JP5005099B2 - Method for manufacturing light emitting device - Google Patents

Description

  The present invention relates to a light emitting device using an element (hereinafter referred to as a light emitting element) in which a light emitting material is sandwiched between electrodes. Specifically, the present invention relates to a technique for narrowing the frame of a light emitting device.

  In recent years, development of light-emitting devices using light-emitting elements has progressed. In the light emitting device, since the light emitting element itself has a light emitting capability, a backlight as used in a liquid crystal display is unnecessary. Therefore, it is possible to reduce the thickness and weight. In addition, the wide viewing angle makes it suitable for outdoor use.

  There are two types of light emitting devices, a passive type (simple matrix type) and an active type (active matrix type), both of which are actively developed. In particular, active light emitting devices are currently attracting attention. In addition, materials used for a light-emitting layer of a light-emitting element include an organic material and an inorganic material, and the organic material is further classified into a low molecular (monomer) organic material and a high molecular (polymer) organic material. Both have been actively studied, and low molecular weight organic materials are mainly formed by vacuum deposition, and high molecular weight organic materials are mainly formed by spin coating.

  Organic materials are characterized by higher luminous efficiency than inorganic materials and can be driven at a low voltage. In addition, since it is an organic compound, it is possible to design and create various new substances. Therefore, there is a possibility that an element that emits light with higher efficiency may be discovered by future progress in material design.

  FIG. 20 shows an example of a light emitting device in which the seal material oozes out. FIG. 20A is a cross-sectional view taken along the dotted line AA ′ of the apparatus in which the seal material oozes out, and FIG. 20B is a top view thereof. The light-emitting element 1208 includes an anode 1202, an organic layer 1203, and a cathode 1204, and is formed so that the organic layer 1203 is sandwiched between the anode 1202 and the cathode 1204. An anode or a cathode may be formed directly on the first substrate 1201, but an anode is generally formed on the first substrate 1201 for ease of manufacturing. The light emitting element emits energy when electrons injected from the cathode and holes injected from the anode recombine at the emission center of the organic layer 1203 to form excitons, and the excitons return to the ground state. Emits light. In addition, a wiring portion 1209 and a driving circuit 1212 are provided over the first substrate 1201. The wiring portion is a group of wirings that are electrically connected to the drive circuit. Although not shown, the drive circuit 1212 and the light emitting element 1208 are also electrically connected by wiring.

  Next, sealing of the light emitting element will be described. Currently, a sealing method using a sealing can or a glass substrate has been devised. In the panel that is currently commercialized, a desiccant is put in a metal sealing can, and an adhesive is applied around the sealing can and cured to be sealed. (Organic EL and display, CMC, p. 250, 2001) The sealing can or the glass substrate is collectively referred to as a second substrate 1200. The adhesive corresponds to a sealing material. That is, a sealing material is applied to the second substrate 1200, and the first substrate 1201 and the second substrate 1200 are bonded to each other through the seal pattern 1205. The sealing material is an adhesive / sealing material for laminating the first substrate and the second substrate and enclosing the light emitting element therein, and is a material disposed in the peripheral portion of the panel. . The seal pattern is defined by the shape, position, and width of the seal material. The light emitting element 1208 is in a sealed space surrounded by the first substrate 1201, the second substrate 1200, the seal pattern 1205, and the drive circuit 1212. Since the light emitting element is deteriorated by moisture or oxygen, the sealed space is filled with an inert gas 1206 (nitrogen molecule or rare gas). In this specification, a region surrounded by the first substrate, the second substrate, the seal pattern, and the light emitting element is referred to as a sealed space. In this specification, the first substrate is a substrate on which a light emitting element is formed, and the second substrate is attached to the first substrate through a seal pattern in order to protect the light emitting element that is easily deteriorated by moisture or oxygen. This is the bonded substrate. The illustration of the desiccant is omitted.

  As shown in FIG. 20, the light-emitting device has a structure in which a first substrate 1201 on which a light-emitting element is formed and a second substrate 1200 are bonded to each other through a seal pattern 1205. After the second substrate 1200 on which the seal material 120 is applied and the first substrate 1201 are pasted together, the seal material is crushed and expanded, and the seal pattern 1205 is viewed from the direction in which the display portion can be seen. The width of becomes thick. In this specification, the display portion corresponds to a region of the light-emitting element viewed from the normal direction of the first substrate. As a result, the seal material oozes out 1207 from the place where the seal pattern is to be formed, and may be applied to the display portion of the display or the end face of the substrate. The following can be considered as a cause of the seepage of the sealing material. In the hot press after the step of bonding the first substrate and the second substrate, the panel temperature is generally heated to 150 to 200 ° C. to advance the curing reaction, and when the curing is completed, the panel temperature is lowered to room temperature. Lower. At 150 ° C. to 200 ° C., the viscosity of the sealing material decreases just before the curing reaction starts, and it becomes a fairly fluid state. Therefore, a slight amount of the first substrate and the second substrate due to the capillary phenomenon. The seal material starts to flow due to the part where the interval is thin, and as the time further elapses, the curing reaction starts, so the viscosity of the seal material increases rapidly, and the seal material once spread It will solidify without returning to the state.

If there is a sealing material between the end surface of the first substrate and the end surface of the second substrate, it may be difficult to cut the bonded substrates. In addition, the portion of the substrate in the vicinity of the seal pattern formed between the first substrate and the second substrate may be difficult to cut.
Therefore, the technology for narrowing the frame of the light emitting device has been stopped. Narrowing the frame means shortening the distance between the light emitting element 1208 and the end surface 1211 when viewed from the direction in which the display portion can be seen. In order to realize a narrow frame of the display, it is conceivable to adjust the coating amount of the sealing material so as to simply narrow the width of the sealing pattern. However, when the width of the seal pattern is narrowed, the strength of adhesion between the first substrate and the second substrate may be reduced and the seal may be peeled off.

In recent years, mobile devices such as mobile phones have been required to reduce the size of the display, while high definition is desired to support moving images. In order to achieve high definition, it is necessary to increase the resolution (increase the number of pixels) and reduce the pixel pitch.
However, for example, the pixel pitch may be about 300 μm for character display. For high definition, the number of pixels must be increased, and the proportion of the display unit in the portable device needs to be increased. Therefore, narrowing the frame of the display is a serious problem.

