JP2003338595A - Cooling device for electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component cooling device capable of improving the discharge performance of heat generated from a high heat generating electronic component. <P>SOLUTION: A heat sink having a plurality of fins is arranged on the upper surface of a heat transmission plate 2 opposed in contact with a heating body 3 to be cooled and comb-like shielding boards 6 or erected shielding boards are inserted into the fins of the heat sink to improve a heat discharge characteristic. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat sink used for cooling a semiconductor such as a micro processing unit (hereinafter abbreviated as MPU) used in a personal computer or the like which generates heat, or an electronic component having other heat generating portion. And a cooling device for an electronic component that cools a heating element by combining a heat sink with a blowing means such as a fan.

[0002]

2. Description of the Related Art In recent years, in electronic equipment, in order to ensure normal operation of electronic parts, the electronic parts such as semiconductors have been highly integrated and the operating clock has been increased in frequency to increase the heat generation amount. How to keep the contact temperature of parts within the operating temperature range has become a big problem. In particular, high integration and high frequency of MPUs are remarkable, and heat dissipation measures have become an important issue from the standpoints of stability of operation and securing of operation life.

Generally, in order to cool a heating element such as an MPU, a heat sink for expanding a heat radiation area and efficiently exchanging heat with a refrigerant such as air, and a forcibly sending a refrigerant such as air to the heat sink. A cooling device consisting of a fan with a motor is used. The heat sink here is usually made of a material having a high thermal conductivity such as aluminum or copper as a main component, and is manufactured by a method such as extrusion molding (or pultrusion molding), cold forging, die casting and thin plate lamination. There is.

A conventional technique will be described with reference to FIGS. 14 and 15.

FIG. 14 is a front view and a side view of a conventional cooling device. FIG. 14 is a front view and a side view showing the configuration when the direction of air blown from a fan is changed. FIG. 15 is a front view and a side view of another cooling device of the related art, which is an example of the configuration of another cooling device of the related art when the shielding plate for controlling the air flow is mounted on the cooling device of FIG.

In such a cooling device, when it is attached to a heating element, a heat sink is used in contact with the heating element 3 as shown in FIG. The cooling principle of the actual cooling device is that the heat generated in the heating element is transferred to the plate-shaped fin 1 through the heat transfer plate 2 having a high heat transfer property such as aluminum as shown in FIG. The heat is transferred to the air sent from the cooling fan 4 on the surface of the fins 1 to be dissipated into the air and cooled.

Regarding the heat radiation performance of the cooling device, it is generally considered that if the air flow around the fins is the same, the heat radiation capacity will simply increase if the number of fins is increased and the surface area is increased. As the number of heat radiating fins increases, the gap between the fins into which air can flow becomes narrower, increasing the air inflow resistance and conversely decreasing the total inflow air volume itself. In some cases, the heat dissipation capacity may decrease. In other words, simply increasing the number of heat radiation fins has no effect.

Here, in order to improve the performance of the cooling device, it is most desirable that the heat be evenly distributed over the entire heat sink so that heat can be radiated from all the fins formed for heat radiation.

In the case of many conventional cooling devices as shown in FIG. 14 (a), the heat generated by the heating element 3 is very small compared to the entire heat sink and the contact area is small. Heat tends to be concentratedly transmitted only to the fins immediately above the body 3. Therefore, in such a configuration,
Even if air is simply blown from the cooling fan 4 to the heat sink, high cooling performance is not always obtained. In addition, due to the configuration of the electronic device, the blowing direction of the cooling fan 4 may be selected as the suction method as shown in FIG. 14C. In such a configuration, the airflow 7a flowing from the side surface of the heat sink is Since it easily flows in from the side surface close to the cooling fan 4 side, it does not flow into the heat radiation fins 1 immediately above the heating element 3 which is considered to be the hottest part, and the area where air stagnates locally, that is, most of the heat radiation effect is generated. A non-working region 10 (hereinafter referred to as a dead region 10) may be generated, which is a factor that further deteriorates the cooling performance.

As described above, it is ideally desirable to make the temperature of the heat sink as uniform as possible and to secure a sufficient heat radiation area and air amount as important factors for determining the performance of the cooling device. Is. However, it is certain that there are many difficulties in the actual configuration.
Therefore, as another method, from the viewpoint of heat transfer characteristics, higher performance can be expected as long as it is possible to secure a large amount of air flow in the high temperature portion.

Considering this point, an improvement has been devised in order to improve the heat radiation performance in the configuration as shown in FIG. 15 (a) (for example, refer to Patent Document 1).

As shown in FIG. 15, the shield plate 9 is attached to the side surface of the heat sink to form an air flow 7c flowing in from the side surface of the heat sink, and the main stream 7a of the air flow is pushed down toward the heat generating element side of the heat sink so that most of the air flow is removed. A method has been proposed in which the dead region 10 immediately above the heating element in FIG.

[0013]

[Patent Document 1] Japanese Patent Laid-Open No. 9-153573

[0014]

However, in the case of electronic parts such as semiconductors, the heat generation tends to increase more and more due to the further increase in speed, and when the cooling device of the conventional structure is used, sufficient cooling is achieved. It has become difficult to perform the above, and especially with high heat-generating electronic components such as MPU, the performance cannot be fully exhibited,
Alternatively, thermal runaway or the like occurs, causing problems such as abnormalities in electronic devices.

