SG10201508237WA - Selective Zone Temperature Control Build Plate - Google Patents
Selective Zone Temperature Control Build PlateInfo
- Publication number
- SG10201508237WA SG10201508237WA SG10201508237WA SG10201508237WA SG10201508237WA SG 10201508237W A SG10201508237W A SG 10201508237WA SG 10201508237W A SG10201508237W A SG 10201508237WA SG 10201508237W A SG10201508237W A SG 10201508237WA SG 10201508237W A SG10201508237W A SG 10201508237WA
- Authority
- SG
- Singapore
- Prior art keywords
- temperature control
- zone temperature
- build plate
- control build
- selective zone
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
- B29C64/245—Platforms or substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/115—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces by spraying molten metal, i.e. spray sintering, spray casting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
- B29C64/386—Data acquisition or data processing for additive manufacturing
- B29C64/393—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y50/00—Data acquisition or data processing for additive manufacturing
- B33Y50/02—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Control Of Resistance Heating (AREA)
- Resistance Heating (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201462059425P | 2014-10-03 | 2014-10-03 | |
US14/550,419 US20160096326A1 (en) | 2014-10-03 | 2014-11-21 | Selective zone temperature control build plate |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201508237WA true SG10201508237WA (en) | 2016-05-30 |
Family
ID=54266386
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201508237WA SG10201508237WA (en) | 2014-10-03 | 2015-10-02 | Selective Zone Temperature Control Build Plate |
Country Status (5)
Country | Link |
---|---|
US (1) | US20160096326A1 (en) |
EP (1) | EP3002112A1 (en) |
JP (1) | JP2016104555A (en) |
CN (1) | CN105666866A (en) |
SG (1) | SG10201508237WA (en) |
Families Citing this family (54)
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CN106061713B (en) * | 2014-01-16 | 2018-08-24 | 惠普发展公司,有限责任合伙企业 | Generate three-dimension object |
KR102123220B1 (en) | 2014-01-16 | 2020-06-17 | 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. | Generating three-dimensional objects |
JP6570542B2 (en) | 2014-01-16 | 2019-09-04 | ヒューレット−パッカード デベロップメント カンパニー エル.ピー.Hewlett‐Packard Development Company, L.P. | 3D object generation |
JP6302077B2 (en) | 2014-01-16 | 2018-03-28 | ヒューレット−パッカード デベロップメント カンパニー エル.ピー.Hewlett‐Packard Development Company, L.P. | 3D object generation |
US9592660B2 (en) * | 2014-12-17 | 2017-03-14 | Arevo Inc. | Heated build platform and system for three dimensional printing methods |
US9782964B2 (en) * | 2015-04-02 | 2017-10-10 | Xerox Corporation | System and method for removing three-dimensional printed parts from a platen using inductive heating and gravity |
WO2016195665A1 (en) * | 2015-06-02 | 2016-12-08 | Hewlett-Packard Development Company, L.P. | Sacrificial objects based on a temperature threshold |
US10583484B2 (en) * | 2015-10-30 | 2020-03-10 | Seurat Technologies, Inc. | Multi-functional ingester system for additive manufacturing |
EP3448663A1 (en) * | 2016-04-27 | 2019-03-06 | SABIC Global Technologies B.V. | 3d printer with independent multi zone temperature controller |
KR101814916B1 (en) * | 2016-04-28 | 2018-01-03 | 양의석 | 3D printer for chocolate manufacturing |
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US11117321B2 (en) * | 2016-09-22 | 2021-09-14 | Sciperio, Inc | Selective laser sintered fused deposition printing with cooling |
