JPH10300782A - Probe apparatus and its assembly - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a probe apparatus and its assembly whereby contact pins of each unit contact probe of the probe apparatus can be made all of uniforme heightwise position easily and highly accurately. SOLUTION: A plurality of pattern wirings are formed on a film. Each leading end of the pattern wirings is projected from the film, thereby constituting a contact pin. A plurality of the thus-constituted unit contact probes are prepared, and a fixed plate 40 having a plurality of inclined faces is prepared. The unit contact probes 1 are bonded to the plurality of inclined faces of the fixed plate 40 with the use of an adhesive or a double-coated tape. The fixed plate 40 is fixed to a mounting plate 60 by screws 63, and shims 64, 65 are interposed between the mounting plate 60 and fixed plate 40. Leading ends of the contact pins 3a of each unit contact probe 1 are accordingly uniformed in heightwise position.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a probe device which is used as a probe pin, a socket pin or the like, and performs an electrical test by contacting each terminal of a semiconductor IC chip or a liquid crystal device, and a method of assembling the same.

[0002]

2. Description of the Related Art Generally, a probe card is used to perform an electrical test by contacting a semiconductor chip such as an IC chip or an LSI chip or each terminal of an LCD (liquid crystal display). In recent years, as the integration and miniaturization of IC chips and the like have increased, the pitch of contact pads, which are electrodes, has been reduced, and the pitch of contact pins has been required to be narrower. However, with a tungsten needle contact probe used as a contact pin, it has been difficult to cope with a multi-pin narrow pitch due to the limitation of the diameter of the tungsten needle.

On the other hand, as shown in FIG. 17, for example, a plurality of pattern wirings 3 are formed on a resin film 2, and the respective tips of the pattern wirings 3 are arranged so as to protrude from the resin film 2 to form a contact. A probe card technology in which the unit contact probe 1 serving as the pin 3a is incorporated by various mechanical parts has been proposed (see, for example, JP-A-6-331655). According to this technique, the tip of each of the plurality of pattern wirings 3 is formed as a contact pin 3a, so that a multi-pin narrow pitch is achieved and many complicated components are not required.

Here, conventionally, for example, in order to integrally connect a plurality of unit contact probes to produce a contact probe, the following jig (assembly apparatus) is used. As shown in FIGS. 20 and 21, a rectangular hole 100 a is formed in the center of a rectangular parallelepiped side holder (probe holding table) 100, and the outer peripheral portion of the upper surface of the side holder 100 is formed in a flat horizontal plane 101. The other part of the upper surface is 4
It has a quadrangular pyramid shape composed of two inclined surfaces 102. A center holder 103 (see FIG. 22) is inserted into the square hole 100a of the side holder 100. FIG.
As shown in FIG. 2, positioning notches 104 are formed on each side of the upper end of the center holder 103. The width H of the positioning notch 104 is slightly larger than the total pin width B of the unit contact probe 1 (see FIG. 17).

In order to manufacture a contact probe using this jig, first, as shown in FIGS.
First, the unit contact probes 1 are respectively mounted on the four inclined surfaces 102 of the side holder 100, and all the contact pins 3a of the unit contact probes 1 are respectively brought into contact with the respective positioning notches 104 of the center holder 103 to perform positioning. .

Next, as shown in FIG. 24, a fixed plate (also referred to as a base) 105 is prepared in which an inner peripheral area of the lower surface is a horizontal plane 106 and another area of the lower surface is an inclined surface 107 having a quadrangular pyramid shape. Then, each inclined surface 10 to which each unit contact probe 1 of the fixing plate 105 is to be adhered.
An adhesive is applied or a double-sided tape is attached to the area 7, and the fixing plate 105 is lowered onto each unit contact probe 1 and pressed. As described above,
As shown in FIG. 24, four unit contact probes 1
Are integrated by a fixing plate 105, and the fixing plate 105 is attached to a printed circuit board (not shown) or the like, whereby a probe device (probe card) can be obtained.

[0007]

By the way, in the above-mentioned conventional probe device, the height position of the tip of the contact pin in each unit contact probe tends to be uneven, and in this case, if the probe device is overdriven, ,
If the contact pin tip is low, there is a problem that not only the aluminum oxide film on the pad surface but also the pad base is damaged. In addition, it is conceivable to polish the tip of each contact pin and align the height position of the tip of each contact pin, but it takes time and effort to polish, lowering the productivity and increasing the manufacturing cost. Become.

In the above conventional probe device, each unit contact probe is bonded to a fixing plate (base) only by an adhesive or a double-sided tape.
In some cases, the bonding strength between the unit contact probe and the fixing plate is not sufficient, and the unit contact probe may come off from the fixing plate. Therefore, there has been a strong demand for increasing the bonding strength between the contact probe and the fixing plate.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems of the prior art, and is a probe apparatus capable of easily and uniformly aligning the height positions of contact pins in each unit contact probe. And an assembling method thereof. It is another object of the present invention to provide a probe device and a method of assembling the same, in which the adhesive strength between the unit contact probe and the fixing plate is increased so that the unit contact probe does not accidentally come off the fixing plate.

