 is mounted on a base 81 fixed to the housing of the welding apparatus 1. [ The base 81 is a pedestal having a surface that expands in the horizontal direction. The upper moving device 32 is fixed to the upper part of a gate 28 fixed to the base 81. The upper moving device 32 supports the upper electrode 20 so as to reciprocate in the vertical direction (V). The wedge 28 constitutes a structure for determining the position of the cap C (member to be bonded) held by the upper electrode 20 in cooperation with the upper electrode 20 and the upper moving device 32. Such a structure for determining the position of the member to be joined is typically a structure such as a retainer or a strut supporting the same.

The stem camera 41 is provided above the value stage 42 provided on the base table 81 in the horizontal direction away from the lower electrode 10. The value stand 42 is a pedestal on which the stem S (see FIG. 3) is placed. The value pedestal 42 is configured to support the base Sb with a height at which the lead Sd floats in the state that the mounting portion St faces upward. The stem camera 41 provided above the value pedestal 42 is used to photograph the stem S mounted on the value pedestal 42 from above and to detect the contour of the base Sb of the stem S, So that the position of the mark Sm can be grasped. The base Sb is a portion held by the lower electrode 10 when it is transported to the lower electrode 10 and the outline of the base Sb is the stem when the stem S is projected onto the reference plane H (S). That is, the stem camera 41 is capable of grasping the outline of the stem S projected on the reference plane H, and corresponds to the outline grasp portion. The outline of the stem S when the stem S is projected on the reference plane H is an outline of the stem S when viewed in a direction perpendicular to the reference plane H. [ It is also possible to mount a device D (see Fig. 3 (A)) manufactured by welding the cap C to the stem S, The stem camera 41 photographs the device D mounted on the value base 42 and projects the image of the device D on the outer edge of the cap C of the device D The outline of the stem S can be grasped, and also serves as a bonding member state grasping portion.

The welding apparatus 1 according to the present embodiment further includes a stem pallet 83, a cap pallet 85, a first stem conveyor 51A for conveying the stem S, A cap 51B for conveying the cap C, and a cap conveyor 56 for conveying the cap C. The stem pallet 83 is a pallet in which a plurality of the stems S are arranged. The stem palette 83 is formed by arranging a plurality of recesses (not shown) capable of accommodating the leads Sd of the stem S therein. A camera (not shown) capable of recognizing the problem of the lead Sd is provided below the stem palette 83. The stem palette 83 is provided on the side opposite to the lower electrode 10 with respect to the value pedestal 42 in a plan view. The stem palette 83 is detachably mounted to the stem pallet support 84. The stem pallet support portion 84 includes a main rail 84a extending in the direction (X direction) in which the stem pallet 83 approaches the lower electrode 10 and a main rail 84b extending perpendicularly to the direction in which the main rail 84a extends And a branch rail 84b extending in the direction (Y direction). The stem pallet 83 is movable in the X and Y directions along with the movement along the branch rail 84b of the stem palette 83 and the movement along the main rail 84a of the branch rail 84b Consists of. The cap pallet 85 is a pallet in which a plurality of caps C are arranged. The cab pallet 85 is formed by arranging a plurality of recesses (not shown) that can sandwich the edge Ce. (Not shown) formed in the cap pallet 85 has a shape corresponding to the cap mark Cm so that the position (direction) of the cap C disposed on the cap pallet 85 is determined . The recesses (not shown) formed in the cap pallet 85 are formed to a depth such that the outer peripheral portion Cp is not buried when the edge Ce is sandwiched. The cap pallet 85 is detachably mounted to the cap pallet support portion 86. The cap pallet support portion 86 is provided with a main rail 86a extending in the direction (X direction) in which the cap pallet 85 approaches the lower electrode 10 and a main rail 86b extending perpendicularly to the direction in which the main rail 86a extends And a cap movement guide 86b extending in the direction (Y direction). The cap pallet 85 is movable in the X and Y directions along with the movement of the cap pallet 85 itself along the cap movement guide 86b and the movement of the cap movement guide 86b along the main rail 86a .

