TW202203528A - Beam-shaping optical device and true roundness adjustment method to make the beam profile close to a true circle - Google Patents
Beam-shaping optical device and true roundness adjustment method to make the beam profile close to a true circle Download PDFInfo
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
- G02B27/0916—Adapting the beam shape of a semiconductor light source such as a laser diode or an LED, e.g. for efficiently coupling into optical fibers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
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- G—PHYSICS
- G02—OPTICS
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- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
- G02B27/0938—Using specific optical elements
- G02B27/095—Refractive optical elements
- G02B27/0955—Lenses
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
- G02B27/0938—Using specific optical elements
- G02B27/0977—Reflective elements
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/18—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors
- G02B7/182—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors for mirrors
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Abstract
Description
本發明係有關一種光束整形光學裝置及真圓度調整方法。 本申請案係基於2020年7月7日申請之日本專利申請第2020-117103號主張優先權。該日本申請案的全部內容係藉由參閱而援用於本說明書中。The invention relates to a beam shaping optical device and a roundness adjustment method. This application claims priority based on Japanese Patent Application No. 2020-117103 filed on July 7, 2020. The entire contents of the Japanese application are incorporated in this specification by reference.
對基板等加工對象物進行鑽孔加工之習知之雷射加工裝置進行說明。從雷射振盪器輸出之雷射光束被引導至凹面鏡,在光束擴展器的轉印源位置聚光為規定的尺寸。光束擴展器將轉印源位置的光束剖面轉印到孔口的位置。藉由孔口使光束剖面的外形呈大致圓形之雷射光束經由電掃描器(Galvano scanner)及fθ透鏡入射到加工對象物的表面。A conventional laser processing apparatus for drilling a workpiece such as a substrate will be described. The laser beam output from the laser oscillator is guided to a concave mirror, and condensed to a predetermined size at the transfer source position of the beam expander. The beam expander transfers the beam profile from the transfer source location to the orifice location. A laser beam having a substantially circular profile of the beam profile through the aperture is incident on the surface of the object to be processed through a Galvano scanner and an fθ lens.
為了在加工對象物上形成圓形的孔,期望提高加工對象物的表面上的光束剖面的真圓度。真圓度是指與圓形形體的幾何學上正確的圓偏離的大小。例如,在用兩個同心的幾何學上的圓夾著圓形形體時,能夠用同心的兩個圓的間隔最小時的兩個圓的半徑之差來表示。半徑之差越小,圓形形體越接近真圓。在下述專利文獻1中揭示了一種雷射振盪器,其藉由在雷射光束的光共振器內配置關於正交之兩個方向具有不同的曲率半徑之形狀的鏡片,實現了光束模式的真圓性的提高。 [先前技術文獻]In order to form a circular hole in an object to be processed, it is desired to improve the roundness of the beam profile on the surface of the object to be processed. Roundness refers to the amount of deviation from the geometrically correct circle of a circular shape. For example, when a circular shape is sandwiched between two concentric geometric circles, it can be represented by the difference between the radii of the two circles when the distance between the two concentric circles is the smallest. The smaller the difference in radii, the closer the circular shape is to a true circle. The following Patent Document 1 discloses a laser oscillator that realizes a true beam mode by arranging mirrors having shapes with different radii of curvature with respect to two orthogonal directions in an optical resonator of a laser beam. Circularity improvement. [Prior Art Literature]
[專利文獻1]日本特開2017-34055號公報[Patent Document 1] Japanese Patent Laid-Open No. 2017-34055
在習知之裝置中,藉由孔口使光束剖面的外形呈圓形,但有時加工對象物的表面上的光束剖面的形狀從圓形變形。這是因為,配置有孔口之位置中的光束輪廓或光束的發散角在縱向和橫向上不同。In the conventional apparatus, the outer shape of the beam cross-section is made circular by the aperture, but the shape of the beam cross-section on the surface of the object may be deformed from the circular shape. This is because the beam profile or the divergence angle of the beam in the position where the aperture is arranged is different in the longitudinal direction and the transverse direction.
