JPH1116961A - Metallic material having bent part, molding thereof, contact probe using above metallic material and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make it possible to mold a metallic material having a bent part provided with a high accuracy and a high durability by a method wherein a second metal layer is selectively formed by plating on a first metal layer having a slant surface to mold the bent part, which is formed into a non-plastic deformed part, at a prescribed position on the surface of the first metal later and thereafter, the second metal layer is made to separate from the first metal layer to form the metallic material. SOLUTION: In the production method of this contact probe, a wedge member Q is inserted between a base metal layer 6 and a support metal plate 5 in a wedge insertion process, whereby the layer 6 is made to bend at a prescribed position W1 on the surface of the layer 6 at a prescribed angle θ. Moreover, after a plating treatment process and a mask removal process are conducted, an Ni alloy layer N is made to separate from the layer 6 by a separation process. Owing to this, even though a bent part BE is a non-plastic deformed part and the residual stress of the part BE is little, a contact pin 3a having a high-accuracy bent position, which is specified by the previously set form of the member Q, and the bent part BE of the prescribed angle is obtained. Thereby, the durability of the part BE can be raised.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a metal body having a bent portion, a method of forming the same, a contact probe using the metal body, and a method of manufacturing the same.
Specifically, a contact probe which is used as a probe pin or a socket pin, is incorporated in a probe card or a test socket, and contacts each terminal of a semiconductor IC chip, a liquid crystal device, or the like to perform an electrical test, and a method of manufacturing the same. About.

[0002]

2. Description of the Related Art In general, a contact pin is used to conduct an electrical test by contacting a semiconductor chip such as an IC chip or an LSI chip or each terminal of an LCD (liquid crystal display). In recent years, as the integration and miniaturization of IC chips and the like have increased, the pitch of contact pads, which are electrodes, has been reduced, and the pitch of contact pins has been required to be narrower. However, with a tungsten needle contact probe used as a contact pin, it has been difficult to cope with a multi-pin narrow pitch due to the limitation of the diameter of the tungsten needle.

On the other hand, for example, Japanese Patent Publication No. 7-820
No. 27 proposes a contact probe technique in which a plurality of pattern wirings are formed on a resin film, and the ends of these pattern wirings are arranged so as to protrude from the resin film and serve as contact pins. In this technical example, the tip of each of the plurality of pattern wirings is used as a contact pin, thereby achieving a narrow pitch with a large number of pins.
This eliminates the need for many complicated components.

The surface of each terminal (pad) of an IC chip or the like formed of an Al (aluminum) alloy or the like is oxidized in the air and is covered with a thin aluminum surface oxide film. I have. Therefore, in order to conduct an electrical test of the pad, it is necessary to remove the surface oxide film of aluminum and expose the aluminum inside to ensure conductivity.

Therefore, in the above-mentioned contact probe, the surface oxide film of aluminum on the pad surface is scraped off by the tip of the contact pin by applying overdrive while the contact pin is in contact with the surface of the pad, thereby removing the aluminum inside. They are exposed.
The above-described operation is called scrub, and is important for reliably performing an electrical test.

In the above contact pins, it is necessary to secure a sufficient contact angle of the contact pins with the pads in order to prevent the base of the pads from being damaged during scrubbing. The reason for this is that if the contact angle is small, the amount of aluminum rejected on the surface becomes extremely large, which affects the pad base.

As a countermeasure, as shown in FIG. 9, a contact probe 601 which is bent at an intermediate position V of a contact pin 600 has been proposed. In the contact probe 601, the angle of the contact pin 600 with respect to the object to be measured (pad) can be changed between the distal end portion and the proximal end portion, and the angle of the contact pin 600 with respect to the pad at the proximal end portion, that is, the pad of the film 602. It is possible to increase the angle (contact angle) between the tip of the contact pin 600 and the pad without increasing the angle with respect to. That is, the contact probe 601 has an advantage that the base of the pad can be prevented from being damaged during the scrub without increasing the scrub distance excessively and without increasing the height of the probe device. .

