TWI454545B - Adhesive composition - Google Patents
Adhesive composition Download PDFInfo
- Publication number
- TWI454545B TWI454545B TW099117932A TW99117932A TWI454545B TW I454545 B TWI454545 B TW I454545B TW 099117932 A TW099117932 A TW 099117932A TW 99117932 A TW99117932 A TW 99117932A TW I454545 B TWI454545 B TW I454545B
- Authority
- TW
- Taiwan
- Prior art keywords
- resin
- adhesive composition
- substrate
- monomer
- solvent
- Prior art date
Links
- 239000000853 adhesive Substances 0.000 title claims description 42
- 230000001070 adhesive effect Effects 0.000 title claims description 42
- 239000000203 mixture Substances 0.000 title claims description 37
- 239000011347 resin Substances 0.000 claims description 105
- 229920005989 resin Polymers 0.000 claims description 105
- 239000000178 monomer Substances 0.000 claims description 37
- 235000007586 terpenes Nutrition 0.000 claims description 29
- 239000012790 adhesive layer Substances 0.000 claims description 28
- 150000003505 terpenes Chemical class 0.000 claims description 25
- 239000000758 substrate Substances 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 21
- 239000002904 solvent Substances 0.000 claims description 18
- 150000001925 cycloalkenes Chemical class 0.000 claims description 14
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 13
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 13
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 13
- 239000003960 organic solvent Substances 0.000 claims description 11
- 239000003208 petroleum Substances 0.000 claims description 11
- 238000012545 processing Methods 0.000 claims description 10
- JFNLZVQOOSMTJK-KNVOCYPGSA-N norbornene Chemical compound C1[C@@H]2CC[C@H]1C=C2 JFNLZVQOOSMTJK-KNVOCYPGSA-N 0.000 claims description 7
- 150000001336 alkenes Chemical class 0.000 claims description 5
- 230000009477 glass transition Effects 0.000 claims description 5
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims description 5
- 230000000379 polymerizing effect Effects 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000003672 processing method Methods 0.000 claims 2
- 239000011248 coating agent Substances 0.000 description 17
- 238000000576 coating method Methods 0.000 description 17
- CFJYNSNXFXLKNS-UHFFFAOYSA-N p-menthane Chemical compound CC(C)C1CCC(C)CC1 CFJYNSNXFXLKNS-UHFFFAOYSA-N 0.000 description 17
- -1 ethylene, propylene, 1-butene Chemical class 0.000 description 14
- 239000007789 gas Substances 0.000 description 14
- 239000000126 substance Substances 0.000 description 10
- 238000012360 testing method Methods 0.000 description 10
- 229920002120 photoresistant polymer Polymers 0.000 description 9
- 229930004008 p-menthane Natural products 0.000 description 8
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 8
- 239000000243 solution Substances 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 7
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 125000000217 alkyl group Chemical group 0.000 description 6
- 239000011247 coating layer Substances 0.000 description 6
- 238000007872 degassing Methods 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 239000002313 adhesive film Substances 0.000 description 5
