KR102044418B1 - Method of fabricating lightweight and thin liquid crystal display device - Google Patents
Method of fabricating lightweight and thin liquid crystal display device Download PDFInfo
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- KR102044418B1 KR102044418B1 KR1020120126902A KR20120126902A KR102044418B1 KR 102044418 B1 KR102044418 B1 KR 102044418B1 KR 1020120126902 A KR1020120126902 A KR 1020120126902A KR 20120126902 A KR20120126902 A KR 20120126902A KR 102044418 B1 KR102044418 B1 KR 102044418B1
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
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Abstract
In the method of manufacturing a light weight thin liquid crystal display device according to the present invention, when an auxiliary substrate is used to process a thin glass substrate, HF or plasma treatment or an inorganic insulating film or a transparent oxide film is deposited on the surface of the auxiliary substrate to obtain surface roughness. In order to easily separate the auxiliary substrate from the liquid crystal panel in which the process is completed and bonded by increasing the surface roughness, the first and second auxiliary substrates and the thin first and second mother substrates are provided. Doing; Depositing a transparent oxide film on surfaces of the first and second auxiliary substrates; Crystallizing the transparent oxide film by performing heat treatment on the first and second auxiliary substrates on which the transparent oxide film is deposited; Attaching first and second auxiliary substrates on which the crystallized transparent oxide film is formed to each of the thin first and second mother substrates; Performing a color filter process on the first mother substrate to which the first auxiliary substrate is attached; Performing an array process on a second mother substrate to which the second auxiliary substrate is attached; Bonding the second mother substrate subjected to the array process and the first mother substrate subjected to the color filter process; And separating the first and second auxiliary substrates from the bonded first and second mother substrates.
Description
The present invention relates to a manufacturing method of a liquid crystal display device, and more particularly, to a manufacturing method of a light weight thin liquid crystal display device.
In recent years, as the society enters a full-scale information age, the display field for processing and displaying a large amount of information has been rapidly developed, and recently, a thin film transistor (Thin) having excellent performance of light weight, thinness, and low power consumption has recently been developed. Film Transistor (TFT) Liquid Crystal Display (LCD) has been developed to replace the existing cathode ray tube (CRT).
The liquid crystal display device is largely composed of a color filter substrate and an array substrate, and a liquid crystal layer formed between the color filter substrate and the array substrate.
The color filter substrate distinguishes between a color filter composed of red (R), green (G), and blue (B) colors and the sub color filter and transmits the liquid crystal layer. It consists of a black matrix that blocks light and a transparent common electrode that applies a voltage to the liquid crystal layer.
The array substrate has gate lines and data lines arranged vertically and horizontally to define pixel regions. In this case, a thin film transistor as a switching element is formed in an intersection region of the gate line and the data line, and a pixel electrode is formed in each pixel region.
The color filter substrate and the array substrate configured as described above are joined to face each other by sealants formed on the outer side of the image display area to form a liquid crystal panel. The combination of the color filter substrate and the array substrate is the color filter substrate or the array substrate. It is made through a bonding key formed on the substrate.
Since the liquid crystal display is particularly used in portable electronic devices, it is possible to improve the portability of the electronic device only by reducing its size and weight. Moreover, in recent years, as the large-area liquid crystal display device is manufactured, the demand for such a light weight and a thin film becomes more intense.
There may be various ways to reduce the thickness or weight of the liquid crystal display, but there are limitations in reducing the essential components of the liquid crystal display in terms of its structure and current technology. Moreover, since these essential components are small in weight, it is very difficult to reduce the weight or weight of the entire liquid crystal display by reducing the weight of these essential components.
Therefore, the method of reducing the thickness and weight of the liquid crystal display device by reducing the thickness of the color filter substrate and the array substrate constituting the liquid crystal panel has been actively researched. The substrate is bent or broken during the process.
In order to solve this problem, a method of attaching an auxiliary substrate to a thin glass substrate and proceeding a process and then separating the thin glass substrate and the auxiliary substrate after the process is completed has been attempted. In this case, an adhesive is applied by attaching the auxiliary substrate to the thin glass substrate. There is a method of bonding directly in the air without using or using a medium.