[發明所欲解決之問題][Problems to be Solved by Invention]
本發明的目的為,提供一種能夠使光束剖面接近真圓之光束整形光學裝置及真圓度調整方法。 [解決問題之技術手段]An object of the present invention is to provide a beam shaping optical device and a roundness adjustment method capable of making the beam profile close to a true circle. [Technical means to solve problems]
依據本發明的一觀點,提供一種光束整形光學裝置,其係具有: 校正光學零件,係配置於雷射光束的路徑上,且包含柱面鏡或柱面透鏡; 聚光光學零件,係配置於經由前述校正光學零件之雷射光束的路徑上,且由凸透鏡或凹面鏡構成;以及 支撐機構,係在改變前述校正光學零件與前述聚光光學零件之間的雷射光束的光路長度之方向上可移動地支撐前述校正光學零件。According to an aspect of the present invention, a beam shaping optical device is provided, which has: Correction optical parts, which are arranged on the path of the laser beam and include cylindrical mirrors or cylindrical lenses; The condensing optical component is disposed on the path of the laser beam passing through the correction optical component, and is composed of a convex lens or a concave mirror; and The supporting mechanism supports the correction optical part movably in the direction of changing the optical path length of the laser beam between the correction optical part and the condensing optical part.
依據本發明的另一觀點,提供一種真圓度調整方法,其係包括如下步驟: 經由包含柱面鏡或柱面透鏡之校正光學零件及由凸透鏡或凹面鏡構成之聚光光學零件,使雷射光束聚光到基準位置, 改變前述校正光學零件與前述聚光光學零件之間的雷射光束的光路長度,使前述基準位置的雷射光束的光束剖面接近真圓。 [發明之效果]According to another aspect of the present invention, there is provided a roundness adjustment method, which comprises the following steps: The laser beam is condensed to the reference position through correction optical parts including cylindrical mirrors or cylindrical lenses and condensing optical parts composed of convex lenses or concave mirrors, The optical path length of the laser beam between the correction optical part and the condensing optical part is changed, so that the beam profile of the laser beam at the reference position is close to a true circle. [Effect of invention]
若配置校正光學零件,則與雷射光束的光軸正交之兩個方向的光束的發散角的其中一個被固定,另一個發生變化。藉由改變校正光學零件與聚光光學零件之間的光路長度,能夠調整發散角的變化量。藉此,能夠使光束剖面接近真圓。When correcting optical components are arranged, one of the divergence angles of the beams in the two directions orthogonal to the optical axis of the laser beam is fixed, and the other is changed. By changing the optical path length between the correction optical part and the condensing optical part, the variation of the divergence angle can be adjusted. Thereby, the beam profile can be made close to a true circle.
參閱圖1~圖5C,對一實施例之光束整形光學裝置進行說明。
圖1係搭載了本實施例之光束整形光學裝置50之雷射加工裝置的概略圖。雷射加工裝置包含雷射振盪器12、加工裝置80及控制裝置70。Referring to FIG. 1 to FIG. 5C , a beam shaping optical device according to an embodiment will be described.