The first stem conveyor 51A is provided between the lower electrode 10 and the value pedestal 42 and is provided between the lower electrode 10 and the value pedestal 42 with the stem S and the device D ). The first stem conveyor 51A has a first rotary shaft 52A and a first arm 53A. The first rotary shaft 52A is installed so as to extend vertically at an intermediate point of a virtual straight line connecting the hole 10h for stem of the lower electrode 10 and the hole for receiving the lead Sd formed in the value pedestal 42 . The first arm 53A is an elongated plate-like member, and a central portion in the longitudinal direction is rotatably mounted on the first rotation shaft 52A. At both ends of the first arm 53A, a first stem grip portion 54A capable of gripping the stem S is formed. Each of the first stem grasping portions 54A is formed on the lower surface of the first arm 53A and one of the first stem grasping portions 54A is located at a position opposed to the stem hole 10h of the lower electrode 10, Are formed at positions opposed to the holes for accommodating the leads Sd formed in the base 42, respectively.

The second stem conveyor 51B is provided between the stem pallet 83 and the value pedestal 42 and between the stem pallet 83 and the value pedestal 42, ). The second stem conveyor 51B has a second rotary shaft 52B and a second arm 53B. The second rotary shaft 52B is provided so as to extend vertically at an intermediate point of a virtual straight line connecting the stem palette 83 and the hole for receiving the lead Sd formed in the value pedestal 42. The second arm 53B is an elongated plate-shaped member, and a central portion in the longitudinal direction is rotatably mounted on the second rotation shaft 52B. At both ends of the second arm 53B, a second stem grip portion 54B capable of gripping the stem S is formed. Each of the second stem grasping portions 54B is formed on the lower surface of the second arm 53B and one of the second stamper gripping portions 54B is provided at a position facing one of the stem pallets 83, Are formed at positions opposed to the holes for accommodating the first and second sidewalls Sd.

The cap carrier 56 is provided at a position away from the lower electrode 10 on the side opposite to the value base 42 with respect to the lower electrode 10 in plan view. The cap conveyor 56 has a cap grip portion 58 capable of gripping the cap C and a support shaft 57 for supporting the cap grip portion 58. The cap grip portion 58 is supported by the support shaft 57 in a reversible manner. The support shaft 57 is configured to reciprocate between the lower portion of the upper electrode 20 and the upper portion of the cap pallet 85 along the direction in which the cap movement guide 86b extends. The cap carrier 56 holds one of the caps C mounted on the cap pallet 85 in such a manner that the cap gripper 58 faces downward and moves the cap moving guide 86b So that the cap C can be inserted into the center hole of the balloon 22 of the upper electrode 20 from the lower side Consists of.

The control device (60) controls the operation of the welding apparatus (1). The control device 60 transmits control signals to the lower electrode 10 and the upper electrode 20 by wire or radio respectively and is used for holding and releasing the stem S in the lower electrode 10, So that the cap 20 can be held and released individually. The control device 60 transmits a control signal to the lower mobile device 31 and the upper mobile device 32 by wire or radio, It is possible to individually perform the movement in the reference plane H and the movement in the vertical direction V of the upper electrode 20 by the upper moving device 32. [ The control device 60 is electrically connected to the stem camera 41 by wire or wireless, and is configured to be able to receive an image photographed by the stem camera 41. The control device 60 is configured to move the first stem conveyor 51A, the second stem conveyor 51B, the cap conveyor 56, the stem palette 83 and the cap pallet 85 appropriately . The control device 60 is electrically connected to a power source (not shown) by wire or wireless, and can control the application of a voltage between the lower electrode 10 and the upper electrode 20 .

Next, referring to Fig. 6, a method of manufacturing a joining member according to an embodiment of the present invention will be described. 6 is a flowchart showing a procedure for manufacturing the device D as the joining member. The manufacturing method of the device D (the manufacturing method of the device D) described below is typically performed in the welding apparatus 1 described so far. The manufacturing method of the device (D) described below also serves as a description of the operation of the welding apparatus 1. [ In the following description of the method of manufacturing the device (D), reference will be made to FIGS. 1 to 5 as appropriate when referring to the configuration of the welding apparatus 1 or the structure of the device (D). The welding apparatus 1 typically has a structure in which the center of the hole 10h for the stem of the lower electrode 10 (the circular space in which the stem S is held) The lower electrode 10 is set at a position where a virtual straight line extending from the axis AX of the movable electrode 20 passes.

