JP2006303374A - Heat radiating device in electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve the problems due to thermal influence, by efficiently radiating the heat generated from a heat-generating component or the like in all directions. <P>SOLUTION: The radiation of the generated heat from the heat generating component 7 is shielded by a heat insulating plate member 9, provided between a cover member 6 at the upper part of the heat generating component 7 mounted on a circuit board 3, the heat generated from the heat generating component 7 is transmitted to a heat radiation plate member 11 and a heat radiation sheet 12 provided on the bottom surface side of the circuit board 3 facing the mounting region of the heat generating component 7, and the heat is radiated. Thus, the temperature rise of the cover member and the inside is suppressed by the heat generated from the heat generating component. Also, by efficiently radiating the generated heat that is generated from the heat generating component and suppressing the temperature rise, an electronic component or the like will operate at stable operation, and reliability is improved. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a heat dissipation device that is provided in an electronic device having a heat generating component mounted on a circuit board or the like and efficiently dissipates heat generated from the heat generating component.

  In an electronic device, an insulating cover for maintaining insulation, a shield cover for reducing the influence of electromagnetic waves, and the like are assembled on a wiring board on which a large number of electronic components are mounted. In an electronic device, more heat is generated from a CPU, an integrated circuit element, a driver circuit element, or the like with multi-function, higher functionality, downsizing, and the like. In an electronic device, since heat generated from an electronic component or the like is heated up inside the cover, there is a problem in that the operation characteristics of the electronic component having low heat resistance are affected and reliability is lowered. Moreover, in an electronic device, a housing | casing becomes high temperature unexpectedly with the heat trapped inside, and gives a big uneasiness to a user.

  In general, an electronic device has a structure that suppresses the high temperature of each component or case by dissipating heat generated from the electronic component or the like by providing the case with an appropriate heat dissipation device such as a heat sink or a heat dissipation fan. It has been adopted. In an electronic device, since such a heat dissipation device is large and heavy, it is necessary to configure the mounting member such as a casing to have sufficient mechanical strength and installation space as well as to increase the size as a whole. Used in the stationary type.

Japanese Patent Laid-Open No. 5-67893

  By the way, in electronic devices, the smaller the power consumption, the smaller the heat generated from the electronic components, etc., but the more electronic components to be mounted and the power consumption are increased in response to the increase in functionality and functionality. It is difficult to achieve a desired heat dissipation while holding. For example, along with the start of the terrestrial digital broadcasting service, a tuner device having the reception function has been developed.

  In the above tuner device, by including a receiving circuit module, many molecular components that generate relatively large heat, such as a diode on the power supply circuit side or a dropper or tuner component on the main board side, are mounted. ing.

  In the tuner device, the housing is often made of metal in order to improve the heat radiation efficiency and function as a ground, and part of the housing may become unexpectedly hot due to the heat generated from each part described above. is there. There has been a problem that touching the heated casing causes anxiety to the user.

  In the tuner device, for example, by inserting an appropriate heat insulating member between the housing and the heat generating component, the generated heat generated from the heat generating component is blocked and diffused to suppress a partial increase in the temperature of the housing. Correspondence is also planned. However, heat that is to be radiated by being radiated to the outside through the housing or diffused inside by the heat insulating member is trapped inside, raising the internal temperature and reducing the operating characteristics of electronic components, etc. Various problems such as shortening the service life occur.

  Accordingly, an object of the present invention is to provide a heat radiating device in an electronic device that efficiently radiates heat generated from a heat-generating component or the like to solve the above-described problem caused by the thermal effect.

  The heat dissipating device in the electronic apparatus according to the present invention that achieves the above-described object is a cover that covers the entire substrate on which a heat generating component composed of a heat dissipating component such as an electronic component generating a large heat or a heat sink is mounted together with various normal electronic components. The member is provided in an electronic device attached to the chassis. The heat dissipating device in the electronic device according to the present invention is provided in a heat insulating plate provided so as to be interposed between the cover member and at least an upper portion of the heat generating component, and at least a lower portion of the substrate facing the mounting region of the heat generating component. A heat dissipation plate and a heat dissipation sheet are provided.

