JPH1164380A - Molding method for metallic body with bent part and manufacture of contact probe using the method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make a bent part of high precision and high durability in the manufacture of a metallic body with the bent. SOLUTION: In this method a metallic body 3a is molded with the bent BE part of a prescribed angle θ. In this case, a first metallic layer 6 to be adhered or connected to the material of the body 3a is first formed on the substrate layer 5 with a slope 5a inclined by forming a prescribed angle θ from a prescribed position W on a surface. Next, masking is applied to parts except for a part to be provided for a metallic body 3a on the first metallic layer 6. There after, a second metallic layer N to be provided for the body 3a is formed by coating processing at the non-masked parts on the first metallic layer 6 to mold a bent part BE at a prescribed position. Next, the masking is removed. After then the layer 6 is entirely separated from the layer 5 again, the layer 6 is selectively removed in addition and the layer N is separated to make the body 3a.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming a metal body having a bent portion, a contact probe using the metal body, and a method for manufacturing the same. In addition, the present invention relates to a contact probe which is incorporated in a probe card, a test socket, or the like and performs an electrical test by contacting each terminal of a semiconductor IC chip, a liquid crystal device, and the like, a method of manufacturing the contact probe, and a probe device including the contact probe.

[0002]

2. Description of the Related Art In general, a contact pin is used to conduct an electrical test by contacting a semiconductor chip such as an IC chip or an LSI chip or each terminal of an LCD (liquid crystal display). In recent years, as the integration and miniaturization of IC chips and the like have increased, the pitch of contact pads, which are electrodes, has been reduced, and the pitch of contact pins has been required to be narrower. However, with a tungsten needle contact probe used as a contact pin, it has been difficult to cope with a multi-pin narrow pitch due to the limitation of the diameter of the tungsten needle.

On the other hand, for example, Japanese Patent Publication No. 7-820
No. 27 proposes a contact probe technique in which a plurality of pattern wirings are formed on a resin film, and the ends of these pattern wirings are arranged so as to protrude from the resin film and serve as contact pins. In this technical example, the tip of each of the plurality of pattern wirings is used as a contact pin, thereby achieving a narrow pitch with a large number of pins.
This eliminates the need for many complicated components.

[0004] By the way, the surface of each terminal (pad) of an IC chip or the like formed of an Al (aluminum) alloy or the like is oxidized in the air to be covered with a thin aluminum surface oxide film. I have. Therefore, in order to conduct an electrical test of the pad, it is necessary to remove the surface oxide film of aluminum and expose the aluminum inside to ensure conductivity.

Therefore, in the above-mentioned contact probe, the surface oxide film of aluminum on the pad surface is scraped off by the tip of the contact pin by applying overdrive while the contact pin is in contact with the surface of the pad, thereby removing the aluminum inside. They are exposed.
The above-described operation is called scrub, and is important for reliably performing an electrical test.

In the above contact pins, it is necessary to secure a sufficient contact angle of the contact pins with the pads in order to prevent the base of the pads from being damaged during scrubbing. The reason for this is that if the contact angle is small, the amount of aluminum rejected on the surface becomes extremely large, which affects the pad base.

As a countermeasure, as shown in FIG. 9, a contact probe 601 which is bent at an intermediate position V of a contact pin 600 has been proposed. In the contact probe 601, the angle of the contact pin 600 with respect to the object to be measured (pad) can be changed between the distal end portion and the proximal end portion, and the angle of the contact pin 600 with respect to the pad at the proximal end portion, that is, the pad of the film 602. It is possible to increase the angle (contact angle) between the tip of the contact pin 600 and the pad without increasing the angle with respect to. That is, the contact probe 601 has an advantage that the base of the pad can be prevented from being damaged during the scrub without increasing the scrub distance excessively and without increasing the height of the probe device. .

[0008]

In the method of manufacturing the contact probe 601 having the bent contact pins 600, the contact pins 600 are bent by a precision die. It is difficult to bend the contact pins 600 with high precision by the length and height of the contact pins 600, and the unevenness of the length (height) of the contact pins 600 generated after the bending process is uniformed by a polishing process using sandpaper or the like to achieve uniformity. I had to plan. In addition, at the intermediate position V, which is the bent portion of the contact pin 600 bent in this way, there is a problem that plastic deformation due to the bending occurs, residual stress remains, and durability decreases. Further, the bending may cause a crack or break at the intermediate position V.

