JP5698894B2 - Heat dissipation structure for electronic components - Google Patents

Heat dissipation structure for electronic components Download PDF

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JP5698894B2
JP5698894B2 JP2008274159A JP2008274159A JP5698894B2 JP 5698894 B2 JP5698894 B2 JP 5698894B2 JP 2008274159 A JP2008274159 A JP 2008274159A JP 2008274159 A JP2008274159 A JP 2008274159A JP 5698894 B2 JP5698894 B2 JP 5698894B2
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heat
shield case
electronic component
housing
heat dissipation
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JP2010103342A5 (en
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勇人 久津摩
勇人 久津摩
小林　孝
小林　　孝
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Mitsubishi Electric Corp
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Description

本発明は、回路基板上に搭載され、シールドケースで電磁シールドされる発熱部品の発生する熱を放熱する放熱構造に関するものである。   The present invention relates to a heat dissipation structure that dissipates heat generated by a heat generating component that is mounted on a circuit board and electromagnetically shielded by a shield case.

光信号でデータの送受信を行う宅内光通信装置にあっては、データの送受信に加えて近年、映像信号を配信するサービスが普及しつつある。映像信号を処理する回路は高周波信号を取り扱う必要があるため、回路を構成する電子部品は、妨害となる電磁ノイズを輻射したり、逆に外部からの電磁ノイズの影響を受けたりすることを防ぐためにシールドケースで覆われている。一方、シールドケース内の電子部品の中には発熱部品もあり、この発熱部品の発生する熱を放熱させる必要があり、従来においても幾つかの放熱構造が提案されている。   In home optical communication devices that transmit and receive data using optical signals, in addition to data transmission and reception, services that distribute video signals have become widespread in recent years. Since a circuit that processes video signals must handle high-frequency signals, the electronic components that make up the circuit are prevented from radiating electromagnetic noise that interferes with it, and from being affected by external electromagnetic noise. It is covered with a shield case. On the other hand, some of the electronic components in the shield case include a heat generating component, and it is necessary to dissipate the heat generated by the heat generating component, and several heat dissipation structures have been proposed in the past.

特許文献１には、シールドケースを内部へ突出させ、この突出部を発熱部品に当接させることで発熱部品の発生する熱をシールドケースに熱伝導させて放熱する放熱構造が記載されている。この構造により発熱部品は放熱できるとともに、電磁ノイズの影響を防止することができる。   Patent Document 1 describes a heat dissipation structure in which a shield case is protruded to the inside, and heat generated by the heat generating component is thermally conducted to the shield case by bringing the protruding portion into contact with the heat generating component. With this structure, the heat generating component can dissipate heat, and the influence of electromagnetic noise can be prevented.

特開平１０−１９０２６３号公報JP-A-10-190263

従来の放熱構造は、突出部により発熱部品の発生する熱をシールドケースに熱伝導させているが、シールドケースに熱伝導した後の放熱には言及されていなく、自然放熱によって筐体外部へ放熱されるものと想定される。そこで、さらに放熱効果を改善するためにシールドケースに放熱フィンを設けることも考えられるが、放熱効果を上げるためにはフィン構造を大きくする必要があり、筐体自体が大きくなってしまう。また、筐体外へ放熱するためには空気を流通させる開口を筐体に設ける必要があるが、開口を設けると外部から筐体内へ塵埃が侵入する恐れがあり、防塵対策が必要になってしまう等の問題点があった。   In the conventional heat dissipation structure, the heat generated by the heat generating component is conducted to the shield case by the protrusion, but heat dissipation after heat conduction to the shield case is not mentioned, and heat is released to the outside of the housing by natural heat dissipation. It is assumed that In order to further improve the heat dissipation effect, it is conceivable to provide heat dissipation fins in the shield case. However, in order to increase the heat dissipation effect, it is necessary to enlarge the fin structure, and the casing itself becomes large. Moreover, in order to dissipate heat to the outside of the housing, it is necessary to provide an opening for circulating air in the housing. However, if the opening is provided, dust may enter the housing from the outside, and measures against dust are required. There was a problem such as.

