JPH0351872U - - Google Patents
Info
- Publication number
- JPH0351872U JPH0351872U JP11389589U JP11389589U JPH0351872U JP H0351872 U JPH0351872 U JP H0351872U JP 11389589 U JP11389589 U JP 11389589U JP 11389589 U JP11389589 U JP 11389589U JP H0351872 U JPH0351872 U JP H0351872U
- Authority
- JP
- Japan
- Prior art keywords
- circuit pattern
- insulating layer
- wiring board
- printed wiring
- periphery
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 2
Description
第１図は、本考案の実施例を示す図、第２図は
、本考案の実施例の断面図、第３図、第４図、第
５図は従来例を示す図である。
１……印刷配線板、２……電極パターン、３，
４，５……パターン、６……第１の絶縁層、７…
…絶縁基板、８……第２の絶縁層。
FIG. 1 is a diagram showing an embodiment of the present invention, FIG. 2 is a sectional view of the embodiment of the present invention, and FIGS. 3, 4, and 5 are diagrams showing conventional examples. 1...Printed wiring board, 2...Electrode pattern, 3,
4, 5...pattern, 6...first insulating layer, 7...
...Insulating substrate, 8... Second insulating layer.
Claims (1)
該回路パターンの電気部品との接続部分の周囲と
近接する回路パターンの一部のみを二重に絶縁層
で被履したことを特徴とする印刷配線板。 A predetermined circuit pattern is formed on the insulating substrate,
1. A printed wiring board characterized in that only a portion of the circuit pattern adjacent to the periphery of the connection portion of the circuit pattern to an electrical component is covered with a double insulating layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989113895U JP2555303Y2 (en) | 1989-09-28 | 1989-09-28 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989113895U JP2555303Y2 (en) | 1989-09-28 | 1989-09-28 | Printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0351872U true JPH0351872U (en) | 1991-05-20 |
| JP2555303Y2 JP2555303Y2 (en) | 1997-11-19 |
Family
ID=31662290
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989113895U Expired - Lifetime JP2555303Y2 (en) | 1989-09-28 | 1989-09-28 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2555303Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017130697A (en) * | 2017-04-28 | 2017-07-27 | Fdk株式会社 | Thick copper wiring board |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6418298A (en) * | 1987-07-13 | 1989-01-23 | Clarion Co Ltd | Printed wiring board |
-
1989
- 1989-09-28 JP JP1989113895U patent/JP2555303Y2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6418298A (en) * | 1987-07-13 | 1989-01-23 | Clarion Co Ltd | Printed wiring board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017130697A (en) * | 2017-04-28 | 2017-07-27 | Fdk株式会社 | Thick copper wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2555303Y2 (en) | 1997-11-19 |