JP5693351B2 - Board built-in housing - Google Patents

Description

  The present invention particularly relates to a board built-in housing that houses therein a board on which an electronic component that generates heat is mounted.

  In a case where a substrate on which a heat generating electronic component is mounted is housed and sealed, a device is devised to dissipate heat from the heat generating electronic component outside the case by natural cooling. In addition, some devices have been devised not only for the housing but also for the substrate on which the heat generating electronic components are mounted. For example, in Patent Document 1, when a heat generating electronic component and a weak heat resistant electronic component are mounted on the same substrate, heat is conducted from the heat generating electronic component to the weak heat resistant electronic component by limiting the arrangement of the electronic components on the substrate. In addition, a heat-dissipating component is provided in the heat transfer path from the heat-generating electronic component to the weak heat-resistant electronic component, and a flexible heat-transfer member is provided between the heat-dissipating component and the inner wall of the housing. The idea is made.

  In Patent Document 2, surface treatment with high infrared emissivity is applied to the inner surface of the housing to improve heat absorption characteristics inside the housing.

JP 2008-211043 A JP-A-4-84496

  However, the housing disclosed in Patent Document 1 has the following problems. That is, the heat dissipation component provided in the middle of the heat transfer path from the heat generating electronic component to the weak heat resistant electronic component is connected to the inner wall of the housing via the heat transfer member. Therefore, when a plurality of substrates having heat generating electronic components, heat radiating components, and weak heat-resistant electronic components are installed, the heat radiating components are placed on the inner wall of the housing by arranging the substrates so as to overlap each other in a plane. Some boards cannot be connected. Therefore, there is a restriction that weak heat-resistant electronic components cannot be mounted on the board that cannot face the inner wall of the case, or there is a problem that the whole case becomes large when each board is shifted in a plane. To do. Further, Patent Document 1 does not disclose a method for attaching a substrate to a housing, and it is unclear how heat conduction is performed from the substrate itself to the housing.

  In Patent Document 2, the circuit board installed in the casing is attached to the casing via a spacer, and heat conduction from the circuit board itself to the casing is not good.

  The present invention has been made to solve such problems, and each board has a heat generating electronic component mounted thereon, and the heat generating electronic component on each board is smaller and more efficiently cooled than before. An object is to provide a built-in housing.

In order to achieve the above object, the present invention is configured as follows.
In other words, the housing for incorporating a substrate in one embodiment of the present invention is a housing that houses and seals a plurality of wiring boards on which at least heat generating electronic components are mounted in a stacking direction in the thickness direction of the wiring board. A housing with a built-in board that dissipates heat released from a component to the outside through the housing by natural convection, and includes a plurality of mounting seats for attaching each wiring board to the inside of the housing with a built-in board. Each mounting seat is formed integrally with the first wall by projecting from the wall surface of the first wall along the thickness direction of the wiring board to the inside of the housing, of the wall portion of the substrate housing. It has the mounting surface which mounts a wiring board and mounts a wiring board in direct contact with a wiring board.

  According to the substrate built-in housing in one aspect of the present invention, the mounting seat integrally formed with the inner wall of the housing is provided, and the wiring substrate is directly mounted on the mounting seat. Therefore, the heat conduction from the heat generating electronic component to the housing through the wiring board and the mounting seat is improved compared to the conventional case, the heat generating electronic component can be efficiently cooled, and the entire housing is miniaturized. be able to.