In this case, the method of using the adhesive is not easy to remove because the adhesive should be removed when the auxiliary substrate is separated, or the adhesive strength of the adhesive should be reduced enough to separate the auxiliary substrate.
The method of direct bonding in the atmosphere is mainly caused by the OH-functional group adsorbed on the surface of the hydrophilic glass, and after completion of the process as the hydrogen bond formed by the OH-functional period attraction force is changed to covalent bond by high temperature during the process. The adhesion between the boards is increased, so separation is not easy. That is, in the method of directly bonding between substrates at atmospheric pressure, OH-functional groups are adsorbed on the surface of the hydrophilic glass, and hydrogen bonding is formed at the bonding interface due to the attraction of the OH-functional period. Such hydrogen bonds form covalent bonds at high temperatures of about 300 ° C., thereby increasing the bonding strength between the substrates.
In addition, there is a problem that the recycling efficiency of the auxiliary substrate is reduced due to damage of the surface of the auxiliary substrate by the chemical during the process. In other words, in order to increase the efficiency of using the auxiliary substrate, the separated auxiliary substrate should be recycled after the completion of the process, and the edge surface of the auxiliary substrate may be exposed to the outside and be damaged by chemicals during the process, making it difficult to recycle.
The present invention is to solve the above problems, in the case of using the auxiliary substrate for the progress of the process of the thin glass substrate, a light weight that can easily separate the auxiliary substrate from the liquid crystal panel of the cell state bonded to the process is completed An object of the present invention is to provide a method of manufacturing a thin liquid crystal display device.
Another object of the present invention is to provide a method for manufacturing a lightweight thin liquid crystal display device which can prevent breakage of a thin glass substrate when the auxiliary substrate is separated.
It is another object of the present invention to provide a method for manufacturing a lightweight thin liquid crystal display device which can prevent damage to the surface of an auxiliary substrate by chemicals during the process.
Other objects and features of the present invention will be described in the configuration and claims of the invention described below.
In order to achieve the above object, a method for manufacturing a lightweight thin liquid crystal display device of the present invention comprises the steps of providing a first, a second auxiliary substrate and a thin first, second mother substrate; Depositing a transparent oxide film on surfaces of the first and second auxiliary substrates; Crystallizing the transparent oxide film by performing heat treatment on the first and second auxiliary substrates on which the transparent oxide film is deposited; Attaching first and second auxiliary substrates on which the crystallized transparent oxide film is formed to each of the thin first and second mother substrates; Performing a color filter process on the first mother substrate to which the first auxiliary substrate is attached; Performing an array process on a second mother substrate to which the second auxiliary substrate is attached; Bonding the second mother substrate subjected to the array process and the first mother substrate subjected to the color filter process; And separating the first and second auxiliary substrates from the bonded first and second mother substrates.
In this case, the transparent oxide film is characterized in that it comprises indium tin oxide (ITO).
At this time, the ITO is characterized in that the content of SnO 2 has a value of 0 to 15%.
The transparent oxide film is characterized in that the deposition to 50 ~ 1000Å thickness.
The transparent oxide film is characterized in that the deposition at a temperature of room temperature ~ 400 ℃.
The heat treatment is characterized in that proceeding at a temperature of 100 ℃ ~ 500 ℃.
The crystallized transparent oxide film is characterized in that the surface roughness has a value of 0.25nm ~ 10.0nm.
And separating the first and second auxiliary substrates from the bonded first and second mother substrates, and then cutting and cutting the first and second auxiliary substrates into a plurality of liquid crystal panels.
In addition, another method for manufacturing a lightweight thin liquid crystal display device of the present invention includes the steps of providing a first and a second auxiliary substrate and a thin first and second mother substrate; HF or plasma treatment on the surface of the first and second auxiliary substrates; Attaching the HF or plasma treated first and second auxiliary substrates to the thin first and second mother substrates, respectively; Performing a color filter process on the first mother substrate to which the first auxiliary substrate is attached; Performing an array process on a second mother substrate to which the second auxiliary substrate is attached; Bonding the second mother substrate subjected to the array process and the first mother substrate subjected to the color filter process; And separating the first and second auxiliary substrates from the bonded first and second mother substrates.