US11660819B2 (en) | 2016-11-02 | 2023-05-30 | R3 Printing, Inc. | System and method for automated successive three-dimensional printing |
US10723075B2 (en) | 2016-11-02 | 2020-07-28 | R3 Printing, Inc. | System and method for automated successive three-dimensional printing |
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US11440261B2 (en) * | 2016-11-08 | 2022-09-13 | The Boeing Company | Systems and methods for thermal control of additive manufacturing |
US20190247923A1 (en) * | 2016-11-09 | 2019-08-15 | Tongtai Machine & Tool Co., Ltd. | Heating and refrigerating device |
US10766241B2 (en) | 2016-11-18 | 2020-09-08 | The Boeing Company | Systems and methods for additive manufacturing |
CN106584840B (en) * | 2016-11-29 | 2018-07-27 | 江苏科技大学 | A kind of the 3D printing method and its printing equipment of unidirectional large scale product |
US10843452B2 (en) | 2016-12-01 | 2020-11-24 | The Boeing Company | Systems and methods for cure control of additive manufacturing |
CN106843321B (en) * | 2016-12-30 | 2018-09-07 | 青岛卓思三维智造技术有限公司 | Temperature control system and method |
US10300530B2 (en) | 2017-01-13 | 2019-05-28 | General Electric Company | Cooling structures for additive manufacturing |
US11059229B2 (en) | 2017-01-27 | 2021-07-13 | Hewlett-Packard Development Company, L.P. | Rules for printing three-dimensional parts |
JP2018134797A (en) * | 2017-02-22 | 2018-08-30 | 株式会社アスペクト | Powder sintered laminated molding apparatus and powder sintered laminated molding method |
US11351598B2 (en) * | 2017-03-05 | 2022-06-07 | Raytheon Company | Metal additive manufacturing by sequential deposition and molten state |
JP6858077B2 (en) * | 2017-05-25 | 2021-04-14 | アズビル株式会社 | Controller adjustment system and adjustment method |
US10974497B2 (en) * | 2017-06-05 | 2021-04-13 | The Boeing Company | Multi-region temperature controlled base for additive manufacturing |
ES2749906T3 (en) * | 2017-06-16 | 2020-03-24 | Cellink Ab | Printing beds, 3D printers, methods and software for regulating the temperature of a printing bed |
EP3673414B1 (en) * | 2017-08-23 | 2023-07-19 | Evapco, Inc. | Additive manufacturing by selective liquid cooling |
BR112020003593A2 (en) * | 2017-08-23 | 2020-09-01 | Evapco, Inc. | additive manufacturing by selective liquid refrigeration |
JP6926820B2 (en) * | 2017-08-24 | 2021-08-25 | セイコーエプソン株式会社 | 3D modeling device and 3D modeling method |
PL233659B1 (en) * | 2017-09-07 | 2019-11-29 | Szymanski Tomasz Verashape | Working platform for 3D printers |
CN111163924B (en) * | 2017-09-29 | 2023-05-23 | 阿科玛股份有限公司 | Material extrusion 3-D printing of compatible thermoplastic films |
CN107756798B (en) * | 2017-12-04 | 2021-04-06 | 深圳森工科技有限公司 | Heating module of 3D printer and heating method thereof |
JP2019142024A (en) * | 2018-02-16 | 2019-08-29 | 株式会社日立製作所 | Additive manufacturing apparatus |
CN108380871B (en) * | 2018-05-03 | 2019-12-10 | 温州职业技术学院 | Nano metal powder three-dimensional printing forming method based on induction heating |
US11440256B2 (en) | 2018-06-15 | 2022-09-13 | Howmedica Osteonics Corp. | Stackable build plates for additive manufacturing powder handling |
US11426818B2 (en) | 2018-08-10 | 2022-08-30 | The Research Foundation for the State University | Additive manufacturing processes and additively manufactured products |
US10882250B2 (en) * | 2018-09-17 | 2021-01-05 | Xerox Corporation | Additive manufacturing apparatus |
