JP2005266754A - Method for manufacturing electrooptical device, electrooptical device and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing an electrooptical device with which a substrate for the electrooptical device is efficiently thinned in the middle of its manufacturing process, the electrooptical device and the electronic equipment. <P>SOLUTION: In the case of manufacturing a display device by sticking a plurality of substrates 2 for the electrooptical device, in a grinder 200, the plurality of substrates 2 for the electrooptical device are fixed to a surface plate 210 by wax 250, after that, a lapping process and a polishing process are performed and after thinning the substrates 2 for the electrooptical device, the plurality of substrates 2 for electrooptical device are stuck on a large-sized substrate 3 on the surface plate 210. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing an electro-optical device, an electro-optical device, and an electronic apparatus using the same.

  Among various electro-optical devices, for example, in an organic EL display device, a substrate having a pixel switching element and an organic EL element in each of a large number of pixel regions arranged in a matrix is used. The organic EL element injects electrons and holes from the electron injection electrode and the hole injection electrode into the light emitting part, recombines the injected electrons and holes at the emission center to bring the organic molecules into an excited state, and the organic molecules Produces fluorescence when it returns from the excited state to the ground state. Here, if a fluorescent material that is a luminescent material is selected, the luminescent color can be changed, so that a color image can be displayed.

  Such an organic EL display device is required to have a size exceeding 30 inches as in the case of a liquid crystal device, but in that case, the substrate is also enlarged. For this reason, a line for manufacturing a TFT (Thin Film Transistor) as a pixel switching element is enlarged. In addition, increasing the size of the substrate itself decreases the yield in the cleaning process and the film forming process. Furthermore, if an attempt is made to construct a TFT with a low-temperature polysilicon TFT for the purpose of using an inexpensive glass substrate as the substrate, laser annealing for crystallizing amorphous silicon into polysilicon becomes unstable.

In view of this, it has been proposed that a large-sized organic EL display device or a large-sized liquid crystal display device is configured by planarly arranging a plurality of substrates that can be manufactured with sufficient technology and equipment. Such an enlargement technique includes a method of arranging a plurality of electro-optical device substrates in a plane after forming all of the pixel switching elements and organic EL elements on the electro-optical device substrate, and an electro-optical device. And a method of forming a plurality of electro-optic device substrates in a planar manner after forming pixel switching elements on the substrate, and then forming an organic EL element on each electro-optic device substrate. However, in the latter case, there is an advantage that the joint between the substrates for the electro-optical device is not conspicuous (see, for example, Patent Documents 1 and 2).
JP 2001-102171 A JP 2002-297063 A

  However, as in the techniques described in Patent Documents 1 and 2, when a plurality of electro-optical device substrates are bonded to a large substrate, the electro-optical device is thicker and the weight cannot be reduced. There is a problem, which is a problem common to both organic EL display devices and liquid crystal display devices. In addition, there is a problem that a new type of electro-optical device having a curved substrate cannot be manufactured. However, when a thin substrate is used from the beginning, there is a problem in that the substrate is broken during the manufacturing process and the yield tends to decrease.

  Further, in the techniques described in Patent Documents 1 and 2, when forming an organic EL element in a state where a plurality of electro-optical device substrates are arranged in a plane, it is necessary to use a semiconductor process or the like as usual. A special technique for forming the organic EL element over a wide area is not employed. For this reason, when forming an organic EL element, there is still a problem that an increase in the size of the manufacturing apparatus cannot be avoided.

  In view of the above problems, an object of the present invention is to provide a method for manufacturing an electro-optical device capable of efficiently thinning a substrate for an electro-optical device during the manufacturing process, and the electro-optical device manufactured by this method. And providing an electronic device using the same.

  Another object of the present invention is to provide an electro-optical device capable of efficiently forming a self-emitting element or a liquid crystal element in a state where a plurality of electro-optical device substrates are arranged in a plane without increasing the size of the manufacturing apparatus. And an electro-optical device manufactured by this method, and an electronic apparatus including the electro-optical device.

  In order to solve the above problems, in the present invention, after the electro-optical device substrate is subjected to a predetermined step to hold the electro-optical material, the electro-optical device substrate is fixed on the surface plate with wax. And a thinning step for thinning the electro-optical device substrate by polishing the surface of the electro-optical device substrate in this state. After the thinning step, the wax is heated. The electro-optical device substrate is melted and removed from the surface plate.

  In the present invention, when the electro-optic device substrate is thinned, the electro-optic device substrate is thinned after being subjected to a predetermined process, so that the electro-optic device substrate is thick until then. Therefore, even when a hard substrate such as a glass substrate is used as the substrate for the electro-optical device, and the substrate for the electro-optical device is thinned to, for example, 100 μm or less, and further to 50 μm or less, the electric substrate is used during the manufacturing process. There is no risk of the optical device substrate breaking. In addition, since a plurality of electro-optical device substrates can be polished together, the efficiency is high. In addition, since the electro-optic device substrate is thinned not by chemical etching but by polishing, the surface of the electro-optic device substrate is not roughened. In addition, although a large number of terminals are formed on the electro-optical device substrate, unlike chemical etching, one surface of the electro-optical device substrate can be selectively polished in the case of polishing, so that the terminals may be damaged. Absent. Furthermore, even when a pair of substrates for an electro-optical device is already bonded with a sealing material as in a liquid crystal device, the sealing material does not deteriorate during mechanical polishing unlike chemical etching. Furthermore, the electro-optical device substrate can be fixed on the surface plate simply by solidifying the melted wax, and after polishing is completed, the electro-optical device substrate can be removed from the surface plate simply by melting the wax. Can be removed. In addition, if the fixing is performed with wax, the fixing stress does not concentrate on a part of the manufactured product, so that the substrate for the electro-optical device is not broken. Furthermore, since the wax melts at a temperature of about 80 ° C., even if the electro-optic material such as liquid crystal or EL material is held on the substrate for the electro-optic device and then thinned, the electro-optic material does not deteriorate. Further, since the surfaces of the plurality of electro-optical device substrates are aligned by polishing, the plurality of electro-optical device substrates and the large substrate can be easily and accurately bonded on the surface plate.

  In the present invention, in the thinning step, the electro-optical device substrate is polished and thinned while the electro-optical device substrate is fixed on the surface plate with the wax, and the electro-optical device is thinned. It is preferable to continuously perform a polishing step for smoothly polishing the surface of the working substrate.

  In the present invention, in the fixing step, the wax is heated and melted in a recess formed on the upper surface of the surface plate, the plurality of electro-optical device substrates are immersed in the melted wax, and the plurality Applying fluid pressure to the substrate for the electro-optical device and pressing it toward the surface plate, and then cooling and solidifying the wax, and the plurality of electro-optics with the wax on the surface plate It is preferable to fix the apparatus substrate. As a method of applying the fluid pressure, there is a method of jetting compressed air from the head toward the upper surface of the electro-optical device substrate. In addition, an electro-optical device substrate is covered with an elastic diaphragm, and fluid is supplied into a space on the opposite side to the side where the electro-optical device substrate is disposed, of the two spaces partitioned by the diaphragm. May be. With this configuration, a uniform force can be applied to each of the electro-optical device substrates, so that the electro-optical device substrate can be fixed on the surface plate in an appropriate posture, and polishing with high accuracy can be performed. It can be carried out.

  In the present invention, a bonded substrate in which a large substrate is bonded to the plurality of electro-optical device substrates on the surface plate, and the plurality of electro-optical device substrates are planarly arranged on the large substrate; After performing the bonding step, the wax is heated and melted to remove the bonded substrate from the surface plate, and then the bonded substrate is used on the large substrate for the electro-optical device. It is preferable to manufacture an electro-optical device in which a plurality of substrates are arranged in a plane.