[0008]

In the contact probe 601 having the bent contact pins 600, the contact pins 600 are bent by a precision mold, but the contact pins 600 are bent at a predetermined angle (height).
And the length (height) of the contact pin 600 generated after the bending process is difficult to bend with high precision.
Must be made uniform by a polishing process using sandpaper or the like to achieve uniformity. In addition, at the intermediate position V, which is the bent portion of the contact pin 600 bent in this way, there is a problem that plastic deformation due to the bending occurs, residual stress remains, and durability decreases.
Further, the bending may cause a crack or break at the intermediate position V.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and has a highly accurate and highly durable metal body having a bent portion, a method of forming the same, a contact probe using the metal body, and a method of manufacturing the same. The purpose is to provide.

[0010]

The present invention has the following features to attain the object mentioned above. That is, in the metal body having a bent portion according to claim 1, the metal body has a bent portion at a predetermined angle, and is provided on a first metal layer having a slope inclined from the predetermined position on the surface to the predetermined angle. , Second
The metal layer is selectively plated to form the bent portion serving as the non-plastically deformed portion at the predetermined position, and then the second metal layer is separated and formed.

In the metal body having the bent portion, the second metal is provided on the first metal layer having the inclined surface inclined at the predetermined angle.
Since the bent portion is formed by selectively forming a metal layer by plating and forming the bent portion, the bent portion is not formed by bending but becomes a non-plastically deformed portion. Therefore, no residual stress remains.

According to a second aspect of the present invention, in the method of forming a metal body having a bent portion having a predetermined angle, a material adhered to or bonded to the material of the metal body on a substrate layer. A first metal layer forming step of forming a first metal layer, a pattern forming step of masking a portion of the first metal layer other than a portion provided for the metal body, and after the pattern forming step, Separating the first metal layer from the substrate layer to a predetermined position, inserting a wedge member between the first metal layer and the substrate layer, and setting the first metal layer at the predetermined angle at the predetermined position. Forming a second metal layer to be provided to the metal body by plating on an unmasked portion on the first metal layer after the wedge inserting step of bending, A plating step of forming the bent portion at a position; Removing the mask, removing the wedge member, removing all of the first metal layer from the substrate layer, further selectively removing the first metal layer, and removing the second metal layer. And a metal body separation step of separating the layers to form the metal body.

In the method for molding a metal body having a bent portion, a wedge member is inserted between the first metal layer and the substrate layer in the wedge inserting step, so that the first metal layer is positioned at a predetermined position. After bending to an angle, and further performing the plating step and the mask removing step, the second metal layer is separated into the metal body by the metal body separation step, so that there is no plastic deformation and there is little residual stress. At the same time, a metal body having a highly accurate bent position and an angled bent portion specified by a preset wedge member shape is manufactured.

According to a third aspect of the present invention, in the method of forming a metal body having a bent portion having a predetermined angle, the metal body is adhered to the material of the metal body on the first substrate layer. A first metal layer forming step of forming a first metal layer of a material to be bonded; a pattern forming step of masking a portion of the first metal layer other than a portion provided for the metal body; After the forming step, the first metal layer is completely peeled off from the first substrate layer, and the first metal layer is formed on a second substrate layer having a surface inclined at a predetermined angle from a predetermined position on the surface. Attaching the first metal layer at the predetermined position and bending the first metal layer at the predetermined angle; and, after the attaching step, the metal on the unmasked portion on the first metal layer. Forming a second metal layer to be provided to the body by plating; A plating step of forming the bent portion at a position, a mask removing step of removing the mask, and removing all of the first metal layer from the second substrate layer again, and further selecting the first metal layer And removing the second metal layer to separate the second metal layer into the metal body.

In the method for forming a metal body having a bent portion, the first metal layer is completely peeled off from the first substrate layer by the attaching step, and the surface has an inclined surface inclined at a predetermined angle from a predetermined position. After pasting a first metal layer on the second substrate layer, bending the first metal layer at the predetermined position at the predetermined angle, and further performing the plating step and the mask removing step, Since the second metal layer is separated into the metal body in the metal body separation step, the metal body is free from plastic deformation, has little residual stress, and is specified by a predetermined shape of the second substrate layer surface (inclined surface). A metal body having a highly accurate bent position and a bent portion at an angle is manufactured.

According to the contact probe of the fourth aspect,
A contact probe in which a plurality of pattern wirings are formed on a film, and each tip of these pattern wirings is arranged in a protruding state from the film to be a contact pin, and the metal body having a bent portion according to claim 1 is provided. A technology in which the bent portion is arranged in the middle of the contact pin as a pattern wiring is employed.