[0010]

In order to achieve the above object, a probe apparatus according to the present invention comprises a plurality of pattern wirings formed on a film, and the tips of the pattern wirings are arranged so as to protrude from the film. A plurality of unit contact probes serving as contact pins, a fixing plate having a plurality of inclined surfaces, and the unit contact probes adhered to each inclined surface with an adhesive or a double-sided tape, and an attachment in which the fixing plate is attached by screws A plate, and a shim interposed between the mounting plate and the fixing plate for uniforming the height position of the tip of the contact pin in each unit contact probe). It is.

Here, it is preferable that resin is connected between adjacent unit contact probes and between each unit contact probe and the fixing plate. One surface of the fixing plate has a pyramid shape having a plurality of inclined surfaces, and unit contact probes are bonded to the plurality of inclined surfaces of the fixing plate, respectively.

In the method of assembling a probe device according to the present invention, a plurality of unit contact probes, each having a plurality of pattern wirings formed on a film and each of the pattern wirings protruding from the film and serving as a contact pin, are provided. Prepare and prepare a fixed plate having a plurality of inclined surfaces, first, using a glue or double-sided tape, glue each unit contact probe to the plurality of inclined surfaces of the fixed plate, respectively, Is fixed to the mounting plate with screws, and a shim is interposed between the mounting plate and the fixing plate, so that the height position of the tip of the contact pin in each unit contact probe is made uniform. Is what you do.
Here, after adhering each unit contact probe to the fixing plate, between the adjacent unit contact probes, and between each unit contact probe and the fixing plate, a molten resin is sealed, and after the resin is solidified, Fix the fixing plate to the mounting plate. Further, a fixing plate having a pyramid shape having one surface having a plurality of inclined surfaces is used, and unit contact probes are bonded to the four inclined surfaces of the fixing plate, respectively.

Here, the operation of the present invention will be described.
In the first and fourth aspects of the present invention,
If the height position of the tip of each contact pin of a certain unit contact probe is higher than that of another unit contact probe, a shim having a thickness equal to the difference in the height is used. By being interposed between the mounting plate and the fixed base and at a position overlapping with the certain unit contact probe, the height positions of the tips of the contact pins in both unit contact probes become the same. If the height position of the contact pins of the remaining unit contact probes is higher than the other ones, the difference in height is eliminated by using a shim having a predetermined thickness as described above. As described above, in all the unit contact probes, the height positions of the contact pins can be easily made uniform. Therefore, when the overdrive is applied to the probe device, all the contact pins of each unit contact probe remove only the aluminum film on the pad surface, and the base of the pad is not damaged.

According to the second and fifth aspects of the present invention, each unit contact probe is connected to a fixing plate (also referred to as a base) by a resin in addition to an adhesive or a double-sided tape. The adhesion strength between the plate and the fixing plate is increased. Further, since the adjacent unit contact probes are also connected by the resin, the contact probe rigidity is improved.

According to the third and sixth aspects of the present invention, the fixing plate has a plurality of surfaces (for example, four surfaces).
Each of the unit contact probes can be bonded to each of the four inclined surfaces of the fixing plate by using a pyramid shape (for example, a quadrangular pyramid shape) having the inclined surfaces described above.

[0016]

Next, embodiments of the present invention will be described with reference to the drawings. 1 is a side view of a contact probe assembling apparatus used in the method of assembling a contact probe according to the present invention, FIG. 2 is a plan view of FIG. 1, FIG. 3 is a left side view of FIG. 1, and FIG. FIG. 2 is an enlarged view of a probe holder (side plate) 13 and a mask holder 15. 1 to 3, the unit contact probe, the fixing plate, and the top plate are not shown.

First, a contact probe assembling apparatus will be described. As shown in FIGS. 1 to 3, a probe holder (side plate) 13 is horizontally supported on a base plate 12 as a base via four columns 14, and the center of the probe holder 13 is An opening 13b (square hole) having a rectangular cross section is formed in the portion. The opening 13b has a prismatic shape described below (a quadrangular prismatic shape in this example).
(Also referred to as a center plate or a movable insert) 15 is slidably inserted in the vertical direction. The outer peripheral portion of the upper surface of the probe holder 13 is a flat horizontal surface 13a, but the other portion of the upper surface has a plurality (four in this example) of inclined surfaces 16 that become lower toward the inside. It has a pyramid shape (a quadrangular pyramid shape in this example). The inclination angle θ of each of the inclined surfaces 16 is the contact angle α required for the pad P of the contact pin 3a.
(See FIG. 12).

On the other hand, reference numeral 29 denotes an elevating plate member. One end and the other end of the elevating plate member 29 are connected to a pair of linear guides 21 and 2 provided on the base plate 12, respectively.
1 is supported movably in the vertical direction (vertical direction). The linear guide 21 is configured such that a cylindrical inner pillar 23 fixed to an elevating plate member 29 is vertically movably inserted into an outer cylinder 22 fixed to the base plate 12.