At this time, the first and second sub-substrate surface is treated with HF or dry etching using a fluorine gas of CF 4 , C 3 F 8 , NH 3 or SF 6 characterized in that to proceed.
In this case, the first and second auxiliary substrates are characterized in that the HF treatment or dry etching using fluorine gas so that the surface roughness has a value of 0.25nm ~ 2.0nm.
N 2 gas plasma treatment on the surface of the first and second auxiliary substrates.
In addition, another method for manufacturing a lightweight thin liquid crystal display device of the present invention comprises the steps of providing a first, a second auxiliary substrate and a thin first, second mother substrate; Depositing an inorganic insulating film of a silicon oxide film or a silicon nitride film on surfaces of the first and second auxiliary substrates; Attaching first and second auxiliary substrates on which the inorganic insulating layer is deposited to each of the thin first and second mother substrates; Performing a color filter process on the first mother substrate to which the first auxiliary substrate is attached; Performing an array process on a second mother substrate to which the second auxiliary substrate is attached; Bonding the second mother substrate subjected to the array process and the first mother substrate subjected to the color filter process; And separating the first and second auxiliary substrates from the bonded first and second mother substrates.
At this time, the inorganic insulating film is characterized in that the deposition to 100 ~ 1000Å thickness.
As described above, in the method of manufacturing a light weight thin liquid crystal display device according to the present invention, when the auxiliary substrate is used to process the thin glass substrate, the surface of the auxiliary substrate is subjected to HF or plasma treatment, or an inorganic insulating film or a transparent oxide film. By depositing and increasing the surface roughness (surface roughness) is completed the process can be easily separated from the auxiliary substrate from the liquid crystal panel of the bonded cell state. Accordingly, the cost and time used for the separation of the auxiliary substrate can be reduced, and the breakage of the substrate can be prevented during the separation of the auxiliary substrate, thereby improving the yield.
In addition, the method for manufacturing a lightweight thin liquid crystal display device according to the present invention can recycle the separated auxiliary substrate, thereby providing an effect of increasing the utility of the auxiliary substrate.
In addition, the method for manufacturing a light weight thin liquid crystal display device according to the present invention can implement a light weight thin liquid crystal display device using such a thin glass substrate, which can reduce the thickness or weight of a television or monitor model and a portable electronic device. Provide effect.
1A to 1D are perspective views sequentially illustrating a part of a process of a method of manufacturing a lightweight thin liquid crystal display device according to a first embodiment of the present invention.
2A to 2D are perspective views sequentially illustrating a part of processes of a method of manufacturing a lightweight thin liquid crystal display device according to a second embodiment of the present invention.
3A to 3D are perspective views sequentially illustrating a part of processes of a method of manufacturing a lightweight thin liquid crystal display device according to a third embodiment of the present invention.
4A to 4E are perspective views sequentially illustrating a part of processes of a method of manufacturing a lightweight thin liquid crystal display device according to a fourth embodiment of the present invention.
5A and 5B are photographs showing, for example, a surface of an auxiliary substrate separated from a liquid crystal panel.
6 is a flowchart schematically illustrating a method of manufacturing a lightweight thin liquid crystal display device according to the present invention;
7A to 7G are perspective views sequentially illustrating a method for manufacturing a lightweight thin liquid crystal display device according to the present invention.
Recently, as the use of liquid crystal display devices has been diversified and design aspects have been emphasized, interest in lightweight thin liquid crystal display devices has also increased, and interest in thinning substrates, which occupies the largest portion of the thickness of liquid crystal panels, has also increased. In addition, in 3D or touch panels, a retarder or a touch function protective substrate is added to the liquid crystal panel, thereby increasing the demand for thinning. However, in the case of thin substrates, there is a limitation in the process progress due to weakening of physical properties such as bending and rigidity.