FIG. 1 is a schematic diagram of a laser processing apparatus equipped with a beam shaping
雷射振盪器12支撐於台架11上,台架11固定於共通底座100上。加工裝置80包含光束整形光學裝置50、光束掃描器81、fθ透鏡82及工作台85。加工對象物90保持在工作台85上。光束整形光學裝置50、光束掃描器81、fθ透鏡82及工作台85支撐於共通底座100上。共通底座100例如為地板。The
雷射振盪器12輸出脈衝雷射光束。作為雷射振盪器12,例如使用二氧化碳雷射振盪器。從雷射振盪器12輸出之脈衝雷射光束由光束整形光學裝置50將光束輪廓進行整形,經由光束掃描器81及fθ透鏡82入射到加工對象物90。光束掃描器81在兩個方向上掃描雷射光束。工作台85使加工對象物90在與其表面平行的兩個方向上移動。控制裝置70控制光束整形光學裝置50,使光束剖面的形狀接近真圓。The
光束掃描器81在兩個方向上掃描雷射光束,使脈衝雷射光束入射到加工對象物90的所期望的位置,藉此進行鑽孔加工。在脈衝雷射光束的可掃描範圍未覆蓋加工對象物90的表面的整個區域之情況下,藉由工作台85使加工對象物90移動,從而能夠對加工對象物90的表面的大致整個區域進行加工。The
圖2係包含雷射振盪器12的光軸之剖面圖。雷射振盪器12包含收容雷射介質氣體及光共振器20等之腔室15。雷射介質氣體收容於腔室15中。腔室15的內部空間被區分為相對位於上側之光學室16及相對位於下側之送風機室17。光學室16和送風機室17被上下分隔板18分隔。另外,在上下分隔板18上設置有使雷射介質氣體在光學室16與送風機室17之間流通之開口。光學室16的底板19從送風機室17的側壁向光共振器20的光軸20A的方向突出,光學室16的光軸方向的長度比送風機室17的光軸方向的長度長。FIG. 2 is a cross-sectional view including the optical axis of the
腔室15的底板19在4個支撐部位45支撐於台架11(圖1)上。4個支撐部位45配置於在俯視下相當於長方形的4個頂點的位置。The
在光學室16內配置有一對放電電極21及一對共振器鏡片25。一對放電電極21分別固定於電極盒22上。一對電極盒22經由複數個電極支撐構件23支撐於底板19上。一對放電電極21在上下方向上隔著間隔配置,從而在兩者之間劃定放電區域24。放電電極21在放電區域24產生放電,藉此激勵雷射介質氣體。一對共振器鏡片25構成具有通過放電區域24之光軸20A之光共振器20。如在後面參閱圖3進行之說明,雷射介質氣體沿與圖2的紙面垂直的方向流過放電區域24。A pair of
一對共振器鏡片25固定於配置於光學室16內之共通的共振器底座26上。共振器底座26為在光軸20A的方向上長的板狀構件,經由複數個光共振器支撐構件27支撐於底板19上。A pair of
在使光共振器20的光軸20A沿一方向(圖1中為左方向)延伸之延長線與光學室16的壁面的交叉部位安裝有使雷射光束透過之透光窗28。在光共振器20內被激勵之雷射光束透過透光窗28向外部放射。A light-transmitting
在送風機室17配置有送風機29。送風機29使雷射介質氣體在光學室16與送風機室17之間循環。A
圖3係與實施例之雷射振盪器12的光軸20A(圖2)垂直的剖面圖。如參閱圖2所說明,腔室15的內部空間被上下分隔板18區分為上方的光學室16和下方的送風機室17。在光學室16內配置有一對放電電極21及共振器底座26。一對放電電極21分別固定於電極盒22上。電極盒22藉由複數個電極支撐構件23支撐於腔室15的底板19(圖2)上。在一對放電電極21之間劃定放電區域24。共振器底座26藉由複數個光共振器支撐構件27支撐於腔室15的底板19(圖2)上。電極支撐構件23及光共振器支撐構件27配置於偏離如圖3所示之剖面之位置,因此在圖3中用虛線表示電極支撐構件23及光共振器支撐構件27。FIG. 3 is a cross-sectional view perpendicular to the
在光學室16內配置有分隔板40。分隔板40劃定從設置於上下分隔板18之開口18A到放電區域24為止的第1氣體流路41及從放電區域24到設置於上下分隔板18之另一開口18B為止的第2氣體流路42。雷射介質氣體沿與光軸20A(圖2)正交之方向流過放電區域24。放電方向與雷射介質氣體流動之方向及光軸20A這兩者正交。由送風機室17、第1氣體流路41、放電區域24及第2氣體流路42形成供雷射介質氣體循環之循環路徑。送風機29產生箭頭所示之雷射介質氣體流,以使雷射介質氣體在該循環路徑中循環。A
在送風機室17內的循環路徑上收容有熱交換器43。在放電區域24被加熱之雷射介質氣體藉由通過熱交換器43而被冷卻,被冷却之雷射介質氣體被再次供給至放電區域24。The
接著,參閱圖4,對本實施例之光束整形光學裝置50進行說明。
圖4係實施例之光束整形光學裝置50的概略圖。光束整形光學裝置50包含校正光學零件51、聚光光學零件55、平面鏡56、光束擴展器60、孔口61、平面鏡62、支撐機構65及檢測器66。校正光學零件51包含圓筒凹面鏡52及平面鏡53。聚光光學零件55為具有球面或拋物面的反射面之凹面鏡。Next, referring to FIG. 4 , the beam shaping