The present invention has been made in view of the above-mentioned problems, and provides a method of forming a metal body having a bent portion having high accuracy and high durability, and a method of manufacturing a contact probe using the method. The purpose is to do.

[0010]

The present invention has the following features to attain the object mentioned above. That is, in the method for forming a metal body having a bent portion at a predetermined angle according to claim 1, the material of the metal body is adhered or adhered on a substrate layer having an inclined surface inclined at a predetermined angle from a predetermined position on the surface. A first metal layer forming step of forming a first metal layer of a material to be bonded; a pattern forming step of masking a portion of the first metal layer other than a portion provided for the metal body; A plating step of forming a second metal layer to be provided for the metal body by plating on an unmasked portion on the first metal layer, and forming the bent portion at the predetermined position; A mask removing step of removing the first metal layer from the substrate layer again, further selectively removing the first metal layer, separating the second metal layer, and removing the metal body. And a metal body separation process. Techniques are employed.

In the method of forming a metal body having a bent portion, the first metal layer forming step previously forms an inclined surface at a predetermined angle from a predetermined position on the substrate layer. A first metal layer is formed at the predetermined position in a bent state at the predetermined angle, and the second metal layer is formed by the mask removing step and the metal body separating step.
Since the second metal layer is separated from the first metal layer and the second metal layer is used as the metal layer, there is no plastic deformation and little residual stress, and high precision specified by the shape of the preset substrate layer surface (inclined surface). A metal body having a bent portion and a bent portion at an angle is manufactured.

According to a second aspect of the present invention, there is provided a method for manufacturing a contact probe, wherein a plurality of pattern wirings are formed on a film, and the tips of the pattern wirings are arranged so as to protrude from the film to form contact pins. And forming a pattern wiring that is the metal body by the method of forming a metal body having a bent portion according to claim 1, comprising a wiring forming step of disposing the bent portion at an intermediate position of the contact pin, The wiring forming step includes:
After the mask removing step, a technique including a film applying step of applying the film covering the portion other than the portion provided for the contact pins on the second metal layer is adopted.

In this method of manufacturing a contact probe,
The method for forming a metal body having a bent portion according to claim 1 includes a wiring forming step of forming a pattern wiring that is the metal body and arranging the bent portion at an intermediate position of a contact pin, so that plastic deformation is suppressed. It is possible to obtain a contact pin that is bent with high accuracy at a bent position and angle specified by a predetermined shape of the substrate layer surface (inclined surface) while having little residual stress.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of a method for manufacturing a contact probe according to the present invention will be described below with reference to FIGS. In these figures, reference numeral 1 denotes a contact probe, 2 denotes a resin film, and 3 denotes a pattern wiring (metal body).

As shown in FIGS. 1 and 2, the contact probe 1 manufactured by the manufacturing method according to the present embodiment has a structure having a pattern wiring 3 formed of metal on one surface of a polyimide resin film 2. At the center opening K of the resin film 2, the tip end of the pattern wiring 3 projects from the end of the resin film 2 (that is, each side of the center opening K) and contacts pins (metal bodies) 3.
a. Also, at the rear end of the pattern wiring 3,
Contact terminal 3b to which the contact pin on the tester side is contacted
Are formed.

The pattern wiring 3 is formed of a Ni alloy, and the contact pins 3a are formed by coating Au on the surface. The contact pin 3a
As shown in FIG. 2, an intermediate position V of a predetermined length from the tip end
It is bent at.

Next, a method for manufacturing the contact probe 1 will be described in the order of steps with reference to FIGS.

[Base Metal Layer Forming Step (First Metal Layer Forming Step)] First, as shown in FIG. 3A, Cu (copper) is placed on a supporting metal plate (substrate layer) 5 made of stainless steel. ) A base metal layer (first metal layer) 6 is formed by plating. As shown in FIG. 4A, the supporting metal plate 5 has an inclined surface 5a that is inclined at a predetermined angle θ from a predetermined position W on the surface.

[Pattern Forming Step] After a photoresist layer 7 is formed on the base metal layer 6, as shown in FIG. 3B, a photoresist having a predetermined pattern is formed on the photoresist layer 7 by photolithography. By applying a mask 8 and exposing with parallel light, or by directly drawing with an excimer laser or the like, as shown in FIG. 3 (c), FIG. 4 (b) and FIG. An opening 7a is formed in the photoresist layer (mask) 7 remaining after removing the portion to be the pattern wiring 3.