The mask holder 15 is fixed to the other end of the elevating plate member 29 by bolts 33 or the like.
Furthermore, a pair of linear guides 21 and
A known micrometer type elevating mechanism 2
4 are provided. That is, the elevating plate member 29 is attached to the sleeve 26a of the micrometer type elevating mechanism 24, and by rotating the thimble (micrometer head) 25, the spindle 26 becomes the sleeve 26a.
protruding or retracting from the spindle 2
6 is a stopper member 27 fixed to the base plate 12
The vertical movement is restricted by the
And the elevating plate member 29 moves up and down. The lowering of the elevating plate member 29 is performed not only by the rotation of the thimble 25, but also by the elastic force of a pair of tension springs 28a and 28b bridged between the base plate 12 and the elevating plate member 29. As described above, the mask holder 15 can be accurately positioned at a predetermined position in the vertical direction by the micrometer type lifting mechanism 24.

Here, suction holes (suction ports) as small holes are provided inside the four inclined surfaces 16 of the probe holder 13.
A linear suction slit (suction port) 17a is formed outside the suction hole 18a. Each suction hole 18a and each suction slit 17a communicate with a vacuum source (not shown) via separate vacuum passages 18, 17, connectors 20, 19, tubes (not shown), and the like. Further, each tube is provided with a valve, and by individually opening and closing each valve, each of the four suction holes 18a and each of the suction slits 17a can individually communicate with and shut off to the vacuum source. ing. As is clear from the above description, the vacuum passages 18 and 17, the connectors 20, 19,
A tube (not shown), a vacuum source (not shown), and the like constitute a vacuuming mechanism.

Next, regarding the details of the mask holder 15, as shown in FIG. 5, a mask member 34 (FIG. 8) to be described later (FIG. 8) is provided at the four corners of the upper surface of the mask holder 15 having a prismatic shape (square prism shape in this example). Cross-shaped marks 15a are provided for alignment. Further, a cross-shaped suction slit 3 is provided in a central region of the upper surface of the mask holder 15.
1, the suction slit 30 communicates with the vacuum source via a vacuum passage 31, a connector 32, a tube (not shown), and the like, which extend in the longitudinal direction of the mask holder 15, as shown in FIG. A valve allows the suction slit 30 to communicate with and shut off the vacuum source.

As shown in FIGS. 4 and 8, the mask member 34 is a rectangular thin plate having substantially the same size as the upper surface of the mask holder 15. In this embodiment, a transparent material such as glass or film is used. It is formed with. Cross-shaped marks 34a for alignment are provided at four corners of the mask member 34, respectively. Further, a pitch pattern 55 parallel to the four outer peripheral portions of the mask member 34 is provided. The pitch pattern 55 has a scale 55a whose length is indicated by a symbol A and is equal to the pitch of the contact pins 3a of the unit contact probe 1. The mask member 34 and the mask holder 15 constitute contact pin positioning means.

As shown in FIGS. 4 and 6, the fixing plate (also referred to as a base) 40 is a plate member having a pyramid shape (a quadrangular pyramid shape in this example) having four inclined surfaces 41 on its lower surface. , Unit contact probe 1 on each inclined surface 41
Are bonded to form a contact probe 70 (see FIG. 9) described later. Note that a rectangular opening 40a is formed in the center of the fixing plate 40.

As shown in FIGS. 4 and 7, the upper plate (fixed plate positioning member) 51 as a part of the contact probe assembling apparatus has positioning holes 54 formed in the outer peripheral portion thereof. The upper plate 51 is placed on the outer peripheral portion 13a on the upper surface of the probe holding base 13 at the flat outer peripheral portion 52 on the lower surface thereof.
The upper plate 51 is positioned on the probe holder 13 by inserting the positioning pins 50 (see FIG. 2) of the probe holder 13 into the probe holder 4. In the center of the upper plate 51, an opening 51a slightly larger than the fixing plate 40 is formed.
The fixed plate 40 is positioned on the probe holder 13 by inserting the fixed plate 40 into the position a. The inner peripheral portion of the lower surface of the upper plate 51 has four inclined surfaces 53 having the same inclination angle as the inclination angle θ of the probe holder 13.

Here, a unit contact probe and a method of manufacturing the same will be described. As shown in FIG. 15, the unit contact probe 1 is a polyimide resin film 2
A pattern wiring 3 made of metal is attached to one surface of the resin film 2, and a tip of the pattern wiring 3 projects from an end of the resin film 2 to form a contact pin 3a.

Next, with reference to FIGS. 16 to 18, the steps of manufacturing the unit contact probe 1 will be described in the order of steps.

[Base Metal Layer Forming Step] First, FIG.
As shown in (a), a base metal layer 6 is formed on a supporting metal plate 5 made of stainless steel by Cu (copper) plating. This base metal layer 6 is formed on the upper surface of the supporting metal plate 5 with a uniform thickness. [Pattern forming step] After forming a photoresist layer (mask) 7 on the base metal layer 6, FIG.
As shown in FIG.
Then, a photomask 8 having a predetermined pattern is applied to the substrate, and the photoresist layer 7 is exposed to light. As shown in FIG. Opening (unmasked part)
7a is formed. In the present embodiment, the photoresist layer 7 is formed of a negative photoresist, but a desired opening 7a may be formed using a positive photoresist. The “mask” used here is, like the photoresist layer 7 of the present embodiment, an opening 7 a through an exposure and development process using a photomask 8.
Is not limited to those in which is formed. For example,
A film or the like in which a hole is formed in advance in a portion to be plated (that is, the film is formed in advance in a state indicated by reference numeral 7 in FIG. 16) may be used. When such a film or the like is used as a “mask”, the pattern forming step in the present embodiment is unnecessary.