  In the present invention, in the bonding step, in a state where a large substrate is overlaid on the plurality of electro-optical device substrates on the surface plate, fluid pressure is applied to the large substrate to place the large substrate on the surface plate. It is preferable to press it toward. For this purpose, compressed air is ejected from the head toward the large substrate. In addition, a diaphragm having elasticity is placed on a large substrate, and a fluid such as air or liquid is supplied into a space on the opposite side to the side where the large substrate is disposed, of the two spaces partitioned by the diaphragm. May be. With this configuration, since a uniform force is applied to the large substrate and the electro-optical device substrate, any of the electro-optical device substrates can be bonded to the large substrate under the same conditions. Therefore, the positional variation in the thickness direction of the electro-optical device substrate can be prevented, and a high-quality image can be displayed.

  In the present invention, the electro-optical device substrate is, for example, a substrate for a liquid crystal device in which a pair of substrates are bonded together with a sealing material. The present invention can also be applied to the case where the electro-optical device substrate is a substrate for a self-luminous electro-optical device such as an organic EL display device.

  When the present invention is applied to a self-luminous electro-optical device, a pixel switching element and a self-luminous element are formed in each of a large number of pixel regions arranged in a matrix on the electro-optical device substrate. Therefore, when applying the present invention, after forming the pixel switching element and the pixel electrode of the self-luminous element on one side of the electro-optical device substrate, the one side is directed to the surface plate. The fixing step and the thinning step are performed on the plurality of electro-optical device substrates to polish the other surface side of the plurality of electro-optical device substrates, and then the plurality of the substrates on the surface plate A bonding step is performed in which a large substrate is bonded to the other surface side of the electro-optical device substrate and the plurality of electro-optical device substrates are planarly arranged on the large substrate. Then, the wax is heated and melted to remove the bonded substrate from the surface plate, and then the self-luminous light is emitted to one surface side of the plurality of electro-optical device substrates in the state of the bonded substrate. Form the light emitting functional layer of the device Perform a light-emitting function layer forming step, and thereafter, the electro-optical device substrate to produce a plurality, electro-optical devices arranged in a plane on the large substrate using the bonded substrate. In other words, processes that require laser annealing or photolithography technology, such as the formation of pixel switching elements and the formation of pixel electrodes of self-luminous elements, are performed before the bonding process to a large substrate, and after the bonding process. The light emitting functional layer of the self light emitting element is formed. For this reason, when forming the light emitting functional layer of the self light emitting element, it is possible to adopt an ink jet method or the like that can be easily applied to an arbitrary position. Even when the light emitting functional layer is formed in a wide region in which a plurality of electro-optical device substrates are arranged in a plane, the size of the device is not increased and the yield is not reduced.

  In the present invention, in the bonding step, in a state where a large substrate is overlaid on the plurality of electro-optical device substrates on the surface plate, fluid pressure is applied to the large substrate to place the large substrate on the surface plate. It is preferable to press it toward. For this purpose, compressed air is ejected from the head toward the large substrate. In addition, a diaphragm having elasticity is placed on a large substrate, and a fluid such as air or liquid is supplied into a space on the opposite side to the side where the large substrate is disposed, of the two spaces partitioned by the diaphragm. May be. With this configuration, since a uniform force is applied to the large substrate and the electro-optical device substrate, any of the electro-optical device substrates can be bonded to the large substrate under the same conditions. Therefore, the positional variation in the thickness direction of the electro-optical device substrate can be prevented, and a high-quality image can be displayed.

  In the present invention, in the light emitting functional layer forming step, a liquid composition is selectively applied to a predetermined region on one surface side of the plurality of electro-optical device substrates by an ink jet method to emit light from the self light emitting element. It is preferable to form a functional layer. When the present invention is applied, the accuracy such as the height position of the electro-optical device substrate is high. Therefore, when forming the light emitting functional layer of the self-light-emitting element by the ink jet method, This distance is constant in any electro-optical device substrate. Therefore, since the flying distance of the droplet from the inkjet head is constant in any electro-optical device substrate, it is possible to prevent variations in the formation position and brightness of the light emitting functional layer due to variations in the flying distance.

  In the present invention, after the pixel switching element and the pixel electrode are formed on one surface side of the electro-optical device substrate, a protective film is formed on the one surface side of the electro-optical device substrate when performing the fixing step. The protective film is preferably removed after removing the bonded substrate from the surface plate and before performing the light emitting functional layer forming step. With this configuration, the one surface side on which the pixel switching elements and the like are formed in the electro-optical device substrate can be protected from foreign matters and damage during the bonding process, so that reliability can be improved. .

  In this case, before applying the protective film to one surface side of the electro-optical device substrate, a partition that defines a coating region of the liquid composition is formed on the electro-optical device substrate, and the protective film is formed. Is preferably provided with a pressure-sensitive adhesive layer that is thicker than the height of the partition wall on one side of the film substrate. If comprised in this way, the penetration | invasion of the bubble between the board | substrate for electro-optical apparatuses and a protective film can be prevented. Accordingly, there is no unevenness on the surface of the protective film applied to the electro-optical device substrate, so even when the electro-optical device substrate and the large substrate are bonded to each other on the basis of the protective film side, one side of the electro-optical device substrate The side position can be aligned with high accuracy. Therefore, the light emitting functional layer of the self light emitting element can be stably formed by the ink jet method. In addition, it is possible to prevent variation in position in the thickness direction of the electro-optical device substrate in a state in which the self-light-emitting electro-optical device is formed, so that high-quality images can be displayed.

  Further, in the present invention, before pasting the protective film on one surface side of the electro-optical device substrate, a partition that defines a coating region of the liquid composition is formed on the electro-optical device substrate, In the protective film, on one side of the film substrate, a liquid repellent material layer for the liquid composition and an adhesive layer thinner than the height of the partition wall are formed, and when the protective film is removed, You may employ | adopt the structure which transfers the said liquid repellent material layer around the application | coating area | region of the said liquid composition. In the case of such a configuration, it is not necessary to perform a special liquid repellent process such as a plasma process on the one surface side of the substrate for the electro-optical device, so that the manufacturing process can be simplified.

  Further, when the present invention is applied to a matrix type liquid crystal panel, a liquid crystal panel holding a liquid crystal material is formed between the electro-optical device substrate and the counter substrate, and then the counter substrate side is fixed with wax. It is also possible to perform a fixing step of fixing to a board, a thinning step of polishing the electro-optical device substrate side, or a bonding step of bonding the large substrate and the electro-optical device substrate. In this way, processes that require laser annealing or photolithography technology, such as the formation of pixel switching elements and the formation of pixel electrodes for liquid crystals, can be performed with a small substrate, such as a vacuum apparatus and an exposure apparatus. The size of expensive semiconductor devices can be prevented. Further, the yield is not reduced due to the increase in size of the substrate. Furthermore, the process of increasing the size of the display by bonding and reducing the weight of the substrate by polishing can be performed after the assembly of the small panel, so that the surface on which the pixel switching elements are formed is protected from foreign matters and damage. Reliability can be improved.

  When the present invention is applied to a matrix-type liquid crystal panel, a pixel switching element and a pixel electrode for a liquid crystal element are formed on one surface side of the electro-optical device substrate, and then the one surface side is polished. The other surface side of the plurality of electro-optical device substrates is polished by performing the thinning process by polishing. Next, a large substrate is bonded to the other side of the plurality of electro-optical device substrates on the surface plate, and the plurality of electro-optical device substrates are bonded in a plane on the large substrate. A bonding process is performed as a bonded substrate. Further, the wax is heated and melted to remove the bonded substrate from the surface plate, and then a liquid crystal panel holding a liquid crystal material from the bonded substrate and the counter substrate. Make it. In this way, it is possible to easily manufacture an electro-optical device in which a plurality of electro-optical device substrates are arranged in a plane on the large substrate. In other words, processes that require laser annealing, photolithography technology, etc., such as the formation of pixel switching elements and the formation of pixel electrodes for liquid crystals, are performed before the bonding process to a large substrate, and after the bonding process, Assemble the LCD panel. For this reason, there is no increase in the size of expensive semiconductor devices such as vacuum devices and exposure devices, and a decrease in yield due to the increase in size of the substrate.