從雷射振盪器12輸出之雷射光束被圓筒凹面鏡52反射,進而被平面鏡53反射而入射到聚光光學零件55。被聚光光學零件55反射之雷射光束被平面鏡56反射而入射到光束擴展器60。光束擴展器60將平面鏡56與光束擴展器60之間的基準位置63的光束剖面藉由放大或縮小光束直徑而轉印到孔口61的位置。有時將基準位置63稱為轉印源位置。關於光束擴展器60,基準位置63和孔口61的位置處於共軛的關係。The laser beam output from the
孔口61遮蔽雷射光束的外圍部,將光束剖面整形為圓形。通過孔口61之雷射光束被平面鏡62反射而入射到光束掃描器81。光束掃描器81例如使用電掃描器。光束掃描器81在兩個方向上掃描雷射光束。fθ透鏡82將由光束掃描器81掃描之雷射光束聚光在加工對象物90的表面上。例如,fθ透鏡82使孔口61在加工對象物90的表面上成像。The
支撐機構65沿著校正光學零件51與聚光光學零件55之間的雷射光束的光軸可移動地支撐校正光學零件51。校正光學零件51如圖4中雙箭頭所示那樣平移移動。用虛線示出移動後的校正光學零件51。入射到校正光學零件51之雷射光束的光軸與從校正光學零件51朝向聚光光學零件55之雷射光束的光軸平行。支撐機構65在保持圓筒凹面鏡52和平面鏡53的相對位置關係之狀態下,使校正光學零件51移動。因此,即使使校正光學零件51移動,從雷射振盪器12到聚光光學零件55為止的雷射光束的光路長度亦不變。The
檢測器66能夠在雷射光束的路徑上的基準位置63與偏離雷射光束的路徑之位置之間,如雙箭頭所示那樣移動。在圖4中,用虛線示出位於雷射光束的路徑上的基準位置63之檢測器66,用實線示出偏離雷射光束的路徑之位置的檢測器66。檢測器66檢測入射之雷射光束的光束剖面的形狀。作為檢測器66,例如能夠使用光束輪廓儀。The
基於檢測器66的檢測結果輸入到控制裝置70。控制裝置70依據檢測器66的檢測結果控制支撐機構65,使校正光學零件51移動。在後面,對支撐機構65的控制進行詳細說明。The detection result based on the
接著,參閱圖5A~圖5C,對光束整形光學裝置50內的雷射光束的發散和收斂及光束剖面的形狀進行說明。Next, referring to FIGS. 5A to 5C , the divergence and convergence of the laser beam and the shape of the beam cross section in the beam shaping
圖5中,圖5A~圖5C係表示不考慮由雷射光束的反射引起之路徑的折彎而假設雷射光束直行時的雷射光束的發散及收斂的情況之示意圖。定義xyz正交座標系統,將與圓筒凹面鏡52(圖4)的圓筒面的母線平行的方向設為x方向,將與母線垂直的面設為y方向,將雷射光束的行進方向設為z方向。例如,x方向對應於一對放電電極21(圖2)分離之方向(放電方向),y方向對應於雷射介質氣體在放電區域24(圖3)內流動之方向。In FIG. 5 , FIGS. 5A to 5C are schematic diagrams showing the divergence and convergence of the laser beam when the laser beam is assumed to travel straight without considering the bending of the path caused by the reflection of the laser beam. The xyz orthogonal coordinate system is defined, and the direction parallel to the generatrix of the cylindrical surface of the cylindrical concave mirror 52 ( FIG. 4 ) is the x direction, the plane perpendicular to the generatrix is the y direction, and the traveling direction of the laser beam is for the z direction. For example, the x direction corresponds to the direction in which the pair of discharge electrodes 21 (FIG. 2) are separated (discharge direction), and the y direction corresponds to the direction in which the laser dielectric gas flows within the discharge region 24 (FIG. 3).