[Electroplating Step] Then, FIG.
As shown in FIG. 16E, after the Ni or Ni alloy layer N to be the pattern wiring 3 is formed in the opening 7a by plating, the photoresist layer 7 is formed as shown in FIG.
Is removed.

[Film Adhering Step] Next, FIG.
As shown in FIG. 14, on the Ni or Ni alloy layer N, except for the tip of the pattern wiring 3 shown in FIG. Glue. The resin film 2 is made of a polyimide resin PI and a metal film (copper foil) 5.
Reference numeral 00 denotes a two-layer tape provided integrally. Prior to this film deposition step, the copper surface 500
Then, after partial copper etching, gold plating is applied depending on the application to form a ground plane. Then, in this film attaching step, the resin surface PI of the two-layer tape is attached to the Ni or Ni alloy layer N via the adhesive 2a. In addition, the metal film 500, in addition to the copper foil,
Ni or a Ni alloy may be used. [Separation Step] Then, as shown in FIG. 16 (g), after the portion consisting of the resin film 2, the pattern wiring 3, and the base metal layer 6 is separated from the supporting metal plate 5, the resin is etched through Cu etching. Only the pattern wiring 3 is adhered to the film 2.

[Gold Coating Step] Then, as shown in FIG.
Plating is performed to form an Au plating layer A on the surface. At this time, the Au layer A is formed on the entire surface of the contact pins 3a protruding from the resin film 2 over the entire circumference. Through the above steps, the unit contact probe 1 is manufactured.

FIG. 17 shows the unit contact probe 1.
FIG. 18 is a cross-sectional view taken along the line CC in FIG. 17.
As shown in FIGS. 17 and 18, on the resin film 2 of the unit contact probe 1, a signal obtained from the pattern wiring 3 is printed via a lead-out wiring 10 on a printed circuit board 6.
0 (see FIG. 12 to be described later).

Next, a method of manufacturing a contact probe using the above-described contact probe assembling apparatus and an assembling method of assembling a probe apparatus from the contact probe will be described.

First, as shown in FIGS. 4 and 5, the mask member 34 is placed on the upper surface of the mask holder 15, and each cross mark 34a of the mask member 34 is matched with each cross mark 15a of the mask holder 15. The mask member 34 is positioned. Here, a valve (not shown) is opened to connect the vacuum passage 31 (see FIG. 1) of the mask holder 15 to a vacuum source (not shown), and the mask member 34 is fixed to the mask holder 15 by the action of the vacuum of the suction slit 30. . Thereby, the displacement of the mask member 34 can be prevented.

Next, four unit contact probes 1
Are placed on the respective inclined surfaces 16 of the probe holder 13 so that the contact pins 3a face downward, and the suction holes 18a of the probe support 13 are vacuum-sucked so that each unit contact probe 1 is placed on the inclined surface 16. Temporarily fix.

The micrometer-type lifting mechanism 24 positions the mask holder 15 up and down, and visually checks the contact pins 3a at both ends of the plurality of contact pins 3a of the unit contact probe 1 while visually checking from above. Match to both ends of the pitch pattern 55 (see FIG. 8). Thus, the tips of the contact pins 3a of the four unit contact probes 1 are positioned so as to match the corresponding scales 55a of the mask member. Here, the position of each unit contact probe 1 is finally determined by vacuum suction of each suction slit 17a of the probe holder 13.

Then, the upper plate 51 is placed on the probe holder 13. At this time, the upper plate 51
The positioning pins 50 of the probe holder 13 are inserted into the respective positioning holes 54, and the upper plate 51 is fixed while being positioned on the probe holder 13.
Next, an epoxy resin-based adhesive is applied to each inclined surface 41 of the fixing plate 40 or a double-sided tape is attached, and the fixing plate 40 is dropped into the opening 51 a of the upper plate 51 and inserted. Then, the fixing plate 40 is placed on the upper surface of each unit contact probe 1.
Thereby, the four unit contact probes 1 are adhered to each inclined surface 41 of the fixing plate 40.

Finally, each suction hole 1 of the probe holder 13
The vacuum suction of 8a and the suction slit 17a is released, and the upper plate 51 is lifted and removed from the probe holder 13. The contact probe 70 (see FIG. 9) in which the four unit contact probes 1 are fixed to the fixing plate 40 is picked up from the probe holder 13. As described above, the contact probe 70 can be manufactured.

As described above, according to the contact probe assembling apparatus of this embodiment, when each unit contact probe 1 is adhered to the fixing plate 40, each unit contact probe 1 is attached to the inclined surface 16 of the probe holder 13. Since it is adsorbed and fixed at the position, it is hardly bent and no displacement occurs. Thereby, in the assembled contact probe 70, the positional accuracy of each unit contact probe 1 with respect to the fixed plate 4 is improved, so that the positional accuracy in the height direction and the width direction (lateral direction) of the tip of the contact pin 3a is also greatly increased. improves. In the present embodiment, the positional accuracy of the tip of the contact pin 3a in the height direction and the width direction (lateral direction) was suppressed to within a specified value of 0.01 mm.