  According to the present invention, after the pixel switching element and the pixel electrode are formed on one surface side of the electro-optical device substrate, the one surface side of the electro-optical device substrate is protected when the fixing step is performed. After the film is pasted and the bonded substrate is removed from the surface plate, it is preferable to remove the protective film from the bonded substrate before performing the bonding step of the counter substrate. In this case, the surface on which the pixel switching elements and the like of the electro-optical device substrate are formed can be protected from foreign matters and damage during the polishing and bonding process, so that reliability can be improved.

  In the present invention, the bonding step of the large substrate for the liquid crystal substrate may be performed by applying fluid pressure to the large substrate in a state where the large substrate is overlaid on the plurality of electro-optical device substrates on the surface plate. It is preferable to press the large substrate toward the surface plate. For this purpose, compressed air is ejected from the head toward the large substrate. In addition, a diaphragm having elasticity is placed on a large substrate, and a fluid such as air or liquid is supplied into a space on the opposite side to the side where the large substrate is disposed, of the two spaces partitioned by the diaphragm. May be. With this configuration, since a uniform force is applied to the large substrate and the electro-optical device substrate, any of the electro-optical device substrates can be bonded to the large substrate under the same conditions. Therefore, the positional variation in the thickness direction of the electro-optical device substrate can be prevented, and a high-quality image can be displayed.

  In the present invention, in the state where the bonded substrate is also fixed on a surface plate with wax, the surface of the large substrate is polished to thin the large substrate, and then the wax is heated and melted to heat the bonded substrate. Is preferably removed from the surface plate. With this configuration, the electro-optical device can be further reduced in thickness and weight.

  In the present invention, after forming a module having a sealing substrate or a counter substrate attached to one surface side of the electro-optical device substrate, the sealing substrate or It is preferable that the surface of the counter substrate is polished to make the substrate thinner, and then the wax is heated and melted to remove the module from the surface plate. With this configuration, the electro-optical device can be further reduced in thickness and weight.

  A self-luminous electro-optical device to which the present invention is applied can be used for a portable electronic device such as a mobile phone or a mobile computer, and can also be used for an electronic device having a large screen exceeding 30 inches.

  Hereinafter, an electro-optical device, a manufacturing method thereof, and an electronic apparatus using the electro-optical device according to the invention will be described with reference to the drawings. In each drawing to be referred to, the scale may be different for each layer or each member in order to make the size recognizable on the drawing.

[Embodiment 1]
(Overall configuration of organic EL display device)
1A and 1B are a perspective view and a plan view of an active matrix organic EL display device according to Embodiment 1 of the present invention. FIG. 2 is an explanatory diagram showing an electrical configuration of the organic EL display device shown in FIG.

  In FIG. 1, an organic EL display device 1 of this embodiment is a large display device of 30 inches or more using so-called tiling technology, and a plurality of electro-optical device substrates 2 (TFT array substrates) (4 in this embodiment). Sheet) and are bonded to the large substrate 3 in a state of being arranged in a plane. In the electro-optical device substrate 2, a gas barrier sealing substrate 4 is bonded to the surface opposite to the large substrate 3. The large substrate 3 is larger than the plurality of electro-optical device substrates 3. On the other hand, the sealing substrate 4 is smaller than a plurality of electro-optical device substrates 2, and a part of the one surface side 21 of the electro-optical device substrate 2 protrudes from the edge of the sealing substrate 4. ing. Accordingly, the terminals formed on the end portion on the one surface side 21 of the electro-optical device substrate 2 can be electrically connected to the outside by a flexible wiring substrate (not shown) or the like.

  Here, the electro-optical device substrate 2 is a glass substrate that has been thinned to, for example, 100 μm or less, and further to 50 μm or less, by a thinning process described later.

  As shown in FIG. 2, the organic EL display device 1 of the present embodiment also has a plurality of scanning lines 131 and scanning lines on the electro-optical device substrate 2 in terms of an equivalent circuit in the same manner as a known organic EL display device. A plurality of signal lines 132 extending in a direction intersecting with 131 and a plurality of power supply lines 133 extending in parallel with the signal lines are wired. Further, the pixel region 100 is formed at each intersection of the scanning line 131 and the signal line 132. For example, the data line driving circuit 103 including a shift register, a level shifter, a video line, and an analog switch is connected to the signal line 132. Further, the scanning line drive circuit 104 including a shift register and a level shifter is connected to the scanning line 131.

(Pixel configuration)
FIG. 3 is an enlarged sectional view showing a pixel region in the organic EL display device shown in FIG.

  As shown in FIGS. 2 and 3, each pixel region 100 of the organic EL display device 1 of the present embodiment has a pixel switching TFT 123 in which a scanning signal is supplied to a gate electrode via a scanning line 131, and the TFT 123. A storage capacitor 135 for holding an image signal supplied from the signal line 132 via the pixel line, and a pixel switching (driving) TFT 124 for supplying the image signal held by the storage capacitor 135 to the gate electrode are formed. Yes. In order to form such TFTs 123 and 124, the substrate 2 for the electro-optical device is provided with a base protective film 2c made of a silicon oxide film on a base material made of a glass substrate, and on the base protective film 2c. An island-shaped semiconductor film 141 made of a low-temperature polysilicon film is formed. A source region 141a and a drain region 141b are formed in the semiconductor film 141 by high-concentration P ion implantation, and a portion where P is not introduced serves as a channel region 141c. A gate insulating film 142 is formed on the surface side of the base protective film 2c and the semiconductor film 141, and a gate electrode 143 (scanning line) made of Al, Mo, Ta, Ti, W, or the like is formed on the gate insulating film 142. ing. A transparent first interlayer insulating film 144a and a second interlayer insulating film 144b are formed on the surface side of the gate electrode 143 and the gate insulating film 142. The gate electrode 143 is provided at a position corresponding to the channel region 141c of the semiconductor film 141. In addition, contact holes 145 and 146 connected to the source and drain regions 141a and 141b of the semiconductor film 141 are formed in the interlayer insulating films 144a and 144b. A transparent pixel electrode 111 made of ITO or the like is formed in a predetermined shape on the second interlayer insulating film 144b. A TFT 124 is connected to the pixel electrode 111 through a contact hole 145.

  The pixel region 100 is further sandwiched between a pixel electrode (anode) 111 into which a drive current flows from the power supply line 133 when electrically connected to the power supply line 133 via the TFT 124, and the pixel electrode 111 and the cathode 12. An organic EL element 101 (self-emitting element) including the light emitting functional layer 110 (organic functional layer) is formed.

  The organic functional layer 110 includes, for example, a hole injection / transport layer 110a laminated on the pixel electrode 111 and a light emitting layer (organic EL layer) 110b formed on the hole injection / transport layer 110a. Yes. An electron injection / transport layer may be formed between the light emitting layer 110b and the cathode. The hole injection / transport layer 110a has a function of injecting holes into the light emitting layer 110b and a function of transporting holes inside the hole injection / transport layer 110a. In the light emitting layer 110b, the holes injected from the hole injection / transport layer 110a and the electrons injected from the cathode 12 side recombine to obtain light emission. Here, the large number of pixel regions 100 correspond to each color of red (R), green (G), and blue (B), and the correspondence of such colors corresponds to the type of material constituting the organic functional layer 110. It is prescribed by.