A stem pallet 83 in which a plurality of stems S are arranged and a cap pallet 85 in which a plurality of caps C are arranged are carried in the welding apparatus 1 S1). The stem pallet 83 carried into the welding apparatus 1 is mounted on the stem pallet support 84 and the cap pallet 85 is mounted on the cap pallet support 86. [ Next, the control device 60 uses one of the stems S mounted on the stem pallet 83 with the value pedestal 42 (S2) using the second stem conveyor 51B. At this time, the control device 60 causes the stem pallet support part 84 to move the stem pallet support part 84 so that the stem S to be gripped comes to the position of the second step grasp part 54B of the second stem conveyor 51B. (83). The control device 60 holds one stem S by holding the second stem 53B with the second stem grasp portion 54B and then rotating the second arm 53B by 180 degrees in the horizontal direction and mounting it on the value pedestal 42. [ When the defective stem S is found by the camera (not shown) provided below the stem palette 83, the controller 60 sets the defective stem S to the value range 42 It is mounted on a separately provided small tray (not shown). The defective stem (S) mounted on the small tray is taken out after a while and is reused after correcting the defect.

When the stem S is mounted on the value base 42, the control device 60 photographs the stem S with the stem camera 41 (S3). Thus, since the outline of the stem S can be grasped, the step S3 of photographing the stem S by the stem camera 41 corresponds to the outline grasping step. Further, the position of the stem mark Sm can be grasped by photographing the stem S with the stem camera 41. [ The image of the stem S photographed by the stem camera 41 is transmitted to the control device 60 as data. Next, the controller 60 uses the first stem conveyor 51A to convey the stem S mounted on the value base 42 to the position of the lower electrode 10, (Step S4). At this time, the control device 60 causes the reference portion 11 and the pressing portion 12 constituting the clamper 10c of the lower electrode 10 to be spaced apart from each other, The first arm 53A is rotated 180 degrees in the horizontal direction after being held by the first stem grasping portion 54A and is conveyed between the reference portion 11 and the pressing portion 12, The reference portion 11 is first moved to the position where it grips the stem 12 and the stem 12 is moved to the reference portion 11 by moving the pressing portion 12 toward the reference portion 11, ).

In the step S4 of holding the stem S at the lower electrode 10, if the size of the contour of the held stem S does not differ from the previously assumed size, The positional relationship between the cap C and the stem S held by the lower electrode 10 is appropriate. However, if the thickness of the outline of the stem S differs from the predetermined size due to the thickness of the plating applied to the stem S or the like, the cap C and the lower electrode The positional relationship in the plan view with the stem S held on the base 10 is inadequate. This occurs because the lower electrode 10 sets the contact portion between the reference portion 11 and the stem S as the reference position Sp. When the cap C held in the upper electrode 20 and the stem S held in the lower electrode 10 are in an inappropriate positional relationship with each other in the plan view, Can be prepared. In order to avoid such a problem, in the welding apparatus 1, after the stem S is held at the lower electrode 10 (S4), the control device 60 causes the stem camera 41 to move the stem S The position of the stem S in a state in which the stem S is held on the lower electrode 10 and the position of the stem S in the state in which the stem S is held on the lower electrode 10 are determined based on the image data of the stem S obtained in the photographing step S3, The lower electrode 10 holding the stem S is moved (a first joining member moving step: S5) to a position (joining position) at which the position of the cap C held in the joining position becomes appropriate. In the present embodiment, the lower electrode 10 is moved in the? Direction (see FIG. 4) so that the stem mark Sm coincides with the cap mark Cm, based on the image data of the stem S And is rotated. When the stem S is held on the lower electrode 10 by using the first stem conveyor 51A and the step S6 is carried out in the step S3 of photographing the stem S with the stem camera 41, The adjustment of the position of the lower electrode 10 in the XY direction and / or the [theta] direction is performed based on the image data of the stem S, and the position adjustment in the first joining member moving step (S5) May be shortened.