- 125000004432 carbon atom Chemical group C* 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 150000002148 esters Chemical class 0.000 description 5
- YTHRBOFHFYZBRJ-UHFFFAOYSA-N (2-methyl-5-prop-1-en-2-yl-1-cyclohex-2-enyl) acetate Chemical compound CC(=O)OC1CC(C(C)=C)CC=C1C YTHRBOFHFYZBRJ-UHFFFAOYSA-N 0.000 description 4
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 4
- 238000004090 dissolution Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- XMGQYMWWDOXHJM-UHFFFAOYSA-N limonene Chemical compound CC(=C)C1CCC(C)=CC1 XMGQYMWWDOXHJM-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 4
- WKBPZYKAUNRMKP-UHFFFAOYSA-N 1-[2-(2,4-dichlorophenyl)pentyl]1,2,4-triazole Chemical compound C=1C=C(Cl)C=C(Cl)C=1C(CCC)CN1C=NC=N1 WKBPZYKAUNRMKP-UHFFFAOYSA-N 0.000 description 3
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 3
- 239000004713 Cyclic olefin copolymer Substances 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- 125000002723 alicyclic group Chemical group 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- CDOSHBSSFJOMGT-UHFFFAOYSA-N linalool Chemical compound CC(C)=CCCC(C)(O)C=C CDOSHBSSFJOMGT-UHFFFAOYSA-N 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- MSFGZHUJTJBYFA-UHFFFAOYSA-M sodium dichloroisocyanurate Chemical compound [Na+].ClN1C(=O)[N-]C(=O)N(Cl)C1=O MSFGZHUJTJBYFA-UHFFFAOYSA-M 0.000 description 3
- NOOLISFMXDJSKH-KXUCPTDWSA-N (-)-Menthol Chemical compound CC(C)[C@@H]1CC[C@@H](C)C[C@H]1O NOOLISFMXDJSKH-KXUCPTDWSA-N 0.000 description 2
- XHXUANMFYXWVNG-ADEWGFFLSA-N (-)-Menthyl acetate Chemical compound CC(C)[C@@H]1CC[C@@H](C)C[C@H]1OC(C)=O XHXUANMFYXWVNG-ADEWGFFLSA-N 0.000 description 2
- GRWFGVWFFZKLTI-IUCAKERBSA-N (-)-α-pinene Chemical compound CC1=CC[C@@H]2C(C)(C)[C@H]1C2 GRWFGVWFFZKLTI-IUCAKERBSA-N 0.000 description 2
- RXBQNMWIQKOSCS-UHFFFAOYSA-N (7,7-dimethyl-4-bicyclo[3.1.1]hept-3-enyl)methanol Chemical compound C1C2C(C)(C)C1CC=C2CO RXBQNMWIQKOSCS-UHFFFAOYSA-N 0.000 description 2
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 2
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 2
- MOQGCGNUWBPGTQ-UHFFFAOYSA-N 2,6,6-trimethyl-1-cyclohexene-1-carboxaldehyde Chemical compound CC1=C(C=O)C(C)(C)CCC1 MOQGCGNUWBPGTQ-UHFFFAOYSA-N 0.000 description 2
- KOCVACNWDMSLBM-UHFFFAOYSA-N 4-(Ethoxymethyl)-2-methoxyphenol Chemical compound CCOCC1=CC=C(O)C(OC)=C1 KOCVACNWDMSLBM-UHFFFAOYSA-N 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- BAVONGHXFVOKBV-UHFFFAOYSA-N Carveol Chemical compound CC(=C)C1CC=C(C)C(O)C1 BAVONGHXFVOKBV-UHFFFAOYSA-N 0.000 description 2
- YTHRBOFHFYZBRJ-RYUDHWBXSA-N Carvyl acetate Natural products CC(=O)O[C@H]1C[C@@H](C(C)=C)CC=C1C YTHRBOFHFYZBRJ-RYUDHWBXSA-N 0.000 description 2
- WTEVQBCEXWBHNA-UHFFFAOYSA-N Citral Natural products CC(C)=CCCC(C)=CC=O WTEVQBCEXWBHNA-UHFFFAOYSA-N 0.000 description 2
- KRCZYMFUWVJCLI-UHFFFAOYSA-N Dihydrocarveol Chemical compound CC1CCC(C(C)=C)CC1O KRCZYMFUWVJCLI-UHFFFAOYSA-N 0.000 description 2
- VZWGRQBCURJOMT-UHFFFAOYSA-N Dodecyl acetate Chemical compound CCCCCCCCCCCCOC(C)=O VZWGRQBCURJOMT-UHFFFAOYSA-N 0.000 description 2
- 206010059866 Drug resistance Diseases 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- LHXDLQBQYFFVNW-UHFFFAOYSA-N Fenchone Chemical compound C1CC2(C)C(=O)C(C)(C)C1C2 LHXDLQBQYFFVNW-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- GLZPCOQZEFWAFX-UHFFFAOYSA-N Geraniol Chemical compound CC(C)=CCCC(C)=CCO GLZPCOQZEFWAFX-UHFFFAOYSA-N 0.000 description 2