圖5A及圖5B表示yz面上的雷射光束的發散、收斂。在圖5A和圖5B中,圓筒凹面鏡52的位置不同。在圖5B中,用虛線示出與圖5A所示之狀態相同的狀態。圖5C表示zx面上的雷射光束的發散、收斂。在圖5A~圖5C中,用二點鏈線表示從雷射振盪器12輸出之雷射光束31的光軸30。在此,“雷射光束的光軸”是指連接光束剖面的中心之直線,與將雷射振盪器12內的光共振器20的光軸20A延長之直線一致。5A and 5B show the divergence and convergence of the laser beam on the yz plane. In FIGS. 5A and 5B , the positions of the cylindrical concave mirrors 52 are different. In FIG. 5B, the same state as that shown in FIG. 5A is shown by a broken line. FIG. 5C shows the divergence and convergence of the laser beam on the zx plane. In FIGS. 5A to 5C , the
從雷射振盪器12輸出之雷射光束31經由圓筒凹面鏡52、聚光光學零件55被引導至基準位置63。在本實施例中,在雷射振盪器12的出口處,雷射光束31的光束剖面32為在x方向上長的橢圓。又,yz面內的雷射光束31的發散角θy(圖5A、圖5B)比zx面內的雷射光束31的發散角θx(圖5C)大。The
如圖5A、圖5B所示,圓筒凹面鏡52使雷射光束31在yz面內收斂。在zx面內,圓筒凹面鏡52作為平面鏡發揮功能,不影響雷射光束31的收斂及發散。As shown in FIGS. 5A and 5B , the cylindrical
圖5A所示之虛線表示配置平面鏡來代替圓筒凹面鏡52時的雷射光束31的發散、收斂的情況。yz面內的雷射光束31的發散角θy比zx面內的雷射光束31的發散角θx大,因此基準位置63的光束剖面33如圖5A中虛線所示,成為在y方向上長的橢圓。The dotted line shown in FIG. 5A shows the divergence and convergence of the
若配置圓筒凹面鏡52,則雷射光束31在yz面內收斂,雷射光束31的發散、收斂在zx面內不受影響。因此,基準位置63的光束剖面33的尺寸在y方向上縮小。在圖5A所示之狀態下,光束剖面33向y方向的收縮量變得過大,光束剖面33如實線所示那樣成為在x方向上長的橢圓。If the cylindrical
如圖5B所示,當使圓筒凹面鏡52向聚光光學零件55移動時,yz面內的雷射光束31的收斂力減弱。在zx面內,即使使圓筒凹面鏡52移動,雷射光束31的發散、收斂亦不受影響。其結果,基準位置63的光束剖面33從圖5A中實線所示之光束剖面33沿y方向延伸。如圖5B及圖5C所示,光束剖面33從虛線所示之形狀變化為實線所示之形狀,接近真圓。As shown in FIG. 5B , when the cylindrical
接著,對控制裝置70(圖4)的功能進行說明。
控制裝置70從檢測器66取得檢測結果,檢測光束剖面的形狀。而且,控制支撐機構65,使校正光學零件51沿光束剖面的形狀接近真圓之方向移動。在當前時刻的光束剖面的形狀與真圓之差在允許範圍內之情況下,控制裝置70使校正光學零件51停止。Next, the function of the control device 70 ( FIG. 4 ) will be described.
The
接著,對本實施例的優異的效果進行說明。
依據本申請的發明人的評估實驗明確得知,若作為光束擴展器60的轉印源之基準位置63(圖4)的光束剖面偏離真圓,則即使利用孔口61將光束剖面整形為真圓,被加工之孔的形狀亦偏離真圓。這是因為,即使在孔口61的位置僅將光束剖面的外形整形為真圓,光束剖面內的光束輪廓或雷射光束的發散角在與光軸正交之縱向和橫向上亦不同。得知,若使基準位置63的光束剖面接近真圓,則被加工之孔接近真圓。Next, the excellent effects of the present embodiment will be described.