本発明に係る電子部品の放熱構造は、複数の電子部品を搭載した回路基板と、この回路基板上に搭載された発熱部品を含む一部の電子部品を覆って該電子部品を電磁シールドするシールドケースと、このシールドケースと同じ部材であり、上記回路基板の上記発熱部品の搭載面に対向する該シールドケースの内面の一部にあって、上記発熱部品の一つの外面の略全域に対応して突出して形成され、該発熱部品の発生する熱を上記発熱部品の一つの外面の略全域から上記シールドケースの外面へ伝達する伝達部と、上記回路基板及びシールドケースを収納する筐体と、この筐体を構成する一つの内面に一方の面の略全域が密着するとともに、他方の面の一部が上記シールドケースの一つの外面の全域に密着した熱拡散板とから構成され、上記熱拡散板に密着した上記シールドケースの一つの外面と、上記伝達部の形成された上記シールドケースの内面とは、表裏関係にあるものである。

The heat dissipation structure for an electronic component according to the present invention includes a circuit board on which a plurality of electronic components are mounted, and a shield that electromagnetically shields the electronic component by covering a part of the electronic components including a heat generating component mounted on the circuit board. A case and the same member as the shield case, which is part of the inner surface of the shield case facing the mounting surface of the heat generating component of the circuit board and corresponds to substantially the entire area of one outer surface of the heat generating component. A transmission part that projects from the substantially entire area of one outer surface of the heat generating component to the outer surface of the shield case, and a housing that houses the circuit board and the shield case. this one inner surface constituting the casing with substantially the entire area of one surface are in close contact, a portion of the other side is composed of a heat diffusion plate in close contact with the entire range of one of the outer surface of the shield case, the heat And one of the outer surface of the shield case in close contact with the diffusion plate, the formed inner surface of the shield case of the transmission portion, are intended to be the front and back relationship.

本発明によれば、発熱部品の一つの外面の略全域から伝達部を介してシールドケースの外面に伝達した熱を、一方の面の一部がシールドケース伝達部を有する内面に対応する外面の略全域に密着した熱拡散板により、筐体を構成する一つの内面へ放熱するように構成したので、放熱フィン等を設ける必要がなく、小型で効率的な放熱構造が得られる効果がある。

According to the present invention, the heat transfer to the outer surface of the shield case from substantially the entire region of one outer surface of the heat generating component via a transmission unit, a part of one surface of the outer surface corresponding to the inner surface having a shield case transmission unit Since the heat diffusing plate in close contact with the entire area is configured to radiate heat to one inner surface constituting the housing, there is no need to provide heat radiating fins and the like, and there is an effect that a small and efficient heat radiating structure can be obtained.

実施の形態１．
図１は本発明の実施の形態１に係る電子部品の放熱構造を示した断面図であり、１は電子部品２、２１を搭載した回路基板であり、電子部品２１は発熱部品である。３は回路基板１上で電子部品２１を覆い電磁シールドするシールドケースで、電子部品２１に当接する突起部が形成されている。なお、この実施の形態１では発熱部品である電子部品２１のみをシールドケース３内に収容しているが、放熱させる必要のない他の電子部品を収容するものであってもよい。４は伝熱効率を上げるための伝熱シート、５は一面が筐体６内面の略全域に密着し、他方の面が伝熱シート４を介してシールドケース３の外面の全域に密着した熱拡散板である。 Embodiment 1 FIG.
FIG. 1 is a cross-sectional view showing a heat dissipation structure for an electronic component according to Embodiment 1 of the present invention, wherein 1 is a circuit board on which electronic components 2 and 21 are mounted, and electronic component 21 is a heat generating component. Reference numeral 3 denotes a shield case that covers and electronically shields the electronic component 21 on the circuit board 1, and has a protrusion that contacts the electronic component 21. In the first embodiment, only the electronic component 21 that is a heat-generating component is accommodated in the shield case 3, but other electronic components that do not need to be radiated may be accommodated. 4 is a heat transfer sheet for increasing heat transfer efficiency, and 5 is a heat diffusion in which one surface is in close contact with the entire inner surface of the housing 6 and the other surface is in close contact with the entire outer surface of the shield case 3 through the heat transfer sheet 4. It is a board.

