KR101936583B1 - Method of fabricating lightweight and thin liquid crystal display device - Google Patents

Abstract

In the method of manufacturing a lightweight thin liquid crystal display device of the present invention, when an auxiliary substrate is used for proceeding a process of a thin glass substrate, a thin glass substrate is set to a smaller size than an auxiliary substrate to protect it from external impact, It is possible to prevent the deposition film from remaining on the edge side of the thin glass substrate by setting the difference at least to a value smaller than the EBR (edge bead removal) region.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a method of manufacturing a lightweight thin liquid crystal display device,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a liquid crystal display device, and more particularly, to a method of manufacturing a lightweight thin type liquid crystal display device.

2. Description of the Related Art Recently, the display field for processing and displaying a large amount of information has been rapidly developed as society has entered into a full-fledged information age. Recently, thin-film transistors (thin A liquid crystal display (LCD) has been developed to replace a conventional cathode ray tube (CRT).

The liquid crystal display device mainly comprises a color filter substrate and an array substrate, and a liquid crystal layer formed between the color filter substrate and the array substrate.

Wherein the color filter substrate is divided into a color filter composed of sub-color filters of red (R), green (G), and blue (B) A black matrix for blocking light, and a transparent common electrode for applying a voltage to the liquid crystal layer.

A gate line and a data line are vertically and horizontally arranged on the array substrate to define a pixel region. At this time, a thin film transistor, which is a switching element, is formed in a crossing region between the gate line and the data line, and pixel electrodes are formed in the pixel regions.

The color filter substrate and the array substrate are adhered to each other so as to face each other by a sealant formed on the outer periphery of the image display area to constitute a liquid crystal panel, And a joining key formed on the substrate.

Such a liquid crystal display device is particularly used for portable electronic devices, so that the size and weight of the liquid crystal display device can be reduced to improve the portability of electronic devices. Further, recently, as a large-area liquid crystal display device is manufactured, the demand for such a light weight and thin shape is further increased.

There are various methods for reducing the thickness and weight of the liquid crystal display device, but there are limitations in reducing the structure and the essential components of the liquid crystal display device in the current state of the art. Moreover, since these essential components are small in weight, it is very difficult to reduce the thickness and weight of the entire liquid crystal display device by reducing the weight of these essential components.

A method for reducing the thickness and weight of a liquid crystal display device by reducing the thickness of a color filter substrate and an array substrate constituting a liquid crystal panel has been actively studied. However, since a thin substrate must be used, The substrate is bent or broken during the process.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to provide a method of manufacturing a lightweight thin liquid crystal display device in which an auxiliary substrate is attached to a thin glass substrate to prevent breakage of the thin glass substrate during the process .

It is another object of the present invention to provide a glass substrate and a method of manufacturing the same, in which a thin glass substrate is protected from an external impact by setting a size relation between a thin glass substrate and an auxiliary substrate, And a method of manufacturing a thin and lightweight liquid crystal display device.

Other objects and features of the present invention will be described in the following description of the invention and claims.

In order to achieve the above object, the present invention provides a method of manufacturing a lightweight thin liquid crystal display device, comprising the steps of: preparing first and second auxiliary substrates and first and second thin mother boards having a smaller size than the first and second auxiliary substrates; ; Attaching the first and second auxiliary substrates to the first and second thin mother boards, respectively; Performing an array process on the first mother substrate to which the first auxiliary substrate is attached; Performing a color filter process on a second mother substrate to which the second auxiliary substrate is attached; Attaching a first mother board on which the array process is performed and a second mother board on which the color filter process is performed; And separating the first and second auxiliary substrates from the first and second mother substrate plates, wherein a difference in size between the first and second mother substrate plates and the first and second auxiliary substrates, Is characterized by having a value of at least 0.015 mm to 0.5 mm.

At this time, after providing the first and second auxiliary substrates and the first and second mother substrates having a smaller size than the first and second auxiliary substrates, the first and second auxiliary substrates, Further comprising the step of forming a corner cut by cutting at an angle to the four corners of the second mother substrate.