According to the evaluation experiments of the inventors of the present application, it is clearly known that if the beam profile at the reference position 63 ( FIG. 4 ) as the transfer source of the
在本實施例中,藉由調整校正光學零件51(圖4)的位置,能夠使基準位置63的光束剖面接近真圓。藉由基準位置63的光束剖面接近真圓,在加工對象物90的表面,光束剖面亦接近真圓,能夠形成圓形的孔。In this embodiment, by adjusting the position of the correction optical component 51 (FIG. 4), the beam profile at the
又,在本實施例中,即使使校正光學零件51(圖4)移動,從雷射振盪器12到聚光光學零件55為止的雷射光束的光路長度亦不變化。因此,校正光學零件51的移動不影響yz面內(圖5A、圖5B)的除了雷射光束的發散、收斂以外的雷射光束的傳播狀態。藉此,抑制為了使光束剖面接近真圓而應調整的參數的數量,能夠容易地進行調整。In addition, in this embodiment, even if the correction optical component 51 ( FIG. 4 ) is moved, the optical path length of the laser beam from the
接著,對上述實施例的變形例進行說明。
在上述實施例中,校正光學零件51使用了圓筒凹面鏡52(圖4),但亦可以使用圓筒凸面鏡來代替圓筒凹面鏡52。亦即,亦可以設為校正光學零件51包含柱面鏡。或者,亦可以使用圓筒凸透鏡或圓筒凹透鏡來代替圓筒凹面鏡52。在使用柱面透鏡之情況下,不需要平面鏡53(圖4)。如此,作為校正光學零件51,使用具有圓筒狀的反射面或折射面之光學零件即可。又,在上述實施例中,作為聚光光學零件55使用了凹面鏡,但亦可以使用凸透鏡來代替凹面鏡。Next, a modification of the above-described embodiment will be described.
In the above-mentioned embodiment, the cylindrical concave mirror 52 ( FIG. 4 ) is used for the correction
在上述實施例中,將光束整形光學裝置50(圖1)搭載於進行鑽孔加工之雷射加工裝置上,但亦可以搭載於其他雷射加工裝置上。尤其,藉由搭載於要求加工成使光束剖面接近真圓之雷射加工裝置上,能夠得到較大效果。又,作為雷射振盪器12使用了二氧化碳雷射,但亦可以在其他各種雷射振盪器中組合上述實施例之光束整形光學裝置50。In the above-mentioned embodiment, the beam shaping optical device 50 ( FIG. 1 ) is mounted on the laser processing device for drilling, but it can also be mounted on other laser processing devices. In particular, it is possible to obtain a large effect by mounting it on a laser processing apparatus which is required to be processed so that the beam cross section is close to a true circle. In addition, a carbon dioxide laser is used as the
在上述實施例中,設為雷射光束被圓筒凹面鏡52(圖4)反射之後入射到平面鏡53之結構,但亦可以替換兩者的位置。亦即,亦可以設為從雷射振盪器12輸出之雷射光束被平面鏡53反射,其反射光入射到圓筒凹面鏡52之結構。In the above-mentioned embodiment, the laser beam is reflected by the cylindrical concave mirror 52 (FIG. 4) and then incident on the
在上述實施例中,控制裝置70控制支撐機構65而使校正光學零件51移動,但亦可以藉由用戶手動調整支撐機構65而使校正光學零件51移動。In the above embodiment, the
在上述實施例中,將校正光學零件51配置於雷射振盪器12與聚光光學零件55之間的雷射光束的路徑上,但亦可以改變校正光學零件51和聚光光學零件55的位置關係。亦即,亦可以將聚光光學零件55配置於雷射振盪器12與校正光學零件51之間的雷射光束的路徑上。在該情況下,藉由改變校正光學零件51與聚光光學零件55之間的雷射光束的光路長度,亦能夠使基準位置63的光束剖面接近真圓。In the above embodiment, the correcting
接著,參閱圖6A~圖6C,對其他實施例之光束整形光學裝置進行說明。以下,省略對與圖1~圖5C所示之實施例之光束整形光學裝置共通的結構的說明。Next, referring to FIGS. 6A to 6C , beam shaping optical devices of other embodiments will be described. Hereinafter, the description of the structure common to the beam shaping optical device of the embodiment shown in FIG. 1 to FIG. 5C is omitted.