即ち、シールドケース３内の電子部品２１の発生する熱は伝熱シート４を介してシールドケース３に形成された突起部に伝達され、該シールドケース３の外面に向かって放熱される。シールドケース３は外面の全域が伝熱シート４を介して熱拡散板５と密着しており、シールドケース３外面に伝達した熱は外面の全域から効率よく熱拡散板５へ放熱される。また、熱拡散板５に伝達した熱は、熱拡散板５内部を伝わって筐体６と接触する面全体から放熱するため、筐体６外面の略全域から外部へ放熱される。したがって、電子部品２１の発生する熱は伝熱シート４、シールドケース３、伝熱シート４、熱拡散板５を伝達して熱拡散板５と接触した筐体６面の外側面の略全域から効率的に外部へ放熱される。   That is, the heat generated by the electronic component 21 in the shield case 3 is transmitted to the protrusions formed on the shield case 3 via the heat transfer sheet 4 and is radiated toward the outer surface of the shield case 3. The entire outer surface of the shield case 3 is in close contact with the heat diffusion plate 5 via the heat transfer sheet 4, and the heat transmitted to the outer surface of the shield case 3 is efficiently radiated from the entire outer surface to the heat diffusion plate 5. Further, since the heat transmitted to the heat diffusion plate 5 is dissipated from the entire surface contacting the housing 6 through the inside of the heat diffusion plate 5, it is dissipated from substantially the entire outer surface of the housing 6 to the outside. Therefore, the heat generated by the electronic component 21 is transmitted from the heat transfer sheet 4, the shield case 3, the heat transfer sheet 4, and the heat diffusion plate 5 from substantially the entire outer surface of the housing 6 surface that contacts the heat diffusion plate 5. Heat is efficiently radiated to the outside.

この実施の形態１によれば、効率的な放熱効果が得られるとともに、放熱フィンをシールドケース３に設けて放熱する従来技術に対して筐体６形状を大幅に小型化できる効果がある。また、熱拡散板５及び筐体６内面を密着させ筐体６外部へ放熱するので、筐体６を密閉構造にすることができ、外部から筐体６内へ塵埃が侵入することを防止することができる効果がある。
実施の形態２．
図２は本発明の実施の形態２に係る電子部品の放熱構造を示した断面図であり、図１と同一符号は同一又は相当部分を示す。 According to the first embodiment, an efficient heat dissipation effect is obtained, and there is an effect that the shape of the housing 6 can be greatly reduced as compared with the conventional technique for dissipating heat by providing heat dissipation fins in the shield case 3. Further, since the heat diffusing plate 5 and the inner surface of the housing 6 are brought into close contact with each other to dissipate heat to the outside of the housing 6, the housing 6 can be sealed, and dust can be prevented from entering the housing 6 from the outside. There is an effect that can.
Embodiment 2. FIG.
2 is a cross-sectional view showing a heat dissipation structure for an electronic component according to Embodiment 2 of the present invention. The same reference numerals as those in FIG. 1 denote the same or corresponding parts.

