JP4737639B2 - COOLING DEVICE AND ELECTRONIC DEVICE HAVING THE SAME - Google Patents

Description

  The present invention relates to electronic devices such as inverter devices and servo amplifiers that mainly operate with a high-voltage power supply, and more particularly to a cooling device for efficiently cooling heat-generating components of electronic devices and an electronic device including the same. It is.

In recent years, with the increase in the density of electronic devices, there has been a demand for higher performance and smaller size of the cooling device. Some conventional cooling devices have a configuration in which cooling air from a fan is blown directly onto a base plate surface of a heat sink in order to improve cooling capacity. It is possible to cool with high efficiency by directing the cooling air of the fan directly to the place where the heat generating component having the highest temperature is attached in the heat sink (for example, see Patent Document 1).
5A and 5B show an electronic apparatus provided with a conventional forced air-cooling type cooling device. FIG. 5A is an overall perspective view and FIG. 5B is a plan view, which corresponds to, for example, an inverter device or a servo amplifier.
In FIG. 5, 101 is an electronic device, 102 is a heat sink body, 103 is a base plate, 104 is a radiating fin, 105 is a fan, 106 is a fan inlet, 107 is a case body, 108 is a heat generating component, 109 is a ventilation path, F is The flow of cooling air is shown.
A cooling device for the electronic device 101 basically includes a heat sink body 102 and a case body 107. The heat sink body 102 is attached so that the heat generating component 108 is in close contact with one surface of the base plate 103, and has a plurality of radiating fins 104 on the back surface of the base plate 103 opposite to the surface to which the heat generating component 108 is attached. The case main body 107 covers a portion facing the tip of the heat radiating fin 104 and is attached to the heat sink main body 102. The heat sink body 102 and the case body 107 form a cooling air ventilation path 109 along the longitudinal direction of the radiating fin 104, and a fan 105 is disposed inside the cooling air ventilation path 109. Further, the case body 107 is provided with a fan air inlet 106 for forcibly introducing the cooling air F into the air passage 109.

Next, regarding the operation of the electronic device, when the fan 105 is rotated, the cooling air F is sucked into the fan 105 from the fan air inlet 106 on the side surface of the electronic device 101, and the cooling air F is applied to the surface of the base plate 103 of the heat sink body 102. Be sprayed. The cooling air F that collides with the surface of the base plate 103 flows along the longitudinal direction of the radiating fins 104, exchanges heat transferred from the heat generating components 108 to the radiating fins 104, and is an opening formed by the heat sink main body 102 and the case main body 1. The cooling air heat-exchanged from the part is discharged.
Japanese Patent Laid-Open No. 10-303348 (specifications, pages 5 to 6, FIG. 2)

However, in the electronic device provided with the conventional cooling device, when another structure or another electronic device is arranged close to the side surface of the electronic device, the fan inlet on the side surface is blocked. As a result, the cooling air from the fan is reduced and the cooling capacity is significantly reduced. In order to allow the fan to suck air smoothly, another structure or another electronic device is attached around the electronic device with an interval of about the thickness of the fan. For this reason, an extra space for mounting the electronic device is required.
On the other hand, in the market, it is required to reduce the installation space for electronic devices, which is a problem to be improved.
The present invention has been made in view of such a problem, and even when an electronic device is disposed close to another structure or another electronic device, the fan is attached to the side surface of the electronic device. It is an object of the present invention to provide a cooling device and an electronic device equipped with the cooling device that can secure a cooling capacity by sucking in well and, as a result, reduce the mounting space of the electronic device.

