JPH03101576U - - Google Patents
Info
- Publication number
- JPH03101576U JPH03101576U JP969790U JP969790U JPH03101576U JP H03101576 U JPH03101576 U JP H03101576U JP 969790 U JP969790 U JP 969790U JP 969790 U JP969790 U JP 969790U JP H03101576 U JPH03101576 U JP H03101576U
- Authority
- JP
- Japan
- Prior art keywords
- insulating layer
- wiring board
- printed wiring
- circuit
- multilayer printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims 1
- 239000000463 material Substances 0.000 description 1
Description
第１図は本考案の第１の実施例の示す断面図、
第２図は本考案の第２の実施例を示す断面図、第
３図は従来例を示す断面図である。
１……基材、２……接続用パツド、３……第１
の絶縁層、４……第２の絶縁層、５……導電樹脂
による回路、６……第３の絶縁層。
FIG. 1 is a sectional view showing the first embodiment of the present invention;
FIG. 2 is a sectional view showing a second embodiment of the present invention, and FIG. 3 is a sectional view showing a conventional example. 1... Base material, 2... Connection pad, 3... First
4... second insulating layer, 5... circuit made of conductive resin, 6... third insulating layer.
Claims (1)
、前記絶縁層上に導電性樹脂を印刷して回路を形
成する多層プリント配線板において、接続用パツ
ドの一部を覆うように絶縁層を形成したことを特
徴とする多層プリント配線板。 In a multilayer printed wiring board in which an insulating layer is formed on a circuit formed by a conductor and a conductive resin is printed on the insulating layer to form a circuit, the insulating layer is formed so as to cover a part of the connection pad. A multilayer printed wiring board characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP969790U JPH03101576U (en) | 1990-02-02 | 1990-02-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP969790U JPH03101576U (en) | 1990-02-02 | 1990-02-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03101576U true JPH03101576U (en) | 1991-10-23 |
Family
ID=31513287
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP969790U Pending JPH03101576U (en) | 1990-02-02 | 1990-02-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03101576U (en) |
-
1990
- 1990-02-02 JP JP969790U patent/JPH03101576U/ja active Pending