In this contact probe, the metal body having the bent portion according to the first aspect is used as a pattern wiring, and the bent portion is disposed at an intermediate position of the contact pin. It is possible to have contact pins bent at various bending positions and angles.

In the method of manufacturing a contact probe according to the present invention, a plurality of pattern wirings are formed on a film, and the tips of the pattern wirings are arranged so as to protrude from the film to form contact pins. A wiring forming step of forming the pattern wiring which is the metal body by the method of forming a metal body having a bent portion according to claim 2 or 3, and arranging the bent portion at an intermediate position of the contact pin. The wiring forming step includes, after the mask removing step, a film applying step of applying the film covering the portion other than the portion provided for the contact pin on the second metal layer. Technology is adopted.

In this method of manufacturing a contact probe,
The method according to claim 2 or 3, further comprising a wiring forming step of forming a pattern wiring which is the metal body by the method of forming a metal body having a bent portion and arranging the bent portion at a position halfway through a contact pin. There is no deformation and little residual stress, and the wedge member or the second
The contact pin bent with high accuracy at the bending position and angle specified by the shape of the substrate layer surface (inclined surface) can be obtained.

[0020]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of a contact probe according to the present invention will be described below with reference to FIGS. In these figures, reference numeral 1 denotes a contact probe, 2 denotes a resin film, 3 denotes a pattern wiring (metal body).
Is shown.

As shown in FIGS. 1 and 2, a contact probe 1 of this embodiment
And has a pattern wiring 3 formed of metal on one surface of the resin film 2.
The tip of the pattern wiring 3 protrudes from an end of the resin film 2 (that is, each side of the central opening K) to be a contact pin (metal body) 3a. At the rear end of the pattern wiring 3, a contact terminal 3b to be contacted with a contact pin on the tester side is formed.

The pattern wiring 3 is formed of a Ni alloy, and the contact pins 3a are formed by coating Au on the surface. The contact pin 3a
As shown in FIG. 2, an intermediate position V of a predetermined length from the tip end
It is bent at.

Next, a method for manufacturing the contact probe 1 will be described in the order of steps with reference to FIGS.

[Base Metal Layer Forming Step (First Metal Layer Forming Step)] First, as shown in FIG. 3A, a stainless steel supporting metal plate (first substrate layer) 5 Cu
Base metal layer (first metal layer) 6 by (copper) plating
To form

[Pattern Forming Step] After a photoresist layer 7 is formed on the base metal layer 6, as shown in FIG. 3B, a predetermined pattern is formed on the photoresist layer 7 by photolithography. A photomask 8 is applied and exposed, and as shown in FIG.
Is developed to remove the portion to be the pattern wiring 3 and form an opening 7a in the remaining photoresist layer (mask) 7.

In the present embodiment, the photoresist layer 7 is formed of a negative type photoresist, but the desired opening 7a is formed by employing a positive type photoresist.
May be formed. In the present embodiment,
The photoresist layer 7 corresponds to a “mask” in the present invention. However, the “mask” in the claims of the present application is:
Like the photoresist layer 7 of the present embodiment, the present invention is not limited to the one in which the opening 7a is formed through the exposure and development steps using the photomask 8. For example, a hole is formed in advance in a portion to be plated (that is, in advance,
A film or the like (formed in a state indicated by reference numeral 7 in FIG. 3C) may be used. In the present invention, when such a film or the like is used as a “mask”, the exposure and development steps in the present embodiment are unnecessary.

[Wedge Inserting Step] After the pattern forming step, the base metal layer 6 is peeled off from the supporting metal plate 5 to a predetermined position W1 as shown in FIG. Then, as shown in FIG. 4B, the wedge member Q is placed between the base metal layer 6 and the supporting metal plate 5.
Insert The wedge member Q has its tip set to a predetermined angle θ in advance. Therefore, in this state, the base metal layer 6 can be bent at the predetermined angle W at the predetermined position W1.

[Plating Step] Then, FIG.
As shown in FIG. 5, a Ni alloy layer (second metal layer) N to be the pattern wiring 3 is formed in the opening 7a by electrolytic plating. At this time, as shown in FIG.
A bent portion BE bent at a predetermined angle θ is formed at a predetermined position W1.