FIG. 11 is a cross-sectional view in the II direction in FIG. 10 of the substrate built-in housing according to the first embodiment of the present invention. It is a figure for demonstrating an example of the installation place of the attachment seat in the housing | casing for board | substrates shown in FIG. It is a figure for demonstrating the other example of the installation place of the attachment seat in the housing | casing for board | substrates shown in FIG. FIG. 11 is a cross-sectional view in the II direction in FIG. 10 of the board built-in housing according to the second embodiment of the present invention. It is a figure for demonstrating an example of the installation place of the mounting seat in the housing | casing for board | substrates shown in FIG. It is a figure for demonstrating the other example of the installation place of the mounting seat in the housing | casing for board | substrates shown in FIG. It is a figure which shows the housing | casing for board | substrate incorporation in Embodiment 3 of this invention, (a) is the III-III direction sectional view in FIG. 10, (b) is the II direction sectional view in FIG. 10, (c). FIG. 11 shows a sectional view in the II-II direction in FIG. It is a figure for demonstrating the example of arrangement | positioning of the mounting seat in the housing | casing for board | substrates shown in FIG. 7, (a) of the said board | substrate housing | casing is a III-III sectional view in FIG. 10, (b) 10 is a cross-sectional view in the II direction in FIG. 10, and FIG. 10C is a cross-sectional view in the II-II direction in FIG. It is a figure for demonstrating the example of arrangement | positioning of the mounting seat in the housing | casing for board | substrates shown in FIG. 7, (a) of the said board | substrate housing | casing is a III-III sectional view in FIG. 10, (b) 10 is a cross-sectional view in the II direction in FIG. 10, and FIG. 10C is a cross-sectional view in the II-II direction in FIG. It is a perspective view for demonstrating the structure of the housing | casing for board | substrate incorporation in Embodiment 4 of this invention. FIG. 11 is a cross-sectional view in the II direction of a mounting seat portion in the board built-in housing illustrated in FIG. 10. FIG. 11 is a cross-sectional view in the II direction in FIG. 10 of the substrate built-in housing according to the fifth embodiment of the present invention. It is II sectional view taken on the line in FIG. 10 of the attachment seat part of the housing | casing for board | substrate incorporation in Embodiment 6 of this invention. It is II sectional view taken on the line in FIG. 10 of the housing | casing for board | substrate incorporation in Embodiment 7 of this invention. It is II sectional view taken on the line in FIG. 10 of the housing | casing for board | substrate incorporation in Embodiment 8 of this invention. It is a top view of the housing | casing for board | substrate incorporation shown to FIG. 15A. It is a front view of the housing | casing for board | substrate incorporation shown to FIG. 15A. It is the II-II direction sectional drawing in FIG. 10 which shows typically the attachment form of the wiring board in each embodiment of this invention.

A case for embedding a substrate according to an embodiment of the present invention will be described below with reference to the drawings. In each figure, the same or similar components are denoted by the same reference numerals.
In the embodiments described below, the board-embedded housing contains a plurality of wiring boards on which at least electronic components that generate heat are mounted, and is housed in a sealed manner by stacking them in the thickness direction of the wiring boards. The case is a case that dissipates heat released from the heat-generating electronic component to the outside through the case by natural convection. In the following, various embodiments of such a case with a built-in substrate will be described.

Embodiment 1 FIG.
FIG. 1 shows a substrate built-in housing 101 according to the first embodiment. The board built-in housing 101 is composed of two housing parts 10a and 10b made of metal or resin. Each casing component 10a, 10b has a U-shaped concave shape in cross section, and is connected by screwing (not shown) or the like with the opening 10c in each of the casing components 10a, 10b facing each other. In the present embodiment, the heat dissipating fins 5 are attached to the outer wall 13 of the casing component 10b. The board built-in casing 101 configured as described above is sealed by housing two wiring boards 2 in the casing inner side 101a.

  Each wiring board 2 is mounted with at least one or a plurality of electronic components (heat generating electronic components) 3 that generate heat, and is arranged on the inner side 101a of the casing in the thickness direction 2a of the wiring board 2. Note that electronic components of a type other than the heat generating electronic component 3 can be mounted on the wiring board 2. Thus, in order to arrange each wiring board 2 on the inside 101a of the casing, the casing components 10a and 10b have mounting seats 111 for the wiring board 2 at a plurality of locations.