Next, the control device 60 carries one of the caps C mounted on the cap pallet 85 to the upper electrode 20 by using the cap conveyor 56, and transfers the cap C to the upper electrode 20 The cap C is held (S6). At this time, the control device 60 moves the cap pallet 85 by the cap pallet support portion 86 so that the cap C to be gripped comes to the position of the cap grip portion 58 of the cap carrier 56 And one cap (C) is held by the cap gripper (58). Thereafter, the capper 58 is vertically inverted while the supporting shaft 57 is moved toward the upper electrode 20 along the cap moving guide 86b, and the cap C is inserted into the balloon (not shown) of the upper electrode 20 22 to the bottom of the center hole. At this time, the position of the cap C may be adjusted in the? Direction. The outer peripheral portion Cp of the cap C is inserted into the center hole of the balloon 22 until the edge Ce touches the electrode tip 23 to inflate the balloon 22, . The upper electrode 20 expands the balloon 22 to hold the cap C so that the balloon 22 evenly contacts the entire periphery of the outer periphery Cp of the cap C, And the axis AX of the upper electrode 20 passes through the center of the cap C. In this case, The upper electrode 20 is supported by the wedge 28 so that it can move in the vertical direction but is not moved in the horizontal direction so that the cap C is connected to the upper electrode 20 At the point of time when it is held at the contact position. Therefore, in the present embodiment, the step (S6) of carrying the cap C from the cap pallet 85 to the upper electrode 20 and holding it with the upper electrode 20 is equivalent to the step do. 6, the holding S6 of the cap C in the upper electrode 20 is moved from the value S2 of the stem S to the joint position of the stem S5 But it may be performed before or after the movement S5 from the value S2 of the stem S to the joint position of the stem S is performed.

The cap S is held at the lower electrode 10 and the cap C is held at the upper electrode 20 so that the upper electrode 20 holding the cap C is lowered, The edge Ce of the stem S is brought into contact with the base Sb of the stem S and the cap C and the stem S are jointed to each other to manufacture the device D (bonding step: S7). The connection between the cap C and the stem S is achieved by further pressing the upper electrode 20 toward the lower electrode 10 after bringing the edge Ce into contact with the base Sb, (Not shown) while applying pressure to the contact portion (projection) between the base Sb of the cap C and the edge Ce of the cap C to energize the projection. When the stem S and the cap C are joined to each other, the upper electrode 20 releases the holding of the cap C (S8) and moves upward so as to be separated from the lower electrode 10. Next, the control device 60 releases the holding of the stem S (S9). Next, the control device 60 uses the first stem conveyor 51A to convey the device D in the lower electrode 10 to the value platform 42 (S10).

When the device D is mounted on the value platform 42, the control device 60 photographs the device D with the stem camera 41 (S11). As a result, the outer edge of the cap C and the outline of the stem S in the state of the device D can be grasped, and the position of the cap C and the stem S in the plane (Typically, whether or not the centers of both of them are shifted) can be grasped. The image of the device D photographed by the stem camera 41 is transmitted as data to the control device 60. When there is a deviation between the position of the cap C and the position of the stem S, And feedback is performed to the alignment of the stem (S) and the cap (C). When the device D is photographed with the stem camera 41 in step S11, the control device 60 uses the second stem transfer device 51B to transfer the device D mounted on the value platform 42 , And returns it to the storage position of the device D (S12). In the present embodiment, the device D of the value unit 42 is transferred to the stem pallet 83, and the device D is received in the stem pallet 83. At this time, the device D is accommodated at a position where the stem S is removed or a position where the original stem S is not mounted on the stem pallet 83 for bonding. Thus, the manufacture of one device D is completed. Subsequently, when the device D is newly manufactured, the above-described flow shown in Fig. 6 is repeated.

As described above, according to the present embodiment, even when the size of the outline of the stem S varies, even when the stem S is held in the lower electrode 10 before the reference plane H, the position of the stem S to be joined and the cap C can be aligned with each other. The adjustment of the position of the lower electrode 10 in the reference plane H is performed based on the image photographed by the stem camera 41 so that the stem S is held by the lower electrode 10 The position of the lower electrode 10 can be adjusted immediately after or after moving the reference portion 11 and / or the pressing portion 12, the time required for the position adjustment can be reduced, and the manufacturing of the device D The efficiency can be improved.