  The cathode 12 includes a calcium layer 12a and an aluminum layer 12b, and is formed on substantially the entire surface of the electro-optical device substrate 2 excluding the terminal formation region. The aluminum layer 12b reflects the light emitted from the light emitting layer 110b to the electro-optical device substrate 2 side. The aluminum layer 12b may be composed of an Ag film, a laminated film of Al and Ag, or the like in addition to the Al film.

In the organic EL display device 1 of this embodiment, in the pixel region 100, the partition 112 is formed as a bank so as to surround the peripheral portion of the pixel electrode 111. As will be described later, the partition 112 defines an application region of a liquid composition that is ejected and applied by an ink jet method (liquid ejection method) when the organic functional layer 110 is formed. The composition is formed with a uniform thickness. In this embodiment, the partition 112 includes, for example, an inorganic bank layer 112a located on the substrate side, and an organic bank layer 112b formed on the inorganic bank layer 112a. The inorganic bank layer 112a is made of, for example, an inorganic material such as SiO ₂ or TiO ₂ . The organic bank layer 112b is formed of a resist having heat resistance and solvent resistance such as acrylic resin and polyimide resin.

  The sealing substrate 4 prevents oxidation of the cathode 12 or the organic functional layer 110 by preventing water and oxygen from entering. The sealing substrate 4 is flat on one side 21 of the electro-optical device substrate 2 such as an epoxy resin. It is bonded together via a sealing resin 40 having a function to make it. The large substrate 3 is bonded to the other surface side 22 of the electro-optical device substrate 2 via a transparent adhesive 30.

  In the organic EL display device 1 configured as described above, when the scanning line 131 is driven and the TFT 123 is turned on, the potential of the signal line 132 at that time is held in the holding capacitor 135, and according to the state of the holding capacitor 135. Thus, the conduction state of the driving TFT 124 is controlled. Further, when the driving TFT 124 is turned on, a current flows from the power supply line 133 to the pixel electrode 111 through the channel, and further, in the organic EL element, a current flows to the cathode 12 through the organic functional layer 110. The organic functional layer 110 emits light according to the amount of current at this time. The light emitted from the organic functional layer 110 to the large substrate 3 side is emitted to the observer side, while the light emitted from the organic functional layer 110 to the side opposite to the large substrate 3 is reflected by the cathode 12 to be large. It is emitted from the substrate 3 to the observer side.

(Production method)
4A and 4B are explanatory views at a stage where TFTs and pixel electrodes have been formed on the electro-optical device substrate in the method of manufacturing the organic EL display device shown in FIG. 5A to 5D and FIGS. 6A to 6F are process cross-sectional views illustrating a method for manufacturing the organic EL display device shown in FIG. 7A and 7B are explanatory diagrams of an organic functional layer forming step in the method for manufacturing the organic EL display device shown in FIG.

  In manufacturing the organic EL display device 1, in this embodiment, as shown in FIGS. 4A and 4B, circuit elements such as TFTs 123 and 124, the pixel electrode 111 of the organic EL element 101, and the partition 112 are electrically connected. It forms on the board | substrate 2 for optical apparatuses. Until such a process is performed, the electro-optical device substrate 2 is a thick glass substrate 2 ′ before being thinned, and the thickness thereof is, for example, 0.5 mm.

  Next, as shown to FIG. 4 (A), (B) and FIG. 5 (A), the protective film 6 is stuck on the one surface side 21 of the board | substrate 2 for electro-optical apparatuses (protective film sticking process). The protective film 6 is a so-called UV film, and includes a UV release layer 62 between the film substrate 61 and the adhesive layer 63 as shown in FIG. The protective film 6 is pasted so as to exclude the region where the terminals 20 are formed on the one surface side 21 of the electro-optical device substrate 2, but may cover the entire surface of the electro-optical device substrate 2. . Further, the electro-optical device substrate 2 may be irradiated with laser light and cut together with the protective film 6 to adjust the outer shape of the electro-optical device substrate 2. Laser cutting of the electro-optical device substrate 2 is performed for other electro-optical devices in a state where at least one of the plurality of substrate sides of the electro-optical device substrate 2 is arranged as shown in FIGS. This is performed on the side adjacent to the substrate 2. In addition, alignment marks indicating laser irradiation positions are preferably formed at the four corners of the electro-optical device substrate 2.

  Next, in the polishing apparatus 200 shown in FIG. 5B, the electro-optical device substrate 2 is thinned. For this purpose, first, a plurality of electro-optical device substrates 2 are arranged and fixed on the surface plate 210 of the polishing apparatus 200 (fixing step). The polishing apparatus 200 includes a ceramic surface plate 210 in which a concave portion 220 is formed in a portion where the electro-optical device substrate 2 is disposed, and the concave portion 220 is filled with wax 250. Accordingly, after the wax 250 is heated and melted to a temperature of about 80 ° C. indirectly or directly via the surface plate 210, the one surface side 21 is placed on the surface of the molten wax 250. A plurality of directed electro-optical device substrates 2 are arranged so as to be planarly arranged, and fluid pressure is applied to the electro-optical device substrate 2 to press the electro-optical device substrate 2 into the recess 220. For this purpose, compressed air is ejected from the head toward the electro-optical device substrate 2. Further, the electro-optical device substrate 2 is covered with an elastic diaphragm, and the air in the space opposite to the side where the electro-optical device substrate 2 is disposed is separated from the two spaces partitioned by the diaphragm. Or a fluid such as a liquid may be supplied. With this configuration, a uniform force can be applied to each of the electro-optical device substrates 2.

  Next, the melted wax 250 is naturally cooled or forcedly cooled to a temperature of 25 ° C. to solidify the wax 250. As a result, as shown in FIG. 5C, the electro-optical device substrate 2 is fixed in the concave portion 220 of the surface plate 210 via the wax 250 with the other surface side 22 facing upward.

Next, a thinning process is performed. For this purpose, the polishing head 280 is disposed above the electro-optical device substrate 2, and the polishing head 280 is rotated around the axis while the platen 210 is rotated at a speed different from that of the polishing head 280. In this state, while supplying a suspension of abrasive grains between the polishing head 280 and the electro-optical device substrate 2 and as indicated by an arrow P, the polishing head 280 is about 150 g / cm ^2. The surface of the counter substrate 20 of the electro-optical device substrate 2 is polished at a speed of about 7.2 μm / min while applying a load of 0.5 mm to a thickness of 0.5 to 25 μm (lapping step).

Next, as a polishing step, as shown in FIG. 5D, a soft polishing cloth 281 is attached to the lower end portion of the polishing head 280, and abrasive grains are interposed between the polishing head 280 and the electro-optical device substrate 2. While supplying the suspension as required, and as indicated by an arrow P, while applying a load of about 50 g / cm ² to the polishing head 280, the other surface side of the polished substrate 2 for the electro-optical device The surface of 22 is smoothed. As a result, the electro-optical device substrate 2 has a light transmittance equivalent to that of glass.

  Next, as shown in FIG. 6A, the other surface side 22 of the electro-optical device substrate 2 is cleaned. Next, as shown in FIG. 6B, an adhesive 30 is applied to the other surface side 22 of the electro-optical device substrate 2, and then, as shown in FIG. The large substrate 3 is stacked on the other side 22 and the adhesive 30 is cured. Also in this case, fluid pressure is applied to the large substrate 3 to press the large substrate 3 against the surface plate 210, thereby improving the adhesion between the electro-optical device substrate 2 and the large substrate 3. As a method for applying fluid pressure to the large substrate 3, for example, compressed air is ejected from the head toward the large substrate 3. Further, a diaphragm having elasticity is placed on the large substrate 3, and a fluid such as air or liquid is put into a space opposite to the side where the large substrate 3 is disposed, in the two spaces partitioned by the diaphragm. You may supply.