In order to solve this problem, a method of separating the thin glass substrate and the auxiliary substrate after the process is completed by attaching the auxiliary substrate to the thin glass substrate and the process is completed, in particular, in the present invention, the vacuum force, van der Waals force (van The process is performed by attaching an auxiliary substrate to a thin glass substrate using der Waals' force, electrostatic force, or molecular bonding, and performing HF or plasma treatment or depositing an inorganic insulating film or a transparent oxide film on the surface of the auxiliary substrate. It is characterized in that the auxiliary substrate is easily separated from the liquid crystal panel in the cell state in which the process is completed by mitigating the adhesion.
Hereinafter, with reference to the accompanying drawings it will be described in detail a preferred embodiment of a method for manufacturing a lightweight thin liquid crystal display device according to the present invention can be easily carried out by those skilled in the art.
Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various different forms, only the present embodiments to make the disclosure of the present invention complete, and common knowledge in the art to which the present invention pertains. It is provided to fully inform the person having the scope of the invention, which is defined only by the scope of the claims. Like reference numerals refer to like elements throughout.
The manufacturing process of the liquid crystal display device may be classified into a driving element array process of forming a driving element on a lower array substrate, a color filter process of forming a color filter on an upper color filter substrate, and a cell process.
As described above, there are various factors that determine the thickness and weight of the liquid crystal display device. Among them, the color filter substrate or the array substrate made of glass is the heaviest component among other components of the liquid crystal display device. Therefore, in order to reduce the thickness or weight of the liquid crystal display device, it is most efficient to reduce the thickness or weight of the glass substrate.
As a method of reducing the thickness or weight of the glass substrate, there is a method of etching the glass substrate to reduce its thickness or using a thin glass substrate. The first method is to reduce the thickness by further glass etching process after the completion of the cell, there are disadvantages of the defects and cost increase during the etching process.
In the present invention, a thin glass substrate having a thickness of about 0.1t to 0.4t is used to perform an array process, a color filter process, and a cell process. In this case, the thin glass substrate is attached to an auxiliary substrate to perform a thin process. Minimize the influence of the bending of the glass substrate and characterized in that the thin glass substrate is not damaged during the movement. In this case, t means mm, and 0.1t means a thickness of 0.1mm and 0.4t means a thickness of 0.4mm. In the following description, mm is expressed as t for convenience of explanation.
That is, a thin glass substrate having a thickness of about 0.1t to 0.4t causes a large warpage when the glass substrate is put into a general liquid crystal display manufacturing line, which causes severe deflection of the substrate. When loading and unloading the unit process equipment, there is a problem that warpage occurs suddenly even by a small impact, so that the positional error occurs frequently. .
Accordingly, in the present invention, the auxiliary substrate is attached before the thin glass substrate of 0.1t to 0.4t is introduced into the manufacturing line, thereby generating the same or improved warpage as the glass substrate having a thickness of about 0.7t used for a general liquid crystal display device. It is characterized in that it is possible to prevent the occurrence of problems, such as the substrate sag during the movement or unit process by having a characteristic.
1A to 1D are perspective views sequentially illustrating a part of a process of a method of manufacturing a lightweight thin liquid crystal display device according to a first embodiment of the present invention, and showing, for example, a bonding and detaching process of a thin glass substrate and an auxiliary substrate. have.
1A to 1D illustrate the bonding strength between the auxiliary substrate and the thin glass substrate by increasing the surface roughness by treating HF on the front surface of the auxiliary substrate or by performing a dry etch using fluorine (F) gas. It is characterized in that to facilitate the desorption between the auxiliary substrate and the thin glass substrate.
As shown in FIG. 1A, the
At this time, the present invention is not limited to the thickness of the thin glass substrate and the
Next, as shown in FIG. 1B, HF is treated on the
As such, when HF is processed on the
At this time, the surface roughness of the
Next, as shown in Figure 1c, to the
The process panel in which the
In addition, the
In this case, the
Thereafter, a color filter process or an array process is performed on the
In addition, after the predetermined process is completed, as shown in FIG. 1D, the
That is, when the bonding force between the
In addition, the
At this time, the method of processing the HF on the auxiliary substrate may have a partial processing method in addition to the above-described front surface treatment.