Further, according to the contact probe assembling apparatus of the present embodiment, the total pin width B of all the contact pins 3a of the unit contact probe 1 (see FIG. 17, usually 7 mm, 15 mm, etc.) is changed. If
While visually observing the mask member 34 from above, the mask holder 15 is moved up and down by the micrometer type elevating mechanism 24 to position the contact members 3a.
4 pitch pattern 55. Further, when the pitch of the contact pins 3a of the unit contact probe 1 is changed, the mask member 34 is replaced with one having a pitch pattern similar to the pitch pattern of the unit contact probe 1 after the change. The contact pins 3a can be aligned. Therefore, with the change of the specifications of the unit contact probe 1, the mask holder 15
Since it is not necessary to design or manufacture each time, the apparatus cost is not increased and the productivity is excellent.

Next, an example of a method of manufacturing a probe device using the contact probe 70 will be described. As shown in FIG. 10, a film 57 having a rectangular opening 57a is prepared. From below the contact probe 70, the opening edge of the opening 57 a of the film 57 is brought into contact with each unit contact probe 1, and in this state, the film 57 is temporarily fixed to each unit contact probe 1 with a tape 58. Here, the fixing plate 40 is provided between the film 57 and each unit contact probe 1.
The molten epoxy resin 59 is sealed uniformly in the circumferential direction of the above, and the epoxy resin 59 is solidified by heating if necessary. The solidification (curing) condition of the epoxy resin 59 is 2 hours at 25 ° C. or 20 minutes at 60 ° C.

The epoxy resin 59 has sufficient rigidity so as not to be deformed by an external force acting on the contact probe 70 (unit contact probe 1) at least under normal use conditions. Here, the epoxy resin 59 has a putty-like fast-curing property suitable for hardening as the contact probe 70 with the unit contact probe 1 accurately positioned, and the metal film 500 provided on the resin film 2. A material having a linear expansion coefficient close to that of the material (copper) is preferable. As one having these properties, for example, there is a two-part adhesive of Araldite (registered trademark) having a resin of AV1580 GB and a curing agent of HV1580 GB. The linear expansion coefficient of this adhesive is 18 × 10 ^-6 1 / ° C. at 0 to 30 ° C.

As shown in FIG. 11, when the epoxy resin 59 is solidified, the film 57 and the temporary fixing tape 58 are removed from the contact probe 70.

As shown in FIG. 12, four screws 63 (2
The fixing plate 40 is inserted into the printed circuit board 60 (mounting plate) and screwed into each of the screw holes 56 of the fixed plate 40 to thereby fix the fixed plate 40 to the printed circuit board 60.
, And the rear end side of each unit contact probe 1 is pressed against the printed board 60 via the O-ring 62 by the clamp member 61. Note that an opening 60 a is formed in the center of the printed circuit board 60. Thus, the assembly of the probe device 80 is completed. In this case, each unit contact probe 1 functions as a flexible substrate at the time of assembling since the whole is flexible and easily bent. That is, even if the contact pins 3a are fixed at the required contact angle α with respect to the pads P by the epoxy resin 59 on the front end side of the unit contact probe 1, the rear end side of the contact probe 70 is It is easy to bend at an angle (horizontal) to be held down by the clamp member 61 with respect to.

The feature of this embodiment is that, between the fixing plate 40 and the printed circuit board 60, at positions corresponding to the positions of the unit contact probes 1, four shims 64 as metal thin plates are provided as necessary. 65 (two shims not shown) are interposed. In addition, shim 64,
As 65, when the thickness is in the range of 10 to 300 μm, 1
Prepare for every 0 μm.

Therefore, when the height position of the tip of each contact pin of a certain unit contact probe is higher than that of another unit contact probe among the four unit contact probes 1, the difference between the heights is equal to that of the other unit contact probes. By interposing a shim having a thickness between the printed circuit board (mounting plate) and the fixed plate and at a position overlapping with a certain unit contact probe, the height position of the tip of the contact pin in both unit contact probes is reduced. Be the same. If the height position of the contact pins of the remaining unit contact probes is higher than the other ones, the difference in height is eliminated by using a shim having a predetermined thickness as described above. As described above, in all the unit contact probes 1, the height positions of the contact pins 3a can be easily made uniform. Therefore, when the overdrive is applied to the probe device, all the contact pins 3a of each unit contact probe 1 remove only the aluminum film on the pad surface, and the base of the pad is not damaged.

In the probe device 80 of this embodiment, as shown in FIGS. 9 and 12, the four unit contact probes 1 are arranged at regular intervals in plan view, and these four unit contact probes 1 are mounted on the fixed plate 40. Glued. Further, since each unit contact probe 1 is connected to the fixing plate 40 by an epoxy resin 59 in addition to the adhesive or the double-sided tape, the adhesive strength between each unit contact probe 1 and the fixing plate 40 is increased, and each unit contact probe 1 is connected. The probe 1 does not come off the fixed plate 40. Further, since the adjacent unit contact probes 1 are also connected by the epoxy resin 59, the rigidity of the contact probes is improved.