- FPCCDPXRNNVUOM-UHFFFAOYSA-N Hydroxycitronellol Chemical compound OCCC(C)CCCC(C)(C)O FPCCDPXRNNVUOM-UHFFFAOYSA-N 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- 125000003342 alkenyl group Chemical group 0.000 description 2
- IGODOXYLBBXFDW-UHFFFAOYSA-N alpha-Terpinyl acetate Chemical compound CC(=O)OC(C)(C)C1CCC(C)=CC1 IGODOXYLBBXFDW-UHFFFAOYSA-N 0.000 description 2
- UAHWPYUMFXYFJY-UHFFFAOYSA-N beta-myrcene Chemical compound CC(C)=CCCC(=C)C=C UAHWPYUMFXYFJY-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- CRPUJAZIXJMDBK-UHFFFAOYSA-N camphene Chemical compound C1CC2C(=C)C(C)(C)C1C2 CRPUJAZIXJMDBK-UHFFFAOYSA-N 0.000 description 2
- 229940043350 citral Drugs 0.000 description 2
- NEHNMFOYXAPHSD-UHFFFAOYSA-N citronellal Chemical compound O=CCC(C)CCC=C(C)C NEHNMFOYXAPHSD-UHFFFAOYSA-N 0.000 description 2
- QMVPMAAFGQKVCJ-UHFFFAOYSA-N citronellol Chemical compound OCCC(C)CCC=C(C)C QMVPMAAFGQKVCJ-UHFFFAOYSA-N 0.000 description 2
- JOZKFWLRHCDGJA-UHFFFAOYSA-N citronellol acetate Chemical compound CC(=O)OCCC(C)CCC=C(C)C JOZKFWLRHCDGJA-UHFFFAOYSA-N 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- ZYGHJZDHTFUPRJ-UHFFFAOYSA-N coumarin Chemical compound C1=CC=C2OC(=O)C=CC2=C1 ZYGHJZDHTFUPRJ-UHFFFAOYSA-N 0.000 description 2
- ZSWFCLXCOIISFI-UHFFFAOYSA-N cyclopentadiene Chemical compound C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 2
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- NNRLDGQZIVUQTE-UHFFFAOYSA-N gamma-Terpineol Chemical compound CC(C)=C1CCC(C)(O)CC1 NNRLDGQZIVUQTE-UHFFFAOYSA-N 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- WTEVQBCEXWBHNA-JXMROGBWSA-N geranial Chemical compound CC(C)=CCC\C(C)=C\C=O WTEVQBCEXWBHNA-JXMROGBWSA-N 0.000 description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 2
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 2
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 description 2
- ZYTMANIQRDEHIO-KXUCPTDWSA-N isopulegol Chemical compound C[C@@H]1CC[C@@H](C(C)=C)[C@H](O)C1 ZYTMANIQRDEHIO-KXUCPTDWSA-N 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 235000001510 limonene Nutrition 0.000 description 2
- 229940087305 limonene Drugs 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- UODXCYZDMHPIJE-UHFFFAOYSA-N menthanol Chemical compound CC1CCC(C(C)(C)O)CC1 UODXCYZDMHPIJE-UHFFFAOYSA-N 0.000 description 2
- 229940041616 menthol Drugs 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- HFPZCAJZSCWRBC-UHFFFAOYSA-N p-cymene Chemical compound CC(C)C1=CC=C(C)C=C1 HFPZCAJZSCWRBC-UHFFFAOYSA-N 0.000 description 2
- NDTYTMIUWGWIMO-UHFFFAOYSA-N perillyl alcohol Chemical compound CC(=C)C1CCC(CO)=CC1 NDTYTMIUWGWIMO-UHFFFAOYSA-N 0.000 description 2
- RUMOYJJNUMEFDD-UHFFFAOYSA-N perillyl aldehyde Chemical compound CC(=C)C1CCC(C=O)=CC1 RUMOYJJNUMEFDD-UHFFFAOYSA-N 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- HKZQJZIFODOLFR-UHFFFAOYSA-N piperitenone Chemical compound CC(C)=C1CCC(C)=CC1=O HKZQJZIFODOLFR-UHFFFAOYSA-N 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- ULWHHBHJGPPBCO-UHFFFAOYSA-N propane-1,1-diol Chemical compound CCC(O)O ULWHHBHJGPPBCO-UHFFFAOYSA-N 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- CZCBTSFUTPZVKJ-UHFFFAOYSA-N rose oxide Chemical compound CC1CCOC(C=C(C)C)C1 CZCBTSFUTPZVKJ-UHFFFAOYSA-N 0.000 description 2