実施の形態２に係る電子部品の放熱構造は、熱拡散板５を筐体６ａにインサート成型したものである。電子部品２１の発生した熱は、伝熱シート４、シールドケース３、熱拡散板５を介して筐体６ａに伝熱され、外部へ放熱する。熱拡散板５は筐体６ａにインサート成型されているので、熱拡散板５及び筐体６ａ間の接触熱抵抗を低減することができる。したがって、熱拡散板５及び筐体６ａ間の伝熱効果が上がるので、上述した実施の形態１のシールドケース３と熱拡散板５との間に配置する伝熱シート４を省略することもできる。
実施の形態３．
図３は本発明の実施の形態３に係る電子部品の放熱構造を示した断面図であり、図１と同一符号は同一又は相当部分を示す。 The heat dissipation structure for an electronic component according to the second embodiment is obtained by insert-molding the heat diffusion plate 5 into the housing 6a. The heat generated by the electronic component 21 is transferred to the housing 6a via the heat transfer sheet 4, the shield case 3, and the heat diffusion plate 5, and is radiated to the outside. Since the heat diffusion plate 5 is insert-molded in the housing 6a, the contact thermal resistance between the heat diffusion plate 5 and the housing 6a can be reduced. Therefore, since the heat transfer effect between the heat diffusing plate 5 and the housing 6a is improved, the heat transfer sheet 4 disposed between the shield case 3 and the heat diffusing plate 5 of the first embodiment described above can be omitted. .
Embodiment 3 FIG.
FIG. 3 is a cross-sectional view showing a heat dissipation structure for an electronic component according to Embodiment 3 of the present invention, and the same reference numerals as those in FIG. 1 denote the same or corresponding parts.

実施の形態３に係る電子部品の放熱構造は、シールドケースと熱拡散板とをダイカスト製法により一体化構造としたシールドケース３ａとして構成したものである。一体化したことで放熱構造部材（シールドケース及び熱拡散板）の接触箇所を減らすことができ、伝熱シートを省略できる。また、部品数が削減されるので、組み立て工数を低減でき、組立て性を向上できる効果がある。
実施の形態４．
図４は本発明の実施の形態４に係る電子部品の放熱構造を示した断面図であり、図１と同一符号は同一又は相当部分を示す。 The heat dissipation structure for an electronic component according to Embodiment 3 is configured as a shield case 3a in which a shield case and a heat diffusing plate are integrated by a die casting method. By integrating, the contact location of the heat radiating structure member (shield case and heat diffusion plate) can be reduced, and the heat transfer sheet can be omitted. Moreover, since the number of parts is reduced, it is possible to reduce the number of assembling steps and improve the assemblability.
Embodiment 4 FIG.
4 is a cross-sectional view showing a heat dissipation structure for an electronic component according to Embodiment 4 of the present invention. The same reference numerals as those in FIG. 1 denote the same or corresponding parts.

実施の形態４に係る電子部品の放熱構造は、回路基板１とシールドケース３との間にスプリング等の弾性部材を配置し、熱拡散板５を筐体６内面に押し付ける構成としたものである。この構成により、シールドケース３と熱拡散板５及び熱拡散板５と筐体６内面とをより一層密着させることができるので、接触熱抵抗を低減することができるとともに、シールドケース３と熱拡散板５との間に配置する伝熱シートを省略することができる。
実施の形態５．
図５は本発明の実施の形態５に係る電子部品の放熱構造を示した断面図であり、図１と同一符号は同一又は相当部分を示す。 The heat dissipation structure for an electronic component according to the fourth embodiment is configured such that an elastic member such as a spring is disposed between the circuit board 1 and the shield case 3 and the heat diffusion plate 5 is pressed against the inner surface of the housing 6. . With this configuration, the shield case 3 and the heat diffusing plate 5 and the heat diffusing plate 5 and the inner surface of the housing 6 can be further adhered to each other. A heat transfer sheet disposed between the plate 5 and the plate 5 can be omitted.
Embodiment 5 FIG.
FIG. 5 is a sectional view showing a heat dissipation structure for an electronic component according to Embodiment 5 of the present invention, and the same reference numerals as those in FIG. 1 denote the same or corresponding parts.