The probe device 80 configured as described above
When a probe test or the like of the IC chip I is performed using the IC chip I, the probe device 80 is mounted on a prober and electrically connected to a tester, and a predetermined electric signal is transmitted from the contact pins 3a of the pattern wiring 3 to the IC By sending the signal to the chip I, the output signal from the IC chip I is transmitted from the contact pin 3a to the tester,
The electrical characteristics of chip I are measured.

In the contact probe 70, the rigidity is given by applying the epoxy resin 59, and even when the contact pin 3a is overdriven toward the contact surface Pa of the pad P, the contact probe is Since the contact probe 70 is not deformed, it is only necessary to mount the contact probe 70 in an accurately positioned state when assembling it as the probe device 80, and a high-precision part for maintaining the arrangement state is not required. Therefore, the cost of parts can be reduced.

In the contact probe 70,
Since the four unit contact probes 1 are adhered in a state where they are positioned with respect to each other, and these four unit contact probes 1 are integrally fixed, each of the unit contact probes 1 is other than the unit contact probe 1. The unit probe is integrally supported by the other unit contact probes 1, and the rigidity of the entire contact probe 70 is improved accordingly.

Further, at the time of assembling the contact probe 70, each unit contact probe 1 is
And the axis of each contact pin 3a is fixed at a position that holds the required contact angle α (inclination angle θ) with respect to the contact surface Pa of the pad P,
The positioning work when assembling as the probe device 80 is easy.

In the contact probe 70,
Each unit contact probe 1 is an epoxy resin 59
The contact pin 3a is fixed to the pad P
Even when the contact probe 70 comes into contact with the contact surface Pa in a pressurized state and an upward force acts on the contact probe 70, the portion fixed by the epoxy resin 59 applied to the rectangular frame-shaped area in plan view expands and contracts. Therefore, the contact probe 70 does not deform. Therefore, the required contact angle α of the contact pin 3a with respect to the pad P does not deviate, and a contact failure between the contact pin 3a and the pad P does not occur.

In this contact probe 70, FIG.
As shown in FIG. 5, by providing the metal film 500 on the resin film 2, the contact pins 3a formed on the resin film 2 are supported. Epoxy resin 59 is
Since the one having the same expansion coefficient as that of the metal film 500 is used, the position of the contact pin 3a may be shifted due to the difference in the amount of thermal expansion between the two even during the burn-in test or the heating for solidifying the epoxy resin 59. Absent.

As shown in FIGS. 17 and 18, in the contact probe 70, the metal film 500 is provided up to the vicinity of the contact pin 3a, and the contact pin 3a has a protrusion L from the tip of the metal film 500 of 5 mm. It is as follows. This metal film 500
It can be used as a ground, so that it is possible to design impedance matching up to the vicinity of the tip of the probe device 80, and it is possible to prevent adverse effects due to reflected noise even when performing a test in a high frequency range.

The resin film 2 (polyimide resin P
The metal film 500 attached to I) has the following advantages. That is, when there is no metal film 500, since the resin film 2 is made of a polyimide resin, it absorbs moisture and elongates, and as shown in FIG. 19, the interval t between the contact pins 3a, 3a changes. There was something. Therefore, there is a problem that the contact pin 3a cannot contact a predetermined position of the terminal electrode, and an accurate electrical test cannot be performed. In the present embodiment, the metal film 500 is adhered to the resin film 2 so as to reduce the change in the interval t even when the humidity changes, so that the contact pin 3a can be securely brought into contact with a predetermined position of the terminal electrode. Has become.

In the above embodiment, the contact probe 70 is formed by the four unit contact probes 1.
However, the present invention is not limited to this, and the contact probe 70 may be constituted by another plurality of unit contact probes 1.

In this embodiment, the probe device 80 is used as a probe card. However, the probe device 80 may be used as another measuring jig. For example, the present invention may be applied to an IC chip test socket or the like mounted on an IC chip burn-in test device or the like for holding and protecting the IC chip inside.

Next, another example of the contact probe assembling apparatus will be described. As shown in FIG. 13, the contact probe assembling apparatus of the present embodiment supports the unit contact probe 1 in a state where the contact pins 3a thereof face upward. That is, the outer peripheral area and the central area on the upper surface of the probe holding base 71 are horizontal planes 71a and 71, respectively.
The other portion of the upper surface has a quadrangular pyramid shape having four inclined surfaces 72, 72 (two inclined surfaces are not shown) that become higher as approaching the center of the probe holding base 71. Has become.

On the other hand, the fixing plate 74 is a frame having a rectangular opening at the center thereof, and the wall surface of the opening of the fixing plate 74 has an inclined surface 75 similar to the inclined surface 72. It has become. Reference numeral 77 denotes a top plate (fixed plate positioning member) mounted on the probe holding base 71, and the fixed plate 74 is positioned by the opening 77a. Reference numeral 76 denotes a mask holder which can be moved up and down by a driving mechanism (not shown) (see arrow D). The mask holder 76 has a locking portion 76a at its lower end for holding the mask member 34 in a horizontal state. The mask holder 76 and the mask member 3
4 constitutes a contact pin positioning means 90.