圖6A係本實施例之光束整形光學裝置的圓筒凹面鏡52、入射到圓筒凹面鏡52之雷射光束的光軸30A及反射之雷射光束的光軸30B的立體圖。本實施例之光束整形光學裝置50包含姿勢調整機構67。姿勢調整機構67以入射到圓筒凹面鏡52之雷射光束的光軸30A與由圓筒凹面鏡52反射之雷射光束的光軸30B所成之角的二等分線為旋轉中心35,改變圓筒凹面鏡52的旋轉方向的姿勢。旋轉中心35與圓筒凹面鏡52的反射面垂直。6A is a perspective view of the cylindrical
接著,參閱圖6B及圖6C,對本實施例的優異的效果進行說明。
圖6B係表示在圓筒凹面鏡52的母線與x軸平行之情況下,使校正光學零件51移動時的光束剖面33的形狀的變化之圖。由於圓筒凹面鏡52的母線與x軸平行,因此當使校正光學零件51移動時,光束剖面33沿y方向伸縮。在真圓度調整前的虛線所示之光束剖面的長軸相對於y方向傾斜之情況下,即使使光束剖面33沿y方向伸縮,光束剖面33亦不會成為真圓。Next, the excellent effects of the present embodiment will be described with reference to FIGS. 6B and 6C .
6B is a diagram showing a change in the shape of the
若改變圓筒凹面鏡52的旋轉方向的姿勢,則藉由使校正光學零件51移動而使光束剖面33伸縮之方向相對於y方向傾斜。When the posture in the rotation direction of the cylindrical
圖6C係表示使光束剖面33伸縮之方向相對於y方向傾斜時的光束剖面33的形狀的變化之圖。調整圓筒凹面鏡52的旋轉方向的姿勢,以使伸縮之方向與虛線所示之光束剖面的長軸方向一致。因此,藉由配置圓筒凹面鏡52,光束剖面33在虛線所示之光束剖面的長軸方向上收縮。藉由使校正光學零件51移動來調整光束剖面33的收縮量,能夠使光束剖面33接近真圓。FIG. 6C is a diagram showing a change in the shape of the
上述各實施例為例示,能夠進行不同的實施例所示之結構的局部替換或組合是不言而喻的。按照基於複數個實施例的相同的結構之相同的作用效果,未在每一個實施例中一一說明。而且,本發明並不限制於上述實施例。例如,能夠進行各種變更、改良、組合等,這對於本領域技術人員來說是顯而易見的。The above-mentioned embodiments are examples, and it is self-evident that the structures shown in different embodiments can be partially replaced or combined. According to the same function and effect based on the same structure of a plurality of embodiments, it is not described in each embodiment one by one. Moreover, the present invention is not limited to the above-described embodiments. For example, it is obvious for those skilled in the art that various modifications, improvements, combinations, etc. can be made.
11:台架
12:雷射振盪器
15:腔室
16:光學室
17:送風機室
18:上下分隔板
18A,18B:開口
19:底板
20A:光軸
21:放電電極
22:電極盒
23:電極支撐構件
24:放電區域
25:共振器鏡片
26:共振器底座
27:光共振器支撐構件
28:透光窗
29:送風機
30,30A,30B:雷射光束的光軸
31:雷射光束
32:雷射振盪器的出口處的光束剖面
33:基準位置的光束剖面
35:旋轉中心
40:分隔板
41:第1氣體流路
42:第2氣體流路
43:熱交換器
45:支撐部位
50:光束整形光學裝置
51:校正光學零件
52:圓筒凹面鏡
53:平面鏡
55:聚光光學零件
56:平面鏡
60:光束擴展器
61:孔口
62:平面鏡
63:基準位置
65:支撐機構
66:檢測器
67:姿勢調整機構
70:控制裝置
80:加工裝置
81:光束掃描器
82:fθ透鏡
85:工作台
90:加工對象物
100:共通底座11: Bench
12: Laser oscillator
15: Chamber
16: Optical Room
17: Blower room
18: Upper and
[圖1]係搭載了本實施例之光束整形光學裝置之雷射加工裝置的概略圖。 [圖2]係包含雷射振盪器的光軸之剖面圖。 [圖3]係與實施例之雷射振盪器的光軸垂直的剖面圖。 [圖4]係實施例之光束整形光學裝置的概略圖。 [圖5]中,圖5A~圖5C係表示不考慮由雷射光束的反射引起之路徑的折彎而假設雷射光束直行時的雷射光束的發散及收斂的情況之示意圖。 [圖6]中,圖6A係其他實施例之光束整形光學裝置的圓筒凹面鏡、入射之雷射光束的光軸及反射之雷射光束的光軸的立體圖,圖6B係表示在圓筒凹面鏡的母線與x軸平行之情況下,使校正光學零件移動時的光束剖面的形狀的變化之圖,圖6C係表示使光束剖面伸縮之方向相對於y方向傾斜時的光束剖面的形狀的變化之圖。