KR101992907B1 - Desorption apparatus having gap forming unit and method of fabricating lightweight and thin liquid crystal display device using thereof - Google Patents

Abstract

In the detachable device having a gap forming unit of the present invention and a method of manufacturing a light weight thin liquid crystal display device using the same, in the case of using an auxiliary substrate to process a thin glass substrate, a thin glass substrate and an auxiliary layer are formed using a gap forming unit. After the initial gap is formed between the substrate to proceed with the detachment of the auxiliary substrate to easily separate the auxiliary substrate without damage to the substrate, the table to be loaded; A vacuum pad installed on the table to perform desorption; And a gap forming unit provided at one side of the table to form an initial gap for detachment.

Description

DESORPTION APPARATUS HAVING GAP FORMING UNIT AND METHOD OF FABRICATING LIGHTWEIGHT AND THIN LIQUID CRYSTAL DISPLAY DEVICE USING THEREOF}

The present invention relates to a method for manufacturing a liquid crystal display device, and more particularly, to a detacher having a gap forming unit and a method for manufacturing a light weight thin liquid crystal display device using the same.

In recent years, as the society enters a full-scale information age, the display field for processing and displaying a large amount of information has been rapidly developed, and recently, a thin film transistor (Thin) having excellent performance of light weight, thinness, and low power consumption has recently been developed. Film Transistor (TFT) Liquid Crystal Display (LCD) has been developed to replace the existing cathode ray tube (CRT).

The liquid crystal display device is largely composed of a color filter substrate and an array substrate, and a liquid crystal layer formed between the color filter substrate and the array substrate.

The color filter substrate distinguishes between a color filter composed of red (R), green (G), and blue (B) colors and the sub color filter and transmits the liquid crystal layer. It consists of a black matrix that blocks light and a transparent common electrode that applies a voltage to the liquid crystal layer.

The array substrate has gate lines and data lines arranged vertically and horizontally to define pixel regions. In this case, a thin film transistor as a switching element is formed in an intersection region of the gate line and the data line, and a pixel electrode is formed in each pixel region.

The color filter substrate and the array substrate configured as described above are joined to face each other by sealants formed on the outer side of the image display area to form a liquid crystal panel. The combination of the color filter substrate and the array substrate is the color filter substrate or the array substrate. It is made through a bonding key formed on the substrate.

Since the liquid crystal display is particularly used in portable electronic devices, it is possible to improve the portability of the electronic device only by reducing its size and weight. Moreover, in recent years, as the large-area liquid crystal display device is manufactured, the demand for such a light weight and a thin film becomes more intense.

There may be various ways to reduce the thickness or weight of the liquid crystal display, but there are limitations in reducing the essential components of the liquid crystal display in terms of its structure and current technology. Moreover, since these essential components are small in weight, it is very difficult to reduce the weight or weight of the entire liquid crystal display by reducing the weight of these essential components.

Therefore, the method of reducing the thickness and weight of the liquid crystal display device by reducing the thickness of the color filter substrate and the array substrate constituting the liquid crystal panel has been actively researched. The substrate is bent or broken during the process.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide a method for manufacturing a lightweight thin liquid crystal display device which prevents breakage of a thin glass substrate by adhering an auxiliary substrate to the thin glass substrate.

It is another object of the present invention to provide a detacher having a gap forming unit for easily separating an auxiliary substrate without damage from a liquid crystal panel in a cell state where the process is completed, and a method of manufacturing a lightweight thin liquid crystal display device using the same. To provide.

Other objects and features of the present invention will be described in the configuration and claims of the invention described below.

In order to achieve the above object, the detacher having a gap forming unit of the present invention is a detacher for separating the auxiliary substrate from the workpiece, the table to which the workpiece is loaded; A vacuum pad installed on the table to perform desorption; And a gap forming unit provided at one side of the table to form an initial gap for detachment.

In this case, the workpiece is a liquid crystal panel in a cell state in which a process is completed, and an auxiliary substrate is attached to both sides of the liquid crystal panel.

The gap forming unit is characterized in that it comprises a gap knife for forming the initial gap, a fluid nozzle for injecting air or fluid and the gap knife.

At this time, the gap forming unit is characterized in that it further comprises a drive means for driving the gap knife and the fluid nozzle and a tank for storing the liquid for supply to the fluid nozzle.

In this case, the driving means is characterized in that it comprises a cylinder for driving the gap knife in the vertical direction and a servo motor for moving the gap knife in the horizontal direction.

The fluid nozzle is characterized in that when the initial gap is formed by spraying a small amount of fluidized air or mist (mist) at the rear end of the gap knife serves as a lubricant.

The detacher may further include a push pin provided at one side of the table to secure an entry space of the gap knife.

In this case, the push pin is a push head, a pin bar having a bar shape connected to the push head, and a rod connected to the pin bar to prevent initial damage of the auxiliary substrate when the push pin is raised. It is characterized in that the cell (load cell) and the servo motor for driving the push pin.