In this case, the difference in size between the first and second mother substrate and the first and second auxiliary substrates is applied not only to the four sides of the substrates but also to the edge where the corner cut is formed.

At least one corner of the first and second mother substrates is exposed to the corner portions of the first and second auxiliary substrates as the cutting is performed in a direction further inward than the edges of the first and second auxiliary substrates .

The difference in size between the thin first and second mother substrates and the first and second auxiliary substrates must be greater than at least 0.015 mm in consideration of the cohesion margin, And is set to a value smaller than at least an EBR (edge bead remove) region in order to prevent the residual phenomenon.

At this time, the EBR region is an edge region where the photoresist applied for patterning the deposition film deposited on the thin first mother substrate or the second mother substrate is removed, and the edge region of the first auxiliary substrate or the second auxiliary substrate, To 5 mm.

Considering a process error of about ± 1 mm with respect to the EBR region, a difference in size between the thin first and second mother substrate and the first and second auxiliary substrates has a value between 0.015 mm and 2 mm do.

Considering the dimensional variation of the substrates, the difference in size between the thin first and second mother substrate and the first and second auxiliary substrates has a value between 0.5 mm and 1 mm.

The thin first and second mother boards have a thickness of 0.1 mm to 0.4 mm.

The first and second auxiliary substrates have a thickness of 0.3 mm to 0.7 mm.

As described above, according to the method of manufacturing a lightweight and thin liquid crystal display device according to the present invention, it is possible to realize a thin and lightweight liquid crystal display device using a thin glass substrate, thereby reducing the thickness and weight of television and monitor models and portable electronic devices Provides a possible effect.

In addition, in the method of manufacturing a lightweight thin liquid crystal display device according to the present invention, a thin glass substrate is set to a smaller size than an auxiliary substrate to protect it from an external impact, and the difference is at least a value smaller than an edge bead remove It is possible to prevent the deposition film from remaining on the edge side of the thin glass substrate. As a result, the process is stabilized and the price competitiveness of the product is improved.

1A and 1B are plan views schematically showing an auxiliary substrate on which corner cuts are formed and a thin glass substrate.
FIG. 2 is a plan view schematically showing a state in which the auxiliary substrate and the thin glass substrate shown in FIGS. 1A and 1B are bonded together. FIG.
FIG. 3 is a cross-sectional view schematically showing a state in which the auxiliary substrate and the thin glass substrate shown in FIGS. 1A and 1B are bonded together. FIG.
4A and 4B are cross-sectional views showing the results of the photolithography process in the case where the difference in size between the thin glass substrate and the auxiliary substrate has a larger value than the EBR region.
5A and 5B are cross-sectional views showing the results of the photolithography process in the case where the difference in size between the thin glass substrate and the auxiliary substrate is smaller than that in the EBR region.
6 is a cross-sectional view schematically showing a state in which a thin glass substrate and an auxiliary substrate are bonded together when the thin glass substrate and the auxiliary substrate are designed to have the same size.
FIGS. 7A to 7F are cross-sectional views showing the thin glass substrate shown in FIG. 6 and showing whether or not a thin glass substrate is broken due to dimensional changes of the substrate.
8 is a cross-sectional view schematically showing a state in which a thin glass substrate and an auxiliary substrate are bonded together when a thin glass substrate is designed to have a small size as compared with an auxiliary substrate.
FIGS. 9A to 9F are cross-sectional views showing the thin glass substrate shown in FIG. 8, showing whether or not a thin glass substrate is broken due to dimensional fluctuations of the substrate.
10 is a cross-sectional view schematically showing a state in which a thin glass substrate and an auxiliary substrate are bonded together when a thin glass substrate is designed to have a size which is twice as small as the dimensional variation of the auxiliary substrate.
11A to 11F are cross-sectional views showing the thin glass substrate shown in Fig. 10 and showing whether or not a thin glass substrate is broken due to dimensional fluctuation of the substrate.
12 is a flowchart schematically showing a method of manufacturing a lightweight thin-type liquid crystal display device according to an embodiment of the present invention.