In the contact probe assembling apparatus having the above structure, the contact pins 3a are placed on the respective inclined surfaces 72 of the probe holding base 71 so as to protrude upward, and the top plate 77 and the fixed plate 74 are sequentially mounted. . Here, the mask holder 76 is lowered to position each contact pin 3a on the mask member 34. Other configurations (suction holes, suction slits, etc. of the probe holding base 71) are the same as those in FIG.

Next, FIG. 14 is a diagram showing a probe device manufactured by using the contact probe assembled by the contact probe assembling device of FIG. FIG.
As shown in FIGS. 10 and 11,
Using film or tape (not shown), each unit contact probe 1 and each unit contact probe 1
And fixing plate 74 are connected by epoxy resin 590. Then, the rear end portion of each unit contact probe 1 is clamped by the frame-shaped clamp member (mounting plate) 610 and the printed circuit board 600, and between the fixing plate 74 and the clamp member 610 and corresponding to each unit contact probe 1. Shims 640 and 650 (two shims are not shown) are interposed at the set positions, and a plurality of screws 630 are further provided.
Thereby, the printed circuit board 600, the clamp member 610, and the fixing plate 74 are integrated. In addition, reference numeral 62
0 indicates an O-ring.

Also in the probe device of this embodiment, the height positions of the contact pins 3a can be easily made uniform in all the unit contact probes 1. Therefore, if you overdrive the probe device,
All contact pins 3 of each unit contact probe 1
a removes only the aluminum film on the pad surface, and the base of the pad is not damaged. Further, since each unit contact probe 1 is connected to the fixing plate 74 by an epoxy resin 590 in addition to the adhesive or the double-sided tape, each unit contact probe 1 and the fixing plate 7 are connected.
4 and the unit contact probe 1
Does not come off the fixing plate 74. In addition, the adjacent unit contact probes 1 are also
Since they are connected by 0, the rigidity of the contact probe is improved.

[0062]

Since the present invention is configured as described above, it has the following effects. According to the first and fourth aspects of the present invention, when the height position of the tip of each contact pin of a certain unit contact probe is higher than that of another unit contact probe, the By interposing a shim having a thickness equal to the height difference between the mounting plate and the fixed base and at a position overlapping with the certain unit contact probe, the height of the tip of the contact pin in both unit contact probes is increased. The position will be the same. If the height position of the contact pins of the remaining unit contact probes is higher than the other ones, the difference in height is eliminated by using a shim having a predetermined thickness as described above. As described above, in all the unit contact probes, the height positions of the contact pins can be easily made uniform. As a result, when the probe device is overdriven, all the contact pins of each contact probe remove only the aluminum film on the pad surface, and the base of the pad is not damaged. Further, since it is not necessary to grind and align the tips of the contact pins as in the related art, the productivity is not reduced and the manufacturing cost is not increased.

According to the second and fifth aspects of the present invention,
Since each unit contact probe is connected to the fixing plate (also called base) by resin in addition to adhesive or double-sided tape, the adhesive strength between each unit contact probe and the fixing plate is increased, and the unit contact probe is fixed to the fixing plate. There is no departure from. Further, since the adjacent unit contact probes are also connected by the resin, the contact probe rigidity is improved.

According to the third and sixth aspects of the present invention, the fixing plate has a plurality of surfaces (for example, four surfaces).
Each of the unit contact probes can be bonded to each of the four inclined surfaces of the fixing plate by using a pyramid shape (for example, a quadrangular pyramid shape) having the inclined surfaces described above.

[Brief description of the drawings]

FIG. 1 is a side view of a contact probe assembling apparatus used in a contact probe assembling method according to the present invention.

FIG. 2 is a plan view of FIG.

FIG. 3 is a left side view of FIG. 1;

FIG. 4 is a probe holder (side plate) 1 of FIG.
FIG. 3 is an enlarged view of 3 and a mask holder, and also shows a unit contact probe, a fixing plate, and a fixing plate positioning plate.

FIGS. 5A and 5B are a plan view and a side view of a mask holder.

FIG. 6 is a perspective view of a fixing plate.

FIG. 7 is a plan view of a top plate.

FIG. 8 is a plan view of a mask member.

FIG. 9 is a perspective view of a contact probe assembled by the contact probe assembling apparatus according to the present invention.

FIG. 10 shows a step of manufacturing a probe device from the contact probe shown in FIG. 9, showing a state after epoxy resin is sealed.

FIG. 11 shows a state in which a temporary fixing tape and the like are removed from the state of FIG. 10;

FIG. 12 is a diagram showing a probe device obtained by mounting a fixing plate on a printed circuit board.

FIG. 13 is a view showing another example of the contact probe assembling apparatus.

FIG. 14 is a diagram showing a probe device manufactured using the contact probe assembled by the contact probe assembling device of FIG. 13;

FIG. 15 is a perspective view of a main part showing a unit contact probe.

FIG. 16 is a fragmentary cross-sectional view showing the method of manufacturing the unit contact probe in the order of steps;

FIG. 17 is a plan view showing a unit contact probe.

18 is a sectional view taken along line CC of FIG. 17;

FIG. 19 is a front view for explaining a metal film in the unit contact probe.