- SGAWOGXMMPSZPB-UHFFFAOYSA-N safranal Chemical compound CC1=C(C=O)C(C)(C)CC=C1 SGAWOGXMMPSZPB-UHFFFAOYSA-N 0.000 description 2
- XBFJAVXCNXDMBH-UHFFFAOYSA-N tetracyclo[6.2.1.1(3,6).0(2,7)]dodec-4-ene Chemical compound C1C(C23)C=CC1C3C1CC2CC1 XBFJAVXCNXDMBH-UHFFFAOYSA-N 0.000 description 2
- ZENOXNGFMSCLLL-UHFFFAOYSA-N vanillyl alcohol Chemical compound COC1=CC(CO)=CC=C1O ZENOXNGFMSCLLL-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- NPNUFJAVOOONJE-ZIAGYGMSSA-N β-(E)-Caryophyllene Chemical compound C1CC(C)=CCCC(=C)[C@H]2CC(C)(C)[C@@H]21 NPNUFJAVOOONJE-ZIAGYGMSSA-N 0.000 description 2
- YKFLAYDHMOASIY-UHFFFAOYSA-N γ-terpinene Chemical compound CC(C)C1=CCC(C)=CC1 YKFLAYDHMOASIY-UHFFFAOYSA-N 0.000 description 2
- LHXDLQBQYFFVNW-XCBNKYQSSA-N (+)-Fenchone Natural products C1C[C@]2(C)C(=O)C(C)(C)[C@H]1C2 LHXDLQBQYFFVNW-XCBNKYQSSA-N 0.000 description 1
- BAVONGHXFVOKBV-ZJUUUORDSA-N (-)-trans-carveol Natural products CC(=C)[C@@H]1CC=C(C)[C@@H](O)C1 BAVONGHXFVOKBV-ZJUUUORDSA-N 0.000 description 1
- 239000001871 (1R,2R,5S)-5-methyl-2-prop-1-en-2-ylcyclohexan-1-ol Substances 0.000 description 1
- CRDAMVZIKSXKFV-FBXUGWQNSA-N (2-cis,6-cis)-farnesol Chemical compound CC(C)=CCC\C(C)=C/CC\C(C)=C/CO CRDAMVZIKSXKFV-FBXUGWQNSA-N 0.000 description 1
- 239000001769 (2-methyl-5-prop-1-en-2-yl-1-cyclohex-2-enyl) propanoate Substances 0.000 description 1
- 239000000260 (2E,6E)-3,7,11-trimethyldodeca-2,6,10-trien-1-ol Substances 0.000 description 1
- 239000001490 (3R)-3,7-dimethylocta-1,6-dien-3-ol Substances 0.000 description 1
- DZWDEGBGKYCSKL-UHFFFAOYSA-N (4-hydroxy-3-methoxyphenyl)methyl acetate Chemical compound COC1=CC(COC(C)=O)=CC=C1O DZWDEGBGKYCSKL-UHFFFAOYSA-N 0.000 description 1
- 239000001605 (5-methyl-2-propan-2-ylcyclohexyl) acetate Substances 0.000 description 1
- PELLUIPPBKHUAB-UHFFFAOYSA-N (5-methyl-2-propan-2-ylcyclohexyl) propanoate Chemical compound CCC(=O)OC1CC(C)CCC1C(C)C PELLUIPPBKHUAB-UHFFFAOYSA-N 0.000 description 1
- IJFKZRMIRAVXRK-VQHVLOKHSA-N (5e)-2,6-dimethylocta-5,7-dien-2-ol Chemical compound C=CC(/C)=C/CCC(C)(C)O IJFKZRMIRAVXRK-VQHVLOKHSA-N 0.000 description 1
- TYDDWHVJHGIJCW-UHFFFAOYSA-N (E)-2,6-dimethyl-octa-1,5,7-trien-3-ol Natural products CC(=C)C(O)CC=C(C)C=C TYDDWHVJHGIJCW-UHFFFAOYSA-N 0.000 description 1
- QMVPMAAFGQKVCJ-SNVBAGLBSA-N (R)-(+)-citronellol Natural products OCC[C@H](C)CCC=C(C)C QMVPMAAFGQKVCJ-SNVBAGLBSA-N 0.000 description 1
- CDOSHBSSFJOMGT-JTQLQIEISA-N (R)-linalool Natural products CC(C)=CCC[C@@](C)(O)C=C CDOSHBSSFJOMGT-JTQLQIEISA-N 0.000 description 1
- WUOACPNHFRMFPN-SECBINFHSA-N (S)-(-)-alpha-terpineol Chemical compound CC1=CC[C@@H](C(C)(C)O)CC1 WUOACPNHFRMFPN-SECBINFHSA-N 0.000 description 1
- RUJPNZNXGCHGID-UHFFFAOYSA-N (Z)-beta-Terpineol Natural products CC(=C)C1CCC(C)(O)CC1 RUJPNZNXGCHGID-UHFFFAOYSA-N 0.000 description 1
- JGMYDQCXGIMHLL-WAYWQWQTSA-N (Z)-hexadec-11-enoic acid Chemical compound CCCC\C=C/CCCCCCCCCC(O)=O JGMYDQCXGIMHLL-WAYWQWQTSA-N 0.000 description 1
- GVRWIAHBVAYKIZ-FNORWQNLSA-N (e)-dec-3-ene Chemical compound CCCCCC\C=C\CC GVRWIAHBVAYKIZ-FNORWQNLSA-N 0.000 description 1