実施の形態５に係る電子部品の放熱構造は、熱拡散板５と接触する筐体６ｂ面を内側に撓ませた構成としたものである。この構成により、筐体６ｂ内面と熱拡散板５とをより密着させることができる。図５では筐体６ｂ面の撓みを強調して記載しているが内部部品を筐体６ｂ内へ収納した状態では撓ませた部分が略直線状になり、熱拡散板５と筐体６ｂとの略全域が密着する。この実施の形態５によっても、シールドケース３と熱拡散板５及び熱拡散板５と筐体６内面とをより一層密着させることができるので、シールドケース３と熱拡散板５との間に配置する伝熱シートを省略することができる。   The heat dissipation structure for an electronic component according to the fifth embodiment is configured such that the surface of the housing 6b that contacts the heat diffusion plate 5 is bent inward. With this configuration, the inner surface of the housing 6b and the heat diffusion plate 5 can be more closely attached. In FIG. 5, the bending of the surface of the housing 6 b is emphasized, but when the internal components are housed in the housing 6 b, the bent portions are substantially straight, and the heat diffusion plate 5 and the housing 6 b The almost whole area of is closely attached. Also according to the fifth embodiment, the shield case 3 and the heat diffusing plate 5 and the heat diffusing plate 5 and the inner surface of the housing 6 can be further adhered to each other, so that the shield case 3 and the heat diffusing plate 5 are arranged. It is possible to omit the heat transfer sheet.

本発明は、シールドケース内の電子部品が発生する熱を外部へ放熱する放熱構造を必要とする電子機器、特に小型化が望まれる電子機器に適用される。   The present invention is applied to an electronic device that requires a heat dissipation structure that dissipates heat generated by an electronic component in a shield case to the outside, particularly an electronic device that is desired to be downsized.

本発明の実施の形態１に係る電子部品の放熱構造を示す断面図である。It is sectional drawing which shows the thermal radiation structure of the electronic component which concerns on Embodiment 1 of this invention. 本発明の実施の形態２に係る電子部品の放熱構造を示す断面図である。It is sectional drawing which shows the thermal radiation structure of the electronic component which concerns on Embodiment 2 of this invention. 本発明の実施の形態３に係る電子部品の放熱構造を示す断面図である。It is sectional drawing which shows the thermal radiation structure of the electronic component which concerns on Embodiment 3 of this invention. 本発明の実施の形態４に係る電子部品の放熱構造を示す断面図である。It is sectional drawing which shows the thermal radiation structure of the electronic component which concerns on Embodiment 4 of this invention. 本発明の実施の形態５に係る電子部品の放熱構造を示す断面図である。It is sectional drawing which shows the thermal radiation structure of the electronic component which concerns on Embodiment 5 of this invention.

符号の説明Explanation of symbols

１ 回路基板 ２、２１ 電子部品 ３ シールドケース ４ 伝熱シート ５ 熱拡散板 ６ 筐体   DESCRIPTION OF SYMBOLS 1 Circuit board 2, 21 Electronic component 3 Shield case 4 Heat transfer sheet 5 Heat diffusion board 6 Case

Claims (5)