  Therefore, a light emitting device capable of suppressing a decrease in strength of adhesion between the first substrate and the second substrate even when the width of the seal pattern is narrowed in order to realize a narrow frame of the display. The issue is to provide. It is another object of the present invention to provide a light-emitting device having a recess that allows the leaked sealing material to be accumulated. It is another object of the present invention to provide a sturdy light emitting device in which a part of the seal pattern is formed on the end portion of the second substrate.

  In the second substrate constituting the light emitting device, a sealing material is applied to form a recess in a portion where a seal pattern is to be formed. If the substrate having the recess is used while the width of the formed seal pattern is kept narrow, the contact area between the seal pattern and the second substrate is increased, so that the first substrate and the second substrate There is an effect of suppressing a decrease in the strength of adhesion, and the frame of the light emitting device can be narrowed. Further, by forming a part of the seal pattern in a part of the recess of the second substrate, the sealing material that has flowed out during the hot pressing can be stored in the recess, so that the first substrate and the second substrate The sticking out of the sealing material when the substrates are bonded together can be suppressed, and the frame of the light emitting device can be reduced. However, it is preferable that the hot pressing process for curing the seal pattern is performed with the first substrate placed on the upper side and the second substrate placed on the lower side. Although the scribe line may be used instead of the recess, the scribe line formed on the substrate 2100 has a width of about 2 μm and a width of about 200 μm as shown in FIG. The material (filler) is mixed to increase the apparent viscosity, but since the average particle diameter of this filler is at least about 3 μm, the scribe line sufficiently suppresses the seepage of the sealant. Does not have the size of Further, when applying the sealing material by adjusting the application amount of the sealing material so that a part of the sealing material is formed in the recess, prepare a first substrate having a scribe line formed on the back surface or the front surface. The first substrate and the second substrate are bonded so that the concave portion and the scribe line overlap each other when viewed from the normal direction of one substrate or the second substrate, and a crack is generated from the concave portion and the scribe line. Therefore, the frame of the light emitting device can be narrowed. Since a part of the seal pattern is formed on the edge of the second substrate, it is possible to provide a sturdy light emitting device. The concave portion provided in the second substrate may be single or plural.

  Therefore, the structure of the invention disclosed in this specification includes a first substrate, a light emitting element formed over the first substrate, a sealing material formed around the light emitting element, and a recess. In the light emitting device in which the second substrate and the first substrate are bonded to each other through the sealing material, the concave portion is filled with the sealing material. When the light emitting device of the present invention is used, even when the width of the seal pattern is narrowed, the area where the seal pattern and the recess come into contact with each other is increased by forming the recess on the second substrate. It is possible to suppress a decrease in the strength of adhesion with the second substrate.

  According to another aspect of the invention, there is provided a first substrate, a light emitting element formed on the first substrate, a seal pattern formed around the light emitting element, and a second formed with a recess. In the light emitting device in which the substrate and the first substrate are bonded together via the seal pattern, the light emitting device has a part of the seal pattern formed in a part of the recess. When the light emitting device of the present invention is used, by forming a recess in the second substrate, the area where the seal pattern and the recess contact is increased, and the strength of adhesion between the first substrate and the second substrate is reduced. Can be suppressed. Further, when the light emitting device of the present invention is used, the sealing material that has flowed out during hot pressing can be stored in the recess, so that the seepage of the sealing material can be suppressed and the distance between the light emitting element and the end face can be reduced. Can be small.

  According to another aspect of the invention, there is provided a first substrate having a part of a scribe line, a light emitting element formed on the first substrate, a seal pattern formed around the light emitting element, and a recess. In the light emitting device in which the second substrate formed with the first substrate and the first substrate are bonded together via the seal pattern, a part of the seal pattern is formed in a part of the recess. Is a light emitting device. The light emitting device of the present invention provides a first substrate on which a scribe line is formed, and the first substrate so that the concave portion and the scribe line overlap with each other when viewed from the normal direction of the first substrate or the second substrate. And the second substrate are bonded to each other, and a crack is produced from the recess and the scribe line. When the light emitting device of the present invention is used, by forming a recess in the second substrate, the area where the seal pattern and the recess contact is increased, and the strength of adhesion between the first substrate and the second substrate is reduced. Can be suppressed. In addition, when the light emitting device of the present invention is used, it is possible to suppress the seepage of the sealing material. Furthermore, by using the light emitting device of the present invention, a part of the seal pattern is formed on the end portion of the second substrate, and it is possible to provide a sturdy light emitting device.

  According to another aspect of the invention, there is provided a first substrate, a light emitting element formed on the first substrate, a sealing material formed around the light emitting element, and a second member having a recess. In the light emitting device in which the substrate and the first substrate are bonded to each other through the sealing material, at least one of the concave portions is filled with the sealing material. . When the light emitting device of the present invention is used, even when the width of the seal pattern is narrowed, the area where the seal pattern and the recess are in contact with each other is increased, so that the reduction in the strength of adhesion between the first substrate and the second is suppressed. It becomes possible.

  According to another aspect of the invention, there is provided a first substrate, a light emitting element formed on the first substrate, a seal pattern formed around the light emitting element, and a plurality of recesses. In the light emitting device in which the second substrate and the first substrate are bonded together via the seal pattern, at least one of the plurality of recesses is formed with a part of the seal pattern. The light emitting device is characterized. When the light emitting device of the present invention is used, by forming a recess in the second substrate, the area where the seal pattern and the recess contact is increased, and the strength of adhesion between the first substrate and the second substrate is reduced. Can be suppressed. Further, when the light emitting device of the present invention is used, the sealing material that has flowed out during hot pressing can be stored in the recess, so that the seepage of the sealing material can be suppressed and the distance between the light emitting element and the end face can be reduced. Can be small.