In the present embodiment, the photoresist layer 7 is formed of a negative type photoresist, but a desired opening 7a is formed by employing a positive type photoresist.
May be formed. In the present embodiment,
The photoresist layer 7 corresponds to a “mask” in the present invention. However, the “mask” in the claims of the present application is:
Like the photoresist layer 7 of the present embodiment, the present invention is not limited to the one in which the opening 7a is formed through the exposure and development steps using the photomask 8. For example, a hole is formed in advance in a portion to be plated (that is, in advance,
A film or the like (formed in a state indicated by reference numeral 7 in FIG. 3C) may be used. In the present invention, when such a film or the like is used as a “mask”, the exposure and development steps in the present embodiment are unnecessary.

[Plating Step] Then, FIG.
As shown in FIG. 5, a Ni alloy layer (second metal layer) N to be the pattern wiring 3 is formed in the opening 7a by electrolytic plating. At this time, as shown in FIG.
A bent portion BE bent at a predetermined angle θ is formed at a predetermined position W.

[Mask removal process] After the above plating process,
As shown in FIG. 3E and FIG. 4D, the photoresist layer 7 is removed.

[Film Adhering Step] Next, FIG.
As shown in FIG. 2, the resin film 2 is adhered to the Ni alloy layer N with an adhesive 2a other than the tip of the pattern wiring 3 shown in FIG. This resin film 2 is a two-layer tape in which a metal film (copper foil) 500 is integrally provided on a polyimide resin PI. Before this film attaching step, the metal film 500 of the two-layer tape is subjected to Cu etching using a photoengraving technique to form a ground pattern. Adhesive 2 of polyimide resin PI of tape
A is applied to the Ni alloy layer N through a. The metal film 500 may be made of Ni, Ni alloy or the like in addition to the copper foil.

[Separation step (metal body separation step)]
As shown in (g) of FIG. 3 and (e) of FIG. 4, the portion composed of the resin film 2, the pattern wiring 3 (contact pins 3 a), and the base metal layer 6 is completely peeled off from the supporting metal plate 5. Let it separate. Further, thereafter, as shown in FIGS. 4F and 5B, the base metal layer 6 was selectively removed through Cu etching, and only the pattern wiring 3 was bonded to the resin film 2. State.
In this state, as shown in FIG. 4F, a contact pin 3a having a bent portion BE bent at a predetermined angle θ at an intermediate position V is formed. That is, the above-described steps constitute a wiring forming step of the contact probe 1 for forming the pattern wiring 3 and the contact pins 3a.

[Gold Coating Step] Then, as shown in FIG.
Plating is applied to form an Au layer AU on the surface. At this time, the Au layer AU is formed on the entire surface of the contact pins 3a protruding from the resin film 2 over the entire circumference.

Through the above steps, the contact probe 1 having the pattern wiring 3 adhered to the resin film 2 as shown in FIGS. 1 and 2 is manufactured.

In the method of manufacturing the contact probe 1, in the first metal layer forming step, the supporting metal plate 5 having the inclined surface 5a which is previously inclined from the predetermined position W to a predetermined angle θ.
Is used, the base metal layer 6 is formed in a bent state at a predetermined angle W at a predetermined position W by the plating process, and the Ni alloy layer N is separated by the mask removing process and the metal body separating process. With no residual stress and a predetermined supporting metal plate 5
Contact pin 3 having highly accurate bent position and angled bent portion BE specified by the shape of the surface (inclined surface)
a is manufactured.

Next, an example in which the contact probe 1 manufactured by the above manufacturing method is applied to a probe device used for a burn-in test or the like, that is, a so-called chip carrier, will be described.
This will be described with reference to FIGS. In these figures, reference numeral 10 denotes a probe device, 11 denotes a frame body, 1
2 denotes a positioning plate, 13 denotes an upper plate, 14 denotes a clamper, and 15 denotes a lower plate. Note that the contact probe according to the present invention functions as a flexible substrate when incorporated in a probe device because the contact probe as a whole is flexible and easily bent.