- XBGUIVFBMBVUEG-UHFFFAOYSA-N 1-methyl-4-(1,5-dimethyl-4-hexenylidene)-1-cyclohexene Chemical compound CC(C)=CCCC(C)=C1CCC(C)=CC1 XBGUIVFBMBVUEG-UHFFFAOYSA-N 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- AWNOGHRWORTNEI-UHFFFAOYSA-N 2-(6,6-dimethyl-4-bicyclo[3.1.1]hept-3-enyl)ethyl acetate Chemical compound CC(=O)OCCC1=CCC2C(C)(C)C1C2 AWNOGHRWORTNEI-UHFFFAOYSA-N 0.000 description 1
- ROKSAUSPJGWCSM-UHFFFAOYSA-N 2-(7,7-dimethyl-4-bicyclo[3.1.1]hept-3-enyl)ethanol Chemical compound C1C2C(C)(C)C1CC=C2CCO ROKSAUSPJGWCSM-UHFFFAOYSA-N 0.000 description 1
- HZLCGUXUOFWCCN-UHFFFAOYSA-N 2-hydroxynonadecane-1,2,3-tricarboxylic acid Chemical compound CCCCCCCCCCCCCCCCC(C(O)=O)C(O)(C(O)=O)CC(O)=O HZLCGUXUOFWCCN-UHFFFAOYSA-N 0.000 description 1
- ZKEYNKDKHRZDGZ-UHFFFAOYSA-N 2-methoxy-4-prop-2-enylcyclohex-3-en-1-ol Chemical compound C1(C(O)CCC(CC=C)=C1)OC ZKEYNKDKHRZDGZ-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- IYYUJCKJSSPXQQ-UHFFFAOYSA-N 2-pyridin-4-yl-1,3-thiazolidin-3-ium-4-carboxylate Chemical compound N1C(C(=O)O)CSC1C1=CC=NC=C1 IYYUJCKJSSPXQQ-UHFFFAOYSA-N 0.000 description 1
- FUDNBFMOXDUIIE-UHFFFAOYSA-N 3,7-dimethylocta-1,6-diene Chemical compound C=CC(C)CCC=C(C)C FUDNBFMOXDUIIE-UHFFFAOYSA-N 0.000 description 1
- YSTPAHQEHQSRJD-UHFFFAOYSA-N 3-Carvomenthenone Chemical compound CC(C)C1CCC(C)=CC1=O YSTPAHQEHQSRJD-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- WWJLCYHYLZZXBE-UHFFFAOYSA-N 5-chloro-1,3-dihydroindol-2-one Chemical compound ClC1=CC=C2NC(=O)CC2=C1 WWJLCYHYLZZXBE-UHFFFAOYSA-N 0.000 description 1
- KMRMUZKLFIEVAO-UHFFFAOYSA-N 7,7-dimethylbicyclo[3.1.1]hept-3-ene-4-carbaldehyde Chemical compound C1C2C(C)(C)C1CC=C2C=O KMRMUZKLFIEVAO-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 240000007087 Apium graveolens Species 0.000 description 1
- 235000015849 Apium graveolens Dulce Group Nutrition 0.000 description 1
- 235000010591 Appio Nutrition 0.000 description 1
- 241000271309 Aquilaria crassna Species 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 239000005973 Carvone Substances 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J145/00—Adhesives based on homopolymers or copolymers of compounds having no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic or in a heterocyclic system; Adhesives based on derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L91/00—Compositions of oils, fats or waxes; Compositions of derivatives thereof
- C08L91/06—Waxes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J193/00—Adhesives based on natural resins; Adhesives based on derivatives thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L91/00—Compositions of oils, fats or waxes; Compositions of derivatives thereof
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L93/00—Compositions of natural resins; Compositions of derivatives thereof
- C08L93/04—Rosin
Landscapes
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- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
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- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Description
本發明係關於一種黏著劑組成物,更詳而言之,係關於一種加工半導體晶圓等之基板時,用以使該基板與玻璃板或薄膜等之支撐體暫時性暫黏之黏著劑組成物。