In addition, by changing the chemical properties of the surface of the auxiliary substrate through the N 2 gas plasma treatment in addition to the above-described HF treatment method, it is possible to weaken the bonding force due to contact with the thin glass substrate, which is the following invention It will be described in detail through the second embodiment of the.
2A to 2D are perspective views sequentially illustrating a part of a process of a method for manufacturing a light weight thin liquid crystal display device according to a second embodiment of the present invention, and showing, for example, a bonding and detaching process of a thin glass substrate and an auxiliary substrate. have.
2A to 2D illustrate that the chemical property of the surface of the auxiliary substrate is changed through N 2 gas plasma treatment to alleviate the adhesion between the auxiliary substrate and the thin glass substrate, thereby desorption between the auxiliary substrate and the thin glass substrate. It is characterized in that to facilitate.
As shown in FIG. 2A, the
In this case, the present invention is not limited to the thicknesses of the thin glass substrate and the
Next, as shown in FIG. 2B, the N 2 gas plasma is treated on the
Due to the N 2 gas plasma treatment, the chemical properties of the
Next, as shown in FIG. 2C, the N 2 gas plasma-treated
The
In addition, the
In this case, the
Thereafter, a color filter process or an array process is performed on the
In addition, after the predetermined process is completed, as shown in FIG. 2D, the
That is, when the bonding force between the
In addition, the
In this case, a method of treating the N 2 gas plasma on the auxiliary substrate may include a partial processing method in addition to the above-described front surface treatment.
In addition, by depositing an inorganic insulating film of a silicon oxide film or a silicon nitride film on the surface of the auxiliary substrate in addition to the above-described method of processing the N 2 gas plasma, it is possible to weaken the bonding force due to contact with the thin glass substrate, which is the following invention The third embodiment of the present invention will be described in detail.
3A to 3D are perspective views sequentially illustrating a part of a process of a method for manufacturing a lightweight thin liquid crystal display device according to a third exemplary embodiment of the present invention, and show a bonding and detaching process of a thin glass substrate and an auxiliary substrate. have.
3A to 3D illustrate an inorganic insulating film of a silicon oxide film or a silicon nitride film deposited on the entire surface of the auxiliary substrate to ease the adhesion between the auxiliary substrate and the thin glass substrate to facilitate detachment between the auxiliary substrate and the thin glass substrate. Characterized in that.
As shown in FIG. 3A, before the thin glass substrate having the thickness of 0.1t to 0.4t is introduced into the manufacturing process of the array process and the color filter process, the
In this case, the present invention is not limited to the thickness of the thin glass substrate and the
Next, as shown in FIG. 3B, an inorganic insulating
As the hydrogen bond between the thin glass substrate and the
Next, as shown in FIG. 3C, the
In this case, the
Thereafter, a color filter process or an array process is performed on the
In addition, after the predetermined process is completed, as shown in FIG. 3D, the
In addition, the
In this case, a method of depositing an inorganic insulating film on the auxiliary substrate may include a partial deposition method in addition to the above-mentioned front deposition.
In addition to the above-described method of depositing an inorganic insulating film on the auxiliary substrate, a transparent oxide film may be deposited on the surface of the auxiliary substrate to increase surface roughness and to weaken the bonding force due to contact with the thin glass substrate. The fourth embodiment of the present invention will be described in detail.
4A to 4E are perspective views sequentially illustrating a part of a process of a method for manufacturing a lightweight thin liquid crystal display device according to a fourth exemplary embodiment of the present invention. For example, the bonding and desorption process of the thin glass substrate and the auxiliary substrate will be described. have.
At this time, Figures 4a to 4e is to deposit a transparent oxide film such as ITO (Indium Tin Oxide) on the entire surface of the auxiliary substrate to relax the adhesion between the auxiliary substrate and the thin glass substrate to remove the separation between the auxiliary substrate and the thin glass substrate It is characterized in that to facilitate.
