JPS61144675U - - Google Patents
Info
- Publication number
- JPS61144675U JPS61144675U JP2900785U JP2900785U JPS61144675U JP S61144675 U JPS61144675 U JP S61144675U JP 2900785 U JP2900785 U JP 2900785U JP 2900785 U JP2900785 U JP 2900785U JP S61144675 U JPS61144675 U JP S61144675U
- Authority
- JP
- Japan
- Prior art keywords
- wiring pattern
- circuit wiring
- bent part
- circuit board
- flexible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011247 coating layer Substances 0.000 claims description 2
- 238000000151 deposition Methods 0.000 claims 1
- 238000005452 bending Methods 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Description
第１図は、本考案の一実施例により構成された
混成回路基板の屈曲構造の概念的要部断面構成図
、そして、第２図は、従来例による混成回路基板
の屈曲構造を示す同様な断面構成図である。
図中、Ａは可撓性屈曲部、Ｂは部品実装部、１
は回路配線パターン、２及び５は接着層、３及び
７は絶縁被覆層、６は導通部を示す。
FIG. 1 is a conceptual cross-sectional configuration diagram of essential parts of a bending structure of a hybrid circuit board constructed according to an embodiment of the present invention, and FIG. 2 is a similar sectional view showing a bending structure of a hybrid circuit board according to a conventional example. FIG. In the figure, A is a flexible bending part, B is a component mounting part, 1
1 shows a circuit wiring pattern, 2 and 5 are adhesive layers, 3 and 7 are insulating coating layers, and 6 is a conductive portion.
Claims (1)
該回路配線パターンの両面に絶縁被覆層を対称的
に被着形成してなる可撓性屈曲部と、該可撓性屈
曲部に連設した多層構造の実装部とを備えるよう
に構成したことを特徴とする混成回路基板の屈曲
構造。 A flexible bent part formed by symmetrically depositing an insulating coating layer on both sides of the circuit wiring pattern so that the circuit wiring pattern is placed in the center, and a multilayer structure connected to the flexible bent part. 1. A bent structure for a hybrid circuit board, characterized in that it is configured to include a mounting section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985029007U JPH0231795Y2 (en) | 1985-02-28 | 1985-02-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985029007U JPH0231795Y2 (en) | 1985-02-28 | 1985-02-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61144675U true JPS61144675U (en) | 1986-09-06 |
| JPH0231795Y2 JPH0231795Y2 (en) | 1990-08-28 |
Family
ID=30527423
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985029007U Expired JPH0231795Y2 (en) | 1985-02-28 | 1985-02-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0231795Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2006033346A1 (en) * | 2004-09-21 | 2008-05-15 | イビデン株式会社 | Flexible printed wiring board |
| JP2009302342A (en) * | 2008-06-13 | 2009-12-24 | Denso Corp | Multilayer substrate, and method of designing the same |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015166588A1 (en) * | 2014-05-02 | 2015-11-05 | 株式会社メイコー | Rigid-flex substrate with embedded component |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5649176U (en) * | 1979-09-22 | 1981-05-01 | ||
| JPS5654607U (en) * | 1979-10-01 | 1981-05-13 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54139830A (en) * | 1978-04-24 | 1979-10-30 | Nippon Keikinzoku Sougou Kenki | Method and apparatus for cooling plunger chip in cold chamber type diecast machine |
-
1985
- 1985-02-28 JP JP1985029007U patent/JPH0231795Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5649176U (en) * | 1979-09-22 | 1981-05-01 | ||
| JPS5654607U (en) * | 1979-10-01 | 1981-05-13 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2006033346A1 (en) * | 2004-09-21 | 2008-05-15 | イビデン株式会社 | Flexible printed wiring board |
| JP5006649B2 (en) * | 2004-09-21 | 2012-08-22 | イビデン株式会社 | Flexible printed wiring board |
| JP2009302342A (en) * | 2008-06-13 | 2009-12-24 | Denso Corp | Multilayer substrate, and method of designing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0231795Y2 (en) | 1990-08-28 |