FIG. 20 is a plan view of a conventional contact probe assembling apparatus.

21 is a longitudinal sectional view of FIG.

FIG. 22 is an enlarged perspective view of a front end portion of the center holder 103 shown in FIG.

FIG. 23 is a longitudinal sectional view showing a state where a unit contact probe is mounted on a conventional contact probe assembling apparatus.

FIG. 24 is a view showing a state in which a fixing plate is further placed from the state of FIG. 23;

FIG. 25 is a plan view of a contact probe.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Unit contact probe 2 Film (resin film) 3 Pattern wiring 3a Contact pin 5 Support metal layer 6 Base metal layer 7 Photoresist layer 7a Opening 8 Photomask 10 Lead-out wiring 11 Window 12 Base plate (base) 13,71 Probe Holder 13a Horizontal plane 13b Opening (square hole) 14 Post 15,76 Mask holder 15a Cross-shaped mark 16 Inclined surface 17,18 Vacuum passage 17a Suction slit (suction port) 18a Suction hole (suction port) 19,20 Connector 21 Linear Guide 22 Outer cylinder 23 Inner column 24 Micrometer type elevating mechanism 25 Thimble 26 Spindle 26a Sleeve 27 Stopper member 28a, 28b Tension spring 29 Elevating plate member 30 Suction slit 31 Vacuum passage 32 Connector 33 Screw 4 Mask member 34a Cross mark 40,74 Fixing plate 40a Opening 50 Positioning pin 51,77 Top plate 51a Opening 52 Flat surface 53 Inclined surface 54 Positioning hole 55 Pitch pattern 55a Scale 56 Screw hole 57 Film 58 Temporary fixing Tape 59 Epoxy resin 60 Printed circuit board (mounting plate) 60a Opening 61 Clamp member 62 O-ring 63 Screw 64, 65 Shim 70 Contact probe 72 Inclined surface 80 Probe device (probe card) 500 Metal film L Projecting from contact metal film Length N Metal layer P Object to be measured (pad) Pa Contact surface α Contact angle θ Tilt angle

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Toshiho Ishii, 12th Techno Park, Mita-shi, Hyogo Sanritsu Materials Co., Ltd.Mita Plant (72) Inventor Hideaki Yoshida 12th, Techno Park, Mita-shi, Hyogo Noroku Sanritsu Material Co., Ltd. Mita Plant

Claims (6)

[Claims] 1. A plurality of pattern wirings (3) are formed on a film (2), and each tip of the pattern wirings (3) is arranged so as to protrude from the film (2) to form contact pins (3a). A plurality of unit contact probes (1), a plurality of inclined surfaces (41, 75), and each inclined surface (4, 75).
1, 75), the fixing plate (4) to which the unit contact probe (1) is adhered with an adhesive or double-sided tape
0, 74) and the fixing plates (40, 74) are screws (63, 63).
0), the mounting plate (60, 610), and the fixing plate (4).
0, 74) and a shim (64, 65, 640, 6) for making the height position of the tip of the contact pin (3a) uniform in each unit contact probe (1).
50), and a probe device (80) characterized by comprising: 2. The probe device according to claim 1, wherein a resin (59) is provided between adjacent unit contact probes (1) and between each unit contact probe (1) and the fixing plate (40, 74). 590). 3. The probe device according to claim 1, wherein one surface of the fixing plate (40, 74) has a pyramidal shape having a plurality of inclined surfaces (41, 75). A probe device in which a unit contact probe (1) is bonded to each of a plurality of inclined surfaces (41, 75) of (40, 74). 4. A plurality of pattern wirings (3) are formed on a film (2), and the tips of the pattern wirings (3) are arranged so as to protrude from the film (2), and are provided with contact pins (3a). A plurality of unit contact probes (1) are prepared, and a plurality of inclined surfaces (4) are prepared.
1, 75) are prepared. First, each of the plurality of inclined surfaces (41, 75) of the fixing plate (40, 74) is bonded to each of the plurality of inclined surfaces (41, 75) using an adhesive or a double-sided tape. The unit contact probes (1) are adhered respectively, and the fixing plates (40, 74) are screwed (63, 63).
0) to the mounting plate (60, 610), and the mounting plate (60, 610) and the fixing plate (40, 610).
74) and shims (64, 65, 640, 650)
A method of assembling a probe device, wherein the height position of the tip of the contact pin (3a) in each unit contact probe (1) is made uniform by interposing the above. 5. The method for assembling a probe device according to claim 4, wherein each unit contact probe (1) is bonded to a fixing plate (40, 74) and then between adjacent unit contact probes (1) and each unit contact probe (1). A molten resin (59, 590) is sealed between the unit contact probe (1) and the fixing plate (40, 74), and this resin (5
After the solidification of the fixing plate (4,9,590),
(0, 74) to the mounting plate (60, 610). 6. The method for assembling a probe device according to claim 4, wherein the fixing plates are provided.
As 4), a pyramid having one surface having a plurality of inclined surfaces (41, 75) is used.
A method of assembling a probe device, wherein unit contact probes (1) are respectively bonded to four inclined surfaces (41, 75) of (0, 74).