  According to another aspect of the invention, there are provided a first substrate having a part of a scribe line, a light emitting element formed on the first substrate, a seal pattern formed around the light emitting element, and a plurality of seal patterns. In the light emitting device in which the second substrate on which the recess is formed and the first substrate are bonded together via the seal pattern, at least one of the plurality of recesses has a part of the seal pattern Is a light-emitting device. In the light emitting device of the present invention, a first substrate having a scribe line formed on the back surface or the front surface is prepared, and the first substrate and the second substrate are arranged so that the concave portion and the scribe line overlap each other when viewed from the direction in which the display portion can be seen. It is manufactured by bonding the substrate and generating cracks from the recesses and the scribe lines. When the light emitting device of the present invention is used, by forming a recess in the second substrate, the area where the seal pattern and the recess contact is increased, and the strength of adhesion between the first substrate and the second substrate is reduced. Can be suppressed. In addition, when the light emitting device of the present invention is used, it is possible to suppress the seepage of the sealing material. Furthermore, by using the light emitting device of the present invention, a part of the seal pattern is formed on the end portion of the second substrate, and it is possible to provide a sturdy light emitting device.

  By using the light-emitting device of the present invention, when the first substrate and the second substrate are bonded together, the width of the seal pattern can be kept narrow, and the seal material can be prevented from seeping out. Narrow frame is possible.

  Further, by using the light emitting device of the present invention, a part of the seal pattern is formed on the end portion of the substrate, and it is possible to provide a sturdy light emitting device.

  Furthermore, when the manufacturing process of the light emitting device of the present invention is used, a process of forming a scribe line on the second substrate is not necessary.

Sectional view (A) and top view (B) of the light emitting device of the present invention FIG. 5 shows a manufacturing process of a light-emitting device of the present invention. FIG. 5 shows a manufacturing process of a light-emitting device of the present invention. FIG. 5 shows a manufacturing process of a light-emitting device of the present invention. Sectional view of light-emitting device of the present invention Sectional view (A) and top view (B) of the light emitting device of the present invention Sectional drawing of active type light-emitting device of this invention Sectional view of the passive light emitting device of the present invention FIG. 5 shows a manufacturing process of a light-emitting device of the present invention. FIG. 5 shows a manufacturing process of a light-emitting device of the present invention. FIG. 5 shows a manufacturing process of a light-emitting device of the present invention. Top view of the light emitting device of the present invention Top view of the light emitting device of the present invention FIG. 5 shows a manufacturing process of a light-emitting device of the present invention. FIG. 5 shows a manufacturing process of a light-emitting device of the present invention. FIG. 5 shows a manufacturing process of a light-emitting device of the present invention. The figure which shows the electric appliance of this invention The figure which shows the electric appliance of this invention The figure which shows the electric appliance of this invention Sectional view and top view of light emitting device in which sealant exudation occurred Diagram explaining scribe line

  A method for manufacturing the light-emitting device of the present invention will be described. 1A is a cross-sectional view of the light-emitting device of the present invention taken along dotted line A1-A1 ′ in FIG. 1B, and FIG. 1B is a top view thereof.

  A sealing material is applied to the second substrate 100 to form a recess 107 in a portion where the seal pattern 105 is to be formed. As a method of forming the recess, when glass is used as the second substrate, etching is performed on the glass.

A seal material is applied to the second substrate 100 to form a seal pattern 105. The application method is performed by a dispenser method or a screen printing method.
A seal pattern 105 is formed in the recess 107 formed in the second substrate as shown in FIG. 1A and around the light emitting element 108 as shown in FIG.

  The material of the second substrate 100 is preferably an insulating material such as amorphous glass (borosilicate glass, quartz, etc.), crystallized glass, ceramic glass, glass, polymer or the like. Insulating substances such as organic resins (acrylic resins, styrene resins, polycarbonate resins or epoxy resins) and silicone resin polymers may also be used. Ceramics may be used. Further, if the seal material is an insulator, a metal material such as a stainless alloy can be used.

  As a material of the sealing material, a sealing material such as an epoxy resin or an acrylate resin can be used. A thermosetting resin or a photocurable resin can also be used as the sealing material. However, it is desirable that the sealing material is a material that does not transmit moisture as much as possible.

  As the material of the first substrate 101, a glass substrate, a quartz substrate, or a plastic substrate is used. Further, a wiring portion 109, a light emitting element 108, and a driving circuit 112 are provided on the first substrate 101. The wiring portion is a group of wirings that are electrically connected to the drive circuit. Although not shown, the light emitting element 108 and the drive circuit 112 are electrically connected by wiring.

  The second substrate 100 and the first substrate 101 over which the light emitting element 108 is formed are attached to each other. The bonding is performed by marking the second substrate 100 and the first substrate 101, aligning the positions with a CCD (charge coupled device) camera, and performing bonding. In order to fill the sealed space where the light emitting element is sealed with an inert gas, the bonding is performed in an inert gas (nitrogen or noble gas) atmosphere. Keep the moisture concentration in the atmosphere as low as possible. Specifically, the water concentration is desirably 1 ppm or less.

  After the first substrate 101 on which the light emitting element 108 is formed and the second substrate 100 are bonded to each other through the seal pattern 105, the seal material is cured by hot pressing. When the sealing material is a thermosetting resin, the sealing material is cured by hot pressing in a clean oven. When the sealing material is a photocurable resin, the sealing material is cured by ultraviolet irradiation by an ultraviolet lamp. In either case, care should be taken because the light emitting element may be damaged during curing.

  When the sealing material is completely cured, a scriber is used to break the first substrate 101 and the second substrate 100 at locations to be divided. Then, it cut | disconnects to a desired magnitude | size by applying force from the surface opposite to the cut surface. At this time, a device for applying pressure called a breaker may be used.

  Through the above steps, the light emitting device of the present invention is obtained. When the light emitting device of the present invention is used, even when the width of the seal pattern 105 is narrowed, the area where the seal pattern 105 and the recess 107 are in contact with each other is increased by forming the recess on the second substrate. It is possible to suppress a decrease in the strength of adhesion between the substrate 100 and the second substrate 101.

  When glass is used for the second substrate as a method for forming the recess, etching is used. However, it may be performed by sand blasting, glass formation with a mold, or the like.

  Further, when a metal plate is used for the second substrate, it may be performed by molding with a press, forming a metal plate with a mold, or the like.

  Although the sealed space is filled with an inert gas, it may be filled with an organic resin.