2. Description of the Related Art [0002] Recently, various applications of liquid crystal display devices have been gaining interest in lightweight and thin liquid crystal display devices, and attention has been paid to thinning of substrates that occupy the largest portion of the thickness of liquid crystal panels. In addition, since a retarder or a protective function substrate is added to a liquid crystal panel in a 3D or touch panel, the demand for further thinning is increased. However, in the case of a thin substrate, the process progress is limited due to weak physical properties such as warpage and rigidity.

In order to solve this problem, a method of attaching an auxiliary substrate to a thin glass substrate and then separating the thin glass substrate from the auxiliary substrate after completion of the process has been attempted. In particular, in the embodiment of the present invention, Is set to a smaller size than the auxiliary substrate to protect it from external impacts during the process, and the difference is set to at least a value smaller than the EBR (edge bead remove) region, thereby causing the deposition film to remain on the edge side of the thin glass substrate Can be prevented.

When a size relationship is established between the thin glass substrate and the auxiliary substrate, the auxiliary substrate is adhered to the thin glass substrate using electrostatic force, vacuum force, surface tension, or the like, and the fluorine- And an edge portion between the thin glass substrate and the auxiliary substrate is detached by a knife and an air is blown therebetween through an air knife to form an air gap between the glass substrate and the auxiliary substrate. Water, or air and water is sprayed to separate the auxiliary substrate from the liquid crystal panel in the cell state in which the process is completed.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of a method for manufacturing a lightweight thin liquid crystal display device according to the present invention will be described in detail with reference to the accompanying drawings.

1A and 1B are plan views schematically showing an auxiliary substrate and a thin glass substrate on which corner cuts are formed.

FIG. 2 is a plan view schematically showing a state in which the auxiliary substrate and the thin glass substrate shown in FIGS. 1A and 1B are attached to each other. FIG. 3 is a cross-sectional view of the auxiliary substrate and the thin glass Sectional view schematically showing a state in which the substrates are bonded together.

As described above, there are various factors that determine the thickness and weight of the liquid crystal display device. Among them, the color filter substrate or the array substrate made of glass is the heaviest component among the other components of the liquid crystal display device. Therefore, it is most effective to reduce the thickness and weight of the glass substrate in order to reduce the thickness and weight of the liquid crystal display device.

There is a method of reducing the thickness or weight of the glass substrate by etching the glass substrate or using a thin glass substrate. In the first method, the glass etching process is further performed after the completion of the cell to reduce the thickness thereof.

Therefore, in the embodiment of the present invention, an array process, a color filter process, and a cell process are performed using a thin glass substrate having a thickness of about 0.1 t to 0.4 t. At this time, So as to minimize the influence of the warpage of the thin glass substrate and to prevent breakage of the thin glass substrate during movement.

In this case, t stands for mm, 0.1t stands for a thickness of 0.1 mm, and 0.4 t stands for a thickness of 0.4 mm.

That is, when a thin glass substrate having a thickness of about 0.1 t to 0.4 t is introduced into a general liquid crystal display device manufacturing line, the occurrence of warpage is large and the substrate is severely deflected. Therefore, In addition, when the unit is loaded and unloaded in the unit process equipment, the occurrence of warpage occurs rapidly due to a small impact, resulting in frequent positional errors. As a result, failure failure increases due to collision, etc., .

Therefore, in the embodiment of the present invention, by attaching an auxiliary substrate having a thickness of 0.3 t to 0.7 t before putting a thin glass substrate of 0.1 t to 0.4 t into a manufacturing line, It is possible to prevent defects such as deflection of the substrate during the movement or the unit process from occurring due to the same or further improved flexural generation characteristics as the glass substrate having the thickness.

At this time, when the thin glass substrate and the auxiliary substrate are manufactured to have the same size, a cohesion margin of about 0.015 mm is generated when the substrates are aligned. The substrate protruded by the cohesion margin may be damaged by collision with a guide roller and a guide pin during the process.

Accordingly, in the embodiment of the present invention, the sizes of the thin glass substrate 100 and the auxiliary substrate 110 are set to be different from each other, as shown in the drawings.