In order to solve the above problems, the present invention is configured as follows.
According to the first aspect of the present invention, a heat sink body having a plurality of heat radiating fins on the back surface of a base plate for attaching a heat-generating component, and a portion of the heat sink body that faces the front end portion of the heat radiating fins are covered. A case main body configured to be attached and combined with the heat sink main body to form a cooling air ventilation path opened along a longitudinal direction of the radiating fin, and disposed inside the cooling air ventilation path in the cooling apparatus having a fan which is, and a fan inlet to force introducing cooling air to the ventilation channel by pre Symbol fans, by cutting out a portion of the outer shape of the case body, the case body A cover plate is provided so as to be recessed inward from the surface position, and the fan intake port is provided in the cover plate .
According to a second aspect of the present invention, in the cooling device according to the first aspect, the cover plate is provided so as to be in close contact with a tip end portion of the radiating fin.
The invention according to claim 3 is the cooling device according to claim 1 or 2, wherein the portion of the case body that does not face the radiation fin from the surface position of the mounting surface of the cover plate provided in the case body. The distance to the surface position is ½ to 2 times the thickness of the fan in plan view.
According to a fourth aspect of the present invention, in the cooling device according to the first or second aspect, the cover plate is provided with a barrier plate on an end surface opposite to an end surface serving as an attachment site for the case body. It is a feature.
Further, the invention according to claim 5 is the cooling device according to claim 1 or 2, wherein the surface position of the portion of the case body that does not face the heat radiating fin is opposite to the heat radiating fin of the cover plate. The second cover plate is provided so as to be arranged at the same position as the first.
The invention according to claim 6 is an electronic apparatus including the cooling device according to any one of claims 1 to 5.

According to the first aspect of the present invention, the space formed by cutting out the outer shape of the cooling device including the heat sink main body and the fan and arranging the cooling device on the inner side becomes the fan intake space, and the amount of intake air to the fan is reduced. It will be secured efficiently. Thereby, it becomes possible to place another structure in the immediate vicinity of the electronic device provided with the cooling device having a fan, and the space necessary for mounting the electronic device can be reduced in size.
According to the second aspect of the present invention, by providing the cover plate so as to be in close contact with the tip of the heat sink fin of the heat sink, heat transfer between the cover plate and the heat sink fin is improved and the cooling efficiency is increased.
According to the third aspect of the present invention, the thickness of the space formed by partially cutting out the outer shape of the cover plate is set to 1/2 to 2 times the thickness of the fan. The thickness can be optimized. Thereby, it is possible to balance the downsizing of the outer shape of the electronic device and the cooling performance.
According to the invention described in claim 4, by providing a barrier plate on the end surface of the cover plate opposite to the end surface serving as the case main body attachment site, another electronic device is brought into close contact with the electronic device in parallel. Even in the case of arrangement, the mounting space for mounting a plurality of electronic devices can be reduced without reducing the cooling capacity of the electronic devices.
According to the invention described in claim 5, the electronic device is provided with a cover in the fan intake portion, so that it is possible to prevent an obstacle that obstructs the intake of the fan from entering the intake space, and the performance of the cooling device is improved. It is possible to prevent the deterioration.
Moreover, according to the invention of Claim 6, the electronic device which has the effect in the cooling device of any one of Claims 1-5 can be provided.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 shows a forced air-cooling electronic apparatus cooling apparatus according to a first embodiment of the present invention, wherein (a) is an overall perspective view and (b) is a plan view.
In FIG. 1, 1 is an electronic device, 2 is a heat sink body, 3 is a base plate, 4 is a radiating fin, 5 is a fan, 6 is a fan inlet, 7 is a case body, 7A is a cover plate, 8 is a heat generating component, 9 is The barrier plate, 12 is the ventilation path, S is the intake space, Ls is the thickness of the intake space, and F is the flow of the cooling air.
The cooling device for the electronic device 1 according to the present invention includes a base plate 3 to which a heat generating component 8 is attached, a heat sink body 2 having a plurality of radiating fins 4 on the back surface of the base plate 3, and tip portions of the radiating fins 4 on the heat sink body 2. A case main body 7 configured to form a ventilation path 12 for cooling air F that is opened along the longitudinal direction of the radiating fin 4 by combining the heat sink main body 2 with a portion facing the heat sink main body 2. A fan 5 disposed inside, and a fan inlet 6 disposed on a surface of the case body 7 facing the heat dissipating fins 4 and forcibly introducing the cooling air F into the air passage 12 by the fan 5 are provided. The point is the same as the prior art.