At this time, the load cell is characterized in that the servo motor to be lowered to the lower to prevent damage to the auxiliary substrate when the pressure greater than the set force is applied to the push pin.

The detacher may further include an air knife for injecting air between the workpiece and the auxiliary substrate.

According to an exemplary embodiment of the present invention, there is provided a method of manufacturing a light weight thin liquid crystal display device, comprising: providing a first and a second auxiliary substrate and a thin first and second mother substrate; Attaching the first and second auxiliary substrates to the thin first and second mother substrates, respectively; Performing an array process on the first mother substrate to which the first auxiliary substrate is attached; Performing a color filter process on a second mother substrate to which the second auxiliary substrate is attached; Bonding the first mother substrate subjected to the array process and the second mother substrate subjected to the color filter process; Providing a desorber comprising a vacuum pad performing desorption and a gap forming unit forming an initial gap for desorption; Loading the bonded first and second mother substrates onto a table of the detacher; Separating the second auxiliary substrate from the second mother substrate using the vacuum pad; Inverting the first and second mother substrates from which the second auxiliary substrate is separated up and down and loading them on the table again; And separating the first auxiliary substrate from the first mother substrate using the vacuum pad.

At this time, using the push pins provided in the detacher before pressing the first auxiliary substrate, the first push substrate and the first auxiliary substrate are pressed by pressing the exposed push pin regions of both edges of the first auxiliary substrate at a predetermined pressure. A gap knife entry space is formed between the mother substrates.

In this case, a gap knife provided in the gap forming unit is introduced into the gap knife entry space, and the gap knife is moved from one direction of the table to the other to move the edge portion between the first auxiliary substrate and the first mother substrate. Desorption is characterized in that to form an initial gap.

In this case, when the initial gap is formed, a small amount of fluidized air or mist (mist) is injected from the rear end of the gap knife by using a fluid nozzle provided in the detacher.

As described above, the light weight thin liquid crystal display device manufacturing method according to the present invention can implement a light weight thin liquid crystal display device using a thin glass substrate to reduce the thickness or weight of a television or monitor model and a portable electronic device. It can be effective.

In addition, a detacher having a gap forming unit according to the present invention and a method for manufacturing a light weight thin liquid crystal display device using the same, after the initial gap is formed between the thin glass substrate and the auxiliary substrate by using the gap forming unit, the auxiliary substrate is detached. By proceeding, it is possible to easily separate the auxiliary substrate without damaging the substrates. As a result, the tact time is minimized and the process is stabilized, thereby improving the price competitiveness of the product.

1 is a flow chart schematically showing a method of manufacturing a lightweight thin liquid crystal display device according to the present invention.
2A to 2D are exemplary views schematically showing a part of a process of manufacturing a light weight thin liquid crystal display device according to the present invention.
3A and 3B are plan views schematically showing first and second auxiliary substrates and first and second mother substrates having corner cuts according to the present invention;
FIG. 4 is a plan view schematically illustrating first and second mother substrates in which a push pin region is formed by attaching first and second auxiliary substrates having edge cuts according to the present invention; FIG.
5 is a perspective view schematically showing the configuration of a detacher having a gap forming unit according to an embodiment of the present invention.
6 is a perspective view schematically illustrating a configuration of a gap forming unit in the detacher according to the embodiment of the present invention illustrated in FIG. 5.
7 is a perspective view schematically showing the configuration of a push pin in the detacher according to the embodiment of the present invention shown in FIG.
8 is a flowchart schematically illustrating a separation process of an auxiliary substrate in a method of manufacturing a lightweight thin liquid crystal display device according to an exemplary embodiment of the present invention.

Recently, as the use of liquid crystal display devices is diversified, interest in lightweight thin liquid crystal display devices is increasing, and interest in thinning substrates, which occupies the largest portion of the thickness of the liquid crystal panel, is also increasing. In addition, in a 3D or touch panel, a retarder or a touch function protective substrate is added to the liquid crystal panel, thereby increasing the demand for thinning. However, in the case of thin substrates, there is a limitation in the process progress due to weakening of physical properties such as bending and rigidity.

In order to solve this problem, a method of separating the auxiliary substrate from the thin glass substrate after the process is completed after attaching the auxiliary substrate to the thin glass substrate is completed, and in particular, in the present invention, electrostatic force, vacuum force or surface tension is used. Process by attaching the auxiliary substrate to the thin glass substrate, and forming an initial gap between the thin glass substrate and the auxiliary substrate using the gap forming unit, and then detaching the auxiliary substrate. It is characterized by easy separation.

Hereinafter, with reference to the accompanying drawings, a preferred embodiment of a detacher having a gap forming unit according to the present invention and a method for manufacturing a light weight thin liquid crystal display device using the same is easily available to those skilled in the art. It will be described in detail so that it can be carried out.

Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various different forms, only the present embodiments to make the disclosure of the present invention complete, and common knowledge in the art to which the present invention pertains. It is provided to fully inform the person having the scope of the invention, which is defined only by the scope of the claims. Like reference numerals refer to like elements throughout.

1 is a flowchart schematically illustrating a method of manufacturing a lightweight thin liquid crystal display device according to the present invention.

1 illustrates an example of a method of manufacturing a liquid crystal display device in the case of forming a liquid crystal layer by a liquid crystal dropping method, but the present invention is not limited thereto, and the present invention forms a liquid crystal layer by a liquid crystal injection method. It is also applicable to the manufacturing method of a liquid crystal display device in this case.

The manufacturing process of the liquid crystal display device may be classified into a driving element array process of forming a driving element on a lower array substrate, a color filter process of forming a color filter on an upper color filter substrate, and a cell process.

As described above, there are various factors that determine the thickness and weight of the liquid crystal display device. Among them, the color filter substrate or the array substrate made of glass is the heaviest component among other components of the liquid crystal display device. Therefore, in order to reduce the thickness or weight of the liquid crystal display device, it is most efficient to reduce the thickness or weight of the glass substrate.

As a method of reducing the thickness or weight of the glass substrate, there is a method of etching the glass substrate to reduce its thickness or using a thin glass substrate. The first method is to reduce the thickness by further glass etching process after the completion of the cell, there are disadvantages of the defects and cost increase during the etching process.

In the present invention, a thin glass substrate having a thickness of about 0.1t to 0.4t is used to perform an array process, a color filter process, and a cell process. In this case, the thin glass substrate is attached to an auxiliary substrate to perform a thin process. Minimize the influence of the bending of the glass substrate and characterized in that the thin glass substrate is not damaged during the movement. In this case, t means mm, and 0.1t means a thickness of 0.1mm and 0.4t means a thickness of 0.4mm. In the following description, mm is expressed as t for convenience of explanation.

That is, a thin glass substrate having a thickness of about 0.1t to 0.4t causes a large warpage when the glass substrate is put into a general liquid crystal display manufacturing line, which causes severe deflection of the substrate. When loading and unloading the unit process equipment, there is a problem that warpage occurs suddenly even by a small impact, so that the positional error occurs frequently. .

Accordingly, in the present invention, the auxiliary substrate is attached before the thin glass substrate of 0.1t to 0.4t is introduced into the manufacturing line, thereby generating the same or improved warpage as the glass substrate having a thickness of about 0.7t used for a general liquid crystal display device. It is characterized in that it is possible to prevent the occurrence of problems, such as the substrate sag during the movement or unit process by having a characteristic.

First, the auxiliary substrate of about 0.3t to 0.7t is attached to the thin glass substrate of 0.1t to 0.4t before inserting the thin glass substrate of 0.1t to 0.4t into the manufacturing line of the array process and the color filter process. (S101). However, the present invention is not limited to the thickness of the thin glass substrate and the auxiliary substrate.

The thin glass substrate and the auxiliary substrate may be bonded to each other by contacting the two substrates in a vacuum state, and the bonding force between the two substrates may be estimated by a vacuum force, a van der Waals force, an electrostatic force, or a molecular bond.

In this case, the present invention may facilitate the desorption with the thin glass substrate by reducing the bonding force by forming a plasma treatment using a fluorine (fluorine), a surfactant treatment, or an uneven pattern on the auxiliary substrate. It will be described in detail with reference to the drawings. However, the present invention is not limited thereto, and the thin glass substrate and the auxiliary substrate may be bonded without any treatment.

2a to 2d are schematic views showing a part of the process of manufacturing a light weight thin liquid crystal display device according to the present invention, an example of the bonding and desorption process of the thin glass substrate and the auxiliary substrate treated with plasma or surfactant. It is shown.

2A to 2D are characterized in that the adhesion between the auxiliary substrate and the thin glass substrate is eased by treating plasma or a surfactant on the entire surface of the auxiliary substrate to facilitate the detachment between the auxiliary substrate and the thin glass substrate. . However, as described above, the present invention is not limited thereto.

As shown in FIG. 2A, for example, a thin glass substrate 100 having a thickness of about 0.1t to 0.4t and an auxiliary substrate 110 having a thickness of about 0.3t to 0.7t are prepared.

In this case, the thin glass substrate 100 may be a large area mother substrate on which a plurality of color filter substrates are arranged for a color filter process or a large area mother substrate on which a plurality of array substrates are arranged for an array process.

Next, as illustrated in FIG. 2B, a plasma or a surfactant using fluorine or the like is treated on the entire surface 111 of the auxiliary substrate 110 to facilitate the detachment of the auxiliary substrate 110.

When the fluorine is treated on the auxiliary substrate 110 as described above, the fluorine etches the surface 111 of the auxiliary substrate 110 to increase the surface roughness or to change the chemical properties of the surface. The adhesion by contact with 100) can be weakened.