As shown in FIGS. 6 and 7, the probe device 10 includes a frame main body 11, a positioning plate 12 fixed inside the frame main body and having an opening formed in the center.
The contact probe 1 includes an upper plate (supporting member) 13 for holding the contact probe 1 from above and supporting the same, and a clamper 14 for urging the upper plate 13 from above and fixing the upper plate 13 to the frame body 11. Further, a lower plate 15 for mounting and holding the IC chip I is attached to a lower portion of the frame main body 11 by a bolt 15a.

The central opening K and the contact pin 3a of the contact probe 1 are formed by the shape and the I of the IC chip I.
It is formed corresponding to the arrangement of the contact pads on the C chip I, and the contact state between the contact pins 3a and the contact pads of the IC chip I can be monitored from the central opening K. Notches are formed in the corners of the central opening K so that the contact probe 1 can be easily assembled.
Can be deformed.

The contact terminal 3 of the contact probe 1
b is set wider than the pitch of the contact pins 3a so that the contact pads of the IC chip I having a narrower pitch and the tester side contact pins having a wider pitch than the contact pads can be easily matched. .

If the contact pads are not formed on all four sides of the IC chip I but are arranged on some of the sides, at least the central opening K corresponding to the part of the sides is formed. It is sufficient to provide the contact pins 3a only on the sides, but in order to stably hold the IC chip I, it is preferable to form the contact pins 3a on two opposing sides and press both opposing sides of the IC chip I. .

A procedure for attaching the IC chip I to the probe device 10 will be described. [Temporary Assembly Step] First, the positioning plate 12 is
And the contact probe 1
Are arranged so that the central opening K and the opening of the frame body 11 are aligned. Then, the upper plate 13 is placed on the central opening K with the openings similarly aligned, and the frame main body 1 is placed on the upper plate 13 from above.
1 is engaged with the clamper 14. Since the clamper 14 is a kind of leaf spring having a bent portion in the center, the clamper 14 has a function of pressing and fixing the upper plate 13 in the locked state.

In the above assembled state, an opening is provided at the center and the IC chip I is attached to this portion, so that the attached IC chip I can be observed from above the opening. The upper plate 13 and the clamper 14 are formed in a substantially rectangular shape on a plane, and as shown in FIG. 7, are assembled so that the contact terminals 3b of the contact probe 1 protrude outward from the long sides.

On the lower surface of the upper plate 13, the vicinity of the opening is inclined at a predetermined inclination angle, and as shown in FIG. 8, the contact pins 3a of the contact probe 1 are inclined downward at a predetermined angle. The IC chip I is placed on the lower plate 15 with the wiring side facing upward. In this state, the lower plate 15 is temporarily fixed to the frame main body 11 from below. At this time, since the distance between the tip of the contact pin 3a of the contact probe 1 and the upper surface of the lower plate 15 is set smaller than the thickness of the IC chip I by a predetermined amount, the IC chip I is sandwiched between the contact pin 3a and the lower plate 15. You.

[Positioning Step] Further, while observing the position of the contact pad of the IC chip I with respect to the tip of the contact pin 3a from above the opening, the positioning plate 12 is moved or the IC chip I is moved with a needle-like jig or the like. And fine adjustment is set so that the corresponding tip of the contact pin 3a and the contact pad coincide with each other and come into contact with each other.

When the dicing accuracy of the IC chip I is high and the external shape and the position of the contact pad are relatively stable, the positional relationship between the positioning plate 12 and the contact probe 1 must be adjusted in advance. By fixedly assembling, it is possible to match the contact pin 3a with the contact pad without performing the fine adjustment. Thus, the step of aligning the IC chip I becomes unnecessary, and the work of mounting the IC chip I can be performed efficiently and easily.

[Fixing Step] After the positioning step, the lower plate 15 is fully fixed to the frame body 11. At this time, so-called overdrive is applied to the contact pin 3a in the inclined state, and the contact pin 3a is pressed with a predetermined pressing force.
a The tip and the contact pad are in contact with each other to be reliably electrically connected. This state is very similar to the state where the IC chip I is mounted on a so-called multi-chip module or the like, and the operation state of the IC chip I almost mounted can be tested with high reliability.

The probe device 10 is a small chip carrier of about 1 inch square (about 2.5 cm square), and is suitable for a reliability test involving high-temperature heating such as a dynamic burn-in test.