[Mask removal process] After the above plating process,
As shown in FIG. 3E, the photoresist layer 7 is removed.

[Film Adhering Step] Next, FIG.
As shown in FIG. 2, the resin film 2 is adhered to the Ni alloy layer N with an adhesive 2a other than the tip of the pattern wiring 3 shown in FIG. This resin film 2 is a two-layer tape in which a metal film (copper foil) 500 is integrally provided on a polyimide resin PI. Before this film attaching step, the metal film 500 of the two-layer tape using the photoengraving technique is subjected to Cu etching to form a ground pattern, and in this film attaching step, Adhesive 2 of polyimide resin PI of tape
A is applied to the Ni alloy layer N through a. The metal film 500 may be made of Ni, Ni alloy or the like in addition to the copper foil.

[Separation step (metal body separation step)]
As shown in FIG. 4D, after removing the wedge member Q,
As shown in FIG. 3 (g), a portion composed of the resin film 2, the pattern wiring 3 (contact pin 3a) and the base metal layer 6 is completely separated from the supporting metal plate 5 and separated. Further, thereafter, the supporting metal plate 5 is selectively removed through Cu etching, and only the pattern wiring 3 is adhered to the resin film 2. In this state, as shown in FIG. 4E, a contact pin 3a having a bent portion BE bent at a predetermined angle θ at an intermediate position V is formed. That is, the above-described steps constitute a wiring forming step of the contact probe 1 for forming the pattern wiring 3 and the contact pins 3a.

[Gold coating step] Then, as shown in FIG.
Plating is applied to form an Au layer AU on the surface. At this time, the Au layer AU is formed on the entire surface of the contact pins 3a protruding from the resin film 2 over the entire circumference.

Through the above steps, the contact probe 1 in which the pattern wiring 3 is adhered to the resin film 2 as shown in FIGS. 1 and 2 is manufactured.

In the method of manufacturing the contact probe 1, the wedge member Q is inserted between the base metal layer 6 and the supporting metal plate 5 in the wedge insertion step, so that the base metal layer 6
Is bent at a predetermined angle θ at a predetermined position W1, and after performing a plating step and a mask removing step, the Ni alloy layer N is separated by a separating step. The contact pin 3a having the highly accurate bent position and angled bent portion BE specified by the set shape of the wedge member Q is obtained.

Next, the contact probe 1 according to the present invention
Another manufacturing method will be described in the order of steps with reference to FIG.

First, a [base metal layer forming step (first metal layer forming step)] and a [pattern forming step] are performed in the same manner as in the above-described manufacturing method.

[Attaching Step] After the pattern forming step, the base metal layer 6 is completely peeled off from the supporting metal plate 5 as shown in FIG. 5A, and as shown in FIG. An inclined surface G inclined by a predetermined angle θ from a predetermined position W2 on the surface
The peeled base metal layer 6 is attached on the inclined substrate member (second substrate layer) G having the number 1. Accordingly, in this state, the base metal layer 6 can be bent at the predetermined angle θ at the predetermined position W2.

[Plating Process] Then, similarly to the above-described manufacturing method, the pattern wiring 3 is formed in the opening 7a.
A Ni alloy layer (second metal layer) N to be (contact pin 3a) is formed by electrolytic plating. At this time, as shown in FIG. 5C, a bent portion BE bent at a predetermined angle θ is formed at a predetermined position W2.

Thereafter, a [mask removing step] and a [film applying step] are performed in the same manner as in the above-described manufacturing method.

[Separation step (metal body separation step)]
As shown in FIG. 5D, the resin film 2, the pattern wiring 3, and the base metal layer 6 are all peeled off from the inclined substrate member G. Further, as shown in FIG. After that, the supporting metal plate 5 is selectively removed, and only the pattern wiring 3 (contact pin 3 a) is adhered to the resin film 2. In this state, a contact pin 3a having a bent portion BE bent at a predetermined angle θ at an intermediate position V is formed.

Thereafter, in the same manner as in the above-described manufacturing method, the contact probe 1 in which the pattern wiring 3 is adhered to the resin film 2 through the gold coating step is manufactured.