  In this manner, the plurality of electro-optical device substrates 2 are bonded to the large substrate 3 on the surface plate 210 via the adhesive 30 to form the bonded substrate 10, and the solidified wax 250 is then used. The substrate 2 for electro-optical device (bonded substrate 10) is melted by heating to a temperature of about 80 ° C. indirectly or directly through the surface plate 210, as shown in FIG. 6 (D). Remove from the recess 220 of the platen 210.

  Next, the protective film 6 is irradiated with UV light, and the protective film 6 is peeled off as shown in FIG. At this time, the adhesive material layer 63 is also completely removed from the one surface side 21 of the electro-optical device substrate 2. Next, the bonded substrate 10 is cleaned.

  In this manner, after the bonded substrate 10 shown in FIG. 7A is manufactured, a light emitting functional layer forming step is performed. For this purpose, holes are directed toward the region surrounded by the partition wall 112 in the electro-optical device substrate 2 while relatively moving the inkjet head 9 and the electro-optical device substrate 2 indicated by a one-dot chain line in FIG. After selectively discharging and applying a liquid composition for forming the injection / transport layer 110a, heat treatment is performed to form the hole injection / transport layer 110a. Similarly, while the inkjet head 9 and the electro-optical device substrate 2 are moved relative to each other, the light-emitting layer 110b corresponding to a predetermined color is formed in the region surrounded by the partition 112 in the electro-optical device substrate 2. After the liquid composition is discharged and applied, heat treatment is performed to form the light emitting layer 110b. Here, the liquid composition for forming the hole injection / transport layer 110a is composed of 3,4-polyethylenediosithiophene / polystyrene sulfonic acid (PEDOT / PSS), a conductive polymer such as polyaniline, polypyrrole, MTDATA, A solution or dispersion of a phenylamine derivative, copper phthalocyanine, or the like. The liquid composition for forming the light emitting layer 110b includes (poly) fluorene derivative (PF), (poly) paraphenylene vinylene derivative (PPV), polyphenylene derivative (PP), polyparaphenylene derivative (PPP), and polyvinyl. These are solutions or dispersions of polysilanes such as carbazole (PVK), polythiophene derivatives, and polymethylphenylsilane (PMPS).

  Next, as shown in FIG. 3, a calcium layer 12a and an aluminum layer 12b are sequentially formed by vapor deposition or the like. At that time, without using a large manufacturing apparatus, the outer peripheral portion such as the terminal formation region is covered with a predetermined member for the purpose of selectively forming the calcium layer 12a and the aluminum layer 12b over a wide area. Vapor deposition is performed.

  Next, as shown in FIG. 6 (F), a sealing substrate 4 is pasted through a sealing resin 40 to form a module 1 ′. Using this module 1 ′, The organic EL display device 1 shown in B) is manufactured.

  In addition, about the large sized board | substrate 3 and the sealing substrate 4, it may cut | disconnect by irradiating a laser and may be adjusted to a predetermined size. Further, as shown in FIGS. 6E and 6F, after a plurality of electro-optical device substrates 2 and a large substrate 3 are bonded together to form a bonded substrate 10, or for an electro-optical device. After laminating the large substrate 3 and the sealing substrate 40 so as to sandwich the substrate 2, the module 1 'is polished, and then the sealing substrate 4 or the large substrate 3 is polished to thin the sealing substrate 4 or the large substrate 3. Also good. Also in this case, as shown in FIGS. 5B, 5C, and 5D, in the polishing apparatus 200, the bonded substrate 10 or the module 1 ′ is fixed to the surface plate 210 with the wax 250, and thereafter, What is necessary is just to perform the lapping process and polishing process which were performed.

(Main effects of this form)
As described above, in this embodiment, when the electro-optical device substrate 2 is thinned, the electro-optical device substrate 2 is thinned after being subjected to a predetermined process. Is thick. Therefore, even when a hard substrate such as a glass substrate is used as the electro-optical device substrate 2 and the electro-optical device substrate 2 is thinned to, for example, 100 μm or less, and further to 50 μm or less, the manufacturing process is in progress. There is no risk of the electro-optical device substrate 2 breaking. In addition, since a plurality of electro-optical device substrates 2 are polished together, the efficiency is high.

  Further, since the electro-optical device substrate 2 is thinned by polishing instead of chemical etching, the surface of the electro-optical device substrate 2 is not roughened. In addition, although a large number of terminals 20 are formed on the electro-optical device substrate 2, unlike chemical etching, one surface of the electro-optical device substrate 2 can be selectively polished in the case of polishing. There is no damage.

  Furthermore, the electro-optical device substrate 2 can be fixed on the surface plate 210 simply by solidifying the melted wax, and after the polishing is completed, the electro-optical device substrate 2 is simply melted. It can be removed from the surface plate 210. In addition, if the fixing is performed using the wax 250, the stress for fixing does not concentrate on a part of the electro-optical device 2, so that the electro-optical device substrate 2 is not broken.

  Further, since the surfaces of the plurality of electro-optical device substrates 2 are aligned by polishing, the plurality of electro-optical device substrates 2 and the large substrate 3 can be easily and accurately bonded on the surface plate 210. Can do.

  In this embodiment, processes that require laser annealing, photolithography technology, and the like, such as the formation of TFTs 123 and 124 and the formation of the pixel electrode 111, are performed before the bonding process to the large substrate 4, and the bonding process is performed. Thereafter, when forming the light emitting functional layer 110 of the organic EL element 101, an ink jet method capable of easily applying to an arbitrary position is employed. For this reason, even when the light emitting functional layer 110 of the organic EL element 101 is formed in a wide region in which a plurality of electro-optical device substrates 2 are arranged in a plane, the size of the manufacturing apparatus is not increased and the yield is not reduced. .

  Further, in this embodiment, since the laser cutting step of cutting the substrate side of the electro-optical device substrate 2 with a laser is performed before the bonding step, the organic EL display device 1 is assembled for the electro-optical device. The substrates 2 can be joined with high positional accuracy. Therefore, when the light emitting functional layer 110 is formed by the inkjet method, the light emitting functional layer 110 can be formed with high accuracy at a predetermined position on the electro-optical device substrate 2.

  Furthermore, in this embodiment, the bonding process is performed in a state where the protective film 6 is adhered to the one surface side 21 of the electro-optical device substrate 2, and therefore, due to adhesion of foreign matter or external force during the thinning process or the bonding process. Damage to the TFTs 123 and 124 can be prevented. In addition, since the bonding process is performed in a state where the protective film 6 is adhered to the one surface side 21 of the electro-optical device substrate 2, the electro-optical device substrate 2 is directed toward the surface plate 210 with the one surface side 21 facing the surface plate 210. Even if the device substrate 2 is arranged and bonded to the large substrate 3, adhesion or damage of foreign matter does not occur on the one surface side 21 of the electro-optical device substrate 2.

  In addition, since bonding to the large substrate 3 is performed with the one surface side 21 on which the protective film 6 of the electro-optical device substrate 2 is formed as a reference, when the light emitting functional layer 110 is formed by the inkjet method, the inkjet head 9 The distance from the one surface side 21 of the electro-optical device substrate 2 is constant in any of the electro-optical device substrates 2. Therefore, since the flying distance of the droplets from the ink jet head 9 is constant in any electro-optical device substrate 2, it is possible to prevent variations in the formation position and luminance of the light emitting functional layer 110 due to variations in the flying distance. And high-quality images can be displayed.

  In the bonding step, the fluid pressure is applied to the large substrate 3 and the large substrate 3 is pressed against the surface plate 210 to bond the electro-optical device substrate 2 and the large substrate 3 together. A uniform force is applied to the optical device substrate 2. Accordingly, any of the electro-optical device substrates 2 can be bonded to the large substrate 3 under the same conditions. Therefore, it is possible to prevent the positional variation in the thickness direction of the electro-optical device substrate 2 in the state in which the EL display device 1 is formed, so that a high-quality image can be displayed.