  The mounting seat 111 is integrally formed with the first wall 112 in the thickness direction 2a of the wiring board 2 in the wall portion of the board built-in housing 101, and from the inner wall 112a of the first wall 112 to the housing inner side 101a. Protruding. Such a mounting seat 111 has a mounting surface 111a on which the wiring board 2 is mounted and in direct contact with the wiring board 2. The wiring board 2 placed and supported on the placement surface 111 a is attached to the attachment seat 111 with screws 6. Further, the mounting seat 111 can be formed in the corners of the housing components 10a and 10b as shown in FIG. 2 or in the middle of the first walls 112 of the housing components 10a and 10b as shown in FIG.

  By providing the mounting seats 111 on the casing components 10a and 10b, the thermal resistance between the heat generating electronic component 3 mounted on the wiring substrate 2 and the casing components 10a and 10b can be reduced as in the conventional case. It becomes smaller than the case where a spacer is interposed between the two. Therefore, the heat of the heat generating electronic component 3 mounted on each wiring board 2 can be efficiently transferred to the housing components 10a and 10b. Moreover, in this embodiment, the structure which the components for heat radiation like the past is connected to a housing | casing inner wall via a heat-transfer member is not taken. Therefore, as described above, the plurality of wiring boards 2 can be arranged so as to overlap each other, and the entire board-embedded casing 101 can be downsized.

Embodiment 2. FIG.
FIG. 4 shows a case 102 with a built-in substrate according to the second embodiment of the present invention. In the first embodiment, the wiring board 2 is attached to each of the housing components 10a and 10b. However, in the second embodiment, a configuration in which a plurality of wiring boards 2 are attached to only one of the housing parts is adopted. . In the following description, only different components will be described, and description of the other parts will be omitted.

  The board built-in casing 102 according to the second embodiment includes casing parts 20a and 20b corresponding to the casing parts 10a and 10b described above, and a mounting seat 111 is formed only on the casing part 20b. In the casing component 20b, the mounting seat 111 is formed in a stepped shape on the inner wall 112a of the first wall 112 of the casing component 20b. By arranging the mounting seats 111 in this way, in each mounting seat 111, the respective mounting surfaces 111 a do not overlap with the projection surface in the plate thickness direction 2 a of the wiring board 2. Therefore, a plurality of wiring boards 2 can be attached only to the casing component 20b in a stacking direction 2a.

Further, the mounting seat 111 can be formed in the corner of the housing part 20b as shown in FIG. 5 or in the middle of the first wall 112 of the housing part 20b as shown in FIG.
The substrate built-in housing 102 according to the second embodiment configured as described above can improve the heat transfer efficiency and reduce the size of the housing, similarly to the substrate built-in housing 101 according to the first embodiment.

Embodiment 3 FIG.
7 to 9 show the substrate built-in housing 103 according to the third embodiment of the present invention. In each of FIGS. 7 to 9, (a) is a plan view, (b) is a front view of (a), and (c) is a right side view of (b).
The substrate built-in housing 103 is composed of housing components 30a and 30b as in the first and second embodiments. 7 to 9 illustrate either one of the housing components 30a and 30b. The differences between the above-described embodiments and the case 103 with a built-in substrate according to the third embodiment are the arrangement of the mounting seats 111 and the number of wiring boards 2. Therefore, in the following description, only different components will be described, and description of the other parts will be omitted.

  The mounting seat 111 is formed on the inner wall 112a of the first wall 112 in at least one of the housing components 30a and 30b, similarly to the configuration of the above-described embodiment. In the third embodiment, since three wiring boards 2 are provided in at least one of the housing components 30a and 30b, for example, as shown in FIG. 7, the mounting surface 111a of each mounting seat 111 has a plate thickness. The projection surfaces in the direction 2a are arranged so as not to overlap each other. The placement surface 111a may be placed as shown in FIGS. Here, the arrangement shown in FIG. 8 is a form translated in the extending direction 2b of the wiring board 2, and the mounting seat 111 is stepped only in the left-right direction in FIGS. 8 (a) and 8 (b). Provided. Further, the arrangement shown in FIG. 9 is a form in which the wiring board 2 is translated left and right and up and down in FIG. 9A, and the mounting seat 111 is shown in FIG. Are formed in a stepped shape.