In the method of manufacturing the contact probe 1, in the attaching step, the base metal layer 6 is completely peeled off from the supporting metal plate 5, and the inclined substrate member having the inclined surface G1 inclined from the predetermined position W2 by a predetermined angle θ on the surface. G, a base metal layer 6 is attached, the base metal layer 6 is bent at a predetermined position W2 at a predetermined angle θ, and the plating process and the mask removing process are performed. Since N is separated into the contact pins 3a, similar to the above-described manufacturing method, there is no plastic deformation and little residual stress, and the preset inclined substrate member G
The contact pin 3a having the highly accurate bent position and angled bent portion BE specified by the shape of the surface (inclined surface G1) is manufactured.

Next, an example in which the contact probe 1 is applied to a probe device used for a burn-in test or the like, that is, a so-called chip carrier, will be described with reference to FIGS. In these figures, reference numeral 10 denotes a probe device, 11 denotes a frame body, 12 denotes a positioning plate, 13
Denotes an upper plate, 14 denotes a clamper, and 15 denotes a lower plate. Note that the contact probe according to the present invention functions as a flexible substrate when incorporated in a probe device because the contact probe as a whole is flexible and easily bent.

As shown in FIGS. 6 and 7, the probe device 10 includes a frame main body 11, a positioning plate 12 fixed inside the frame main body and having an opening formed in the center.
The contact probe 1 includes an upper plate (supporting member) 13 for holding the contact probe 1 from above and supporting the same, and a clamper 14 for urging the upper plate 13 from above and fixing the upper plate 13 to the frame body 11. Further, a lower plate 15 for mounting and holding the IC chip I is attached to a lower portion of the frame main body 11 by a bolt 15a.

The center opening K and the contact pins 3a of the contact probe 1 are formed in the shape and the shape of the IC chip I.
It is formed corresponding to the arrangement of the contact pads on the C chip I, and the contact state between the contact pins 3a and the contact pads of the IC chip I can be monitored from the central opening K. Notches are formed in the corners of the central opening K so that the contact probe 1 can be easily assembled.
Can be deformed.

The contact terminal 3 of the contact probe 1
b is set wider than the pitch of the contact pins 3a so that the contact pads of the IC chip I having a narrower pitch and the tester side contact pins having a wider pitch than the contact pads can be easily matched. .

If the contact pads are not formed on all four sides of the IC chip I but are arranged on some of the sides, at least the central opening K corresponding to the part of the sides is formed. It is sufficient to provide the contact pins 3a only on the sides, but in order to stably hold the IC chip I, it is preferable to form the contact pins 3a on two opposing sides and press both opposing sides of the IC chip I. .

A procedure for attaching the IC chip I to the probe device 10 will be described. [Temporary Assembly Step] First, the positioning plate 12 is
And the contact probe 1
Are arranged so that the central opening K and the opening of the frame body 11 are aligned. Then, the upper plate 13 is placed on the central opening K with the openings similarly aligned, and the frame main body 1 is placed on the upper plate 13 from above.
1 is engaged with the clamper 14. Since the clamper 14 is a kind of leaf spring having a bent portion in the center, the clamper 14 has a function of pressing and fixing the upper plate 13 in the locked state.

In the above assembled state, an opening is provided at the center and the IC chip I is attached to this portion, so that the attached IC chip I can be observed from above the opening. The upper plate 13 and the clamper 14 are formed in a substantially rectangular shape on a plane, and as shown in FIG. 7, are assembled so that the contact terminals 3b of the contact probe 1 protrude outward from the long sides.

On the lower surface of the upper plate 13, the vicinity of the opening is inclined at a predetermined inclination angle, and as shown in FIG. 8, the contact pins 3a of the contact probe 1 are inclined downward at a predetermined angle. The IC chip I is placed on the lower plate 15 with the wiring side facing upward. In this state, the lower plate 15 is temporarily fixed to the frame main body 11 from below. At this time, since the distance between the tip of the contact pin 3a of the contact probe 1 and the upper surface of the lower plate 15 is set smaller than the thickness of the IC chip I by a predetermined amount, the IC chip I is sandwiched between the contact pin 3a and the lower plate 15. You.

[Positioning Step] Further, while observing the position of the contact pad of the IC chip I with respect to the tip of the contact pin 3a from above the opening, the positioning plate 12 is moved or the IC chip I is moved by a needle jig or the like. And fine adjustment is set so that the corresponding tip of the contact pin 3a and the contact pad coincide with each other and come into contact with each other.