JP7172368B2 (en) | 2018-09-27 | 2022-11-16 | セイコーエプソン株式会社 | Three-dimensional modeling apparatus and method for manufacturing three-dimensional model |
KR102246186B1 (en) * | 2018-11-30 | 2021-04-29 | 안미선 | 3d printer |
US11396045B2 (en) * | 2019-03-11 | 2022-07-26 | The Aerospace Corporation | Monitoring during additive manufacturing process using thermocouples |
US11926104B2 (en) | 2019-03-11 | 2024-03-12 | The Aerospace Corporation | Monitoring during additive manufacturing process using thermocouples |
WO2020237163A1 (en) * | 2019-05-23 | 2020-11-26 | General Electric Company | Build receptacles for additive manufacturing apparatuses and methods for using the same |
US20220227058A1 (en) * | 2019-10-25 | 2022-07-21 | Hewlett-Packard Development Company, L.P. | Chamber temperature control |
JP7285559B2 (en) * | 2019-12-13 | 2023-06-02 | 秀夫 谷口 | 3D printer and modeling stage for 3D printer |
EP3888894A1 (en) * | 2020-03-31 | 2021-10-06 | Essilor International | Laminate wafers containing a soft deformable inner film |
WO2021225586A1 (en) * | 2020-05-05 | 2021-11-11 | Wavelet Systems, Llc | A continuous flow, high throughput, automated additive manufacturing system |
US11135771B1 (en) * | 2021-04-09 | 2021-10-05 | Curiteva, Inc. | System and method of manufacturing a medical implant |
CN113275568A (en) * | 2021-05-26 | 2021-08-20 | 华中科技大学 | Electromagnetic induction heating auxiliary SLM forming device and forming method |
CN113733543A (en) * | 2021-08-10 | 2021-12-03 | 深圳市维智梅克科技有限公司 | Heating control method, device and equipment for 3D printer and readable storage medium |
DE102022203819A1 (en) | 2022-04-19 | 2023-10-19 | Volkswagen Aktiengesellschaft | Additive manufacturing process for producing components using melt layering of filament material |
KR102623703B1 (en) * | 2022-12-26 | 2024-01-12 | 주식회사 클리셀 | Bioprinters and Control Methods |
CN116100811B (en) * | 2023-04-14 | 2023-07-28 | 易加三维增材技术(杭州)有限公司 | Printing part forming method and device, electronic equipment and nonvolatile storage medium |
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JP6017906B2 (en) * | 2011-10-19 | 2016-11-02 | 株式会社Kelk | Temperature control device |
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CN203650988U (en) * | 2013-12-04 | 2014-06-18 | 北京太尔时代科技有限公司 | 3D printer working platform |
CN103640218B (en) * | 2013-12-04 | 2016-06-08 | 北京太尔时代科技有限公司 | A kind of 3D printer work platforms |
US20150174824A1 (en) * | 2013-12-19 | 2015-06-25 | Karl Joseph Gifford | Systems and methods for 3D printing with multiple exchangeable printheads |
US20150314532A1 (en) * | 2014-05-01 | 2015-11-05 | BlueBox 3D, LLC | Increased inter-layer bonding in 3d printing |
WO2015175651A1 (en) * | 2014-05-13 | 2015-11-19 | Massachusetts Institute Of Technology | Systems, devices, and methods for three-dimensional printing |
US20160096327A1 (en) * | 2014-10-03 | 2016-04-07 | Tyco Electronics Corporation | Apparatus and method for producing objects utilizing three-dimensional printing |
-
2014
- 2014-11-21 US US14/550,419 patent/US20160096326A1/en not_active Abandoned
-
2015
- 2015-10-01 EP EP15187950.9A patent/EP3002112A1/en not_active Withdrawn
- 2015-10-02 JP JP2015196420A patent/JP2016104555A/en active Pending
- 2015-10-02 SG SG10201508237WA patent/SG10201508237WA/en unknown
- 2015-10-08 CN CN201511035497.1A patent/CN105666866A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
EP3002112A1 (en) | 2016-04-06 |
JP2016104555A (en) | 2016-06-09 |
US20160096326A1 (en) | 2016-04-07 |
CN105666866A (en) | 2016-06-15 |
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