  Although the second substrate 400 of the light emitting device of the present invention is in a sheet form, the second substrate 300 having the recess 307 as shown in FIG. 5 has a recess 311 (thick line portion) having an inner dimension smaller than the outer dimension of the light emitting element 308. ), And the present invention is also applicable to a light emitting device having a recess 311 sealed with a desiccant 312. The film 313 has a role of confining the desiccant 312 in the recess 311. When the light emitting device of the present invention is used, even when the width of the seal pattern 305 is narrowed, the area where the seal pattern 305 and the recess 307 are in contact with each other is increased by forming the recess on the second substrate. It is possible to suppress a decrease in the strength of adhesion between the substrate 300 and the second substrate 301. Further, since the desiccant 312 is sealed in the recess 311, deterioration of the light-emitting element 308 due to moisture or oxygen can be suppressed.

  The present invention having the above-described configuration will be described in more detail with the following examples.

  A light-emitting device in which the present invention is applied to bottom emission is shown in FIG. In this specification, the emission of light transmitted through the first substrate 401 is referred to as bottom emission. The direction of light is indicated by an arrow. 6A is a cross-sectional view of the light-emitting device of the present invention taken along a dotted line A2-A2 ′ in FIG. 6B, and FIG. 6B is a top view of the light-emitting device of the present invention.

First, as shown in FIG. 2A, a resist 202 is formed on a second substrate 400a made of glass by a spin coating method. Next, the resist 202 is exposed to light using a mask 203 that can make the resist pattern thinner than the actual seal pattern width (FIG. 2 (A) resist application / exposure). Next, as shown in FIG. 2B, development is performed, and the resist in the portion where the recess is formed is removed. The resist 202a and the resist 202b remain on the second substrate 400a made of glass in a portion where the recess is not formed (development in FIG. 2B). Next, as shown in FIG. 3A, when etching is performed, a recess 407 is formed in the second substrate 400a made of glass. As the etchant, hydrofluoric acid or a solution containing hydrofluoric acid as a main component is used.
In the case of wet etching, isotropic etching is performed, so that the shape after etching has a partially curved shape as shown in FIG. Further, dry etching may be used. In this case, the cross-sectional shape is preferably rectangular and has a depth of 0.3 to 0.4 mm. (FIG. 3 (A) Etching). Next, when the resist 202a and the resist 202b are peeled off and washed, a second substrate 400b made of glass in which a concave portion 407 is formed is obtained as shown in FIG. The second substrate 400b made of glass corresponds to the second substrate 400 in FIG. The width of the recess 407 may be in the range of 0.8 to 1.0 mm, and the depth of the recess 407 may be in the range of 0.08 to 0.12 mm. What is necessary is just to adjust the depth of the recessed part 407 with the time of an etching (FIG. 3 (B) peeling and washing | cleaning).

  On the other hand, as shown in FIG. 6, a glass substrate, a quartz substrate, or a plastic substrate is used for the first substrate 401. Further, a wiring portion 409 and a drive circuit 412 are provided on the first substrate 401. The wiring portion is a group of wirings that are electrically connected to the drive circuit.

  Next, an anode 402 is formed over the first substrate 401. As a material of the first substrate 401, a glass substrate, a quartz substrate, or a plastic substrate is used. As a material of the anode 402, a conductive film having a large work function, typically a transparent conductive film (such as a compound of indium oxide and tin oxide), platinum, gold, nickel, palladium, iridium, or cobalt is used. The anode is formed by a method such as sputtering or vacuum vapor deposition, and is patterned by photolithography.

  A sealing material is applied to the second substrate 400 to form a recess 407 in a portion where a seal pattern is to be formed. As a method for forming the concave portion, when a second substrate made of glass is used as the second substrate, etching is performed on the second substrate made of glass.

  Next, an organic layer 403 is formed on the anode 402 in an inert gas (nitrogen or noble gas) atmosphere. Note that a known material can be used for the organic layer 403. The organic layer 403 is mainly used in a laminated structure. The organic layer 403 is formed using a hole injection material, a hole transport material, a material that serves as a light-emitting layer, an electron transport material, an electron injection material, or the like. Alternatively, a material that can convert energy when returning from the triplet excited state to the ground state into light emission may be used for the organic layer 403.

  A cathode 404 is formed on the organic layer 403 in an inert gas (nitrogen or noble gas) atmosphere. The cathode 404 is formed by a vacuum evaporation method using a metal mask. The material of the cathode 404 is a metal having a small work function, typically an element belonging to Group 1 or Group 2 of the periodic table (magnesium, lithium, potassium, barium, calcium, sodium, or beryllium) or a work function close thereto. Use the metal you have. Alternatively, aluminum may be used as a cathode material, and lithium fluoride or a lithium acetylacetonate complex may be formed under the aluminum as a cathode buffer layer. In this specification, an element in which an anode, an organic layer, and a cathode are stacked is referred to as a light emitting element.

  Next, the light emitting element 408 is sealed as shown in FIG. A seal pattern 405 a is formed around a region where the light emitting element 408 is formed, that is, in a recess 407 formed in the second substrate 400. A part of the seal pattern 405 a is filled in the recess 407. In this specification, the fact that the sealing material is filled in the concave portion means that the sealing material is densely packed in a region surrounded by the dotted line portion and the concave portion. After the sealing material is cured, the width of the seal pattern is in the range of 1.1 to 1.3 mm, and the distance between the first substrate 401 and the second substrate 400 is in the range of 10 to 20 μm. In addition, it is only necessary to adjust the application amount of the sealing material (FIG. 4A) formation of a sealing pattern. The distance between the first substrate 401 and the second substrate 400 is determined by the film thickness of the light emitting element 408 and is controlled by the size of the filler contained in the sealant.

  The second substrate 400 is bonded to the first substrate 401 over which the light-emitting element 408 is formed (bonding in FIG. 4B). As shown in FIG. 6, an inert gas 406 is filled in a region surrounded by the first substrate 401, the second substrate 400, the seal pattern 405 b, the light emitting element 408, and the drive circuit 412. Next, the sealing material is cured by hot pressing.