As shown in FIG. 4A, the
In this case, as described above, the present invention is not limited to the thicknesses of the thin glass substrate and the
Next, as shown in FIG. 4B, a
In this case, the
At this time, the condition of the
In this case, the
The specific resistance may have a value of 10 −1 to 10 −8 Ωm, and the content of SnO 2 may have a value of 0 to 15%. In the case of general ITO, the content of SnO 2 is 10%, the compositional change of SnO 2 content is 0-15%, and there is no significant change in the transmittance or the resistivity characteristics, and the surface roughness also has a larger value than glass.
Next, as shown in FIG. 4C, a predetermined heat treatment is performed on the
In this case, the heat treatment may be performed at a temperature of 100 ℃ ~ 500 ℃, as a result, the surface roughness of the crystallized transparent oxide film 415 'may have a value of 0.25nm ~ 10.0nm.
By controlling the heat treatment temperature, the surface roughness of the crystallized
Next, as shown in FIG. 4D, the
The
In addition, the
In this case, the
Thereafter, a color filter process or an array process is performed on the
After the completion of the predetermined process, as shown in FIG. 4E, the
That is, when the bonding force between the
For reference, in the case of heat treatment after bonding between glass, the bonding strength is measured to be about 0.7 kgf, whereas in the fourth embodiment of the present invention, the surface roughness is increased by crystallization of the
In addition, the
In this case, the method of depositing a transparent oxide film on the auxiliary substrate may have a partial deposition method in addition to the above-mentioned full surface deposition.
As described above, according to the fourth embodiment of the present invention, the
That is, in the fourth exemplary embodiment of the present invention, the
In the case where the
That is, when the
Meanwhile, ITO crystallized using ITO as the
5A and 5B are photographs showing, for example, a surface of an auxiliary substrate separated from a liquid crystal panel, and are scanning electron microscope images of the surface of the auxiliary substrate.
5A is a scanning micrograph of the surface of the auxiliary substrate when the ITO is not deposited on the auxiliary substrate, and FIG. 5B is a scanning microscope picture of the surface of the auxiliary substrate when the crystallized ITO is formed on the auxiliary substrate.
Referring to the drawings, when ITO is not deposited on the auxiliary substrate, the surface of the auxiliary substrate is damaged by chemicals during the process, whereas when crystallized ITO is formed on the auxiliary substrate, the surface of the auxiliary substrate is crystallized by the ITO. It can be seen that this chemical can be protected.
Hereinafter, a method of manufacturing the light weight thin liquid crystal display device according to the present invention will be described in detail with reference to the bonding and desorption process of the thin glass substrate and the auxiliary substrate according to the fourth embodiment of the present invention. However, the present invention is not limited to the bonding and desorption process of the thin glass substrate and the auxiliary substrate according to the fourth embodiment.
6 is a flowchart schematically illustrating a method of manufacturing a lightweight thin liquid crystal display device according to the present invention.
7A to 7D are perspective views sequentially illustrating a method of manufacturing a lightweight thin liquid crystal display device according to the present invention.
6 illustrates a method of manufacturing a liquid crystal display device when the liquid crystal layer is formed by the liquid crystal dropping method, for example. However, the present invention is not limited thereto, and the present invention is a liquid crystal injection method. It is also applicable to the manufacturing method of a liquid crystal display device in this case.
As described above, the manufacturing process of the liquid crystal display device may be classified into a driving element array process of forming a driving element on a lower array substrate, a color filter process of forming a color filter on an upper color filter substrate, and a cell process.
At this time, in the present invention, an array process, a color filter process, and a cell process are performed using a thin glass substrate having a thickness of about 0.1t to 0.4t. In particular, the thin glass substrate is attached to an auxiliary substrate. This minimizes the effect of the warp of the thin glass substrate and is characterized in that there is no breakage of the thin glass substrate during movement.