Alternatively, when the auxiliary substrate 110 is treated with a surfactant when the auxiliary substrate 110 is cleaned, the bonding force may be alleviated by reducing the -OH group between the auxiliary substrate 110 and the thin glass substrate 100. have.

Next, as shown in FIG. 2C, the auxiliary substrate 110 treated with the plasma or the surfactant is attached to the thin glass substrate 100. In this case, the thin glass substrate 100 and the auxiliary substrate 110 may be bonded together when the glass substrate is used as the auxiliary substrate 110 by contacting the two substrates 100 and 110 in a vacuum state. The bonding force between 100 and 110) may be estimated by vacuum force, van der Waals force, electrostatic force, or molecular bond.

The process panel in which the thin glass substrate 100 having a thickness of 0.1t to 0.4t and the auxiliary substrate 110 having a thickness of 0.3t to 0.7t are bonded to the thin glass substrate 100 constituting the same ) And the auxiliary substrate 110 are made of the same glass material, so that the expansion rate is the same according to the temperature change, there is no problem that warpage occurs due to the expansion rate difference during the unit process.

In addition, the thin glass substrate 100 itself has a thickness of 0.1t ~ 0.4t, but as the secondary substrate 110 is bonded to form a process panel, the occurrence of warpage is significantly reduced and the thickness of the general 0.7t The level of warpage of the glass substrate having a level of less than or equal to that of the glass substrate having a lower level does not cause any problem in proceeding the unit process for the liquid crystal display.

Thereafter, the thin glass substrate 100 to which the auxiliary substrate 110 is attached is subjected to a color filter process or an array process to be described later to form a thin film transistor or a color filter layer as a driving element in each panel region.

After the completion of the predetermined process, as shown in FIG. 2D, the auxiliary substrate 110 should be separated from the thin glass substrate 100, wherein the plasma is formed on the entire surface 111 of the auxiliary substrate 110. B has been treated with a surfactant can be easily detached of the auxiliary substrate (110).

That is, when the bonding force between the thin glass substrate 100 and the auxiliary substrate 110 is strong, it is difficult to physically separate, so the bending phenomenon may occur in the thin glass substrate 100 when separating, but the auxiliary substrate 110 When the plasma treatment is performed on the entire surface 111, the bonding force is reduced between the thin glass substrate 100 and the auxiliary substrate 110, so that the auxiliary substrate 110 can be easily detached. Alternatively, when the surfactant is treated on the auxiliary substrate 110, the bonding force may be alleviated by reducing the -OH group between the auxiliary substrate 110 and the thin glass substrate 100.

In addition, the auxiliary substrate 110 detached from the thin glass substrate 100 may be attached to a new glass substrate and recycled for a new process.

On the other hand, the method of processing the plasma on the auxiliary substrate may be a partial treatment method in addition to the above-described front surface treatment, for example, to perform a plasma treatment using fluorine or the like on a part surface of the center of the auxiliary substrate to facilitate the detachment of the auxiliary substrate. Can be. In this case, as the fluorine is treated only on a part of the surface of the auxiliary substrate, bonding is performed in a region where contact between the substrates is possible.

In addition, the above cases are described by taking plasma or surfactant treatment on the auxiliary substrate to ease the desorption by adhering to the thin glass substrate, for example, but the present invention is not limited thereto. In addition, the present invention may form a concave-convex pattern on the auxiliary substrate to alleviate the bonding force with the thin glass substrate. As the method of forming the uneven pattern, an inorganic insulating layer patterning, an organic insulating layer patterning, a low temperature SiO ₂ etching, a laser patterning method and the like. As such, when the uneven pattern is formed on the auxiliary substrate, as the surface roughness increases, the bonding force due to contact with the thin glass substrate may be weakened.

However, the present invention is not limited to the above-described method of attaching the auxiliary substrate, and as described above, the present invention can be made in a vacuum state without adhesive or surface treatment to attach the auxiliary substrate to the thin glass substrate. At this time, the two substrates may be bonded by electrostatic force, vacuum force, van der Waals force or surface tension in a vacuum.

On the other hand, as a desorption method that can be applied to the upper substrate or a thin glass substrate by holding a vacuum pad (vacuum pad) there is a way to lift the auxiliary substrate or thin glass substrate, wherein the surface of the auxiliary substrate plasma or surfactant Due to the treatment or the formation of the uneven pattern, the adhesion between the two substrates is not large, so that the detachment can be easily performed. However, the breakage of the auxiliary substrate may occur at the start or end point of the detachment due to the tension generated by the vertical detachment. In addition, when the bonding force between the two substrates is low, the breakage of the substrates may occur during separation, and when the bonding force is high, defects may occur that are not separated or the central part is torn off, and thus, improvement is required.