  Through the above steps, the light emitting device of the present invention is obtained. When the light emitting device of the present invention is used, even when the width of the seal pattern 405 is narrowed, the area where the seal pattern 405 and the recess 407 are in contact with each other is increased by forming the recess 407 in the second substrate 400. It is possible to suppress a decrease in the strength of adhesion between the first substrate 400 and the second substrate 401.

  Although a light emitting device applied to bottom emission is described in this embodiment, a light emitting device applied to top emission can be manufactured by using a transparent material for the second substrate 400. In this specification, the emission of light through the second substrate 400 is referred to as top emission.

  In this embodiment, a part of the seal pattern is formed in a single recess formed in the second substrate, but a plurality of recesses may be formed in the second substrate to fill a part of the seal pattern. The width of the recess may be in the range of 0.4 to 0.5 mm, and the depth of the recess may be in the range of 0.08 to 0.12 mm. When the light emitting device of the present invention is used, even when the width of the seal pattern is narrowed, the area where the seal pattern and the plurality of recesses are in contact with each other is increased by forming the plurality of recesses on the second substrate. It is possible to increase the strength of adhesion between the one substrate and the second substrate.

  In Example 1, a method for manufacturing a concave portion by etching of glass was mentioned, but in this embodiment, a method for manufacturing a concave portion by a glass sandblasting method will be described. The other device manufacturing methods are the same as those in the first embodiment, and a detailed description thereof is omitted.

  A resist is formed on a glass substrate other than a portion where a recess is to be formed. Put it in a sandblasting machine and spray sand onto the glass substrate. Next, when the resist is removed, the glass is scraped to complete the second substrate on which the concave portion is formed. At this time, a known sandblasting device may be used.

  Next, a light emitting element is formed on the first substrate provided with the wiring portion and the drive circuit, and the substrate and the second substrate on which the concave portion is formed are bonded to each other with a sealant and divided into a desired size. Thus, the light emitting device of the present invention is completed.

  In Example 2, the method for forming the recesses by the sand blasting method for glass was described, but in this example, the method for manufacturing glass by using a mold is described. The other device manufacturing methods are the same as those in the first embodiment, and a detailed description thereof is omitted.

  A glass substrate having a recess formed by a mold is formed. A convex mold is prepared so that a concave portion is formed on the glass substrate, and a second substrate in which the concave portion is formed is manufactured using the template.

  Next, a light emitting element is formed on the first substrate provided with the wiring portion and the drive circuit, and the substrate and the second substrate on which the concave portion is formed are bonded to each other with a sealant and divided into a desired size. Thus, the light emitting device of the present invention is completed.

  In Examples 1 to 3, an example in which glass is applied to the second substrate has been described. In this example, an example in which metal is applied to the second substrate will be described. In this example, a method for manufacturing a second substrate in which concave portions are formed by press molding will be described.

  First, the 2nd board | substrate which formed the recessed part by shaping | molding by press is produced.

  Next, a light emitting element is formed on the first substrate provided with the wiring portion and the drive circuit, and the substrate and the second substrate on which the concave portion is formed are bonded to each other with a sealant and divided into a desired size. Thus, the light emitting device of the present invention is completed.

  In this embodiment, pressing is performed in the method for manufacturing the second substrate having the recesses, but a metal plate having the recesses by the mold may be formed.

  The present invention can also be applied to an active light-emitting display device. An example in which the present invention is applied to an active light-emitting device is shown in FIG. 700 is a second substrate, 701 is a first substrate, 702 is an anode, 703 is an organic layer, 704 is a cathode, 705 is a seal pattern, 706 is an inert gas, 707 is a recess, 708 is a switching TFT (Thin Film Transistor) (in the dotted line), 709 is a TFT for current control (in the dotted line), and 710 and 711 are insulating films. The range of the pixel is indicated by the arrow in FIG. In order to prevent a short circuit between the anode 702 and the cathode 704, it is preferable to overlap the end portion of the anode 702 and the insulating film 711 (in a dotted line) when viewed from the normal direction of the first substrate 701.

  The present invention can also be applied to a passive light emitting device. An example in which the present invention is applied to a passive light emitting device is shown in FIG. 800 is a second substrate, 801 is a first substrate, 802 is an anode, 803 is an organic layer, 804 is a cathode, 805 is a seal pattern, 806 is an inert gas, 807 is a recess, and 808 is an insulating film. The range of the pixel is indicated by the arrow in FIG.

  In Examples 1-6, although an example of the light-emitting device with which the recessed part was filled with the sealing material was shown, in this Example, the example of the light-emitting device in which a part of seal pattern was formed in a part of recessed part is shown.

  As shown in FIG. 9, a recess 507 a is formed on the second substrate 500 a along the end surface 509 and after bonding so as to be outside the light emitting element 508. A seal material is applied to the surface of the second substrate 500a on the side opposite to the end face 509 when viewed from the dotted line on the recess 507a to form a seal pattern 505a (FIG. 9A). In this embodiment, the seal pattern 505a is formed on the light emitting element 508 side as viewed from the dotted line on the concave portion 507a. However, the seal pattern 505a may be formed on the end face 509 side.

  On the other hand, a first substrate 501a provided with a wiring portion (not shown) and a drive circuit (not shown) is prepared. When the second substrate 500a and the first substrate 501a are bonded together in an inert gas (nitrogen or noble gas) atmosphere, the seal pattern 505a is crushed and a seal pattern 505b in which a part is formed in the recess 507a. Is formed (FIG. 9 (B) bonding). An inert gas 506 is filled in a region surrounded by the first substrate 501, the second substrate 500, the seal pattern 505b, the light emitting element 508, and a drive circuit (not shown). When the sealing material is a thermosetting resin, the sealing material is cured by hot pressing in a clean oven.

  In the hot press after the bonding process of the first substrate 500a and the second substrate 501a, the panel temperature is generally heated to 150 to 200 ° C. to advance the curing reaction. Reduce the temperature. At 150 ° C. to 200 ° C., the viscosity of the sealing material decreases just before the curing reaction starts and becomes a fairly fluid state. Therefore, the first substrate 500a and the second substrate 501a are only a little due to capillary action. The seal material starts to flow due to the part where the gap is thin, and when the time further elapses, the curing reaction starts, so the viscosity of the seal material increases rapidly, and the seal material that has once spread It will solidify without returning to its original state. During hot pressing, it is preferable that the second substrate 500a on which the concave portion 507a is formed is disposed on the lower side and the first substrate 501a is disposed on the upper side. By installing in this way, even when the sealing material oozes out, the oozing sealing material can be stored in the recess 507a, and the end surface 509 can be prevented from being covered with the sealing material. In addition, in the case where a seal pattern is formed on the end surface 509 side, the seal material can be prevented from oozing out to the light emitting element 508 (not shown).