  The heat insulating plate is formed of, for example, a thin metal plate having a high thermal conductivity, and is provided between the heat insulating component and the cover member. The heat insulating plate is attached to the substrate or the chassis so as to cover the heat generating components individually or to cover a region where a plurality of heat generating components are mounted. The heat insulating plate suppresses the increase in the temperature of the cover member by blocking the radiation generated from the heat generating component to the cover member.

  The heat radiating plate is formed in a pedestal shape using a metal material having a high thermal conductivity such as aluminum material or copper material, and is provided on the bottom surface of the substrate at least facing the mounting area of the heat generating component so as to support the substrate. Fixed on the chassis. The heat radiating plate radiates heat by conducting heat from the heat-generating component mounting portion of the board, which becomes high temperature by heat generated from the heat-generating component, to the chassis side.

The heat radiating sheet is formed into a sheet shape by, for example, an elastic silicone sheet or the like, and is joined to the bottom surface of the substrate or the receiving surface of the heat radiating plate facing the mounting portion of the heat generating component. The heat dissipating sheet is in close contact with the bottom surface of the substrate and the receiving surface of the heat dissipating plate so that heat conduction from the substrate to the heat dissipating plate is efficiently performed to promote heat dissipation. The heat dissipation sheet is provided between the heat dissipation plate and the substrate in an elastically deformed state in the thickness direction. In the heat dissipation device for electronic equipment, the heat insulating plate covers and blocks the heat generated from the heat-generating components and diffuses. Reduces the temperature of the member. In a heat dissipation device for electronic equipment, the heat generated from the heat generating component is conducted to the chassis side by the heat radiating plate and the heat radiating sheet to efficiently dissipate the heat, thereby suppressing the temperature rise of the heat generating component, and the heat insulating plate and the substrate. The high temperature of the space part between is also suppressed.

  According to the heat dissipating device in the electronic device according to the present invention, the heat insulating plate provided between the heat generating component and the cover member, the heat dissipating plate and the heat dissipating sheet provided in the lower portion of the substrate facing the mounting region of the heat generating component, Therefore, it is possible to suppress the temperature rise of the cover member and the internal heat generated by the heat generated from the heat-generating component and efficiently radiate the heat generated from the heat-generating component to suppress the temperature increase. Reliability can be improved by performing stable operation.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The embodiment shows a tuner device 1 having a heat radiating device 2 that has a reception function of digital terrestrial broadcasting and that radiates heat generated from a heat generating component 7 described later in detail. In the tuner device 1, as shown in FIGS. 1 and 2, the heat dissipation device 2 is provided on a circuit board 3 that constitutes a receiving circuit module, a power supply circuit module unit, and the like. The circuit board 3 is fixed onto the stud 4 by screwing, so that the circuit board 3 is assembled on the inner surface of the metal chassis 5 that also serves as a housing.

  In the tuner device 1, a cover member 6 that covers the entire circuit board 3 is attached to the chassis 5. The cover member 6 is formed in a substantially box shape by a thin metal plate or the like that has been subjected to insulation treatment, and retains electrical insulation by covering the circuit board 3. The cover member 6 is grounded when the leg portion is mechanically and electrically connected to the chassis 5, and exhibits a shielding action by blocking electromagnetic waves. The cover member 6 also has a function of radiating heat generated inside the tuner device 1 to the outside as will be described later.

  The circuit board 3 constitutes, for example, a receiving circuit module that receives digital terrestrial broadcasting, a power supply circuit module unit, and the like. On the circuit board 3, a large number of lands and wiring patterns are appropriately formed on the first main surface 3a. By fixing electrodes on each land, a dropper, a high-frequency signal processing circuit element, a power supply diode, etc. A heat generating component 7 made of an integrated circuit element or electronic component that generates relatively large heat, or a normal component 8 such as an integrated circuit element or electronic component that does not generate much heat is mounted.