Accordingly, the present invention proceeds with the detachment of the auxiliary substrate after forming an initial gap between the thin glass substrate and the auxiliary substrate using a gap forming unit to facilitate the detachment without damaging the auxiliary substrate, which will be described later.

After the auxiliary substrate is attached to the thin glass substrate as described above, the thin glass substrate for an array substrate (hereinafter referred to as an array substrate for convenience of description) to which the auxiliary substrate is attached is arranged on the array substrate by an array process. As a result, a plurality of gate lines and data lines defining pixel regions are formed, and thin film transistors, which are driving elements connected to the gate lines and data lines, are formed in each of the pixel regions (S102). In addition, the pixel electrode is connected to the thin film transistor through the array process to drive the liquid crystal layer as a signal is applied through the thin film transistor.

In addition, a thin glass substrate for a color filter substrate (hereinafter, referred to as a color filter substrate for convenience of description) to which the auxiliary substrate is attached has a red, green, and blue sub-color filter for implementing color by a color filter process. A color filter layer and a common electrode are formed (S103). In this case, when a liquid crystal display device having an in-plane switching (IPS) method is manufactured, the common electrode is formed on an array substrate on which the pixel electrode is formed through the array process.

Subsequently, after the alignment film is printed on the color filter substrate and the array substrate, the alignment control force or the surface fixing force (that is, the pretilt angle and orientation) is applied to the liquid crystal molecules of the liquid crystal layer formed between the color filter substrate and the array substrate. Direction) to rub the alignment film (S104, S105).

A sealing material is applied to the rubbed color filter substrate as described above to form a predetermined failure turn, and a liquid crystal is dropped on the array substrate to form a liquid crystal layer (S106 and S107).

On the other hand, the color filter substrate and the array substrate are each formed on a large area mother substrate. In other words, a plurality of panel regions are formed in each of the large area mother substrates, and a thin film transistor or a color filter layer serving as a driving element is formed in each of the panel regions.

In this case, the dropping method uses a dispenser to drop and dispense liquid crystals into an image display area of a first mother substrate having a large area on which a plurality of array substrates are arranged or a second mother substrate on which a plurality of color filter substrates are disposed. The liquid crystal layer is formed by uniformly distributing the liquid crystals to the entire image display region by the pressure for bonding the first and second mother substrates together.

Therefore, when the liquid crystal layer is formed on the liquid crystal panel by a dropping method, a failure turn should be formed in a closed pattern surrounding the outer portion of the pixel region so as to prevent the liquid crystal from leaking out of the image display region.

The dropping method can drop the liquid crystal in a short time compared to the vacuum injection method, and can form the liquid crystal layer very quickly even when the liquid crystal panel is enlarged. In addition, since only the required amount of liquid crystal is dropped on the substrate, the price competitiveness of the liquid crystal panel due to the disposal of the expensive liquid crystal is prevented, such as vacuum injection, thereby strengthening the product's price competitiveness.

Thereafter, the first mother substrate and the second mother substrate are bonded together by the sealing material by applying pressure while the liquid crystal is dropped and the first mother substrate and the second mother substrate coated with the sealing material are aligned as described above. The liquid crystal dropped by the application of pressure is spread evenly over the entire liquid crystal panel (S108). By such a process, a plurality of liquid crystal panels in which a liquid crystal layer is formed are formed on the first and second mother substrates having a large area, and the first and second mother substrates are formed from the first and second mother substrates in which the large liquid crystal panels are formed. 2 After separating the auxiliary substrate, the substrate is processed, cut into a plurality of liquid crystal panels, and each liquid crystal panel is inspected to produce a liquid crystal display device (S109 and S110).

In this case, as described above, the present invention is characterized in that after the initial gap is formed between the thin glass substrate and the auxiliary substrate by using the gap forming unit, the auxiliary substrate is detached and pushed using the edge cut of the substrate. The formation of the push pin region facilitates the formation of the initial gap, which will be described in detail with reference to the accompanying drawings.

3A and 3B are plan views schematically illustrating first and second auxiliary substrates and first and second mother substrates having corner cuts according to the present invention.

4 is a plan view schematically illustrating the first and second mother substrates having the first and second auxiliary substrates having the corner cuts formed therein and having the push pin regions formed therein according to the present invention.

Referring to the drawings, as described above, in the present invention, a thin glass substrate of 0.1t to 0.4t, that is, 0.3t to 0.7t before the first and second mother substrates 101 and 102 are introduced into the manufacturing line. By attaching the first and second auxiliary substrates 110a and 110b having a thickness, the movement or unit process is performed to have the same or improved warpage generation characteristics as the glass substrate having a thickness of about 0.7t used in a general liquid crystal display device. It is characterized by being able to prevent the occurrence of problems such as substrate sag during the process.

In this case, the corners of the first and second mother substrates 101 and 102 and the first and second auxiliary substrates 110a and 110b in the bonded state, to which the plurality of liquid crystal panels 103 are allocated, have predetermined inclination angles. This is called cutting, which is called edge cutting.