In the above description, the displacement between the stem S and the cap C in the device D photographed by the stem camera 41 is referred to as feedback of the position of the lower electrode 10 holding the stem S A temperature sensor 46 (indicated by a chain double-dashed line in FIG. 1) for detecting the temperature in the vicinity of the upper electrode 20 is provided and a stem (not shown) of the device D taken by the stem camera 41 The temperature detected by the temperature sensor 46 may be fed back to the position adjustment of the lower electrode 10, instead of the deviation between the cap S and the cap C. In this case, it can be configured as follows. The temperature sensor 46 is typically a thermocouple. The temperature sensor 46 is mounted on the wedge 28 and is configured to be able to detect a temperature change of the wedge 28. The wedge 28 may be referred to as a structure in which the upper moving device 32 supporting the upper electrode 20 is mounted and the position of the cap C held by the upper electrode 20 is determined. Therefore, the temperature sensor 46 corresponds to the temperature change detecting section. The control device 60 is configured to be electrically connected to the temperature sensor 46 by wire or wireless, and to receive the temperature change detected by the temperature sensor 46 as a signal. The control device 60 controls the temperature sensor 46 so that the standard position is a position at which the stem S and the cap C are appropriately joined at the reference temperature, The shift of the ruler 28 is stored in advance. The wedge 28 supporting the upper electrode 20 may expand or shrink with a change in temperature and cause a deviation in the bonding position of the upper electrode 20. [ The control device 60 determines the temperature detected by the temperature sensor 46 based on the relationship of the deviation of the slippage 28 with respect to the temperature change detected by the temperature sensor 46 stored in advance, It is preferable to add the offset of the flap 28 to the temperature change in the step S5 of moving the stem S held by the lower electrode 10 to the bonding position in the flowchart. In this case, the temperature is detected by the temperature sensor 46 before reaching the step S5 of moving the stem S held by the lower electrode 10 to the bonding position, and the temperature detected by the temperature sensor 46 To the step S5 of moving the stem S held in the lower electrode 10 to the bonding position and to photograph the device D with the stem camera 41 from the flowchart shown in Fig. The step S11 is omitted.

In the above description, the reference portion 11 and the pressing portion 12 are configured so as to be capable of reciprocating movement approaching and separating each other along the top face 10f. However, 10b so that only the pushing portion 12 is reciprocally moved toward and away from the reference portion 11. However, it is possible to prevent the stem S from interfering with the clamper 10c when the stem S is mounted on the lower electrode 10 by moving both the reference portion 11 and the pressing portion 12 So that it is possible.

In the above description, the lower electrode 10 moves in the reference plane H (horizontal plane) and the upper electrode 20 moves in the vertical direction V (vertical direction). However, It may move in the vertical direction V (vertical direction) and the upper electrode 20 may move in the reference plane H (horizontal plane). Alternatively, the upper electrode 20 may be moved in both the reference plane H (horizontal plane) and the vertical direction V (vertical direction) without the lower electrode 10 moving. Conversely, The lower electrode 10 may be moved both in the reference plane H (horizontal plane) and in the vertical direction V (vertical direction) without the movable electrode 20 moving, The upper electrode 20 is moved in both of the reference plane H (horizontal plane) and the vertical direction V (vertical direction) while moving to one side in the horizontal direction H (horizontal plane) The lower electrode 10 may be moved in the reference plane H (horizontal plane) while the upper electrode 20 is moved in the reference plane H (horizontal plane) or in the vertical direction V (Vertical direction), and both the lower electrode 10 and the upper electrode 20 may be moved in the vertical direction V It may be moved both in the plane H (horizontal plane) and in the vertical direction V (vertical direction).

In the above description, the bonding member (device D) is an optical semiconductor, but it may be a sensor product manufactured by bonding two members.

1: welding device
10: Lower electrode
10c: clamper
11: Reference part
12:
20: upper electrode
28: Witchcraft
30: Mobile device
41: stem camera
46: Temperature sensor
60: Control device
D: Device
C: cap
S: Stem
Sp: Reference position
H: Reference plane
V: vertical direction

Claims (8)