  The tuner device 1 is provided with a heat insulating plate member 9 so as to cover the heat generating component 7. The heat insulating plate member 9 includes a main surface portion 9a that is sufficient to cover the heat-generating component 7 with a thin metal plate such as an aluminum plate or a copper plate having a high conductivity, and a plurality of integrally bent portions formed on the outer peripheral portion of the main surface portion 9a. It is comprised from the leg part 9b. As shown in FIG. 1, the heat insulating plate member 9 has each leg portion 9 b fixed on the circuit board 3 with screws 4 a so as to surround the heat generating component 7 and face the circuit board 3. In the mounted state, each part of the heat insulating plate member 9 is kept insulated from the heat generating component 7, the normal component 8, or the wiring pattern, and the main surface portion 9a is interposed between the heat generating component 7 and the inner surface of the cover member 6. .

  In the tuner device 1, when a plurality of heat generating components 7 are mounted on the first main surface 3 a of the circuit board 3 in a relatively narrow region, the heat insulating plate member 9 collectively covers these heat generating components 7. It is formed with a sufficient shape.

  The tuner device 1 is provided with a heat radiating plate member 11 and a heat radiating sheet 12 located on the second main surface 3 b side of the circuit board 3. The heat radiating plate member 11 is formed of a metal material such as an aluminum material or a copper material, which has a high thermal conductivity and has a predetermined thickness and thus has a mechanical strength. The heat dissipating plate member 11 has a main surface portion 11a having an outer dimension slightly larger than the mounting surface of the heat dissipating component 7 on the circuit board 3, and a substantially L-shaped cross section integrally formed on the outer peripheral portion of the main surface portion 11a. It is formed in the shape of a pedestal comprising leg portions 11b. In the heat radiating plate member 11, each leg portion 11 b is formed with a slightly lower height than each stud 4 that assembles the circuit board 3 to the chassis 5.

  As shown in FIG. 1, the heat radiating plate member 11 fixes the leg portion 11 b to the inner surface of the chassis 5 so that the main surface portion 11 a is positioned on the second main surface 3 b of the circuit board 3 facing the mounting area of the heat generating component 7. Is done. When the heat radiating plate member 11 is fixed to the chassis 5, the main surface portion 11 a is held at a predetermined distance from the second main surface 3 b of the circuit board 3. When the plurality of heat generating components 7 are mounted on the first main surface 3a of the circuit board 3 in a relatively narrow region, the heat radiating plate member 11 has the main surface portion 11a opposed to the heat generating components 7 collectively. It is formed with a sufficient shape. In addition, for example, a plurality of slits may be formed in the chassis 5 corresponding to the attachment portion of the heat radiating plate member 11 so that the heat radiating plate member 11 is exposed to the outside air so that more efficient heat radiating is performed. .

  The heat radiating plate member 11 is provided on the chassis 5 so as to face at least the mounting region of the heat generating component 7, but is not limited to such a configuration. For example, when the heat radiating plate 1 member 11 can secure a space between the chassis 5 and the circuit board 3 and the tolerance of weight restriction is large, the main surface portion 11a has a larger area in the circuit. The substrate 3 may be opposed to the second main surface 3b. When the heat radiating plate member 11 is formed in a large size as described above, a mounting hole may be formed in the outer peripheral portion so as to exhibit a stud function for assembling the circuit board 3 to the chassis 5.

  A heat radiating sheet 12 is joined to the heat radiating plate member 11 on the surface of the main surface portion 11 a facing the second main surface 3 b of the circuit board 3. The heat radiating sheet 12 has, for example, a certain degree of elastic deformation characteristics, and is slightly higher than the height of the gap formed between the main surface portion 11a of the heat radiating plate member 11 and the second main surface 3b of the circuit board 3 described above. It has a large thickness dimension. The heat radiating sheet 12 is sandwiched between the circuit board 3 and the heat radiating plate member 11 in a state where the circuit board 3 is assembled to the chassis 5 via the studs, and the second main surface 3b and the main surface portion 11a. Adhering closely to.