In this embodiment, the contact probe 1 applied to the probe device 10 as a chip carrier is used.
To manufacture contact jigs to be incorporated into mechanical parts as IC probes to apply to other measurement jigs, such as probe cards, and to manufacture contact probes used in LCD probe devices as LCD probes. You may apply it. in this case,
Corresponding to each built-in probe device, the contact probe shape, wiring, contact pin pitch and arrangement,
The bending angle and the like are set.

[0041]

According to the present invention, the following effects can be obtained. (1) According to the method for manufacturing a metal body having a bent portion according to the first aspect, the first metal layer forming step forms an inclined surface which is previously inclined at a predetermined angle from a predetermined position on the substrate layer by the first metal layer forming step. After the second metal layer is formed at a predetermined position by bending at a predetermined angle by plating, the second metal layer is separated into the metal body, so that the bent portion becomes a non-plastically deformed portion. The durability can be improved without remaining, and a highly accurate bending position and angle can be easily obtained.

According to a second aspect of the present invention, there is provided a method for manufacturing a metal body having a bent portion according to the first aspect of the present invention, wherein a pattern wiring which is the metal body is formed and the bent portion is positioned at an intermediate position of the contact pin. Since there is provided a wiring forming step to be disposed on the substrate layer, there is no plastic deformation and there is little residual stress, and the wire is bent with high precision at a bending position and an angle specified by a predetermined shape of the substrate layer surface (inclined surface). Contact pins can be obtained. Therefore, the height and length of each contact pin can be easily made uniform without using a bending process and a polishing process, and a highly durable contact probe is manufactured by having a bent portion that is not plastically deformed. can do.

[Brief description of the drawings]

FIG. 1 is an enlarged schematic view showing a contact probe manufactured by one embodiment of a method for manufacturing a contact probe according to the present invention.

FIG. 2 is a sectional view taken along line AA of FIG.

FIG. 3 is a fragmentary cross-sectional view showing one embodiment of a method for manufacturing a contact probe according to the present invention in the order of steps;

FIG. 4 is a cross-sectional view of a main part of a contact pin portion showing one embodiment of a method for manufacturing a contact probe according to the present invention in the order of steps.

FIG. 5 is a perspective view of a main part of a contact pin portion showing a state after a pattern forming step and a separating step in one embodiment of the method for manufacturing a contact probe according to the present invention.

FIG. 6 is an exploded perspective view of a probe device (chip carrier) using an embodiment of the contact probe according to the present invention.

FIG. 7 is an external perspective view of a probe device (chip carrier) using one embodiment of the contact probe according to the present invention.

8 is an enlarged cross-sectional view taken along line BB of a main part of FIG. 7;

FIG. 9 is an enlarged sectional view of a main part showing a conventional example of a contact probe according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Contact probe 2 Resin film 3 Pattern wiring 3a Contact pin (metal body) 5 Support metal plate (substrate layer) 5a Inclined surface 6 Base metal layer (first metal layer) 10 Probe device 13 Upper plate 500 Metal film AU Au layer BE bent portion I IC chip N Ni alloy layer (second metal layer) PI polyimide resin V Intermediate position W Predetermined position θ Predetermined angle

Claims (2)

[Claims] 1. A method for forming a metal body having a bent portion having a predetermined angle, wherein the metal body is adhered or bonded to a material of the metal body on a substrate layer having an inclined surface inclined at a predetermined angle from a predetermined position on the surface. A first metal layer forming step of forming a first metal layer of a material; a pattern forming step of masking a portion of the first metal layer other than a portion provided for the metal body; A second metal layer to be provided for the metal body is formed by plating on an unmasked portion of the metal layer, and a plating step of forming the bent portion at the predetermined position; and removing the mask. A mask removing step of removing the first metal layer from the substrate layer again, selectively removing the first metal layer, and separating the second metal layer into the metal body Having a metal body separation process. Forming method of the metal body to symptoms. 2. A method for manufacturing a contact probe, wherein a plurality of pattern wirings are formed on a film, and the tips of the pattern wirings are arranged so as to protrude from the film to form contact pins. Forming a pattern wiring that is the metal body by a method of forming a metal body having a portion, and arranging the bent portion at an intermediate position of the contact pin, wherein the wiring forming step includes the mask removing step Forming a film covering the portion of the second metal layer other than the portion provided for the contact pins.