[Modification of Embodiment 1]
As shown in FIG. 8, if a UV film provided with a pressure-sensitive adhesive layer 63 thicker than the partition 112 is used as the film base 61 as the protective film 6, the protective film 6 is attached to one side of the electro-optical device substrate 2. When pasted on the side 21, it is possible to prevent bubbles from entering between the electro-optical device substrate 2 and the protective film 6. Therefore, since the surface of the protective film 6 is not uneven due to air bubbles, when the electro-optical device substrate 2 and the large substrate 3 are bonded together, the position of the one surface side 21 of the electro-optical device substrate 2 is high. Can be aligned with accuracy. Therefore, the light emitting functional layer 110 can be stably formed by the inkjet method, and position variation in the thickness direction of the electro-optical device substrate 2 in the state where the organic EL display device 1 is configured can be prevented. Therefore, a high quality image can be displayed.

  Further, as shown in FIG. 9A, the protective film 6 is provided with a liquid repellent material layer 64 for the liquid composition for forming the light emitting functional layer 110 in the film base 61, and an adhesive. If the layer 63 is made thinner than the height of the partition 112, when the protective film 6 is removed, as shown in FIG. 9B, the periphery of the liquid composition application region in the ink jet method, that is, the partition 112. The liquid repellent material layer 64 can be transferred to the upper end side. Accordingly, it is not necessary to perform special liquid repellent treatment such as plasma treatment using a fluorine compound on the one surface side 21 of the electro-optical device substrate 2, so that the manufacturing process can be simplified.

  In the above embodiment, the organic EL display device 1 is taken as an example. However, the present invention may be applied to the manufacture of a self-luminous electro-optical device using other self-luminous elements.

[Embodiment 2]
Embodiment 1 is an example in which the present invention is applied to an organic EL display device in which an electro-optical material is held on a single substrate for an electro-optical device, as shown in FIGS. 10A and 10B. In addition, the present invention may be applied to a liquid crystal device in which an electro-optic material is held between two electro-optic device substrates.

  10A and 10B are a perspective view and a cross-sectional view of the liquid crystal device according to Embodiment 2 of the present invention as viewed from the counter substrate side.

  As shown in FIGS. 10A and 10B, in the liquid crystal device 500, the TFT array substrate 510 (electro-optical device substrate) and the counter substrate 520 (electrical device) bonded together by a sealing material 552 applied in a rectangular frame shape. A liquid crystal 550 as an electro-optical material is held between the substrate and the optical device substrate. The TFT array substrate 510 is larger than the counter substrate 520, and a large number of terminals 514 are formed along one side of the TFT array substrate 510 in the protruding region 512 from the counter substrate 520. Note that the driving IC may be COG-mounted on the TFT array substrate 510. Even in such a case, the terminal 514 is formed in the overhanging region 512.

  On the TFT array substrate 510, pixel electrodes 559 are formed in a matrix along with pixel switching TFTs. On the counter substrate 520, a light shielding film 523 called a black matrix or black stripe is formed in a region facing the vertical and horizontal boundary regions of the pixel electrode 559 of the TFT array substrate 510, and an ITO film is formed on the upper layer side. The counter electrode 521 is formed. Note that when the liquid crystal device 500 is configured for color display, an RGB color filter is formed together with its surface protective film in a region of the counter substrate 520 facing each pixel electrode 559 of the TFT array substrate 510.

  Also in the liquid crystal device 500 having such a configuration, for example, a large display device (electro-optical device) exceeding 30 inches can be formed by arranging a plurality of sheets in a plane and bonding them to a large substrate. At that time, when the TFT array substrate 510 and the counter substrate 520 constituting the liquid crystal device 500 are thinned to, for example, 25 μm to reduce the thickness and weight of the large display device, FIG. ) And (D), in the polishing apparatus 200, a plurality of liquid crystal devices 200 are fixed to the surface plate 210 with wax 250, and then the lapping process and the polishing process described above are performed to obtain the TFT array substrate 510 and The counter substrate 520 may be thinned. When the TFT array substrate 510 and the counter substrate 520 are thinned, the liquid crystal device 500 is bonded to a large substrate as described with reference to FIGS. 6B and 6C. A plurality of liquid crystal devices 500 and a large substrate may be bonded together. In addition, as shown in FIGS. 5B, 5C, and 5D, the large substrate bonded to the liquid crystal device 500 is fixed to the surface plate 210 with the wax 250 in the polishing apparatus 200, and then, The large substrate may be thinned by performing the lapping process and the polishing process.

(Main effects of this form)
In this embodiment, processes that require laser annealing or photolithography technology, such as formation of pixel switching elements and liquid crystal pixel electrodes, can be performed with a small substrate, and are expensive such as a vacuum apparatus and an exposure apparatus. Large semiconductor devices can be prevented. Further, the yield is not reduced due to the increase in size of the substrate.

  Furthermore, the process of enlarging the display by bonding and reducing the weight of the substrate by polishing is performed after the assembly of the small panel, so that the surface and terminals on which the pixel switching elements are formed are protected from foreign matter and damage. The display reliability can be improved. In addition, since the heating and melting temperature at the time of fixing / removing with wax can be performed at a low temperature of about 80 ° C., reliability is maintained without affecting the liquid crystal.

[Embodiment 3]
FIG. 11 is a perspective view showing the course of the manufacturing process of the liquid crystal panel according to Embodiment 3 in which the present invention is applied to the liquid crystal display device.

  As shown in FIGS. 10A and 10B of the second embodiment, the liquid crystal device 500 includes a TFT array substrate 510 (electro-optical device substrate) bonded by a sealing material 552 applied in a rectangular frame shape. ) And the counter substrate 520 (electro-optical device substrate), the liquid crystal 550 as an electro-optical material is held. On the TFT array substrate 510, pixel electrodes 559 are formed in a matrix along with pixel switching TFTs. On the counter substrate 520, a light shielding film 523 called a black matrix or black stripe is formed in a region facing the vertical and horizontal boundary regions of the pixel electrode 559 of the TFT array substrate 510, and an ITO film is formed on the upper layer side thereof. A counter electrode 521 is formed.

  In the liquid crystal device 500 having such a configuration, a large display device (electro-optical device) exceeding 30 inches can be formed by arranging a plurality of medium- and small-sized substrates in a plane and bonding them to a large substrate. At that time, the TFT array substrate 510 and the counter substrate 520 constituting the liquid crystal device 500 can be thinned to reduce the thickness and weight of the large display device. Since the third embodiment has the same manufacturing process as the organic EL display device of the first embodiment, the description is simplified.

  In FIG. 5, the protective film 6 is first applied to the TFT array substrate 510 for the liquid crystal display device in which the formation of the pixel switching TFT and the pixel electrode is completed, that is, the one surface side 21 of the electro-optical device substrate 2 in FIG. Adhere (protective film application process). The protective film 6 is pasted so as to exclude the region where the terminals 20 are formed on the one surface side 21 of the electro-optical device substrate 2, but may cover the entire surface of the electro-optical device substrate 2. . Further, the electro-optical device substrate 2 is preferably cut with the protective film 6 by irradiating a laser beam to adjust the outer shape of the electro-optical device substrate 2.