That is, in the present invention, by attaching the auxiliary substrate before inserting the thin glass substrate of 0.1t to 0.4t into the manufacturing line, the same or improved warpage as the glass substrate having the thickness of about 0.7t used in the general liquid crystal display device It is characterized in that it can prevent the occurrence of problems such as substrate sag during the movement or unit process progress by having a generation characteristic.
First, as illustrated in FIG. 7A,
In this case, for convenience of description, the
As described above, the present invention is not limited to the thicknesses of the thin glass substrates and the
Next, as illustrated in FIG. 7B, the
In this case, the
In this case, the conditions of the
In this case, as described above, the
The specific resistance may have a value of 10 −1 to 10 −8 Ωm, and the content of SnO 2 may have a value of 0 to 15%. In the case of general ITO, the content of SnO 2 is 10%, the compositional change of SnO 2 content is 0-15%, and there is no significant change in the transmittance or the resistivity characteristics, and the surface roughness also has a larger value than glass.
Next, as shown in FIG. 7C, a predetermined heat treatment is performed on the
At this time, the heat treatment may be performed at a temperature of 100 ℃ ~ 500 ℃, as a result the surface roughness of the crystallized transparent oxide film (415a ', 415b') may have a value of 0.25nm ~ 10.0nm.
By controlling the heat treatment temperature, the surface roughness of the crystallized
Next, as shown in FIG. 7D, the
In this case, the
Thereafter, a color filter process or an array process is performed on each of the
That is, after the
In addition, the
Subsequently, after the alignment films are printed on the
A sealing material is applied to the rubbed
On the other hand, the
In this case, the dropping method uses a dispenser to form a liquid crystal in an image display area of a first mother substrate having a large area where a plurality of
Therefore, when the liquid crystal layer is formed on the liquid crystal panel by a dropping method, a failure turn should be formed in a closed pattern surrounding the outer portion of the pixel region so as to prevent the liquid crystal from leaking out of the image display region.
The dropping method can drop the liquid crystal in a short time compared to the vacuum injection method, and can form the liquid crystal layer very quickly even when the liquid crystal panel is enlarged. In addition, since only the required amount of liquid crystal is dropped on the substrate, the price competitiveness of the liquid crystal panel due to the disposal of the expensive liquid crystal is prevented, such as vacuum injection, thereby strengthening the product's price competitiveness.
Subsequently, as shown in FIG. 7E, the first mother substrate and the second mother substrate are applied by the sealing material by applying pressure while the liquid crystal is dropped and the first mother substrate and the second mother substrate on which the sealing material is applied are aligned. And the liquid crystals dropped by the application of pressure are uniformly spread over the entire liquid crystal panel (S110). By such a process, a plurality of liquid crystal panels in which a liquid crystal layer is formed are formed on the first and second mother substrates having a large area.
As shown in FIGS. 7F and 7G, the
As a detachable method that can be applied to the auxiliary substrates (410a, 410b) or thin glass substrates (400a, 400b) by holding a vacuum pad (vacuum pad), the auxiliary substrates (410a, 410b) or thin glass substrates (400a, There is a method of lifting the 400b), wherein the adhesion between the two
In addition, the
Subsequently, the liquid crystal display is manufactured by cutting and cutting the liquid crystal panel into a plurality of liquid crystal panels and inspecting each liquid crystal panel (S112). However, the present invention is not limited thereto, and the separation process of the above-described
Many details are set forth in the foregoing description but should be construed as illustrative of preferred embodiments rather than to limit the scope of the invention. Therefore, the invention should not be defined by the described embodiments, but should be defined by the claims and their equivalents.