At this time, the corners of the glass substrate 100 and the auxiliary substrate 110, which are thinly joined together and to which the plurality of liquid crystal panels 103 are allocated, are cut at a predetermined oblique angle, Quot; If such corner cuts are not formed on the thin glass substrate 100, residual foreign matter is formed due to penetration of organic materials such as photoresist.

Particularly, as at least one edge of the thin glass substrate 100 is further cut inward than the auxiliary substrate 110 in order to distinguish the direction and post-process, the edge portion of the auxiliary substrate 110 The region may be used as a push pin region E to which a push pin is applied to start the separation process of the auxiliary substrate 110. [

At this time, the thin glass substrate 100 according to the embodiment of the present invention should be made smaller in size than the auxiliary substrate 110 on the lower side so that it can be protected from external impact. That is, since the thin glass substrate 100 is thin, it should be formed to have a smaller size than the auxiliary substrate 110 because it is vulnerable to an external impact. The difference d between the thin glass substrate 100 and the auxiliary substrate 110, that is, the distance d between the thin glass substrate 100 and the auxiliary substrate 110, 0.0 > 0.015mm. ≪ / RTI >

In addition, the size difference d should be set at least smaller than the EBR region to prevent the deposition film from remaining on the edge side of the thin glass substrate 100.

For reference, the EBR region is an edge region where the photoresist applied for patterning the deposition film deposited on the thin glass substrate 100 is removed, and may be set to about 3 mm to 5 mm from the edge of the auxiliary substrate 110.

4A and 4B are cross-sectional views showing the result of photolithography (hereinafter referred to as a photo) process in the case where the difference in size between the thin glass substrate and the auxiliary substrate has a larger value than that in the EBR region.

4A and 4B, when the size difference d 'between the thin glass substrate 100 and the auxiliary substrate 110 has a larger value than the EBR region D, The photoresist film 150 coated on the film 140 is patterned to completely cover the edge of the thin glass substrate 100 on which the deposition film 140 is deposited.

As a result, when the deposition film 140 is patterned, the deposition film 140 is not etched on the edge side of the thin glass substrate 100. As a result, when the auxiliary substrate 110 is detached, There arises a problem that the semiconductor device 100 is damaged.

Further, there is a problem that the thickness of the photoresist film 150 where the align key is located becomes thick, and the key pattern is deformed.

5A and 5B are cross-sectional views showing the results of the photolithography process in the case where the difference in size between the thin glass substrate and the auxiliary substrate is smaller than that in the EBR region.

5A and 5B, when the size difference d "between the thin glass substrate 100 and the auxiliary substrate 110 is smaller than the EBR area D, The photoresist film 150 coated on the film 140 is patterned to expose the edges of the thin glass substrate 100 on which the deposition film 140 is deposited.

Accordingly, when the deposition film 140 is patterned, the deposition film 140 deposited on the edge side of the thin glass substrate 100 is completely removed.

Therefore, the difference in size between the thin glass substrate and the auxiliary substrate according to the embodiment of the present invention should be at least 0.015 mm in consideration of the cohesion margin, and in order to prevent the deposition film from remaining as described above, It should be set to a small value. That is, the size difference between the thin glass substrate and the auxiliary substrate should be at least 0.015 mm to 5 mm. This size difference can equally be applied not only to the four sides of the substrates, but also to the corner where the corner cut is made.

In this case, considering a process error of about ± 1 mm for the EBR region, the difference in size between the thin glass substrate and the auxiliary substrate may have a value between 0.015 mm and 2 mm.

On the other hand, since the thin glass substrate and the auxiliary substrate are mostly manufactured in the same manufacturing line, the influence of dimensional variation of the substrate is canceled, so that the dimensional variation of the substrate may not be considered.

However, even if the thin glass substrate and the auxiliary substrate are manufactured in different manufacturing lines or manufactured in the same manufacturing line, in the case where the dimensional variation of the substrate is different, the relation of the substrate size described above should be adjusted in consideration of the dimensional variation of the substrate .

Approximately the dimensional variation of the substrate will be about ± 0.5 mm and for one side it will be ± 0.25 mm.