複数の電子部品を搭載した回路基板、
この回路基板上に搭載された発熱部品を含む一部の電子部品を覆って該電子部品を電磁シールドするシールドケース、
このシールドケースと同じ部材であり、上記回路基板の上記発熱部品の搭載面に対向する該シールドケースの内面の一部にあって、上記発熱部品の一つの外面の略全域に対応して上記発熱部品の高さに合わせて突出させて形成され、該発熱部品の発生する熱を上記発熱部品の一つの外面の略全域から上記シールドケースの外面へ伝達する伝達部、
上記回路基板及びシールドケースを収納する筐体、
この筐体を構成する一つの内面に一方の面の略全域が密着するとともに、他方の面の一部が上記シールドケースの一つの外面の全域に密着した熱拡散板を備え、
上記熱拡散板に密着した上記シールドケースの一つの外面と、上記伝達部の形成された上記シールドケースの内面とは、表裏関係にあることを特徴とする電子部品の放熱構造。 Circuit boards with multiple electronic components,
A shielding case for electromagnetically shielding the electronic component by covering a part of the electronic component including the heat-generating component mounted on the circuit board;
The heat generating member is the same member as the shield case and is located on a part of the inner surface of the shield case facing the mounting surface of the heat generating component of the circuit board, corresponding to substantially the entire area of one outer surface of the heat generating component. A transmission part that is formed so as to protrude according to the height of the component, and that transmits heat generated by the heat-generating component from substantially the entire area of one outer surface of the heat-generating component to the outer surface of the shield case;
A housing for housing the circuit board and the shield case;
This one inner surface constituting the casing with substantially the entire area of one surface is in close contact, with a heat diffusing plate portion of the other surface in close contact with the entire range of one of the outer surface of the shield case,
A heat dissipation structure for an electronic component, wherein one outer surface of the shield case in close contact with the heat diffusing plate and an inner surface of the shield case on which the transmission portion is formed are in a front-back relationship . 発熱部品と伝達部との間には伝熱シートが介在されていることを特徴とする請求項１に記載の電子部品の放熱構造。 The heat dissipation structure for an electronic component according to claim 1, wherein a heat transfer sheet is interposed between the heat generating component and the transmission portion. 熱拡散板及びシールドケースは一体に形成されていることを特徴とする請求項１または２のいずれか１項に記載の電子部品の放熱構造。 Radiating structure for an electronic component according to any one of claims 1 or 2 heat dissipating plate and the shield case is characterized in that it is formed integrally. 熱拡散板は筐体の内面にインサート成型されていることを特徴とする請求項１または２のいずれか１項に記載の電子部品の放熱構造。 3. The heat dissipation structure for an electronic component according to claim 1, wherein the heat diffusion plate is insert-molded on the inner surface of the housing. 4. シールドケースと熱拡散板との間には伝熱シートが介在されていることを特徴とする請求項１、２または請求項４のいずれか１項に記載の電子部品の放熱構造。 Radiating structure for an electronic component according to any one of claims 1, 2 or claim 4, characterized in that the heat transfer sheet is interposed between the shield case and the heat diffusion plate.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11393739B2 (en) 2018-03-08 2022-07-19 Denso Corporation Heat dissipation device for electronic component

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5565608B2 (en) * 2009-09-25 2014-08-06 株式会社オートネットワーク技術研究所 Circuit unit
JP2016127341A (en) * 2014-12-26 2016-07-11 富士通株式会社 Radio equipment
WO2016163135A1 (en) * 2015-04-08 2016-10-13 三菱電機株式会社 Electronic module and electronic device
US9781819B2 (en) * 2015-07-31 2017-10-03 Laird Technologies, Inc. Multifunctional components for electronic devices and related methods of providing thermal management and board level shielding
JP2017212379A (en) * 2016-05-26 2017-11-30 株式会社ジェイテクト Semiconductor device
CN106231883A (en) * 2016-07-28 2016-12-14 广东欧珀移动通信有限公司 Pcb board assembly and there is its mobile terminal
JP7326138B2 (en) * 2019-12-06 2023-08-15 サクサ株式会社 Heat dissipation structure in electronic equipment
WO2024039395A1 (en) * 2022-08-16 2024-02-22 Google Llc Wireless network device operable in the 6 ghz band
CN116406156B (en) * 2023-06-09 2023-08-18 中国科学院微小卫星创新研究院 Electromagnetic shielding and heat dissipation integrated satellite-borne electronic system and assembly method thereof

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5748455A (en) * 1996-04-23 1998-05-05 Ericsson, Inc. Electromagnetic shield for a radiotelephone
JPH1041678A (en) * 1996-07-25 1998-02-13 Hitachi Ltd Optical receiver
US6195267B1 (en) * 1999-06-23 2001-02-27 Ericsson Inc. Gel structure for combined EMI shielding and thermal control of microelectronic assemblies
JP2004207661A (en) * 2002-12-26 2004-07-22 Sony Corp Heat radiation member and electronic apparatus therewith
KR100652621B1 (en) * 2003-11-21 2006-12-06 엘지전자 주식회사 Apparatus preventing discharging heat for portable terminal
JP4525460B2 (en) * 2005-05-12 2010-08-18 富士通株式会社 Mobile device
JP2008277432A (en) * 2007-04-26 2008-11-13 Kaneka Corp Heat dissipation structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11393739B2 (en) 2018-03-08 2022-07-19 Denso Corporation Heat dissipation device for electronic component

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