TW200629970A - Metal mask unit, method of producing the same, method of installing metal tape, and tension application device - Google Patents

Metal mask unit, method of producing the same, method of installing metal tape, and tension application device

Info

Publication number
TW200629970A
TW200629970A TW094143460A TW94143460A TW200629970A TW 200629970 A TW200629970 A TW 200629970A TW 094143460 A TW094143460 A TW 094143460A TW 94143460 A TW94143460 A TW 94143460A TW 200629970 A TW200629970 A TW 200629970A
Authority
TW
Taiwan
Prior art keywords
metal mask
frame
mask unit
producing
same
Prior art date
Application number
TW094143460A
Other languages
Chinese (zh)
Other versions
TWI361636B (en
Inventor
Terunao Tsuchiya
Toshihiro Sano
Original Assignee
Dainippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2004356257A external-priority patent/JP5151004B2/en
Priority claimed from JP2005133155A external-priority patent/JP4784145B2/en
Priority claimed from JP2005290577A external-priority patent/JP2007257839A/en
Application filed by Dainippon Printing Co Ltd filed Critical Dainippon Printing Co Ltd
Publication of TW200629970A publication Critical patent/TW200629970A/en
Application granted granted Critical
Publication of TWI361636B publication Critical patent/TWI361636B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
    • H01L21/0332—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their composition, e.g. multilayer masks, materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
    • H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
    • H01L21/0337—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
    • H10N30/081—Shaping or machining of piezoelectric or electrostrictive bodies by coating or depositing using masks, e.g. lift-off

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Inorganic Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
  • Screen Printers (AREA)

Abstract

To increase flatness by restraining warpage generated in a metal mask unit without enhancing rigidity by increasing the thickness of a frame, in a metal mask unit having a structure where a metal mask with tension applied thereto is fixed to a window frame-like frame. This metal mask unit 10 composed by mounting, on the surface of the window frame-like frame 13, the metal mask 11 with tension longitudinally and laterally applied thereto is so structured that the warpage of the frame 13 is restrained by mounting metal tapes 17 and 18 with tension applied thereto to back faces of four sides of the frame 13.
TW094143460A 2004-12-09 2005-12-08 Metal mask unit, method of producing the same, method of installing metal tape, and tension application device TW200629970A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004356257A JP5151004B2 (en) 2004-12-09 2004-12-09 Metal mask unit and manufacturing method thereof
JP2005133155A JP4784145B2 (en) 2005-04-28 2005-04-28 Attaching method of metal tape, manufacturing method of mask unit and jig for applying tension
JP2005290577A JP2007257839A (en) 2005-10-03 2005-10-03 Tension applying device and metal tape installation device

Publications (2)

Publication Number Publication Date
TW200629970A true TW200629970A (en) 2006-08-16
TWI361636B TWI361636B (en) 2012-04-01

Family

ID=36577864

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094143460A TW200629970A (en) 2004-12-09 2005-12-08 Metal mask unit, method of producing the same, method of installing metal tape, and tension application device

Country Status (3)

Country Link
KR (1) KR101011901B1 (en)
TW (1) TW200629970A (en)
WO (1) WO2006062035A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10342264C5 (en) * 2003-09-12 2012-10-31 Leica Biosystems Nussloch Gmbh System for uniquely assigning histological cassettes and slides
KR100922045B1 (en) * 2007-11-20 2009-10-19 삼성모바일디스플레이주식회사 Apparatus for fabricating mask of vertical deposition and Fabrication Method for making a mask of vertical deposition
KR100922046B1 (en) * 2007-11-20 2009-10-19 삼성모바일디스플레이주식회사 Apparatus for fabricating mask of vertical deposition
KR100947442B1 (en) * 2007-11-20 2010-03-12 삼성모바일디스플레이주식회사 Apparatus for fabricating mask of vertical deposition and Fabrication Method for making a mask of vertical deposition
KR102444178B1 (en) * 2015-04-27 2022-09-19 삼성디스플레이 주식회사 Mask assembly, manufacturing method for the mask assembly and manufacturing method for a display apparatus
KR20170000195A (en) 2015-06-23 2017-01-02 (주) 포커스레이져 A device for fixing frame for metal mask
KR200480788Y1 (en) * 2015-08-18 2016-07-06 주식회사 포커스테크 Frame for mask with adjustable height
KR101893942B1 (en) * 2016-11-10 2018-09-03 주식회사 선익시스템 Shadow mask tension device for deposition apparatus and method for attaching substrate and mask using the same device
US20210060700A1 (en) * 2017-09-05 2021-03-04 Dai Nippon Printing Co., Ltd. Manufacturing method for vapor deposition mask device and manufacturing apparatus for vapor deposition mask device
CN111534789A (en) * 2019-02-07 2020-08-14 悟勞茂材料公司 Method for reducing deformation of mask unit sheet part, frame integrated mask and manufacturing method thereof

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6955726B2 (en) * 2002-06-03 2005-10-18 Samsung Sdi Co., Ltd. Mask and mask frame assembly for evaporation
KR100908232B1 (en) * 2002-06-03 2009-07-20 삼성모바일디스플레이주식회사 Mask frame assembly for thin film deposition of organic electroluminescent device
JP2004232050A (en) 2003-01-31 2004-08-19 Nippon Seiki Co Ltd Holder for vapor deposition
JP4293822B2 (en) 2003-04-10 2009-07-08 大日本印刷株式会社 Method and apparatus for laminating metal thin plate
JP2004311336A (en) * 2003-04-10 2004-11-04 Dainippon Printing Co Ltd Method and device for frame-sticking metal thin plate
JP2004323888A (en) * 2003-04-23 2004-11-18 Dainippon Printing Co Ltd Vapor deposition mask and vapor deposition method

Also Published As

Publication number Publication date
TWI361636B (en) 2012-04-01
WO2006062035A1 (en) 2006-06-15
KR101011901B1 (en) 2011-02-01
KR20070101755A (en) 2007-10-17

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