Considering the dimensional fluctuation of such a substrate, the difference in size between the thin glass substrate and the auxiliary substrate may have a value between 0.5 mm and 1 mm, and this will be described in detail with reference to the drawings.

6 is a cross-sectional view schematically showing a state in which a thin glass substrate and an auxiliary substrate are bonded together when the thin glass substrate and the auxiliary substrate are designed to have the same size.

7A to 7F are cross-sectional views showing the thin glass substrate shown in FIG. 6 and showing whether or not the thin glass substrate is broken due to dimensional variations of the substrate.

The distance L shown in FIG. 6 represents the chamfer distance of the polishing surface formed by rounding the protrusions on the side surface generated when cutting (cutting) the lower auxiliary substrate 110, and has a value of about 0.3 mm have.

As shown in FIGS. 7A to 7F, when the thin glass substrate 100 and the auxiliary substrate 110 are designed to have the same size, NG (no good) is generated in consideration of the dimensional variation of the substrate .

Here, a case where the dimension variation of the thin glass substrate 100 and / or the auxiliary substrate 110 is smaller than the chamfer distance L of the auxiliary substrate 110 will be described as an example. Hereinafter, (Dv) indicates the case of one side.

7A, when the size of the auxiliary substrate 110 is increased by the dimensional variation value Dv due to the dimensional variation, the gap between the glass substrate 100 and the auxiliary substrate 110 (Dv) is maintained.

As another example, when the size of the auxiliary substrate 110 decreases by the dimensional variation value Dv or the size of the thin glass substrate 100 increases by the dimensional variation value Dv due to dimensional variation, As shown in FIGS. 7A and 7B, the thin glass substrate 100 protrudes from the auxiliary substrate 110 to the dimension variation value Dv, and NG is generated due to the impact damage.

As another example, when the size of the thin glass substrate 100 is reduced by the dimensional variation value Dv due to the dimensional variation, as shown in FIG. 7D, the thin glass substrate 100 and the auxiliary substrate 110 maintains the dimensional variation value Dv.

As another example, when the dimension of the auxiliary substrate 110 is reduced by the dimensional variation value Dv and the size of the thin glass substrate 100 is increased by the dimensional variation value Dv, As shown in FIG. 7E, since the thin glass substrate 100 protrudes from the auxiliary substrate 110 twice as much as the dimensional variation value Dv, NG is generated due to the impact breakage.

As another example, when the dimension of the auxiliary substrate 110 is increased by the dimensional variation value Dv and the size of the thin glass substrate 100 is decreased by the dimensional variation value Dv, The size difference between the thin glass substrate 100 and the auxiliary substrate 110 is maintained at about twice the dimension variation value Dv as shown in FIG.

In the case where the thin glass substrate and the auxiliary substrate are designed to have the same size, it can be seen that NG may occur in consideration of the dimensional variation of the substrate.

8 is a cross-sectional view schematically showing a state in which a thin glass substrate and an auxiliary substrate are bonded together when a thin glass substrate is designed to have a small size as compared with an auxiliary substrate.

Figs. 9A to 9F are cross-sectional views showing the thin glass substrate shown in Fig. 8 and showing whether or not the thin glass substrate is damaged due to dimensional variations of the substrate.

9A to 9F, even if the thin glass substrate 100 is designed to have a smaller size than the auxiliary substrate 110, differences in the degree of chamfering distance L may be considered as NG Can be generated.

9A, when the size of the auxiliary substrate 110 increases by the dimensional variation value Dv due to the dimensional variation, the gap between the glass substrate 100 and the auxiliary substrate 110, which is thin, The size difference is further increased by the dimensional variation value Dv in the original size difference (= L).

In another example, when the size of the auxiliary substrate 110 decreases by the dimensional variation value Dv or the size of the thin glass substrate 100 increases by the dimensional variation value Dv due to dimensional variation, 9C, the difference in size between the thin glass substrate 100 and the auxiliary substrate 110 is determined by subtracting the dimensional variation value Dv from the original size difference (= L), that is, only 0.05 mm It is possible to cause NG due to impact damage.