在薄型半導體矽晶片之製造中,例如使高純度矽單結晶等切成薄片而形成晶圓後,利用光阻劑而於晶圓表面形成特定之電路圖型。然後,對所得到之半導體晶圓的背面實施硏磨切削加工後,對硏磨切削成特定之厚度的半導體晶圓實施切片加工而得到晶片。
在如此之製造步驟中,已薄板化之晶圓本身易脆弱破損,故必須補強此。尚且,亦必須防止藉由例如於硏磨切削加工所產生之硏磨屑等而於晶圓表面形成之電路圖型被污染。因此,防止晶圓的破損,保護晶圓表面之電路圖型的方法,已知以下之方法。
(1)於晶圓以黏著劑層暫黏支撐體之狀態進行硏磨切削加工,其後,剝離支撐體之方法(專利文獻1、2)
(2)於晶圓表面之電路圖型面貼黏具備黏著劑層之黏著薄膜的狀態進行硏磨切削加工,其後,剝離黏著薄膜之方法(專利文獻3、4)
近年,於電子機器之小型化、薄型化、高功能化之期望高漲中,例如系統封裝(SiP)中之電極(凸塊)與電路基板之配線方法,取代習知主流之線黏合技術,層合形成貫通電極之晶片,於晶片之背面形成凸塊之貫通電極形成技術已受注目。適用此貫通電極形成技術係於硏削成特定厚度之半導體晶圓形成貫通電極,必須製造具備貫通電極之晶片。因此,必須經過含有高溫製程或高真空製程之多數步驟。
但,在防止晶圓之破損,用以保護晶圓表面之電路圖型的專利文獻1~4之方法中,於用以暫黏支撐體之黏著劑層或用以貼黏黏著薄膜之黏著劑層所使用的黏著劑,係未具有充分的耐熱性。因此,於半導體晶圓貼黏支撐體或黏著薄膜,實施硏削加工,其後,欲形成貫通電極時,藉由於形成貫通電極時之製程黏著劑層被曝露於高溫,俾黏著劑層之樹脂產生劣化而黏著強度降低,或黏著劑層已吸濕之水分在高溫下成為氣體,此於黏著劑層產生泡狀剝離而招致黏著不良之問題仍存在。進一步,剝離黏著劑層(支撐體或黏著薄膜)時,若暫時曝露於高溫,易引起剝離時殘渣物殘存等之剝離不良的問題仍存在。又,於形成貫通電極需要在高溫高真空環境下之製程時,在高溫下黏著劑層本身會分解而產生之氣體或從黏著劑層之水分所產生的氣體,係如上述般,不僅招致黏著不良,亦成為妨礙真空環境的保持之原因。
因此,具有良好的耐熱性,在高溫環境下發揮充分的黏著強度之黏著劑組成物,已提出以特定之丙烯酸系樹脂作為主成分之黏著劑組成物(專利文獻5)。又,具備以使用於電子零件或基板之黏著作為目的之耐熱性的黏著性樹脂組成物,亦提出含有具特定分子量之含脂環式構造的聚合物與具有特定分子量之低分子量化合物的黏著劑組成物(專利文獻6)。
(先前技術文獻)
(專利文獻)
(專利文獻1)特開平7-224270號公報
(專利文獻2)特開平9-157628號公報
(專利文獻3)特開2003-173993號公報
(專利文獻4)特開2001-279208號公報
(專利文獻5)特開2008-133405號公報
(專利文獻6)特開平11-269394號公報
專利文獻5記載之黏著劑組成物係在形成貫通電極之製程中,若接觸於以光阻等所使用之各種藥液(代表性係丙二醇單甲基醚乙酸酯(PGMEA)等),藉由此等藥液而黏著劑層會溶解而劣化,其結果,具有污染晶圓表面之問題。
又,於專利文獻6記載之黏著劑組成物中,起因於含脂環式構造的聚合物之極性基而黏著劑層易吸濕,其結果,在高溫下產生之氣體量會增加,故招致黏著不良,或剝離黏著劑層時之剝離速度慢,故,就生產性之點有變成不利之問題。
本發明主要之目的在於提供一種加工晶圓等基板時形成用以暫時性暫黏該基板與玻璃板或薄膜等之支撐體的黏著劑層適用之黏著劑組成物。亦即,本發明係提供於基板加工時,即使曝露於高溫,亦具有不會招致樹脂之劣化或氣體產生所造成的黏著不良的良好耐熱性,同時對於以光阻等所使用的PGMEA等之各種藥液形成顯示充分的耐性之黏著劑層,基板之加工後,可迅速地剝離該黏著劑層,且柔軟性優異之黏著劑組成物。
本發明人等為解決上述課題,進行專心硏究。其結果,具有優異之耐熱性同時並亦難溶於以光阻等所使用之PGMEA等各種藥液的樹脂,選擇使含有環烯烴系單體(a1)之單體成分聚合而成之樹脂(A)。進一步,以此樹脂(A)單獨係剝離黏著劑層時之剝離速度慢,故為彌補此,與樹脂(A)相同地,搭配由耐熱性優異且亦難溶於以光阻等所使用之PGMEA等之各種藥液的萜烯系樹脂、松香系樹脂及石油樹脂所構成之群選出至少一種樹脂(B)作為剝離助劑。若為以特定之比率使此等2種類的樹脂溶解於有機溶劑(S)之黏著劑組成物,發現可一次解決前述課題,終完成本發明。
亦即,本發明之黏著劑組成物,係使含有環烯烴系單體(a1)之單體成分聚合而成之樹脂(A)、由萜烯系樹脂、松香系樹脂及石油樹脂所構成之群選出的至少一種樹脂(B),溶解於有機溶劑(S)而成。其時,前述樹脂(A)之玻璃轉移點為60℃以上,前述樹脂(B)之軟化點為80~160℃,且樹脂(B)之分子量為300~3000。前述樹脂(A)與前述樹脂(B)之搭配比率為(A):(B)=80:20~55:45(質量比)。
又,本發明之基板的加工方法,係包含:藉由黏著劑層而於晶圓等之基板上暫黏支撐體之步驟、含有前述基板之加熱步驟的前述基板之加工步驟、以溶劑從前述基板剝離支撐體之步驟;前述黏著劑層係可藉由上述之黏著劑組成物所形成者。
若依本發明之黏著劑組成物,可形成加工晶圓等之基板時暫時性暫黏該基板與玻璃板或薄膜等之支撐體的黏著劑層。此黏著劑層係於基板加工時,即使曝露於高溫,亦具有不會招致樹脂之劣化或氣體產生所造成的黏著不良的良好耐熱性。又,上述黏著劑層係對於以光阻等所使用的PGMEA等之各種藥液顯示充分的耐性,基板之加工後,可迅速地剝離,且柔軟性優異。藉此,可得到如下之效果:防止半導體晶圓之破損,保護晶圓表面之電路圖型外,尚且經過含有高溫製程或高真空製程之步驟,可於晶圓形成貫通電極。
[用以實施發明之形態]
本發明之黏著劑組成物係使特定之樹脂(A)與特定之樹脂(B)以特定之比率溶解於有機溶劑而成者。
本發明之樹脂(A)係使含有環烯烴系單體(a1)之單體成分聚合而成之樹脂。具體上,樹脂(A)係可舉例如含有環烯烴系單體(a1)之單體成分之開環(共)聚合物、使含有環烯烴系單體(a1)之單體成分加成(共)聚合之樹脂等。
於構成前述樹脂(A)之單體成分所含有的前述環烯烴系單體(a1),可舉例如降冰片烯、降冰片二烯等之二環體、二環戊二烯、二羥基戊二烯等之三環體、四環十二碳烯等之四環體、環戊二烯三量體等之五環體、四環戊二烯等之七環體、或此等多環體之烷基取代體、烯基取代體、伸烷基取代體、芳基取代體等。此等之中,尤其,宜為如以下述通式(1)所示般,由降冰片烯、四環十二碳烯、或此等烷基取代體所構成之群選出的降冰片烯系單體。
前述烷基取代體中之烷基係可舉例如甲基、乙基、丙基、丁基、戊基、己基等之碳數1~6的烷基。烯基取代體中之烯基,係可舉例如乙烯基、烯丙基、丁烯基、戊烯基、己烯基、環己烯基等之碳數2~6的烯基。伸烷基取代體中之伸烷基,可舉例如伸乙基、伸丙基、伸丁基、伸己基等之碳數1~6的伸烷基。芳基取代體中之芳基,可舉例如苯基、甲苯基、萘基等。
【化1】
(式(1)中,R1
~R2
分別獨立為氫原子或碳數1~6的烷基,n為0或1。)
其中,由降冰片烯或其烷基取代體所構成之群選出的單體(前述通式(1)中,n為0)從使耐熱性與柔軟性併存之觀點,更佳。
構成前述樹脂(A)之單體成分係可含有可與前述環烯烴系單體(a1)共聚合的其他單體,例如宜亦含有如以下述通式(2)所示之烯烴單體(a2)。烯烴單體(a2)可舉例如乙烯、丙烯、1-丁烯、異丁烯、1-己烯等之α-烯烴。前述烯烴單體(a2)可為直鏈狀,亦可為分枝狀。
【化2】
(式(2)中,R3
~R6
係分別獨立為氫原子或碳數1~4之烷基。)
構成前述樹脂(A)之單體成分宜其50質量%以上為前述環烯烴系單體(a1),更佳係60質量%以上為前述環烯烴系單體(a1)。若環烯烴系單體(a1)為單體成分全體之不足50質量%,在高溫環境下之黏著強度有不充分的傾向。