  Next, the light emitting device of the present invention is completed by dividing into a desired size. In the case of using the light emitting device of the present invention, by forming the recess 507a in the second substrate 500a, the area where the seal pattern 505b and the recess 507a are in contact with each other is increased, and the first substrate 401, the second substrate 400, It is possible to suppress a decrease in the adhesive strength.

  In addition, when the light emitting device of the present invention is used, the sealing material that has flowed out at the time of hot pressing can be stored in the concave portion, so that the seepage of the sealing material can be suppressed, and the light emitting element 508 and the end face 509 can be prevented. The distance can be reduced. Therefore, the frame of the light emitting device can be reduced.

  Another example of a method for manufacturing a light-emitting device using the second substrate 500 having the recess 507a used in Example 7 will be described.

  In order to narrow the frame of the light-emitting device manufactured in Example 7, a light-emitting device in which a part of the seal pattern 505b exists on the end portion 514 is manufactured as illustrated in FIG.

  A second substrate 500a having a seal pattern 505a, a recess 507a, and an end surface 509 is prepared (FIG. 10A) Formation of a seal pattern. For bonding, as shown in FIG. 10B, it overlaps with the surface of the first substrate 501c and the concave portion 507a when viewed from the normal direction of the second substrate 500a and the first substrate 501c in FIG. A scribe line 512 and a light emitting element 508 are formed on the first substrate 501c. FIG. 12 shows a top view of the second substrate 500a and the first substrate 501c bonded together. A cross-sectional view taken along dotted line A3-A3 ′ in FIG. 12 corresponds to FIG.

  In an inert gas (nitrogen or rare gas) atmosphere, the second substrate 500a and the first substrate 501c are attached to each other (FIG. 10B). An inert gas 506 is filled in a region surrounded by the first substrate 501c, the second substrate 500a, the seal pattern 505b, the light emitting element 508, and a drive circuit (not shown).

  Next, if the back surface of the second substrate 500a is pressed in the direction of the arrow with a breaker breaker as shown in FIG. 11A, a crack 511a is generated in the direction of the arrow on the second substrate 500a. When the crack 511a reaches the back surface of the second substrate 500a, a part of the second substrate 500a from the place where the crack 511a enters to the end surface 509 is separated from the second substrate 500a, and the end surface 513 and the recess A second substrate 500d having 507d is formed. The recess 507d is formed along the end 514 and the end 513a of the second substrate 500d. At the same time, a crack 511b is generated from the scribe line 512, a part of the first substrate 501c from the first substrate 501c to the end surface 515 is cut off, and a part of the scribe line 512a is formed. A light-emitting device having the formed first substrate 501d and the second substrate 500d in which the concave portion 507d is formed is obtained (after cutting in FIG. 11B). In this specification, a crack means that a crack is avoided. If a part of the substrate 501c from the scribe line 512 to the end surface 515 is not cut off, the breaker bar of the breaker presses the inner surface of the end surface 515 and the back surface of the first substrate 501c. A part of the first substrate 501c from the place where the crack 511b enters to the end face is cut off from the substrate 501c, and a light emitting device in which a part of the scribe line 512a is formed is obtained.

  The scribe line 512 is preferably formed on the back surface or the front surface of the second substrate 500a so as to overlap the concave portion 507a when viewed from the normal direction of the substrate. In the present specification, the surfaces of the first substrate and the second substrate refer to surfaces on the side in contact with the seal pattern. Moreover, in this specification, the back surface of a 1st board | substrate and a 2nd board | substrate means surfaces other than the surface of the side in contact with a recessed part, an end surface, and a seal pattern. Part of the second substrate from the end surface near the three sides other than the wiring portion side to the recess is divided from the second substrate to the scribe line from the end surface near the three sides other than the wiring portion side. It is preferable that the first substrate portion is also divided. FIG. 13 shows a top view of the light-emitting device after division (FIG. 11B). A cross-sectional view taken along dotted line A4-A4 ′ in FIG. 13 corresponds to FIG.

  Through the above steps, the light emitting device of the present invention is completed. In the case of using the light emitting device of the present invention, by forming the concave portion 507d in the second substrate 500d, the area where the seal pattern and the concave portion are in contact with each other is increased, and the first substrate 501d and the second substrate 500d are bonded. It is possible to suppress a decrease in strength.

  Further, a part of the first substrate 501c from the scribe line 512 to the end surface 515 as viewed from the direction in which the display portion is visible is cut off from the first substrate 501c, and from the recess 507a to the end surface 509 as viewed from the direction in which the display portion is visible. By separating a part of the second substrate 500a from the second substrate 500a, the distance between the end face and the light-emitting element 508 can be reduced as viewed from the observer, so that the frame of the light-emitting device can be narrowed.

  Furthermore, by using the light emitting device of the present invention, a part of the seal pattern 505b is formed on the end portion 514 of the surface of the second substrate 500d, and a sturdy light emitting device can be provided. In this specification, the end portion refers to a portion where a surface constituting the first substrate or the second substrate is in contact with a concave portion in contact with the surface.

  When the manufacturing process of this embodiment is used, a process of forming a scribe line on the second substrate is not necessary.

  In Examples 1 to 8, a method for manufacturing a light-emitting device using a second substrate in which a single recess was formed was shown. In this example, light emission using a second substrate in which a plurality of recesses were formed. A method for manufacturing the device will be described.

  As shown in FIG. 14, a recess 607 a and a recess 608 a are formed on the second substrate 600 a along the end surface 609 and after being bonded to the first substrate 601 c so as to be outside the light emitting element 610. A sealant is applied to the surface of the second substrate 600a between the recess 607a and the recess 608a to form a seal pattern 605a (FIG. 14A: formation of a seal pattern). When the second substrate 600a is bonded to the first substrate 601a in an inert gas (nitrogen or rare gas) atmosphere (FIG. 14B, bonding), the seal pattern 605a is crushed, and the recess 607a and the recess A part of the seal pattern 605a is formed at 608a.