As another example, when the size of the thin glass substrate 100 is reduced by the dimensional variation value Dv due to the dimensional variation, as shown in FIG. 9D, the thin glass substrate 100 and the auxiliary substrate 110 is further increased by the dimensional variation value Dv in the original size difference (= L).

As another example, when the dimension of the auxiliary substrate 110 is reduced by the dimensional variation value Dv and the size of the thin glass substrate 100 is increased by the dimensional variation value Dv, As shown in FIG. 9E, the thin glass substrate 100 protrudes from the auxiliary substrate 110 by an amount obtained by subtracting the chamfering distance L from twice the dimension variation value Dv, .

As another example, when the dimension of the auxiliary substrate 110 is increased by the dimensional variation value Dv and the size of the thin glass substrate 100 is decreased by the dimensional variation value Dv, 9F, the size difference between the thin glass substrate 100 and the auxiliary substrate 110 is increased by twice the dimensional variation value Dv at the original size difference (= L).

Even if the thin glass substrate is designed to have a size smaller than that of the auxiliary substrate, it can be seen that NG may occur due to the dimensional variation of the substrate due to the difference in the degree of chamfering.

10 is a cross-sectional view schematically showing a state in which a thin glass substrate and an auxiliary substrate are adhered to each other when a thin glass substrate is designed to have a size as small as twice the dimension variation value as compared with the auxiliary substrate.

11A to 11F are cross-sectional views showing the thin glass substrate shown in FIG. 10 and showing whether or not the thin glass substrate is broken due to variations in substrate size.

11A, when the dimension of the auxiliary substrate 110 is increased by the dimension variation value Dv due to the dimensional variation, the distance between the glass substrate 100 and the auxiliary substrate 110 Is further increased by the dimensional variation value Dv in the original size difference (= 2Dv).

As another example, when the size of the auxiliary substrate 110 decreases by the dimensional variation value Dv or the size of the thin glass substrate 100 increases by the dimensional variation value Dv due to dimensional variation, The size difference between the thin glass substrate 100 and the auxiliary substrate 110 maintains the dimension variation value Dv as shown in FIGS.

As another example, when the size of the thin glass substrate 100 is reduced by the dimension variation value Dv due to the dimensional variation, as shown in FIG. 11D, the thin glass substrate 100 and the auxiliary substrate 110 is further increased by the dimensional variation value Dv in the original size difference (= 2Dv).

As another example, when the dimension of the auxiliary substrate 110 is reduced by the dimensional variation value Dv and the size of the thin glass substrate 100 is increased by the dimensional variation value Dv, 11E, the difference in size between the thin glass substrate 100 and the auxiliary substrate 110 maintains a degree obtained by subtracting the dimension variation value Dv from the chamfer distance L. [

As another example, when the dimension of the auxiliary substrate 110 is increased by the dimensional variation value Dv and the size of the thin glass substrate 100 is decreased by the dimensional variation value Dv, As shown in FIG. 11F, the difference in size between the thin glass substrate 100 and the auxiliary substrate 110 is maintained at about four times the dimensional variation value Dv.

When the size relationship between the thin glass substrate and the auxiliary substrate is set as described above, an auxiliary substrate is attached to the thin glass substrate, and the process is performed to manufacture a liquid crystal display device, which will be described in detail with reference to the drawings.

12 is a flowchart schematically showing a method of manufacturing a lightweight thin liquid crystal display device according to an embodiment of the present invention.

12 illustrates a method of manufacturing a liquid crystal display device in a case where a liquid crystal layer is formed by a liquid crystal dropping method. However, the present invention is not limited thereto, and the present invention can be applied to a liquid crystal display The present invention can be applied to a manufacturing method of a liquid crystal display device.

The manufacturing process of the liquid crystal display device can be largely divided into a driving element array process for forming driving elements on the lower array substrate, a color filter process for forming a color filter on the upper color filter substrate, and a cell process.

First, an auxiliary substrate of about 0.3 t to 0.7 t is attached to the above-mentioned thin glass substrate of 0.1 t to 0.4 t before a thin glass substrate of 0.1 t to 0.4 t is put into a manufacturing line of an array process and a color filter process (S101). However, the present invention is not limited to the thicknesses of the thin glass substrate and the auxiliary substrate.