  In the tuner device 1 including the heat dissipation device 2 configured as described above, when the power is turned on and the heat generating component 7 is operated, relatively large heat is generated from the heat generating component 7 and is radiated to the surroundings and the circuit. The substrate 3 is heated. In the heat radiating device 2, as described above, by providing the heat insulating plate member 9 with the main surface portion 9a extending above the heat generating component 7, the main surface portion 9a blocks radiation conduction to the cover member 6 and diffuses. Let Therefore, in the heat radiating device 2, even if the user holds the tuner device 1 by suppressing the cover member 6 from being partially heated, there is no sense of anxiety.

  In the heat radiating device 2, the heat generated by the heat radiating component 7 is efficiently radiated by the heat radiating plate member 11 and the heat radiating sheet 12, thereby suppressing the temperature rise of the heat radiating component 7. In the heat radiating device 2, the heat radiating plate member 11 is provided with the heat radiating sheet 12 in close contact with the second main surface 3 b side of the circuit board 3 facing the mounting region of the heat radiating component 7 as described above. In the heat radiating device 2, the heat generated from the heat radiating component 7 is efficiently conducted to the heat radiating sheet 12 through the circuit board 3, and further radiated by the heat radiating plate member 11. Therefore, in the heat radiating device 2, the temperature rise of the heat radiating component 7 is suppressed.

  In the tuner device 1, as described above, radiation to the cover member 6 is blocked by the heat insulating plate member 9 against the heat generated from the heat radiating component 7 by the heat radiating device 2, and the heat radiating plate member 11 and the heat radiating sheet 12 Efficient heat dissipation. In the tuner device 1, the temperature of the cover member 6 is lowered to about 4 ° C. to 6 ° C. at the portion facing the heat radiating component 7, and even if the user grips the casing, the part does not feel high temperature. Be used with confidence.

  In the tuner device 1, as described above, the heat radiating device 2 efficiently radiates heat from the heat radiating component 7 by the heat radiating plate member 11 and the heat radiating sheet 12. Since the temperature of the heat dissipating part 7 itself can be lowered to about 6 ° C. to 7 ° C., the high temperature inside can be suppressed and the heat dissipating part 7 or the normal part 8 can be stably operated. Is improved.

  In the above-described embodiment, the tuner device 1 including the heat radiating device 2 is shown. However, the present invention is not limited to the tuner device 1 and is applied to various electronic devices including the heat generating component 7. Of course.

It is principal part sectional drawing of the tuner apparatus shown as embodiment. 1 is a perspective view of a tuner device shown as an embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Tuner apparatus 2 Heat radiating device 3 Circuit board 4 Stud 5 Chassis 6 Cover member 7 Heat generating component 8 Normal component 9 Heat insulating plate member 10 Heat radiating plate member 11 Heat radiating sheet

Claims (4)

In an electronic device in which an insulating cover member is attached to a chassis by covering the entire board on which a heat generating component composed of a heat generating electronic component or a heat dissipating component that generates heat together with a normal electronic component or element component is mounted,
A heat insulating plate that blocks radiation heat generated from the heat-generating component to the cover member by being provided so as to cover at least the heat-generating component and between the cover member;
A heat dissipating device in an electronic device, comprising: A heat dissipating plate that is provided between at least the bottom surface of the substrate facing the mounting region of the heat generating component and the chassis, and conducts the generated heat to the chassis through the substrate to dissipate heat;
A heat dissipating sheet provided on the main surface of the heat dissipating plate so as to be in close contact with the bottom surface of the substrate and transmitting the generated heat generated from the heat generating component and conducted through the substrate to the heat dissipating plate; The heat radiating device in the electronic device according to claim 1, further comprising:   The heat insulating plate is attached to the substrate or the chassis so as to cover the heat generating components individually or to cover a region where a plurality of the heat generating components are mounted. The heat radiating device in the electronic device as described in any one of Claims. 4. The heat dissipation device for an electronic device according to claim 1, wherein the heat dissipation sheet is provided in a state of being elastically deformed in a thickness direction between the heat dissipation plate and the substrate. 5.

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