  In the hot press after the bonding process of the first substrate 600a and the second substrate 601a, the panel temperature is generally heated to 150 to 200 ° C. to advance the curing reaction, and when the curing is completed, the panel is brought to room temperature. Reduce the temperature. At 150 ° C. to 200 ° C., the viscosity of the sealing material decreases just before the curing reaction starts, and the fluid becomes in a considerably fluid state. Therefore, the first substrate 600a and the second substrate 601a are only a little due to capillary action. The seal material starts to flow due to the part where the gap is thin, and when the time further elapses, the curing reaction starts, so the viscosity of the seal material increases rapidly, and the seal material that has once spread It will solidify without returning to its original state. During hot pressing, the second substrate 600a having the recesses 607a and the recesses 608a is preferably placed on the lower side and the first substrate 601a on the upper side. By such an installation, even when the sealing material oozes out, the oozing sealing material can be stored in the concave portion 607a or the concave portion 608a, and the sealing material may be applied to the end surface 609 or the light emitting element 610. It is possible to prevent the sealing material from seeping out.

  Therefore, the frame of the light emitting device can be reduced. The region surrounded by the second substrate 600a (including a part of the recess 608a), the first substrate 601a, the seal pattern 605b, the light emitting element 608, and the drive circuit (not shown) is filled with the inert gas 606. . A top view of FIG. 14B is omitted.

  In the case of using the light emitting device of the present invention, by forming the concave portion 607a and the concave portion 608a in the second substrate 600a, the area where the seal pattern 605b and the concave portion 608a and the concave portion 608a are in contact with each other increases. It is possible to suppress a decrease in the strength of adhesion with the second substrate 600a. In addition, when the light emitting device of the present invention is used, the sealing material that has flowed out at the time of hot pressing can be stored in the recess, so that the sealing material can be prevented from seeping out, and the light emitting element 610 and the end surface 609 The distance can be reduced.

  Another example of a method for manufacturing a light-emitting device using the second substrate 600 having the recess 607a and the recess 608a used in Example 9 will be described.

  In order to narrow the frame of the light emitting device manufactured in Example 9, first, a second substrate 600a having a seal pattern 605a, a recess 607a, a recess 608a, and an end surface 609 is prepared (FIG. 15A) Formation). A first substrate in which a scribe line 612 is formed on the surface of the first substrate 601c for bonding (FIG. 15B) so as to overlap the concave portion 607a when viewed from the normal direction of the first substrate 601c. A light emitting element 610 is formed in 601c.

As shown in FIG. 16A (partitioning), the second substrate 600a and the first substrate 601c are bonded together in an inert gas (nitrogen or rare gas) atmosphere. The region surrounded by the first substrate 601c, the second substrate 600a (including a part of the recess 608a), the seal pattern 605b, the light emitting element 610, and the drive circuit (not shown) is filled with the inert gas 606. . Next, if the breaker of the breaker presses the back surface of the second substrate 600a between the end surface 609 and the recess 607a in the direction of the arrow, a crack 611a is generated in the direction of the arrow in the second substrate 600a. When the crack 611a reaches the back surface of the second substrate 600a, a part of the second substrate 600a from the portion where the crack 611a enters to the end surface 609 is separated from the second substrate 600a, and has a recess 607b. A second substrate 600b is formed. The recess 607b is formed along the end 613a and the end 614. At the same time, a crack 611b is generated from the scribe line 612, and a part of the first substrate 601c from the place where the crack 611b is entered to the end surface 615 is cut off from the first substrate 601c, thereby forming a part 612a of the scribe line. Thus, a light-emitting device having the first substrate 601d and the second substrate 600b formed with the recess 607b is obtained. When a part of the substrate 601c from the scribe line 612 to the end surface 615 is not cut off, the breaker of the breaker presses the back surface of the second substrate 601c between the end surface 615 and the scribe line 612 in the direction of the arrow. Then, a part of the first substrate 601c from the place where the crack 611b is entered to the end surface 615 is cut off, the first substrate 601d is formed, and the light-emitting device is completed (after dividing FIG. 16B). . Fig. 16 (B) (after dividing)
A top view of the light emitting device is omitted.

  In the case of using the light emitting device of the present invention, by forming the concave portion 607b and the concave portion 608a in the second substrate 600b, the area where the seal pattern 605b and the concave portion 607b and the concave portion 608a are in contact with each other increases. It is possible to suppress a decrease in strength of adhesion with the second substrate 600d.

  Further, a part of the first substrate 601c from the scribe line 612 to the end surface 615 is separated from the first substrate 601c when viewed from the direction in which the display portion can be seen, and the second substrate 600a from the concave portion 607a to the end surface 609 is separated. By partly separating from the second substrate 600a, the distance between the end surface and the light emitting element 610 can be reduced as viewed from the direction in which the display portion can be seen, so that the light emitting device can be narrowed.

  Furthermore, by using the light emitting device of the present invention, a part of the seal pattern 605b is formed on the end portion 614 of the second substrate 600b, and a sturdy light emitting device can be provided.

  When the manufacturing process of this embodiment is used, a process of forming a scribe line on the second substrate is not necessary.

  Since the light-emitting device of the present invention is a self-luminous type, it has excellent visibility in a bright place as compared with a liquid crystal display, and has a wide viewing angle. Therefore, it can be used as a display unit of various electric appliances. For example, in order to appreciate TV broadcasting or the like on a large screen, the light emitting device of the present invention may be used in a display portion of a display having a diagonal of 30 inches or more (typically 40 inches or more).

  The display includes all information display devices such as a personal computer display device, a TV broadcast receiving display device, and an advertisement display device. In addition, the light-emitting device of the present invention can be used for display portions of various electric appliances.