At this time, as described above, the size difference between the thin glass substrate and the auxiliary substrate according to the embodiment of the present invention should be at least 0.015 mm to 5 mm. This size difference can equally be applied not only to the four sides of the substrates, but also to the corner where the corner cut is made.

In this case, considering a process error of about ± 1 mm for the EBR region, the difference in size between the thin glass substrate and the auxiliary substrate may have a value between 0.015 mm and 2 mm.

In addition, in the case where the thin glass substrate and the auxiliary substrate are manufactured in different manufacturing lines or manufactured in the same manufacturing line, in the case where the dimensional variation of the substrate is different, the dimensional variation of the substrate should be further taken into consideration. The difference in size between the auxiliary substrates may have a value between 0.5 mm and 1 mm.

The adhesion between the thin glass substrate and the auxiliary substrate having such a size relationship can be achieved by bringing the two substrates into contact with each other in a vacuum state. In this case, the combining force between the two substrates can be estimated by electrostatic force, vacuum force, surface tension or the like.

At this time, in the embodiment of the present invention, plasma processing using fluorine or the like or a concavo-convex pattern is formed on the auxiliary substrate to relax the combining force, thereby facilitating the detachment from the thin glass substrate. Then, the auxiliary substrate detached from the thin glass substrate can be attached to a new glass substrate and recycled for a new process.

The method of treating the plasma on the auxiliary substrate may be a partial treatment method in addition to the front treatment, and the same can be applied to the case of forming the irregular pattern.

However, the present invention is not limited to the above-described method of attaching the auxiliary substrate. The present invention can be performed in a vacuum state without an adhesive or a surface treatment for attaching the auxiliary substrate to the thin glass substrate, A vacuum force, a van der Waals force, a surface tension, or the like in vacuum.

After the auxiliary substrate is attached to the thin glass substrate in this way, the thin glass substrate for the array substrate to which the above-described auxiliary substrate is attached (hereinafter referred to as an array substrate for convenience of explanation) is arrayed on the array substrate A plurality of gate lines and data lines defining a pixel region are formed, and a thin film transistor, which is a driving element connected to the gate line and the data line, is formed in each of the pixel regions (S102). In addition, a pixel electrode connected to the thin film transistor through the array process and driving the liquid crystal layer as a signal is applied through the thin film transistor is formed.

Further, a thin glass substrate for a color filter substrate (hereinafter, referred to as a color filter substrate for convenience of description) to which the above-described auxiliary substrate is attached is provided with red, green and blue sub-color filters And a common electrode are formed (S103). At this time, when an in-plane switching (IPS) liquid crystal display device is manufactured, the common electrode is formed on the array substrate on which the pixel electrode is formed through the array process.

Then, after aligning films are printed on the color filter substrate and the array substrate, alignment control force or surface fixing force (that is, pretilt angle and orientation) is applied to the liquid crystal molecules of the liquid crystal layer formed between the color filter substrate and the array substrate Direction) of the alignment film is rubbed (S104, S105).

A sealing material is applied to the rubbed color filter substrate to form a predetermined seal pattern, and a liquid crystal layer is formed by dropping liquid crystal on the array substrate (S106, S107).

On the other hand, the color filter substrate and the array substrate are formed on a large-sized mother substrate. In other words, a plurality of panel regions are formed on each of the large-sized mother substrate, and a thin film transistor or color filter layer serving as a driving element is formed on each of the panel regions.

At this time, the dropping system dispenses liquid crystal to an image display area of a large-area first mother substrate on which a plurality of array substrates are arranged or a second mother substrate on which a plurality of color filter substrates are arranged using a dispenser, And the liquid crystal is uniformly distributed over the entire image display area by the pressure for attaching the first and second mother substrates to each other, thereby forming a liquid crystal layer.

Therefore, when the liquid crystal layer is formed on the liquid crystal panel through the dropping method, the seal pattern must be formed in a closed pattern surrounding the periphery of the pixel region so as to prevent the liquid crystal from leaking out of the image display region.