In particular, at least two edges of the thin first and second mother substrates 101 and 102 are cut inwardly in comparison with the first and second auxiliary substrates 110a and 110b for direction discrimination and post-processing. As a result of this, the edges of the first and second auxiliary substrates 110a and 110b are exposed, and this region is provided with a push pin to start the separation process of the first and second auxiliary substrates 110a and 110b. It can be used as the push pin area (A, B) applied.

Hereinafter, a method of separating the auxiliary substrate from the liquid crystal panel in a cell state in which the process is completed will be described in detail with reference to the accompanying drawings.

5 is a perspective view schematically showing the configuration of a detacher having a gap forming unit according to an embodiment of the present invention.

6 is a perspective view schematically illustrating a configuration of a gap forming unit in the detacher according to the embodiment of the present invention illustrated in FIG. 5.

FIG. 7 is a perspective view schematically illustrating a configuration of a push pin in the detacher according to the embodiment of the present invention illustrated in FIG. 5.

Referring to FIG. 5, the detacher 170 according to the embodiment of the present invention is largely provided in the frame 171 and installed on the table 175 and the table 175 on which the object 100 is loaded. A vacuum pad (not shown) that performs desorption and a gap forming unit 180 and a push pin 160 provided on one side of the table 175 to form an initial gap for desorption are formed.

In this case, as an example, the object 100 may be a first or second mother substrate in a bonded state in which a plurality of liquid crystal panels 103 are allocated, and in this case, both sides of the first and second mother substrates may be An auxiliary substrate is attached to process thin glass substrates.

In this case, the gap forming unit 180 includes a gap knife 180a and a fluid nozzle 180b for forming an initial gap to separate the auxiliary substrate from the processed object 100 after the process is completed. can do.

And, although not shown, the desorption unit 170 according to an embodiment of the present invention further includes an air knife for injecting air between the object 100 and the auxiliary substrate in the desorption process so that the auxiliary substrate is separated well. can do.

At this time, the table 175 according to the embodiment of the present invention can be heated to about 100 ~ 150 ℃, for example, when maintaining the temperature of the table 175 about 100 ℃ when separating the glass and glass bonding force Is reduced by 1/2. When the adhesion is reduced in this manner, when the auxiliary substrate is detached from the workpiece 100, the stress on the auxiliary substrate may be reduced to prevent gap lifting, glass breakage, and cell stiffness degradation.

As a result of confirming the change in the desorption force according to the temperature of the table 175, it was found that the desorption force was reduced to about 0.52 kgf when desorbed at 110 ° C. than when desorbed at room temperature (about 1.16 kgf).

The gap forming unit 180 described above will be described in detail with reference to FIG. 6. The gap forming unit 180 according to the embodiment of the present invention has a gap knife 180a and an air or fluid for forming an initial gap. It may include a fluid nozzle 180b for spraying the plate 183 and the support 184 on which the gap knife 180a and the fluid nozzle 180b are installed.

In addition, the gap forming unit 180 according to an exemplary embodiment of the present invention stores driving means for driving the gap knife 180a and the fluid nozzle 180b and a liquid for supplying the fluid nozzle 180b. Tank 186 may be further included.

In this case, the tank 186 is provided with a plurality of pipes 187 for supplying or supplying the liquid to the fluid nozzle 180b, and the fluid nozzle 180b is formed from the pipe 187. A plurality of supply pipes 182 for supplying the supplied liquid or air to the nozzle 181 of the fluid nozzle 180b are formed.

The driving means may include a cylinder 185 for driving the gap knife 180a in the vertical direction and a servo motor (not shown) for moving the gap knife 180a in the horizontal direction.

In this case, the cylinder 185 may be substituted by a motor, and serves to adjust the position of the gap knife 180a.

The servo motor moves the gap knife 180a forward and backward so that the gap knife 180a inserted between the workpiece 100 and the auxiliary substrate can be separated between the workpiece 100 and the auxiliary substrate. It plays a role.

The gap knife 180a may be made of a material such as steel, ceramic, or titanium alloy, which may not be bent when passing between the workpiece 100 and the auxiliary substrate, and may be formed by friction in the process of forming a gap. These can be broken so that a predetermined coating can be applied on top.

These coatings can use Teflon or Carbon Nano Tube (CNT) coatings to minimize friction and reduce the strength and friction to ensure that gaps are formed.

The gap knife 180a withstands bending when forming a gap, and is manufactured to have a thickness that does not cause breakage of the substrates upon separation. The gap knife 180a may be manufactured to have a thickness ranging from 0.05 mm to 0.2 mm depending on the material.

As described above, friction may occur when the gap knife 180a passes between the workpiece 100 and the auxiliary substrate, and scratches may occur on the gap knife 180a or the substrates. To minimize this, the fluid nozzle 180b serves as a lubricant by spraying a small amount of fluidized air or mist at the rear end of the gap knife 180a when the gap is formed.