  The substrate built-in housing 103 according to the third embodiment configured as described above can improve the heat transfer efficiency and reduce the size of the housing, similarly to the substrate built-in housing 101 according to the first embodiment.

Embodiment 4 FIG.
10 and 11 show a substrate built-in housing 104 according to the fourth embodiment of the present invention. The substrate built-in housing 104 includes a first lid-type housing 41, a second lid-type housing 42, and a frame-type housing 43. The first lid type casing 41 and the second lid type casing 42 are concave casings having closing plate members 41 a and 42 a that seal the inside of the board built-in casing 104. The frame-type housing 43 is disposed between the first lid-type housing 41 and the second lid-type housing 42, and is composed of one or a plurality of frames having a frame shape (□ shape) without a closing plate material. Is the body. The first lid-type housing 41 and the second lid-type housing 42 are fixed to both sides of the frame-type housing 43 with screws or the like so as to close the inside of the frame-type housing 43.

  In the substrate built-in housing 104, the mounting seat 111 is formed on the inner wall 112a of the first wall 112 in the frame-shaped housing 43 as shown in FIG. Therefore, the frame-type housing 43 has two wiring boards 2 attached thereto. Further, the heat conducting member 4 is bridged between the mounting seats 111 so as to be in contact with the upper surface of the heat generating electronic component 3 in at least one of the two wiring boards 2. The heat conductive member 4 is a plate material having high thermal conductivity, and is, for example, a metal plate of aluminum or copper.

  When the mounting seat 111 has the form shown in FIG. 11, the wiring board 2 having the same size can be attached to the frame-type housing 43. Further, the mounting seat 111 may take a stepped form as described in the second and third embodiments.

  The substrate built-in housing 104 according to the fourth embodiment configured as described above can improve the heat transfer efficiency and reduce the size of the housing, similarly to the substrate built-in housing 101 according to the first embodiment.

Embodiment 5 FIG.
FIG. 12 shows a substrate built-in housing 105 according to the fifth embodiment of the present invention. The substrate built-in housing 105 has a configuration in which the heat conductive member 4 having high thermal conductivity described in the fourth embodiment is provided. The case component 50 constituting the substrate built-in case 105 corresponds to the case components 10a, 10b, 20a, 20b, 30a, 30b described in the first to third embodiments. Further, in the case component 50, the heat conducting member 4 is bridged between the mounting seats 111 so as to contact the upper surface of the heat generating electronic component 3 mounted on the wiring board 2 as described in the fourth embodiment. Alternatively, one end of the first wall 112 of the housing component 50 is connected to the inner wall 112a.

  The board built-in case 105 in the fifth embodiment configured as described above can improve the heat transfer efficiency and reduce the size of the case in the same manner as the board built-in case 101 in the first embodiment. Further, the substrate built-in housing 105 can achieve the effects described below.

That is, when the heat generating electronic component 3 and the low heat resistant electronic component are mounted on the same wiring board 2, the heat generated by the heat generating electronic component 3 is conducted through the wiring board 2 to reach the low heat resistant electronic component. There is also a risk of damage to the electronic components.
Therefore, as in the fifth embodiment, by providing the heat conducting member 4 between the mounting seats 111 and the like, the heat generated by the heat generating electronic component 3 is conducted not only to the wiring board 2 but also to the heat conducting member 4. Thus, since the heat transfer path from the heat generating electronic component 3 to the housing component 50 is increased, the risk of destruction of the low heat resistant electronic component can be reduced. Further, if the low heat resistant electronic component is acceptable, the same or different high heat conductive member 4 is attached so as to be in contact with the low heat resistant electronic component and orthogonal to the wall surface of the housing component 50, A heat dissipation effect can be obtained.