The present invention is different from the prior art in that the case body 7 has a cover plate 7A formed so as to be in close contact with the tip of the radiating fin 4 by cutting out a part of the outer shape of the portion to which the fan intake port 6 is attached. The surface position of the attachment surface of the cover plate 7A attached to the case body 7 is more electronic than the surface position of the portion of the case body 7 that does not face the heat radiating fins 4 in plan view in FIG. It is a point provided inside the main body of 1. That is, as shown in FIG. 1B, the intake space S is formed in a portion of the base plate where a part of the outer shape of the case body 7 is cut out.
Further, the distance from the surface position of the mounting surface of the cover plate 7A attached to the case body 7 to the surface position of the portion of the case body 7 that does not face the radiation fin 4 (the dimension of the thickness L _S of the intake space S) is , 1/2 to 2 times the thickness _{L F} of the fan is preferably in plan view in FIG. 1 (b).
Specifically, the thickness L _S of the intake space S is too small relative to the thickness L _F of the fan 5, the cooling capacity is lower intake efficiency of the fan 5 is reduced. If the thickness L _S of the intake space S is too large relative to the thickness L _F of the fan 5, the intake efficiency of the fan 5 is improved, the miniaturization of the electronic device 1 outside dimension of the electronic device 1 is increased Adversely affect. For this reason, in order to achieve both cooling capacity and downsizing, the thickness Ls of the intake space S is optimally about 1/2 to 2 times the thickness of the fan 5.
Further, the cover plate 7A has a configuration in which a barrier plate 9 is provided on the end surface opposite to the end surface that is an attachment site for the case main body 7, but the embodiment is the same as in the second and third embodiments. explain.

Next, regarding the operation of the electronic device, when the fan 5 is rotated, the cooling air F is supplied to the fan intake port via the intake space S in the base plate portion where a part of the outer shape of the case body 7 of the electronic device 1 is cut out. 6 is sucked into the ventilation path 12 and sprayed onto the surface of the base plate 3 of the heat sink body 2. The cooling air F that collides with the surface of the base plate 3 flows along the longitudinal direction of the heat radiating fin 4, exchanges heat transferred from the heat generating component 8 to the heat radiating fin 4, and is an opening formed by the heat sink main body 2 and the case main body 1. The cooling air F that has been subjected to heat exchange is discharged from the section.
Further, the cover plate 7A suppresses the mixing of the cooling air F sucked from the fan air inlet 6 and the cooling air F that is heat-exchanged due to the heat dissipation of the heat sink body 2, and has a cooling characteristic. There is an effect to improve.

FIG. 2 is a plan view showing a state in which the electronic apparatus cooling device according to the second embodiment is attached to a structure.
As shown in FIG. 2, even when another structure 10 is mounted close to the fan mounting surface of the electronic device 1 by the barrier plate 9 provided on the cover plate 7 </ b> A of the electronic device 1, the intake space S is viewed in plan view. Since the upper and lower sides of the intake space S are open, the air that passes through the intake space S and enters the ventilation path 12 is smoothly sucked into the fan, and the cooling capacity of the heat sink is maintained. The Thereby, while being able to maintain the capability of a cooling device, the attachment space of the electronic device 1 can be reduced in size.

FIG. 3 is a plan view showing a state in which the electronic apparatus cooling apparatus according to the third embodiment is arranged in close contact with another electronic apparatus.
In FIG. 3, reference numeral 11 denotes an electronic device different from the electronic device 1.
When the electronic device 1 and another electronic device 11 are arranged in close contact with each other, an intake space S is secured between the electronic device 1 and the other electronic device 11 by the electronic device 1 main body and the barrier plate 9, and the intake air Since the upper and lower portions of the space S are open, the air that passes through the intake space S and enters the direction of the ventilation path 12 is smoothly drawn into the fan 5, and the cooling capacity of the heat sink 2 is maintained.