In this case, the fluid may be a liquid, such as distilled water or alcohol, using a material that does not affect the substrate or equipment.

In addition, referring to FIG. 7, the push pin 160 according to the exemplary embodiment of the present invention has a push head 161 and a bar pin pin connected to the push head 161. bar 162 and a load cell 163 and the push pin 160 to be connected to the pin bar 162 to prevent initial damage of the auxiliary substrate when the push pin 160 is raised. It may be made of a servo motor 164 for driving.

The push head 161 may be made of a material that does not occur deformation, such as polyether ether ketone (PEEK) at a temperature of 200 ℃ or more, the cross section may be a variety of shapes, such as circular, square, triangle. .

The pin bar 162 refers to a metal bar supporting the push head 161, and the servo motor 164 drives the push pin 160 up and down.

The load cell 163 refers to a force sensing sensor that detects the servo motor 164 to be lowered in order to prevent damage to the auxiliary substrate when a pressure greater than a set force is applied to the push pin 160. .

Hereinafter, as an example, a method of separating the auxiliary substrate from the liquid crystal panel in a cell state in which the process is completed will be described in detail with reference to the accompanying drawings.

8 is a flowchart schematically illustrating a separation process of an auxiliary substrate in a method of manufacturing a light weight thin liquid crystal display device according to an exemplary embodiment of the present invention.

However, the present invention is not limited to the order of the separation process of the auxiliary substrate shown in FIG.

The first and second mother substrates bonded to each other after completion of the process should separate the first and second auxiliary substrates attached to each other to proceed with the process. The bonded first and second mother substrates are loaded onto the table of the detacher according to the embodiment of the present invention (S201).

In this case, as described above, the first mother substrate on which the thin film transistor array substrates are formed and the second mother substrate on which the color filter substrates are formed may be formed of a thin glass substrate having a thickness of about 0.1t to 0.4t. To this end, each of the first and second mother substrates may be attached with a first and second auxiliary substrates of about 0.3t to about 0.7t each having a predetermined plasma, a surfactant treatment, or an uneven pattern. However, the present invention is not limited to the thicknesses of the thin first and second mother substrates and the first and second auxiliary substrates.

The thin first and second mother substrates and the first and second auxiliary substrates may be bonded to each other by contacting the two substrates in a vacuum state, wherein the bonding force between the two substrates may be a vacuum force, a van der Waals force, an electrostatic force, Or molecular bonds.

In this case, for example, the first and second mother substrates are loaded on the table so that the second auxiliary substrate to be separated is facing upward, and a vacuum pad is installed on the loaded first and second mother substrates. Can be.

In this way, the first and second mother substrates loaded on the table are aligned with the upper vacuum pads through the predetermined alignment unit (S202).

Next, using the bar-shaped push pin according to an embodiment of the present invention by pressing the exposed push pin area of the opposite side of the second auxiliary substrate at a constant pressure up, the second auxiliary substrate and the thin glass substrate, that is, A gap knife entry space is formed between the second mother substrates (S203-1).

In addition, a predetermined gap knife is introduced into a corner space between the second auxiliary substrate and the second mother substrate, that is, a gap knife entry space. For example, the gap knife is moved from one direction of the table to the other to move the first gap knife. 2, the initial gap is formed by removing the edge portion between the auxiliary substrate and the second mother substrate (S203-2).

As described above, the initial gap is formed in order to facilitate detachment without damaging the auxiliary substrate. In this case, when the initial gap is formed, a small amount of air or mist is formed by using the fluid nozzle of the above-described embodiment of the present invention. By spraying fluid at the rear end of the gap knife, the gap knife acts as a lubricant when passing between the second auxiliary substrate and the second mother substrate, thereby preventing damage to the gap knife or substrates such as scratches. do.

The desorption of the second auxiliary substrate is completed using the vacuum pads (S203-3 and S203).

Thereafter, the first and second mother substrates separated from the second auxiliary substrate are vertically inverted and then loaded again on the table of the detacher (S204).

That is, the first and second mother substrates are loaded on the table so that the first auxiliary substrate to be separated faces upward, and the above-described vacuum pads are installed on the loaded first and second mother substrates.

In addition, the first and second mother substrates loaded on the table of the detacher are aligned with the upper vacuum pad through the above-described alignment unit (S205).

Subsequently, by pressing the exposed push pin regions of both edges of the first sub-substrate with a predetermined pressure upward by using the push pins as described above, the first sub-substrate and the thin glass substrate, that is, between the first mother substrate. Form a gap knife entry space (S206-1).

In addition, the aforementioned gap knife is introduced into the corner space between the first auxiliary substrate and the first mother substrate, that is, the gap knife entry space. For example, the gap knife is moved from one direction of the table to another direction. 1 The edge portion between the auxiliary substrate and the first mother substrate is removed to form an initial gap (S206-2).