When the dicing accuracy of the IC chip I is high and the external shape and the position of the contact pad are relatively stable, the positional relationship between the positioning plate 12 and the contact probe 1 must be adjusted in advance. By fixedly assembling, it is possible to match the contact pin 3a with the contact pad without performing the fine adjustment. Thus, the step of aligning the IC chip I becomes unnecessary, and the work of mounting the IC chip I can be performed efficiently and easily.

[Fixing Step] After the positioning step, the lower plate 15 is fixed to the frame body 11 in full scale. At this time, so-called overdrive is applied to the contact pin 3a in the inclined state, and the contact pin 3a is pressed with a predetermined pressing force.
a The tip and the contact pad are in contact with each other to be reliably electrically connected. This state is very similar to the state where the IC chip I is mounted on a so-called multi-chip module or the like, and the operation state of the IC chip I almost mounted can be tested with high reliability.

This probe device 10 is a small chip carrier of about 1 inch square (about 2.5 cm square), and is suitable for a reliability test involving high-temperature heating such as a dynamic burn-in test.

Although the contact probe 1 is applied to the probe device 10 as a chip carrier, other measuring jigs, for example, a probe card in which the contact probe 1 is incorporated into a mechanical part as an IC probe or a contact probe 1 is used as an LCD. The probe for the LCD may be cut into a predetermined shape and used for the LCD probe device.
In this case, the shape of the contact probe, the wiring, the pitch and arrangement of the contact pins, the angle of bending, and the like are set in accordance with each of the probe devices to be incorporated.

[0056]

According to the present invention, the following effects can be obtained. (1) According to the metal body having the bent portion according to claim 1,
The second metal layer was selectively formed by plating on the first metal layer having the inclined surface inclined at the predetermined angle to form a bent portion, and then the second metal layer was separated and formed. In addition, since the bent portion is not formed by bending, but becomes a non-plastically deformed portion, there is no residual stress, and durability can be improved.

(2) According to the method for forming a metal body having a bent portion according to the second aspect, the first wedge member is inserted between the first metal layer and the substrate layer in the wedge insertion step. After bending the metal layer at a predetermined position at a predetermined angle, and further performing a plating step and a mask removing step, the second metal layer is separated into a metal body by a metal body separating step.
It is possible to manufacture a metal body that has no plastic deformation, has little residual stress, and has a highly accurate bent position and a bent portion specified by the shape of the wedge member set in advance.

(3) According to the method for forming a metal body having a bent portion according to the third aspect, the first metal layer is completely peeled off from the first substrate layer in the attaching step, and the surface is fixed to a predetermined position from a predetermined position. Attaching a first metal layer on a second substrate layer having an inclined surface inclined at an angle, bending the first metal layer at the predetermined position at the predetermined angle, further performing a plating process and removing a mask; After performing the step, the second metal layer is separated into the metal body by the metal body separation step, so that the metal body is free from plastic deformation, the residual stress is small, and the predetermined second substrate layer surface (inclined surface) A metal body having a highly accurate bent position and a bent portion at an angle specified by the shape of ()) can be manufactured.

(4) According to the contact probe of the fourth aspect, the metal body having the bent portion according to the first aspect is used as a pattern wiring, and the bent portion is disposed at an intermediate position of the contact pin. In addition to having no residual stress, the contact pin can be bent at an accurate bending position and angle.

(5) According to the method for manufacturing a contact probe according to the fifth aspect, the pattern wiring which is the metal body is formed by the method for forming a metal body having a bent portion according to the second or third aspect, and the bending is performed. Since there is provided a wiring forming step of arranging the portion at an intermediate position of the contact pin, there is no plastic deformation and little residual stress, and the predetermined shape of the wedge member or the surface of the second substrate layer (inclined surface) The contact pin bent with high accuracy at the bending position and angle specified by the above can be obtained. Therefore, the height and length of each contact pin can be easily made uniform without using a bending process and a polishing process, and a highly durable contact probe is manufactured by having a bent portion that is not plastically deformed. can do.

[Brief description of the drawings]

FIG. 1 is an enlarged schematic view illustrating an embodiment of a contact probe according to the present invention.

FIG. 2 is a sectional view taken along line AA of FIG.