  Next, in the polishing apparatus 200 shown in FIG. 5B, the electro-optical device substrate 2 is thinned. For this purpose, as in the case of the organic EL display device, a plurality of electro-optical device substrates 2 are arranged and fixed on the surface plate 210 of the polishing apparatus 200 (fixing step). In this polishing apparatus 200, wax 250 is filled in a portion where the electro-optical device substrate 2 is disposed. Accordingly, after the wax 250 is heated to a temperature of about 80 ° C. and melted, a plurality of electro-optical device substrates 2 are arranged on the surface of the melted wax 250 so as to be arranged in a plane, and the electro-optics. A fluid pressure is applied to the device substrate 2 to press the electro-optical device substrate 2 into the recess 220. For this purpose, compressed air is ejected from the head toward the electro-optical device substrate 2. In this way, a uniform force can be applied to each of the electro-optical device substrates 2. Next, the molten wax 250 is cooled to a temperature of 25 ° C., and the wax 250 is solidified.

  Next, the fixed substrate is thinned. For this purpose, the polishing head 280 is disposed on the electro-optical device substrate 2, and the polishing head 280 is rotated about the axis, and the surface plate 210 is also rotated. In this state, the polishing head 280 is electrically connected to the polishing head 280. The surface 22 of the electro-optical device substrate 2 is polished and thinned at a speed of about 7.2 μm / min while supplying a suspension of abrasive grains to the optical device substrate 2 (lapping step).

  Next, in the polishing step, as shown in FIG. 5D, a soft polishing cloth 281 is attached to the lower end portion of the polishing head 280, and abrasive grains are placed between the polishing head 280 and the electro-optical device substrate 2. The surface of the other side 22 of the polished electro-optical device substrate 2 is smoothed while supplying the suspension as required.

  Next, as shown in FIG. 6A, the other surface side 22 of the electro-optical device substrate 2 is cleaned. Next, as shown in FIG. 6B, an adhesive 30 is applied to the other surface side 22 of the electro-optical device substrate 2, and then, as shown in FIG. The large substrate 3 is stacked on the other side 22 and the adhesive 30 is cured. Also in this case, fluid pressure is applied to the large substrate 3 to press the large substrate 3 against the surface plate 210, thereby improving the adhesion between the electro-optical device substrate 2 and the large substrate 3. As a method for applying fluid pressure to the large substrate 3, for example, compressed air is ejected from the head toward the large substrate 3.

  In this way, after the plurality of electro-optical device substrates 2 are formed into the large bonded substrate 10 on the surface plate 210, the solidified wax 250 is heated and melted to a temperature of about 80 ° C. As shown in (D), the bonded substrate 10 is removed from the surface plate. Next, the protective film 6 is irradiated with UV light, the protective film 6 is peeled off, and the bonded substrate 10 is cleaned. In order to further reduce the thickness of the large substrate 3, the polishing substrate is thinned after the bonding step, and then the bonded substrate 10 is removed from the surface plate.

  Next, bonding with a large counter substrate 560 for forming a liquid crystal panel is performed. As shown in FIG. 11, a sealant 552 is applied to the outer periphery of an individual TFT array substrate or a portion (not shown) corresponding to the outer periphery of the counter substrate 560, and then pasted so as to cover the counter substrate 560. Together, create a space to inject liquid crystal. In addition, in this space, there are dispersed spherical gap members or pre-installed shell-column-shaped resins, and the interval is fixed by applying a certain pressure to the counter substrate 560 at the time of bonding. In addition, a cutout is provided in a part of the sealing material 552, and liquid crystal is filled therein by a vacuum injection method. After filling, the hole is sealed with an epoxy adhesive or the like. In addition, recently, liquid crystal filling by a liquid crystal dropping method is also performed. At this time, a seal notch is not required and there is no hole sealing.

  In order to further reduce the weight of the manufactured liquid crystal panel, the bonded counter substrate 560 may be thinned. In this case, the above-described polishing apparatus 200 is used and the procedure shown in FIG. 5 is performed. Since the thinning process is repeated as described above, a description thereof is omitted.

(Main effects of this form)
As described above, in this embodiment, when the electro-optical device substrate 2 is thinned, the electro-optical device substrate 2 is subjected to a predetermined process and then thinned. There is no risk of 2 breaking. In addition, since a plurality of electro-optical device substrates 2 are polished together, the efficiency is high. Furthermore, the electro-optical device substrate 2 can be fixed on the surface plate 210 simply by solidifying the melted wax, and after the polishing is completed, the electro-optical device substrate 2 is simply melted. It can be removed from the surface plate 210. In addition, since the stress for fixing does not concentrate on a part of the electro-optical device 2, the electro-optical device substrate 2 is not cracked.

  Furthermore, in this embodiment, processes that require laser annealing or photolithography technology, such as the formation of pixel switching elements and the formation of pixel electrodes for liquid crystals, are thinned and thinned on a small substrate and attached to a large substrate. After the alignment, a large liquid crystal panel composed of a plurality of small substrates is assembled. For this reason, there is no increase in the size of expensive semiconductor devices such as vacuum devices and exposure devices, and a decrease in yield due to the increase in size of the substrate.

  Further, since the surfaces of the plurality of electro-optical device substrates 2 are aligned by polishing, the plurality of electro-optical device substrates 2 and the large substrate 3 can be easily and accurately bonded on the surface plate 210. Can do.

  Furthermore, in this embodiment, the bonding process is performed in a state where the protective film 6 is adhered to the one surface side 21 of the electro-optical device substrate 2, and therefore, due to adhesion of foreign matter or external force during the thinning process or the bonding process. Damage to the TFTs 123 and 124 can be prevented.

  In the bonding step, the fluid pressure is applied to the large substrate 3 and the large substrate 3 is pressed against the surface plate 210 to bond the electro-optical device substrate 2 and the large substrate 3 together. A uniform force is applied to the optical device substrate 2. Accordingly, any of the electro-optical device substrates 2 can be bonded to the large substrate 3 under the same conditions.

[Application to electronic devices]
The electro-optical device to which the present invention is applied is most preferably mounted on an electronic device having a large screen exceeding 30 inches. In addition, a multimedia-compatible personal computer (PC), mobile computer, etc. Engineering workstation (EWS), pager or mobile phone, word processor, TV, viewfinder type or monitor direct view type video recorder, electronic notebook, electronic desk calculator, car navigation device, POS terminal, touch panel, etc. The present invention can also be applied to electronic devices having any small display device.

FIGS. 2A and 2B are a perspective view and a plan view of an active matrix organic EL display device which is an embodiment of the self-luminous electro-optical device according to Embodiment 1 of the present invention. FIGS. It is explanatory drawing which shows the electrical structure of the organic electroluminescent display apparatus shown in FIG. It is sectional drawing which expands and shows the pixel area | region in the organic electroluminescent display apparatus shown in FIG. (A), (B) is explanatory drawing of the stage which finished forming TFT and a pixel electrode with respect to the substrate for electro-optical devices in the manufacturing method of the organic electroluminescence display shown in FIG. (A)-(D) are process sectional drawings which show the manufacturing method of the organic electroluminescence display shown in FIG. (A)-(F) are process sectional drawings which show the manufacturing method of the organic electroluminescence display shown in FIG. (A), (B) is explanatory drawing of the organic functional layer formation process in the manufacturing method of the organic electroluminescence display shown in FIG. It is explanatory drawing of the state which stuck the protective film on the board | substrate for electro-optical devices in the manufacturing method of another organic electroluminescence display which concerns on this invention. (A), (B) is explanatory drawing of the state which stuck the protective film on the board | substrate for electro-optical devices in the manufacturing method of another organic electroluminescent display device which concerns on this invention. (A), (B) is the perspective view and sectional drawing of the liquid crystal device which concern on Embodiment 2 of this invention. It is a perspective view in the middle of the manufacturing process of the liquid crystal panel which concerns on Embodiment 3 of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Organic EL display device (self-light-emitting electro-optical device) 2 Electro-optical device substrate (TFT array substrate) 3 Large substrate 4 Sealing substrate 6 Protection film 9 Inkjet head 101 Organic EL element 110 Light emission Functional layer, 111 pixel electrode, 123, 124 TFT, 200 polishing device, 210 surface plate, 220 concave portion of surface plate, 250 wax, 280 polishing head, 500 liquid crystal device (electro-optical device), 510 TFT array substrate (electro-optical) Device substrate), 520 Counter substrate (electro-optical device substrate).