FIG. 1 is a schematic diagram of a laser processing apparatus equipped with the beam shaping optical apparatus of this embodiment. [ Fig. 2 ] is a cross-sectional view including the optical axis of the laser oscillator. Fig. 3 is a cross-sectional view perpendicular to the optical axis of the laser oscillator of the embodiment. Fig. 4 is a schematic diagram of the beam shaping optical device of the embodiment. In FIG. 5 , FIGS. 5A to 5C are schematic diagrams showing the divergence and convergence of the laser beam when the laser beam is assumed to travel straight without considering the bending of the path caused by the reflection of the laser beam. In FIG. 6, FIG. 6A is a perspective view of a cylindrical concave mirror, an optical axis of an incident laser beam, and an optical axis of a reflected laser beam of a beam shaping optical device according to another embodiment, and FIG. 6B is a cylindrical concave mirror. Figure 6C shows the change in the shape of the beam profile when the direction of expansion and contraction of the beam profile is inclined with respect to the y-direction when the generatrix is parallel to the x-axis. picture.
12:雷射振盪器12: Laser oscillator
50:光束整形光學裝置50: Beam shaping optics
51:校正光學零件51: Correcting Optical Parts
52:圓柱凹面鏡52: Cylindrical concave mirror
53:平面鏡53: Flat mirror
55:聚光光學零件55: Condensing Optical Parts
56:平面鏡56: Flat mirror
60:光束擴展器60: Beam Expander
61:孔口61: Orifice
62:平面鏡62: Flat mirror
63:基準位置63: Reference position
65:支撐機構65: Supporting mechanism
66:檢測器66: Detector
70:控制裝置70: Controls
81:光束掃描器81: Beam Scanner
82:fθ透鏡82: fθ lens
85:工作台85: Workbench
90:加工對象物90: Processing object
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JP5300544B2 (en) * | 2009-03-17 | 2013-09-25 | 株式会社ディスコ | Optical system and laser processing apparatus |
KR100984726B1 (en) * | 2010-04-28 | 2010-10-01 | 유병소 | Method, apparatus, and system for processing workpiece using laser |
KR100984727B1 (en) * | 2010-04-30 | 2010-10-01 | 유병소 | Method and apparatus for processing workpiece |
US8014427B1 (en) * | 2010-05-11 | 2011-09-06 | Ultratech, Inc. | Line imaging systems and methods for laser annealing |
KR101298019B1 (en) * | 2010-12-28 | 2013-08-26 | (주)큐엠씨 | Laser processing apparatus |
JP6420216B2 (en) * | 2015-07-31 | 2018-11-07 | ファナック株式会社 | Laser oscillator with folding mirror |
JP6675951B2 (en) * | 2016-08-08 | 2020-04-08 | 三菱電機株式会社 | Beam shaping device |
JP7176738B2 (en) * | 2016-11-16 | 2022-11-22 | 国立大学法人電気通信大学 | Laser cavity and method for designing laser cavity |
CN110449731B (en) * | 2019-08-27 | 2023-07-04 | 华中科技大学 | Laser cone-changing and diameter-changing rotary-cut hole machining optical system |
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2020
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2021
- 2021-06-18 KR KR1020210079102A patent/KR20220005983A/en active Search and Examination
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CN113894411A (en) | 2022-01-07 |
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