FIG. 3 is a fragmentary cross-sectional view showing a manufacturing method in an embodiment of the contact probe according to the present invention in the order of steps.

FIG. 4 is a cross-sectional view of a main part of a contact pin, showing a manufacturing method in an embodiment of the contact probe according to the present invention in the order of steps.

FIG. 5 is a fragmentary cross-sectional view of a contact pin portion showing another manufacturing method in an embodiment of the contact probe according to the present invention in the order of steps;

FIG. 6 is an exploded perspective view of a probe device (chip carrier) using an embodiment of the contact probe according to the present invention.

FIG. 7 is an external perspective view of a probe device (chip carrier) using one embodiment of the contact probe according to the present invention.

8 is an enlarged cross-sectional view taken along line BB of a main part of FIG. 7;

FIG. 9 is an enlarged sectional view of a main part showing a conventional example of a contact probe according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Contact probe 2 Resin film 3 Pattern wiring 3a Contact pin (metal body) 5 Supporting metal plate (substrate layer) 6 Base metal layer (first metal layer) 7 Photoresist layer 10 Probe device 13 Upper plate 500 Metal film AU Au Layer BE bent portion G Inclined substrate member (second substrate layer) G1 Inclined surface I IC chip (measurement target) N Ni alloy layer (second metal layer) PI Polyimide resin Q Wedge member V Midway position W1, W2 Position θ Predetermined angle

Claims (5)

[Claims] 1. A metal body having a bent portion having a predetermined angle, wherein a second metal layer is selectively formed on a first metal layer having an inclined surface inclined at a predetermined angle from a predetermined position on a surface. A metal body having a bent portion, wherein the second metal layer is formed by separating the second metal layer after forming the bent portion to be a non-plastically deformed portion at the predetermined position by plating. 2. A method of forming a metal body having a bent portion at a predetermined angle, comprising: forming a first metal layer of a material to be adhered to or bonded to a material of the metal body on a substrate layer; A forming step, a pattern forming step of applying a mask on the first metal layer other than a portion provided for the metal body, and after the pattern forming step, the first metal layer is positioned at a predetermined position from the substrate layer. And a wedge member is inserted between the first metal layer and the substrate layer to bend the first metal layer at the predetermined position at the predetermined angle, and after the wedge insertion step, A plating step of forming a second metal layer to be provided for the metal body by plating on an unmasked portion on the first metal layer, and forming the bent portion at the predetermined position; A mask removing step of removing the mask; And removing the first metal layer from the substrate layer, selectively removing the first metal layer, and separating the second metal layer to form the metal body as the metal body. A method for forming a metal body having a bent portion, comprising a separating step. 3. A method for forming a metal body having a bent portion at a predetermined angle, wherein a first metal layer of a material to be attached to or bonded to a material of the metal body is formed on a first substrate layer. A metal layer forming step, a pattern forming step of applying a mask on the first metal layer other than a portion provided for the metal body, and after the pattern forming step, the first metal layer
And a first metal layer is stuck on a second substrate layer having a surface inclined at a predetermined angle from a predetermined position on the surface, and the first metal layer is placed at the predetermined position. A bonding step of bending at a predetermined angle, and after the bonding step, a second metal layer provided for the metal body is plated on an unmasked portion on the first metal layer by plating. A plating step of forming and forming the bent portion at the predetermined position; a mask removing step of removing the mask; and removing all of the first metal layer from the second substrate layer again. A metal body separating step of selectively removing said metal layer and separating said second metal layer into said metal body. 4. A contact probe in which a plurality of pattern wirings are formed on a film, and each tip of the pattern wirings is arranged so as to protrude from the film to serve as a contact pin. A contact probe, wherein a metal body is used as the pattern wiring, and the bent portion is disposed at an intermediate position of the contact pin. 5. A method for manufacturing a contact probe, wherein a plurality of pattern wirings are formed on a film, and the tips of the pattern wirings are arranged so as to protrude from the film to form contact pins. Forming a pattern wiring that is the metal body by a method of forming a metal body having a bent portion, and arranging the bent portion at an intermediate position of the contact pin. A method for manufacturing a contact probe, comprising: after the removing step, a film applying step of applying the film covering the portion other than a portion provided for the contact pin on the second metal layer. .