Claims (19)

A fixing step of fixing the electro-optical device substrate on a surface plate with wax after performing a predetermined step on the electro-optical device substrate for holding the electro-optical material;
In this state, the surface of the electro-optical device substrate is polished to reduce the thickness of the electro-optical device substrate.
After the thinning step, the electro-optical device manufacturing method is characterized in that wax is heated and melted to remove the electro-optical device substrate from the surface plate.   2. The lapping process according to claim 1, wherein in the thinning process, the electro-optical device substrate is polished and thinned while the electro-optical device substrate is fixed on the surface plate with the wax, and the electro-optical device is thinned. A method for manufacturing an electro-optical device, comprising performing a polishing step of smoothly polishing a surface of a substrate for an apparatus.   3. The electro-optical device according to claim 1, wherein in the fixing step, wax is heated and melted in a recess formed on an upper surface of the surface plate, the electro-optical device substrate is immersed in the melted wax, and A fluid pressure is applied to the substrate and pressed against the surface plate, and then the wax is cooled and solidified, and the electro-optical device substrate is fixed on the surface plate by the wax. A method for manufacturing an electro-optical device. 4. The electro-optical device substrate according to claim 1, wherein the electro-optical device substrates on the surface plate are bonded to a large substrate, and the electro-optical device substrates are arranged in a plane on the large substrate. After performing the bonding step to be a bonded substrate, the wax is heated and melted to remove the bonded substrate from the surface plate,
Thereafter, an electro-optical device manufacturing method, wherein a plurality of electro-optical device substrates are planarly arranged on the large substrate using the bonded substrate.   5. The bonding step according to claim 4, wherein in the bonding step, fluid pressure is applied to the large substrate in a state where the large substrate is overlaid on the plurality of electro-optical device substrates on the surface plate. A method for manufacturing an electro-optical device, wherein the method is pressed toward the surface. 4. The self-light emitting electro-optical device according to claim 1, wherein the electro-optical device substrate has a pixel switching element and a self-light emitting element formed in each of a large number of pixel regions arranged in a matrix. Board
After forming the pixel switching element and the pixel electrode of the self-luminous element on one side of the electro-optical device substrate, the fixing step and the thinning step are performed with the one side facing the surface plate. Polishing the other side of the plurality of electro-optic device substrates,
Next, a large substrate is bonded to the other surface side of the plurality of electro-optical device substrates on the surface plate, and the plurality of electro-optical device substrates are bonded in a plane on the large substrate. Perform the bonding process to make the substrate,
Next, the wax is heated and melted to remove the bonded substrate from the surface plate,
Next, a light emitting functional layer forming step of forming a light emitting functional layer of the self-light emitting element on one surface side of the plurality of electro-optical device substrates in the state of the bonded substrate,
Thereafter, an electro-optical device manufacturing method, wherein a plurality of electro-optical device substrates are planarly arranged on the large substrate using the bonded substrate.   7. The bonding step according to claim 6, wherein in the bonding step, a fluid pressure is applied to the large substrate while the large substrate is overlaid on the plurality of electro-optical device substrates on the surface plate. A method for manufacturing an electro-optical device, wherein the method is pressed toward the surface.   7. The light emitting functional layer forming step according to claim 6, wherein in the light emitting functional layer forming step, a liquid composition is selectively applied to a predetermined region on one surface side of the plurality of electro-optical device substrates by an ink jet method, and the self light emitting element is formed. A method of manufacturing an electro-optical device, comprising forming a light emitting functional layer. 9. The electro-optical device substrate according to claim 6, wherein the pixel switching element and the pixel electrode are formed on one surface side of the electro-optical device substrate and then the fixing process is performed. Put a protective film on one side,
An electro-optical device manufacturing method, wherein the protective film is removed from the bonded substrate after the bonded substrate is removed from the surface plate and before the light emitting functional layer forming step. In Claim 9, before pasting the protective film on the one surface side of the electro-optical device substrate, a partition that defines an application region of the liquid composition is formed on the electro-optical device substrate,
The method for manufacturing an electro-optical device, wherein the protective film includes a pressure-sensitive adhesive layer that is thicker than a height of the partition wall on one side of a film base material. In Claim 9, before pasting the protective film on the one surface side of the electro-optical device substrate, a partition that defines an application region of the liquid composition is formed on the electro-optical device substrate,
In the protective film, on one side of the film substrate, a liquid repellent material layer for the liquid composition and an adhesive layer thinner than the height of the partition walls are formed,
When the protective film is removed, the liquid repellent material layer is transferred around the application area of the liquid composition. 4. The electro-optical device substrate according to claim 1, wherein the electro-optical device substrate includes at least a pixel switching element and a pixel electrode in each of a large number of pixel regions arranged in a matrix. And
After forming the liquid crystal panel holding the liquid crystal material between the electro-optical device substrate and the counter substrate, the fixing step of fixing the counter substrate side to the surface plate with wax, or the electro-optical device substrate side Performing a thinning process for polishing, or a bonding process for bonding the large substrate and the substrate for an electro-optical device;
A method for manufacturing an electro-optical device. 4. The electro-optical device substrate according to claim 1, wherein the electro-optical device substrate includes a pixel switching element and a liquid crystal element formed in each of a large number of pixel regions arranged in a matrix. ,
After forming the pixel switching element and the pixel electrode of the liquid crystal element on one surface side of the electro-optic device substrate, the fixing step and the thinning step are performed with the one surface side facing the surface plate. Polishing the other surface side of the plurality of electro-optic device substrates,
Next, a large substrate is bonded to the other surface side of the plurality of electro-optical device substrates on the surface plate, and the plurality of electro-optical device substrates are planarly arranged on the large substrate. Perform the bonding process to make the bonded substrate,
Next, the wax is heated and melted to remove the bonded substrate from the surface plate,
Thereafter, a liquid crystal panel holding a liquid crystal material from the bonded substrate and the counter substrate is manufactured, and an electro-optical device in which a plurality of the substrates for the electro-optical device are arrayed on the large substrate is manufactured. about,
A method for manufacturing an electro-optical device. 14. The method according to claim 13, wherein after the pixel switching element and the pixel electrode are formed on one surface side of the electro-optical device substrate, the one surface side of the electro-optical device substrate is protected when the fixing step is performed. Put a film,
An electro-optical device manufacturing method, wherein after removing the bonded substrate from the surface plate, the protective film is removed from the bonded substrate before performing the bonding step of the counter substrate.   14. The bonding step according to claim 12, wherein in the bonding step, fluid pressure is applied to the large substrate while the large substrate is overlaid on the plurality of electro-optical device substrates on the surface plate. A method for manufacturing an electro-optical device, which is pressed against a surface plate.   16. The method according to claim 4, wherein the surface of the large substrate is polished with the electro-optical device substrate fixed on a surface plate with wax to thin the large substrate, and then the wax is heated. A method of manufacturing an electro-optical device, comprising melting and removing the electro-optical device substrate from the surface plate.   The sealing substrate according to any one of claims 1 to 16, wherein a panel module having a sealing substrate or a counter substrate pasted on one surface side of the electro-optical device substrate is fixed on a surface plate with wax. Alternatively, the surface of the counter substrate is polished to make the substrate thinner, and then the wax is heated and melted to remove the module from the surface plate.   An electro-optical device manufactured by the method as defined in claim 1. An electronic apparatus comprising the electro-optical device defined in claim 18.

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