Embodiment 6 FIG.
FIG. 13 shows a board built-in case 106 according to the sixth embodiment of the present invention, and the board built-in case 106 includes a case component 60. Here, the casing component 60 corresponds to the casing components 10 a, 10 b, 20 a, 20 b, 30 a, 30 b, 50 and the frame-type casing 43 described in the first to fifth embodiments. The wiring board 2 includes an insulating layer 207, a wiring pattern 208, and a ground pattern 209, and the heat generating electronic component 3 is connected to the wiring pattern 208 and the ground pattern 209. Further, the ground pattern 209 has an exposed portion 209a at a portion of the mounting seat 111 that contacts the mounting surface 111a of the wiring board 2 in more detail, and the ground pattern 209 and the exposed portion 209a are connected. ing. In the present embodiment, the ground pattern 209 and the exposed portion 209a are formed of a copper material having good thermal conductivity.

  The board built-in case 106 in the sixth embodiment configured as described above can improve the heat transfer efficiency and reduce the size of the case in the same manner as the board built-in case 101 in the first embodiment. Furthermore, the following effects can be obtained.

  That is, as described above, the heat generating electronic component 3 is connected to the ground pattern 209, and the ground pattern 209 is in direct contact with the mounting seat 111 of the housing component 60 via the exposed portion 209a. Become. Therefore, the heat of the heat generating electronic component 3 is conducted to the housing component 60 through the ground pattern 209, the exposed portion 209a, and the mounting seat 111. Therefore, it is possible to cool the heat-generating electronic component 3 more efficiently than when the insulating layer 207 in the wiring board 2 and the mounting seat 111 of the housing component 60 are brought into contact with each other.

Embodiment 7 FIG.
FIG. 14 shows a case 107 with a built-in substrate according to the seventh embodiment of the present invention. The case 107 with a built-in substrate has a case component 70. Here, the casing component 70 corresponds to the casing components 10a, 10b, 20a, 20b, 30a, 30b described in the first to third embodiments. The configurations in Embodiments 4 to 6 can also be applied to the substrate housing 107.

  In the case component 70, the inner wall 71 a of the second wall 71 along the extending direction 2 b of the wiring board 2 has an uneven shape 72 corresponding to the shape of the electronic component mounted on the wiring board 2. Further, the heat radiating fins 5 are provided on the outer wall of the casing component 70. Here, the heat radiating fins 5 are formed so that the tips of the heat radiating fins 5 are aligned with the portion 73 that protrudes most outward in the housing component 70.

  The substrate built-in case 107 in the seventh embodiment configured as described above can improve the heat transfer efficiency and reduce the size of the case in the same manner as the substrate built-in case 101 in the first embodiment. Furthermore, the following effects can be obtained. That is, by forming the inner wall 71a of the second wall 71 in the casing component 70 into the concavo-convex shape 72 and aligning the tips of the radiating fins 5, for example, the electronic components that were simply spaces in the casing components 10a and 10b in the first embodiment are used. The gap between the component and the inner wall of the housing is narrowed, and the length of the heat dissipating fin 5 is increased by the amount that the gap is narrowed. Therefore, a larger volume of the radiating fins 5 can be secured in the casing component 70, and the heat-generating electronic component 3 can be cooled more efficiently.

Embodiment 8 FIG.
15A to 15C show the substrate built-in housing 108 according to Embodiment 8 of the present invention. The substrate built-in housing 108 is configured according to the configuration of the substrate built-in housing 104 described with reference to FIG. 10, and further, the configuration of the seventh embodiment described above is compared with the housing component 41. The applied configuration is provided. In addition to the heat generating electronic component 3, an electromagnetic wave transmitting / receiving element 8 is mounted on the wiring board 2. Therefore, the substrate built-in case 108 is a case of a substrate for electromagnetic wave transmission / reception equipment, and therefore has the following configuration.