又,前述樹脂(A)係例如使由以上述式(1)所示之環烯烴系單體(a1)與以上述式(2)所示之烯烴單體(a2)所構成的單體成分聚合而成之樹脂般,為不具有極性基之二元共聚物在抑制高溫下之氣體發生上,佳。
聚合前述單體成分時之聚合方法或聚合條件等無特別限制,只要依常用方法而適當設定即可。
可使用來作為前述樹脂(A)之市售品,可舉例如Polyplastics公司製之「TOPAS」、三井化學公司製之「APEL」、日本Zeon公司製之「ZEONOR」或「ZEONEX」、JSR公司製之「ARTON」等。
前述樹脂(A)之玻璃轉移點(Tg)為60℃以上乃很重要。較佳係樹脂(A)之玻璃轉移點可為70℃以上。若樹脂(A)之玻璃轉移點不足60℃,黏著劑組成物曝露於高溫環境時會軟化,產生黏著不良。
在本發明之樹脂(B)係由萜烯系樹脂、松香系樹脂及石油樹脂所構成之群選出至少一種樹脂。具體上,前述萜烯系樹脂可舉例如萜烯樹脂、萜烯酚樹脂、改性萜烯樹脂、氫化萜烯、氫化萜烯酚樹脂等,前述松香系樹脂可舉例如松香、松香酯、氫化松香、氫化松香酯、聚合松香、聚合松香酯、改性松香等,前述石油樹脂可舉例如脂肪族或芳香族石油樹脂、氫化石油樹脂、改性石油樹脂、脂環族石油樹脂、香豆素‧茚石油樹脂等。此等之中,宜為氫化萜烯樹脂、氫化石油樹脂。
前述樹脂(B)之軟化點為80~160℃乃很重要。若樹脂(B)之軟化點不足80℃,黏著劑組成物被曝露於高溫環境時會軟化,產生黏著不良。另外,若樹脂(B)之軟化點超過160℃,剝離黏著劑組成物時之剝離速度變慢。
前述樹脂(B)之分子量係300~3000乃很重要。若前述樹脂(B)之分子量不足300,耐熱性不充分,在高溫環境下脫氣量變多。另外,若樹脂(B)之分子量超過3000,剝離黏著劑組成物時之剝離速度變慢。又,在本發明之樹脂(B)的分子量意指以凝膠滲透色層分析(GPC)所測定之聚苯乙烯換算的分子量者。
前述樹脂(A)與前述樹脂(B)之搭配比率為(A):(B)=80:20~55:45(質量比)。若前述樹脂(A)太多於前述範圍(換言之,若樹脂(B)太少於前述範圍),剝離黏著劑組成物時之剝離速度變慢,另外,若前述樹脂(A)太少於前述範圍(換言之,若樹脂(B)太多於前述範圍),黏著劑組成物被曝露於高溫環境時會軟化,產生黏著不良。
前述有機溶劑(S)若為溶解前述樹脂(A)及前述樹脂(B)者,無特別限定,宜可舉例如烴系溶劑,更佳可舉例如萜烯系溶劑。又,有機溶劑(S)可只為1種,亦可為2種以上。
前述萜烯系樹脂可舉例如α-蒎烯、茨烯(camphene)、蒎烷、月桂烯(myrcene)、二氫月桂烯、對薄荷烷、3-蒈烯、對薄荷二烯、α-萜品烯、β-萜品烯、α-茴香萜、羅勒烯(ocimene)、檸檬烯、對異丙基甲苯、γ-萜品烯、異松油烯(terupinoren)、1,4-桉油醇(Cineol)、1,8-桉油醇、玫瑰醚(rose oxide)、氧化沈香醇、茴香酮(fenchone)、α-環檸檬醛、羅勒烯醇(ocimenol)、四氫沈香醇、沈香醇、四氫木枸醇(tetrahydro-mugol)、異蒲勒醇(isopulegol)、二氫沈香醇、異二氫拉凡醇、β-環檸檬醛、香茅醛、L-薄荷酮(menthanone)、蟻酸沈香酯、二氫萜品醇、β-萜品醇、薄荷醇、月桂烯醇(myrcenol)、L-薄荷醇、松香芹醇(pinocarveol)、α-萜品醇、γ-萜品醇、諾卜醇(nopol)、桃金娘醇(myrtenol)、二氫香芹醇(dihydrocarveol)、香茅醇、桃金娘烯醛(myrtenal)、二氫香旱芹酮、d-蒲勒酮、香草基乙基醚、蟻酸香葉基酯、蟻酸橙花酯、蟻酸萜品酯、醋酸異二氫拉凡酯、醋酸萜品酯、醋酸沈香酯、醋酸月桂烯酯、醋酸冰片酯、丙酸薄荷酯、丙酸沈香酯、橙花醇、香芹醇(carveol)、紫蘇醇(perilla alcohol)、香草醇、番紅花醛(safranal)、檸檬醛(citral)、紫蘇醛(perillaldehyde)、香茅基氧乙醛(Citronellyloxyacetaldehyde)、羥香茅醛(hydroxycitronellal)、馬鞭烯酮(verbenone)、d-香旱芹酮(carvone)、L-香旱芹酮、辣薄荷酮(piperitone)、辣薄荷烯酮(piperitenone)、蟻酸香茅酯、醋酸異冰片酯、醋酸薄荷酯(menthyl acetate)、醋酸香茅酯、醋酸香芹酯(carvyl acetate)、醋酸二甲基辛酯、醋酸橙花酯(neryl acetate)、醋酸異蒲勒醇(isopulegol)、醋酸二氫香芹酯、醋酸諾葡酯(nopyl acetate)、醋酸香草酯、丙酸冰片酯、丙酸橙花酯、丙酸香芹酯、醋酸萜品酯(terpinyl acetate)、丙酸香茅酯、丙酸異冰片酯、異酪酸沈香酯、異酪酸橙花酯、酪酸沈香酯、酪酸橙花酯、異酪酸萜品酯、酪酸萜品酯、異酪酸香草酯、酪酸香茅酯、己酸香茅酯、異吉草酸薄荷酯、β-石竹烯(caryophyllene)、雪松烯(cedrene)、紅沒藥烯(bisabolene)、羥基香茅醇、菌綠烯醇(farnesol)、異酪酸松香酯等。此等之中,就溶解性之觀點,宜為以檸檬烯及對薄荷烷之至少一者作為萜烯系溶劑,尤宜為對薄荷烷。
相對於本發明之黏著劑組成物的固形分濃度(亦即,前述樹脂(A)、前述樹脂(B)及前述有機溶劑(S)之全質量,前述樹脂(A)及前述樹脂(B)之合計質量占有之比率)一般為20~60質量%。
於本發明之黏著劑組成物中除了前述樹脂(A)、前述樹脂(B)及前述有機溶劑(S)之外,依需要,亦可例如使可塑劑、抗氧化劑等之添加劑在無損本發明之效果的範圍含有。
本發明之黏著劑組成物係即使曝露於高溫,亦具有不會招致樹脂之劣化或氣體發生所造成的黏著不良的良好耐熱性,同時可形成對於以光阻等所使用之各種藥液顯示充分的耐性之黏著劑層者,而且,此黏著劑層係在成為不需要之時點,藉浸漬於特定溶劑等之處理,可迅速地剝離。又,以光阻等所使用之各種藥液代表性係可舉例如PGMEA,但其以外,亦可舉例如在後述之實施例中的耐藥液性之評估所使用的藥液等。又,剝離依本發明之黏著劑組成物所形成的黏著劑層時所使用的溶劑(以下稱為「剝離溶劑」)可舉例如與前述有機溶劑(S)同樣者。較佳係宜使用與用來作為前述有機溶劑(S)之溶劑相同的溶劑作為剝離溶劑。
[實施例]
以下,舉出實施例而更詳細地說明本發明,但本發明係不受如此之實施例限定。
黏著劑組成物之評估係使用該黏著劑組成物而於矽晶圓上形成塗膜,以所得到之附塗膜的矽晶圓作為試驗片而以後述之各試驗方法進行。
又,試驗片係於6英吋之矽晶圓上塗佈所得到之黏著劑組成物成為乾燥膜厚為15μm後,藉由以110℃ 3分鐘、然後以150℃ 3分鐘,然後以200℃以3分鐘的條件乾燥進行製作。但,供給至塗膜之柔軟性的評估之試驗片,在上述方法中,塗佈成乾燥膜厚為50μm後,以150℃ 3分鐘、然後以200℃ 3分鐘的條件乾燥之方式進行變更而製作。
〈剝離性〉
使試驗片(附塗膜之矽晶圓)浸漬於保持在23℃的對薄荷烷中,5分鐘後,以目視觀察塗膜之狀態,塗膜層完全溶解時為「○」,塗膜層溶解殘存時判定為「×」。又,試驗片係浸漬於對薄荷烷至塗膜完全溶解,測定至塗膜完全溶解之時間,從此溶解時間(T(秒))與預先測定之試驗片上的塗膜之厚(L(nm))算出溶解速度(L/T(nm/秒))。溶解速度就生產性之點宜為60nm/秒以上。
〈耐藥液性〉
使以光阻等所使用之各種藥液保持於23℃,於其中浸漬試驗片(附塗膜之矽晶圓),5分鐘後以目視觀察塗膜之狀態,於塗膜層看不出龜裂及溶解部分時為「○」,於塗膜層可看出龜裂及溶解部分之至少一者時判定為「×」。又,藥液係使用下述者(括弧內為簡稱)而評估。