100,200,300,400,400a, 400b: thin glass substrate
110,210,310,410,410a, 410b: auxiliary board
415,415a, 415b: transparent oxide film
415 ', 415a', 415b ': crystallized transparent oxide film
Claims (14)
Depositing a transparent oxide film on surfaces of the first and second auxiliary substrates;
Heat-treating the first and second auxiliary substrates on which the transparent oxide film is deposited to crystallize the transparent oxide film to increase surface roughness;
Attaching first and second auxiliary substrates on which the crystallized transparent oxide film is formed to each of the thin first and second mother substrates;
Performing a color filter process on the first mother substrate to which the first auxiliary substrate is attached;
Performing an array process on a second mother substrate to which the second auxiliary substrate is attached;
Bonding the second mother substrate subjected to the array process and the first mother substrate subjected to the color filter process; And
Separating the first and second auxiliary substrates from the bonded first and second mother substrates,
The bonding force between the crystallized transparent oxide film and the thin first and second mother substrates is characterized in that the surface of the first and second auxiliary substrates and the thin first, second and second substrates are increased as the transparent oxide film is crystallized and the surface roughness increases. A method for manufacturing a lightweight thin liquid crystal display device, which is smaller than the bonding force between the second mother substrates.
Increasing surface roughness by HF or plasma treatment on the surfaces of the first and second auxiliary substrates;
Attaching the HF or plasma treated first and second auxiliary substrates to the thin first and second mother substrates, respectively;
Performing a color filter process on the first mother substrate to which the first auxiliary substrate is attached;
Performing an array process on a second mother substrate to which the second auxiliary substrate is attached;
Bonding the second mother substrate subjected to the array process and the first mother substrate subjected to the color filter process; And
Separating the first and second auxiliary substrates from the bonded first and second mother substrates,
The bonding force between the surface of the HF or plasma-treated first and second auxiliary substrates and the thin first and second mother substrates is characterized in that the surface of the first and second auxiliary substrates is HF or plasma-treated and thus the surface roughness is reduced. A method of manufacturing a light weight thin liquid crystal display device having a smaller adhesion force between the surfaces of the first and second auxiliary substrates and the thin first and second mother substrates before the HF or plasma treatment.
Depositing an inorganic insulating film having no OH-functional group of a silicon oxide film or a silicon nitride film on a surface of the first and second auxiliary substrates;
Attaching first and second auxiliary substrates on which the inorganic insulating layer is deposited to each of the thin first and second mother substrates;
Performing a color filter process on the first mother substrate to which the first auxiliary substrate is attached;
Performing an array process on a second mother substrate to which the second auxiliary substrate is attached;
Bonding the second mother substrate subjected to the array process and the first mother substrate subjected to the color filter process; And
Separating the first and second auxiliary substrates from the bonded first and second mother substrates,
The bonding force between the inorganic insulating film and the thin first and second mother substrates is formed by depositing an inorganic insulating film having no OH-functional group on the surfaces of the first and second auxiliary substrates. A method of manufacturing a light weight thin liquid crystal display device having a smaller bonding force between surfaces of the first and second auxiliary substrates and the thin first and second mother substrates before deposition of the inorganic insulating layer as the bond is weakened.
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JP2005340058A (en) * | 2004-05-28 | 2005-12-08 | Kyodo Printing Co Ltd | Organic el display and manufacturing method therefor |
WO2008088068A1 (en) * | 2007-01-19 | 2008-07-24 | The University Of Tokyo | Fine structure body manufacturing method, fine structure body and micro device |
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KR20040006894A (en) * | 2002-07-16 | 2004-01-24 | 엘지.필립스 엘시디 주식회사 | Method for manufacturing liquid crystal display |
CN101242951B (en) * | 2005-08-09 | 2012-10-31 | 旭硝子株式会社 | Thin sheet glass laminate and method for manufacturing display using thin sheet glass laminate |
KR20080068348A (en) * | 2007-01-19 | 2008-07-23 | 삼성전자주식회사 | Method of manufacturing display device |
KR20120098640A (en) * | 2009-10-20 | 2012-09-05 | 아사히 가라스 가부시키가이샤 | Glass laminate, glass laminate manufacturing method, display panel manufacturing method, and display panel obtained by means of display panel manufacturing method |
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JP2005340058A (en) * | 2004-05-28 | 2005-12-08 | Kyodo Printing Co Ltd | Organic el display and manufacturing method therefor |
WO2008088068A1 (en) * | 2007-01-19 | 2008-07-24 | The University Of Tokyo | Fine structure body manufacturing method, fine structure body and micro device |
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