In this case, as described above, when the initial gap is formed, a small amount of fluidized air or mist is injected from the rear end of the gap knife by using the aforementioned fluid nozzle.

In addition, the detachment of the second auxiliary substrate is completed using the vacuum pad (S206-3, S206).

As described above, the method for manufacturing a lightweight thin liquid crystal display device according to the present invention facilitates an auxiliary substrate without damaging the substrates by forming and / or detaching the auxiliary substrate after forming an initial gap between the thin glass substrate and the auxiliary substrate using a gap forming unit. Can be separated. As a result, the tact time is minimized and the process is stabilized to improve the price competitiveness of the product.

Many details are set forth in the foregoing description but should be construed as illustrative of preferred embodiments rather than to limit the scope of the invention. Therefore, the invention should not be defined by the described embodiments, but should be defined by the claims and their equivalents.

100: thin glass substrate 101: first mother substrate
102: second mother substrate 110, 110a, 110b: auxiliary substrate
160: push pin 161: push head
162: pin bar 163: load cell
164: servo motor 170: detacher
171: Frame 175: Table
180: gap forming unit 180a: gap knife
180b: fluid nozzle 181: nozzle
182: supply pipe 185: cylinder
186 tank 187 piping

Claims (14)

In the detacher which separates the auxiliary board from the mother board,
The mother substrate is loaded and the heated table of about 100 ~ 150 ℃;
A vacuum pad installed on the table to perform desorption; And
A gap forming unit provided at one side of the table to form an initial gap for detachment;
The gap forming unit includes a gap knife for forming the initial gap and a fluid nozzle for injecting air or fluid,
And a push pin provided at one side of the table to secure an entry space of the gap knife. The detacher according to claim 1, wherein the mother substrate is a liquid crystal panel in a cell state in which a process is completed, and the auxiliary substrate is attached to both sides of the liquid crystal panel. delete 2. The detacher of claim 1, wherein said gap forming unit further comprises a tank for storing said gap knife and drive means for driving said fluid nozzle and a liquid for supplying said fluid nozzle. 5. The detacher according to claim 4, wherein the driving means includes a cylinder for driving the gap knife in the vertical direction and a servo motor for moving the gap knife in the horizontal direction. 2. The detacher of claim 1, wherein the fluid nozzle serves as a lubricant by spraying a small amount of fluidized air or mist at the rear end of the gap knife when the initial gap is formed. delete The push pin of claim 1, wherein the push pin includes a push head, a pin bar having a bar shape connected to the push head, and a pin bar connected to the pin bar to prevent initial damage of the auxiliary substrate when the push pin is raised. And a load cell for preventing and a servo motor for driving the push pin. 9. The detacher according to claim 8, wherein the load cell senses that the servo motor can be lowered to prevent damage to an auxiliary substrate when a pressure greater than a set force is applied to the push pin. The detacher according to claim 1, wherein the detacher further comprises an air knife for injecting air between the mother substrate and the auxiliary substrate. Providing a thin first and second mother substrate having an edge cut formed with first and second auxiliary substrates and push pin regions;
Subjecting the first and second auxiliary substrates to plasma or surfactant treatment;
Attaching the first and second auxiliary substrates to the thin first and second mother substrates, respectively;
Performing an array process on the first mother substrate to which the first auxiliary substrate is attached;
Performing a color filter process on a second mother substrate to which the second auxiliary substrate is attached;
Bonding the first mother substrate subjected to the array process and the second mother substrate subjected to the color filter process;
Providing a desorber comprising a vacuum pad performing desorption and a gap forming unit forming an initial gap for desorption;
Loading the bonded first and second mother substrates onto a table of the detacher;
Separating the second auxiliary substrate from the second mother substrate using the vacuum pad;
Inverting the first and second mother substrates from which the second auxiliary substrate is separated up and down and loading them on the table; And
Separating the first auxiliary substrate from the first mother substrate using the vacuum pad;
A method of manufacturing a light weight thin liquid crystal display device, wherein the table on which the first and second mother substrates are loaded is heated at a temperature of about 100 to 150 ° C. 12. The method of claim 11, wherein the first auxiliary substrate by pressing the exposed push pin region of the opposite side edges of the first auxiliary substrate with a predetermined pressure by using a push pin provided in the detacher before removing the first auxiliary substrate. And a gap knife entry space between the first mother substrate and the first mother substrate. The first auxiliary substrate and the first mother substrate of claim 12, wherein a gap knife provided in the gap forming unit is introduced into the gap knife entry space, and the gap knife is moved from one direction of the table to the other. A method for manufacturing a lightweight thin liquid crystal display device, wherein an initial gap is formed by detaching an edge portion therebetween. The method of claim 13, wherein, when the initial gap is formed, a small amount of fluidized by air or mist is injected from the rear end of the gap knife by using a fluid nozzle provided in the detacher. .

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