  That is, the second lid housing 42 adjacent to the transmission / reception element 8 is made of a resin that hardly attenuates the signal so that the transmission signal and the reception signal from the transmission / reception element 8 can be transmitted and received with high sensitivity. Further, in order to suppress disturbance to the transmission signal and the reception signal, it is preferable that the thickness of the second wall 42b in the second lid type casing 42 facing the transmission / reception element 8 is constant, and there is no unevenness. Is preferred. In this embodiment, the thickness of the 2nd wall 42b is constant, and the unevenness | corrugation is not formed in the 2nd wall 42b.

  Further, in order to suppress the leakage magnetic field from the transmission / reception element 8, a magnetic shielding plate may be mounted between the wiring board 2 provided with the transmission / reception element 8 and the other wiring board 2. Further, the magnetic shield plate may be used as the high thermal conductive material 4.

  Further, as shown in FIGS. 15B and 15C, the control signal wiring and the power supply wiring 81 and their pins 81a may be collectively provided on the housing wall, preferably the upper and lower surfaces in the gravity direction 2c, more preferably Providing on the upper surface does not hinder natural convection around the housing and can dissipate heat more efficiently. In FIG. 15C, the direction of the arrow in the gravity direction 2c indicates the ground side.

  Further, when the substrate built-in housing 108 is used outdoors, the substrate built-in housing 108 preferably has a watertight structure, and each of the housing components 41, 42, 43 constituting the substrate built-in housing 108. It is preferable to provide a sealing material such as an O-ring, packing or adhesive in between. In this case, the inside of the substrate housing 108 becomes hot during operation, and the internal air may expand to increase the internal pressure. Therefore, a waterproof vent plug 82 may be provided as shown in FIGS. 15B and 15C. . The mounting position of the waterproof vent plug 82 is the housing wall in the same manner as the mounting position of the wiring 81.

In this embodiment, the configuration according to the configuration of the case 104 with built-in substrate is taken as an example. However, the present invention is not limited to this configuration, and the electromagnetic wave transmitting / receiving element 8 is provided in the case in the configuration in other embodiments. It can also be decorated.
An example of the electromagnetic wave transmitting / receiving element 8 corresponds to an element that transmits and receives millimeter waves. Such an electromagnetic wave transmitting / receiving device substrate is mounted on, for example, a car.

Each embodiment has been described above, but the configuration is not limited to that described above, and modifications such as those described below can be adopted.
For example, in each of the first to eighth embodiments, the screw 6 is used to fix the wiring board 2 to the mounting seat 111. However, the screw 6 is not limited to the screw 6, and may be fixed with a bolt / nut, a rivet or the like. Also good.
Further, as shown in FIG. 11, when the wiring board 2 is attached from both sides of the mounting seat 111, the screw holes for attaching the wiring board 2 may be penetrated and fixed with one set of bolts and nuts.

Further, as shown in FIG. 16 as an example, the outer shape of the wiring board 2 may be any shape, and may not be the above-described configuration as long as the mounting portion of the wiring board 2 does not overlap the projection surface.
Moreover, the fixing method of the highly heat-conductive material 4 and a housing | casing component may be attached by a screw, welding, etc., and may be integrally molded with a housing | casing component.

The size of the radiating fins 5 and the interval between the radiating fins 5 may be any shape, and may be omitted if the radiating fins 5 are unnecessary.
Further, in the casing component 10b having the heat radiation fins 5 or the like, a portion adjacent to a component having a high internal electronic component may be a smooth surface on both the inside and the outside, and a label relating to the device may be attached. In order to achieve such a configuration, parts having high electronic parts may be densely packed.

  In the drawings showing the first to eighth embodiments, only two or three casing parts are shown, but the number of casing parts is not limited, and any number may be used.