The dropping method can drop the liquid crystal in a shorter time than the vacuum injection method, and even when the liquid crystal panel is enlarged, the liquid crystal layer can be formed very quickly. In addition, since only a necessary amount of liquid crystal is dropped onto the substrate, an increase in the price of the liquid crystal panel due to disposal of expensive liquid crystal such as a vacuum injection method is prevented, thereby enhancing the price competitiveness of the product.

Thereafter, the first mother substrate and the second mother substrate are bonded together by applying a pressure in a state in which the first mother substrate and the second mother substrate, to which the liquid crystal is dropped and the sealing material is coated, are aligned, The liquid crystal dropped by application of pressure is uniformly spread over the liquid crystal panel (S108). By this process, a plurality of liquid crystal panels having a liquid crystal layer are formed on the first and second large-sized mother substrates, and the first and second large-sized mother substrates on which the plurality of liquid crystal panels are formed are separated from the auxiliary substrate Then, the liquid crystal panel is processed, cut and separated into a plurality of liquid crystal panels, and each liquid crystal panel is inspected to manufacture a liquid crystal display device (S109, S110).

At this time, for example, the auxiliary substrate can be detached from the liquid crystal panel by detaching the edge portion between the auxiliary substrate and the thin glass substrate with a knife, and injecting air, water, air, and water therebetween through the air knife .

While a great many are described in the foregoing description, it should be construed as an example of preferred embodiments rather than limiting the scope of the invention. Therefore, the invention should not be construed as limited to the embodiments described, but should be determined by equivalents to the appended claims and the claims.

100: thin glass substrate 110: auxiliary substrate
140: Deposition film 150: Photoresist film

Claims (10)

Providing first and second auxiliary substrates and thin first and second mother substrates having a smaller size than the first and second auxiliary substrates;
Attaching the first and second auxiliary substrates to the first and second thin mother boards, respectively;
Cutting the four corners of each of the first and second auxiliary boards and the first and second mother boards at an oblique angle to form a corner cut;
Performing an array process on the first mother substrate to which the first auxiliary substrate is attached;
Performing a color filter process on a second mother substrate to which the second auxiliary substrate is attached;
Attaching a first mother board on which the array process is performed and a second mother board on which the color filter process is performed; And
Separating the first and second auxiliary substrates from the first and second bonded mother boards,
The difference in size between the thin first and second mother substrates and the first and second auxiliary substrates is at least a value between 0.015 mm and 0.5 mm,
Wherein at least one corner of the first and second mother substrates is cut in a further inward direction as compared with the edges of the first and second auxiliary substrates so that the edge portions of the first and second auxiliary substrates are exposed, A method of manufacturing a thin liquid crystal display device. delete The liquid crystal display according to claim 1, wherein the difference in size between the thin first and second mother substrate and the first and second auxiliary substrates is not only a four-sided substrate but also a lightweight thin liquid crystal display Device manufacturing method. delete 2. The apparatus according to claim 1, wherein the difference in size between the thin first and second mother substrate and the first and second auxiliary substrates is greater than at least 0.015 mm in consideration of cohesion margin, (Edge bead removal) region in order to prevent the deposition film from remaining on the edge side of the EBR (edge bead removal) region. [6] The method of claim 5, wherein the EBR region is an edge region where the photoresist applied to pattern the deposition film deposited on the thin first mother substrate or the second mother substrate is removed, Is set at 3 mm to 5 mm from the edge of the liquid crystal display panel. [7] The method of claim 5, wherein a difference in size of about ± 1 mm with respect to the EBR region is taken into consideration, and a size difference between the first and second mother substrates and the first and second auxiliary substrates is between 0.015 mm and 2 mm Lt; RTI ID = 0.0 > 1, < / RTI > 6. The liquid crystal display device according to claim 5, wherein the size difference between the first and second mother substrates and the first and second auxiliary substrates is between 0.5 mm and 1 mm, A method of manufacturing a display device. The method according to claim 1, wherein the thin first and second mother substrates have a thickness of 0.1 mm to 0.4 mm. The method of claim 1, wherein the first and second auxiliary substrates have a thickness of 0.3 mm to 0.7 mm.

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