4A and 4B show a cooling apparatus for electronic equipment according to a fourth embodiment of the present invention. FIG. 4A is an overall perspective view, and FIG. 4B is a plan view.
In FIG. 4, 7B is a cover plate.
The fourth embodiment is different from the first to third embodiments in that it is disposed on the opposite side of the cover plate 7A from the heat dissipating fins 4 at the same position as the surface position of the case body 7 that does not face the heat dissipating fins 4. Thus, the second cover plate 7B is provided.
In FIG. 4, for example, when the electronic device 1 is arranged side by side with other structures or electronic devices, parts smaller than the intake space S may enter the intake space S, which may reduce the intake efficiency. In order to prevent this, the cover plate 7B is attached to the main body of the electronic device 1 to secure the intake space S.
Accordingly, it is possible to prevent an obstacle that prevents the fan 5 from entering the intake space S of the electronic device 1 and to prevent the performance of the cooling device from deteriorating.

  The present invention includes a heat sink body having a plurality of heat radiating fins on the back surface of a base plate to which a heat generating component is attached, a case main body that forms a ventilation path and stores a fan, a fan that forcibly introduces cooling air into the ventilation path and the radiating fin, In the cooling apparatus for electronic equipment provided with the electronic device, even when the electronic equipment is arranged close to another structure or another electronic equipment, cooling is performed by efficiently sucking air into a fan attached to the side of the electronic equipment. It can be applied to all electronic devices by securing capacity and consequently reducing the mounting space of electronic devices.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a forced air-cooling electronic apparatus cooling apparatus according to a first embodiment of the present invention, wherein (a) is an overall perspective view and (b) is a plan view. It is a top view which shows the state which attached the cooling device for electronic devices in 2nd Example of this invention to the structure. It is a top view which shows the state which closely_contact | adhered and arranged the cooling device for electronic devices in 3rd Example of this invention in another electronic device. It is a cooling device for electronic devices which shows 4th Example of this invention, Comprising: (a) is a whole perspective view, (b) is a top view. It is the cooling device for electronic devices provided with the conventional forced air cooling type cooling device, Comprising: (a) is a whole perspective view, (b) is a top view.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic device 2 Heat sink main body 3 Base plate 4 Radiation fin 5 Fan 6 Fan inlet 7 Case main body,
7A Cover plate 7B Cover plate 8 Heat-generating parts,
9 Barrier plate,
10 Structure 11 Another electronic device 12 Ventilation path S Intake space,
Ls Thickness of intake space F Flow of cooling air

Claims (6)

A heat sink body having a plurality of heat dissipating fins on the back surface of the base plate for attaching the heat generating components;
It is attached to the heat sink main body so as to cover a portion facing the tip of the radiating fin, and combined with the heat sink main body so as to form a cooling air ventilation path opened along the longitudinal direction of the radiating fin. A case body configured; and
A fan disposed inside the ventilation path of the cooling air ;
A fan inlet to force introducing cooling air to the ventilation channel by pre Symbol fan,
In a cooling device comprising:
A cooling device , wherein a part of an outer shape of the case body is cut out, a cover plate is provided so as to be recessed inward from the surface position of the case body, and the fan intake port is provided in the cover plate .   The cooling device according to claim 1, wherein the cover plate is provided so as to be in close contact with a front end portion of the radiating fin.   The distance between the surface position of the mounting surface of the cover plate provided in the case body and the surface position of the portion of the case body that does not face the heat radiating fins is ½ times the thickness of the fan in plan view. The cooling device according to claim 1, wherein the cooling device is doubled.   3. The cooling device according to claim 1, wherein the cover plate is provided with a barrier plate on an end surface opposite to an end surface serving as an attachment site for the case main body.   The second cover plate is provided on the opposite side of the cover plate to the heat radiating fin so as to be disposed at the same position as the surface position of the portion of the case body not facing the heat radiating fin. The cooling device according to 1 or 2. The electronic device provided with the cooling device of any one of Claims 1-5.

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