2 Wiring board, 2c Gravitational direction, 3 Heating electronic components, 4 Heat conduction member,
5 radiating fins, 8 transmitting / receiving elements, 41 first lid type housing, 42 second lid type housing,
43 frame type housing, 71 2nd wall, 72 uneven shape,
81 wiring, 81a wiring pin, 82 waterproof vent plug,
101-108 Housing for built-in substrate, 111 mounting seat, 112 first wall,
209 Ground pattern, 209a Exposed portion.

Claims (8)

A casing in which a plurality of wiring boards mounted with at least electronic components that generate heat are stacked in the thickness direction of the wiring board and housed inside and sealed, and heat radiated from the electronic parts is naturally convected through the casing. A board built-in housing that diffuses outside,
A plurality of mounting seats are provided for mounting each wiring board inside the board built-in housing, and each mounting seat is along the thickness direction of the wiring board within the wall portion of the board built-in housing. It is the first wall and integrally formed to protrude from the wall surface of the first wall to the housing interior, and have a mounting surface for performing the mounting of the wiring board in direct contact with the wiring substrate by disposing the wiring substrate,
Further, the substrate built-in housing is sandwiched between first and second lid-type housings having a closing plate member that seals the inside of the substrate built-in housing, and the first and second lid-type housings. It is composed of one or a plurality of frame-type housings arranged in a frame shape without a closing plate material,
The mounting seat is formed on the inner wall of the frame-shaped housing, and the outer wall of the frame-shaped housing has heat radiation fins along the direction of gravity.
A board built-in case characterized by the above. A casing in which a plurality of wiring boards mounted with at least electronic components that generate heat are stacked in the thickness direction of the wiring board and housed inside and sealed, and heat radiated from the electronic parts is naturally convected through the casing. A board built-in housing that diffuses outside,
A plurality of mounting seats are provided for mounting each wiring board inside the board built-in housing, and each mounting seat is along the thickness direction of the wiring board within the wall portion of the board built-in housing. It is the first wall and integrally formed to protrude from the wall surface of the first wall to the housing interior, and have a mounting surface for performing the mounting of the wiring board in direct contact with the wiring substrate by disposing the wiring substrate,
The inner wall of the second wall along the extending direction of the wiring board in the wall portion of the board built-in housing corresponds to the shape of the electronic component mounted on the wiring board. It has a concavo-convex shape that becomes convex toward the wiring board in a region that is not mounted than a region that is mounted,
The outer wall surface of the substrate built-in housing opposite to the inner wall of the second wall has an uneven shape corresponding to the uneven shape of the inner wall, and the inner wall is convex toward the wiring substrate. The corresponding outer wall surface of the built-in housing is concave,
The outer wall surface is provided with a heat radiating fin with the tip aligned at the most protruding part to the outside,
The heat dissipating fins have different lengths depending on the uneven shape on the inner wall of the second wall.
A board built-in case characterized by the above. Each of the mounting seat is placed without overlapping one another in projection plane in the sheet thickness direction of the wiring board, according to claim 1 or 2 Symbol mounting substrate internal casing of. Each of the mounting seat, are arranged in a staircase pattern, according to claim 1 or 2 substrate internal housing according. A plurality of wiring board is attached to the frame-type housing, the substrate internal housing according to claim 1 Symbol placement.   6. The substrate built-in according to claim 1, wherein the wiring board has an exposed portion that contacts the mounting seat, and the exposed portion is connected to a ground pattern included in the wiring substrate. Enclosure. 7. The heat conduction member according to claim 1, further comprising a heat conduction member having a high thermal conductivity that extends along the wiring board from the first wall , bridges between the mounting seats, and contacts the heat generating electronic component. The housing for incorporating a substrate according to item 1. The wiring board further includes an electromagnetic wave transmission / reception element. The transmission / reception element is incorporated in a board built-in housing mounted on the vehicle and transmits / receives millimeter waves. The housing | casing for board | substrate incorporation of any one of Claim 1 to 7 with which the housing | casing which opposes an element is resin, and the thickness is constant.

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