‧丙二醇單甲基醚乙酸酯(PGMEA)
‧水
‧異丙醇(IPA)
‧丙二醇單甲基醚(PGME)
‧N-甲基吡咯烷酮(NMP)
‧二甲基亞碸(DMSO)
‧2.38質量%氫氧化四甲基銨水溶液(TMAH)
‧5質量%氫氧化鈉水溶液(NaOH)
‧1質量%氟化氫水溶液(1-HF)。
‧3質量%氟化氫水溶液(3-HF)。
〈塗膜之柔軟性〉
如上述般,以目視觀察變更乾燥膜厚與乾燥條件而得到之試驗片(具備膜厚50μm之塗膜的矽晶圓),於塗膜層看不出龜裂時為「○」,於塗膜層可看出龜裂時判定為「×」。
〈耐熱性(產生氣體)〉
使試驗片(附塗膜之矽晶圓)從40℃昇溫至250℃,使來自塗膜之氣體的產生量(脫氣量)依據TDS法(Thermal Desorption Spectroscopy法:昇溫脫離分析法),使用TDS測定裝置(釋出氣體測定裝置;電子科學(股)製「EMD-WA1000」)而以如下之條件測定。
[TDS測定裝置之條件]
寬:100
中心質量數:50
增益:9
掃描速度:4
Emult伏特:1.3kV
繼而,在100℃、200℃中從TDS測定裝置所求出之強度(Intensity)均不足10000時為「○」,至少一者為10000以上時判定為「×」。
一般,以至100℃之溫度所測定的脫氣量係源自於黏著劑組成物吸濕之水分所產生的水蒸氣或其共沸氣體之產生量,以超過100℃之溫度所測定的脫氣量係黏著劑組成物本身被熱分解所產生之氣體的產生量。因而,藉由看到100℃之強度(脫氣量)、與200℃之強度(脫氣量),可綜合性評估黏著劑組成物之耐熱性。
〈耐熱性(樹脂劣化)〉
使試驗片(附塗膜之矽晶圓)以230℃加熱1小時後,浸漬於保持在23℃之對薄荷烷中,5分鐘後以目視觀察塗膜之狀態,於塗膜層完全溶解時為「○」,塗膜層溶解殘留時判定為「×」。
(實施例1~3及比較例1~4)
就樹脂(A)而言,使用降冰片烯與乙烯以金屬茂(metallocene)觸媒共聚合之環烯烴共聚物(Polyplastic公司製「TOPAS8007」、降冰片烯:乙烯=65:35(質量比)、玻璃轉移點:70℃、Mw:98200、Mw/Mn:1.69)。就樹脂(B)而言,使用氫化萜烯樹脂(Yasuhara Chemical公司製「Clearon P135」、軟化點:135℃、分子量:820;以此作為「萜烯樹脂(1)」。使此等之樹脂(A)與樹脂(B)以表1所示之比率溶解於萜烯系溶劑(對-薄荷烷),得到固形分濃度30質量%之黏著劑組成物。
(實施例4~6及比較例5~8)
就樹脂(A)而言,使用於實施例1~3及比較例1~4所使用之環烯烴共聚物(Polyplastic公司製「TOPAS8007」)。就樹脂(B)而言,使用氫化萜烯樹脂(Yasuhara Chemical公司製「Clearon P115」、軟化點:115℃、分子量:650;以此作為「萜烯樹脂(2)」。使此等之樹脂(A)與樹脂(B)以表2所示之比率溶解於萜烯系溶劑(對-薄荷烷),得到固形分濃度30質量%之黏著劑組成物。
(實施例7~9及比較例9~12)
就樹脂(A)而言,使用於實施例1~3及比較例1~4所使用之環烯烴共聚物(Polyplastic公司製「TOPAS8007」)。就樹脂(B)而言,使用氫化萜烯樹脂(Yasuhara Chemical公司製「Clearon P105」、軟化點:105℃、分子量:630;以此作為「萜烯樹脂(3)」。使此等之樹脂(A)與樹脂(B)以表3所示之比率溶解於萜烯系溶劑(對-薄荷烷),得到固形分濃度30質量%之黏著劑組成物。
Claims (6)
- 一種黏著劑組成物,其係含有:使含有環烯烴系單體(a1)之單體成分聚合而成之樹脂(A)、由萜烯系樹脂、松香系樹脂及石油樹脂所構成之群選出的至少一種樹脂(B)與溶解此等樹脂(A)及(B)之有機溶劑(S),其特徵在於:前述樹脂(A)係玻璃轉移點為60℃以上,前述樹脂(B)係軟化點為80~160℃,且分子量為300~3000,同時前述樹脂(A)與前述樹脂(B)之搭配比率為(A):(B)=80:20~55:45(質量比),前述環烯烴系單體(a1)為降冰片烯系單體,前述有機溶劑(S)為萜烯系溶劑。
- 如申請專利範圍第1項之黏著劑組成物,其中構成前述樹脂(A)之前述單體成分係50質量%以上為環烯烴系單體(a1)。
- 如申請專利範圍第1或2項之黏著劑組成物,其中構成前述樹脂(A)之前述單體成分亦含有烯烴單體(a2)。
- 一種基板之加工方法,其係包含:藉由黏著劑層而於基板上暫黏支撐體之步驟、含有前述基板之加熱步驟的前述基板之加工步驟、以溶劑從前述基板剝離支撐體之步驟;其中前述黏著劑層係可藉由申請專利範圍第1~3項中任 一項之黏著劑組成物所形成者。
- 如申請專利範圍第4項之加工方法,其中前述基板為晶圓。
- 如申請專利範圍第4或5項之加工方法,其中從前述基板剝離支撐體之溶劑為與使用於前述黏著劑組成物之溶劑(S)相同的溶劑。
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JP5681502B2 (ja) | 2010-09-30 | 2015-03-11 | 東京応化工業株式会社 | 接着剤組成物 |
JP5728243B2 (ja) * | 2011-02-16 | 2015-06-03 | 東京応化工業株式会社 | 積層体 |
KR101638655B1 (ko) | 2011-05-24 | 2016-07-11 | 도오꾜오까고오교 가부시끼가이샤 | 박리용 조성물 및 박리 방법 |
JP5956224B2 (ja) * | 2011-05-24 | 2016-07-27 | 東京応化工業株式会社 | 剥離用組成物および剥離方法 |
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JP5361092B2 (ja) * | 2011-09-16 | 2013-12-04 | リンテック株式会社 | ダイシングシート用基材フィルムおよびダイシングシート |
JP6060479B2 (ja) * | 2011-11-24 | 2017-01-18 | Jsr株式会社 | 基材の処理方法、半導体装置および仮固定用組成物 |
KR101770863B1 (ko) | 2012-02-08 | 2017-08-23 | 도쿄 오카 고교 가부시키가이샤 | 박리용 조성물 및 박리용 조성물의 제조 방법 |
JP6093187B2 (ja) * | 2012-02-08 | 2017-03-08 | 東京応化工業株式会社 | 剥離用組成物、剥離用組成物の製造方法、及びその利用 |
JP6128837B2 (ja) * | 2012-02-21 | 2017-05-17 | 東京応化工業株式会社 | 接着剤組成物の製造方法、接着剤組成物及び接着フィルム |
JP6103817B2 (ja) * | 2012-04-17 | 2017-03-29 | Jsr株式会社 | 基材の処理方法、積層体、仮固定材、仮固定用組成物および半導体装置 |
JP5982248B2 (ja) * | 2012-09-28 | 2016-08-31 | 富士フイルム株式会社 | 半導体装置製造用仮接合層、積層体、及び、半導体装置の製造方法。 |
KR20150011072A (ko) | 2013-07-22 | 2015-01-30 | 삼성전자주식회사 | 임시 접착제 조성물 및 이를 이용한 반도체 소자의 제조 방법 |
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