An apparatus for manufacturing a joining member in which a first joining target member and a second joining target member are joined to each other;
A first holding member for holding the first member to be joined;
A second holding means for holding the second member to be joined;
A moving device that moves the first holding tool relative to the second holding tool in a reference plane and relatively reciprocates in a vertical direction perpendicular to the reference plane;
An outline of a portion of the first object to be bonded held by the first retention hole is projected on the reference plane and a projection of the portion to be retreated from the first retention hole A contour determination unit configured to determine a contour;
And a control device for controlling the mobile device;
Wherein the first holding tool is configured to hold the first object to be bonded with a part of the contour of the first object to be bonded as a reference position;
Wherein the control device is configured to control the first object to be joined held by the first holding tool and the second object to be joined held by the second holding tool in correspondence with the outline grasped by the outline holding unit, Of the first retaining hole with respect to the second retaining hole in the reference plane at a position where the first retaining hole is appropriately joined by the movement in the vertical direction relative to the second retaining hole And to relatively move the joining member. The method according to claim 1,
An outer edge of the joining member when the second joining member is projected onto the reference plane and a joining member state grasping portion for grasping the outline;
Wherein the control device is configured to control the positional relationship between the outer edge and the contour of the joining member state grasping section, 2 relative to the holding tool. The method according to claim 1,
The first holding tool has a holding mechanism for holding the first object to be bonded;
Wherein the gripping mechanism includes a reference portion contacting the reference position and a pressing portion sandwiching the first object to be bonded in cooperation with the reference portion, wherein the reference portion and the pressing portion are relatively close to each other, So as to perform a reciprocating movement. 3. The method of claim 2,
The first holding tool has a holding mechanism for holding the first object to be bonded;
Wherein the gripping mechanism includes a reference portion contacting the reference position and a pressing portion sandwiching the first object to be bonded in cooperation with the reference portion, wherein the reference portion and the pressing portion are relatively close to each other, So as to perform a reciprocating movement. 5. The method according to any one of claims 1 to 4,
At least one of the structure for determining the position of the first object to be bonded held by the first holding tool and the structure for determining the position of the second object to be bonded held by the second holding tool And a temperature change detecting unit for detecting a change in the temperature of the fuel cell stack.
Wherein the control device is configured to adjust a relative movement of the first retaining hole with respect to the second retention hole in the reference plane in response to a change in temperature detected by the temperature change detecting unit, . An apparatus for manufacturing a joining member in which a first joining target member and a second joining target member are joined to each other;
A first holding member for holding the first member to be joined;
A second holding means for holding the second member to be joined;
A moving device that moves the first holding tool relative to the second holding tool in a reference plane and relatively reciprocates in a vertical direction perpendicular to the reference plane;
At least one of the structure for determining the position of the first object to be bonded held by the first holding tool and the structure for determining the position of the second object to be bonded held by the second holding tool A temperature change detecting unit for detecting a change in the temperature of the substrate;
And a control device for controlling the mobile device;
Wherein the control device includes a standard position where a joining of the first joining object held by the first holding tool and the second joining object held by the second holding tool at a reference temperature is performed, And the temperature change detected by the temperature change detecting unit is stored in advance in the standard position and the structure of the structure which are stored in advance. And adjusts the relative movement of the first retaining hole with respect to the second retaining hole in the reference plane in view of the relationship with the misalignment. A method of manufacturing a joining member in which a first joining member and a second joining member are joined to each other;
An outline grasping step of grasping an outline of projection of the first joining member onto a reference plane;
A first joining member moving step of moving the first joining member to a joining position where joining with the second joining member is performed when the first joining member is projected onto the reference plane;
The second joining target member is spaced apart from the first joining target member in a vertical direction perpendicular to the reference plane and is moved to the joining position when projected onto the reference plane, An object member moving process;
The first joining object and the second joining object located at the joining position are moved closer to each other in the vertical direction when projected on the reference plane so as to form the joining member A joining step for joining the first and second substrates;
Wherein the contour grasping step is configured to grasp the contour at a position apart from the bonding position when projected onto the reference plane;
Wherein the first joining member moving step is configured to adjust the relative movement of the first joining object member with respect to the second joining target member in correspondence with the outline grasped in the outline grasping step, Way. A method of manufacturing a joining member in which a first joining member and a second joining member are joined to each other;
A temperature detecting step of detecting a temperature of at least one of a structure for determining the position of the first object to be bonded and a structure for determining the position of the second object to be bonded;
A first joining object moving step of moving the first joining target member to a joining position where joining with the second joining target member is performed when the first joining target member is projected onto the reference plane;
The second joining target member is spaced apart from the first joining target member in a vertical direction perpendicular to the reference plane and is moved to the joining position when projected onto the reference plane, An object member moving process;
The first joining object and the second joining object located at the joining position are moved closer to each other in the vertical direction when projected on the reference plane so as to form the joining member A joining step for joining the first and second substrates;
The first joining target member moving step is a step of moving the first joining target member and the second joining target member at a reference temperature to a standard position at which joining of the first joining object member and the second joining target member is performed, Wherein a shift of the structure with respect to a change is grasped in advance and a change in the temperature detected in the temperature detecting step is reflected in a relationship between the standard position and a shift portion of the structure, And adjust the relative movement of the object member with respect to the second object member to be joined.

Images