  Such an electric appliance of the present invention includes a video camera, a digital camera, a goggle type display device (head mounted display), a navigation system, a sound reproduction device (car audio, audio component, etc.), a notebook type personal computer, and a game machine. (Electronic gaming equipment), in-vehicle rearward confirmation monitor, videophone, portable information terminal (mobile computer, mobile phone, portable game machine, electronic book, etc.), image playback device (specifically, DVD etc.) provided with a recording medium For example, a device having a display capable of reproducing the recording medium and displaying the image thereof). Specific examples of these electric appliances are shown in FIGS. In the present specification, the vehicle rearward confirmation monitor is a light emitting device that projects a blind spot from a driver's seat to a display unit through a camera or the like through a blind spot.

  FIG. 17A illustrates a display, which includes a housing 901, a support base 902, a display portion 903, and the like. The light emitting device of the present invention can be used in the display portion 903. Note that since the light-emitting device of the present invention is a self-luminous type, a backlight is not necessary, and a display portion thinner than a liquid crystal display can be obtained.

  FIG. 17B illustrates a video camera, which includes a main body 911, a display portion 912, an audio input portion 913, operation switches 914, a battery 915, an image receiving portion 916, and the like. The light emitting device of the present invention can be used in the display portion 912.

  FIG. 17C shows a part (right side) of the head mounted display, which includes a main body 921, a signal cable 922, a head fixing band 923, a display portion 924, an optical system 925, a display device 926, and the like. The light-emitting device of the present invention can be used in the display device 926.

  FIG. 17D illustrates an image reproducing device (specifically, a DVD player) provided with a recording medium, which includes a main body 931, a recording medium (DVD or the like) 932, an operation switch 933, a display unit (a) 934, a display unit ( b) including 935 and the like. The display portion (a) 934 mainly displays image information, and the display portion (b) 935 mainly displays character information. The light emitting device of the present invention is displayed on the display portion (a) 934 and the display portion (b) 935. Can be used. Note that an image reproducing device provided with a recording medium includes a home game machine and the like.

  FIG. 17E illustrates a goggle type light emitting device (head mounted display), which includes a main body 941, a display portion 942, and an arm portion 943. The light emitting device of the present invention can be used in the display portion 942.

  FIG. 17F illustrates a personal computer, which includes a main body 951, a housing 952, a display portion 953, a keyboard 954, and the like. The light emitting device of the present invention can be used in the display portion 953.

  If the emission luminance of the material of the organic layer is increased in the future, the light including the output image information can be enlarged and projected by a lens or the like and used for a front type or rear type projector.

  In addition, the electric appliances often display information distributed through electronic communication lines such as the Internet or CATV (cable television), and in particular, opportunities to display moving image information are increasing. Since the response speed of the material of the organic layer is very high, the light emitting device of the present invention is preferable for displaying moving images.

FIG. 18A illustrates a mobile phone, which includes a display panel 1001, an operation panel 1002, a connection portion 1003, a display portion 1004, an audio output portion 1005, an operation switch 1006, a power switch 1007, an audio input portion 1008, and an antenna 1009. Including.
The light emitting device of the present invention can be used in the display portion 1004. Note that the display portion 1004 can reduce power consumption of the mobile phone by displaying white characters on a black background.

  FIG. 18B illustrates a sound reproducing device, specifically a car audio, which includes a main body 1011, a display portion 1012, an operation switch 1013, and an operation switch 1014. The light emitting device of the present invention can be used in the display portion 1012. Moreover, although the vehicle-mounted audio is shown in the present embodiment, it may be used for a portable or household sound reproducing device. Note that the display unit 1014 can reduce power consumption by displaying white characters on a black background. This is particularly effective in a portable sound reproducing apparatus.

  FIG. 18C illustrates a digital camera, which includes a main body 1021, a display portion (A) 1022, an eyepiece portion 1023, operation switches 1024, a display portion (B) 1025, and a battery 1026. The light-emitting device of the present invention can be used in the display portion (A) 1022 and the display portion (B) 1025. In addition, when the display portion (B) 1025 is mainly used as an operation panel, power consumption can be suppressed by displaying white characters on a black background.

  FIG. 19A illustrates a vehicle rearward confirmation monitor, which includes a main body 3201, a display portion 3202, a connection portion 3203 with a car, a relay cable 3204, a camera 3205, a mirror 3206, and the like. The light emitting device of the present invention can be applied to the display portion 3202. In the present application, the mirror 3206 includes the display unit 3202, but the mirror and the display unit may be separated.

  FIG. 19B illustrates a videophone, which includes a main body 3301, a display portion 3302, an image receiving portion 3303, a keyboard 3304, operation switches 3305, a receiver 3306, and the like. The light emitting device of the present invention can be applied to the display portion 3303.

  FIG. 19C illustrates car navigation, which includes a main body 3401, a display portion 3402, operation switches 3403, and the like. The light emitting device of the present invention can be applied to the display portion 3402. The display unit 3402 displays a picture such as a road.

  FIG. 19D illustrates an electronic notebook, which includes a main body 3501, a display portion 3502, an operation switch 3503, an electronic pen 3504, and the like. The light emitting device of the present invention can be applied to the display portion 3502.

  In the portable electric appliance shown in this embodiment, as a method for reducing power consumption, a sensor unit that senses external brightness is provided, and when used in a dark place, the luminance of the display unit is reduced. For example, a method of adding a function such as dropping a function.

  As described above, the applicable range of the light-emitting device of the present invention is so wide that the light-emitting device can be used for electric appliances in various fields. Moreover, any configuration shown in the first to tenth embodiments may be applied to the electric appliance of the present embodiment.

Claims (2)

Forming a light emitting element on the first substrate;
Forming a first recess and a second recess in a second substrate;
Forming a scribe line around the light emitting element on the first substrate;
The first substrate and the second substrate are formed by the sealant, the sealant is formed between the first recess and the second recess, and the scribe line and the second substrate A step of bonding so that the concave portion overlaps,
Dividing the first substrate and the second substrate along the scribe line and the second recess,
The sealing material is formed around the light emitting element,
Forming the first recess in the second substrate so as to be outside the light emitting element;
Forming the second recess in the second substrate to be outside the first recess,
A method for manufacturing a light-emitting device, wherein when the first substrate and the second substrate are bonded together, a part of the sealing material is accumulated in the first recess and the second recess. In claim 1,
A method for manufacturing a light-emitting device, wherein the first recess and the second recess are formed by etching the surface of the second substrate.

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