In particular, in the case where the configuration of the conventional suction system as shown in FIG. 14 (c) has to be selected, in order to prevent the dead region of the air flow described above, FIG.
There is a method of using the shielding plate as shown in (a), which is a preferable configuration in that a large amount of air is secured in the above-mentioned high temperature portion. However, this FIG.
Even in the case of, the structure is such that the dead region 10 is generated on the back side of the shielding plate 9, and in terms of performance, FIG.
Although it is improved compared to the above case, there is a dead area in the surface of the heat sink that does not contribute to heat dissipation, and as a result, there is a problem that sufficient heat dissipation performance cannot be obtained. In addition, in order to meet the recent demand for higher performance, the length of the heat sink is often longer than the width of the fan, and this dead region is unavoidable. Even if the cooling fan 4 is of the blowing type as described in (4), if the length of the heat sink is longer than the width of the fan, the generation of the dead region 10 is unavoidable, and it is difficult to bring out the heat dissipation performance of the entire heat sink.

The present invention solves the above problems, and provides a cooling device for electronic parts which is excellent in cooling performance by drawing out the maximum performance of the heat sink in order to efficiently dissipate the heat generated from the heating element. With the goal.

[0017]

A cooling device according to the present invention is provided with a heat transfer plate that is in contact with a heat generating element and projects to the opposite side of a heat receiving surface, and is erected on the heat transfer plate on the opposite side of the heat receiving surface. A cooling device comprising a heat sink having a plurality of fins and a fan that is a blower for the heat sink, wherein a shield plate (comb-shaped shield plate or cut-and-raised shield plate) is arranged between the fins of the heat sink, The amount of air that contributes to heat dissipation can be increased, and the heat dissipation characteristics can be improved.

The cooling device of the present invention is characterized in that the shielding plate arranged between the fins of the heat sink is arranged perpendicularly to the fan mounting surface.

The cooling device of the present invention is characterized in that the shielding plate arranged between the fins of the heat sink is inclined with respect to the fan mounting surface.

In the cooling device of the present invention, the shield plate arranged between the fins of the heat sink has two fins per fin.
It is characterized by arranging more than one.

The cooling device of the present invention is characterized in that the shield plate having the same pitch as the fin pitch of the heat sink is arranged on the side wall of the heat sink.

The cooling device of the present invention is characterized in that a duct is added to a heat sink with a shielding plate of a suction type and a fan as a blowing means.

[0023]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 is a heat transfer plate having a heat receiving surface, a heat sink having a plurality of fins provided upright on the surface of the heat transfer plate opposite to the heat receiving surface, and a heat sink. By providing a cooling member that controls the air passage between the fins of the heat sink, it is possible to increase the amount of airflow that contributes to heat dissipation and improve heat dissipation characteristics.

According to the second aspect of the present invention, the gap between the fins is made narrower than other portions by the restricting member, so that the amount of airflow contributing to heat dissipation can be increased and the heat dissipation characteristics can be improved.

According to the third aspect of the invention, since the restricting member and the fin are in contact with each other, the amount of airflow contributing to heat dissipation can be increased and the heat dissipation characteristics can be improved.

In the invention according to claim 4, the shape of the regulating member is one of a plate shape and a comb tooth shape, so that the mounting becomes easy and the main stream of the air flowing in from the side surface of the heat sink is effective. In addition, the heat dissipation characteristics can be improved by guiding the heat sink to the heating element side.

According to a fifth aspect of the present invention, a heat transfer plate having a heat receiving surface, a heat sink having a plurality of fins provided upright on the surface of the heat transfer plate opposite to the heat receiving surface, and a ventilation means for the heat sink. And a wind guide member that is inserted between the fins of the heat sink and guides the flow path to the central portion of the heat sink, thereby increasing the amount of airflow that contributes to heat dissipation and reducing the amount of air flowing from the side surface of the heat sink. It is possible to effectively guide the main stream to the heating element side of the heat sink to enhance the heat radiation characteristics.

According to the sixth aspect of the present invention, since the air guide member and the fins are in contact with each other, the amount of air flow contributing to heat dissipation is increased, and the main stream of the air flowing in from the side surface of the heat sink is effectively provided on the heat generating body side of the heat sink. The heat dissipation characteristics can be improved by inducing

According to a seventh aspect of the present invention, a heat transfer plate having a heat receiving surface, a heat sink having a plurality of fins provided upright on the surface of the heat transfer plate opposite to the heat receiving surface, and a ventilation means for the heat sink. A cooling device having a wind guide member that is inserted between the fins of the heat sink and guides the flow path to the central portion of the heat transfer plate, thereby increasing the amount of airflow that contributes to heat dissipation and flowing from the side surface of the heat sink. The main stream of air can be effectively guided to the heat generating element side of the heat sink to enhance the heat radiation characteristics.

The invention according to claim 8 has a heat transfer plate which is in contact with the heating element and projects to the opposite side of the heat receiving surface, and a plurality of fins which are provided upright on the side opposite to the heat receiving surface on the heat transfer plate. A cooling device including a heat sink and a fan that is a means for blowing air to the heat sink. By disposing a shield plate between the fins of the heat sink, the amount of airflow that contributes to heat dissipation can be increased, and heat dissipation characteristics can be improved. .

According to the ninth aspect of the present invention, since the shield plate arranged between the fins of the heat sink is perpendicular to the fan mounting surface, the main stream of air flowing in from the side surface of the heat sink is guided to the heat generating element side of the heat sink. The heat dissipation characteristics can be improved.

According to the tenth aspect of the present invention, the shield plate arranged between the fins of the heat sink is inclined with respect to the fan mounting surface, so that the main stream of air has the highest temperature in the heat sink near the heating element. The heat dissipation characteristics can be improved by guiding the heat to the part.

According to the eleventh aspect of the present invention, since the shield plate arranged between the fins of the heat sink is comb-shaped, the attachment is facilitated, and the main stream of the air flowing in from the side surface of the heat sink is effectively absorbed. It is possible to enhance the heat dissipation characteristics by inducing it toward the heating element side.

According to the twelfth aspect of the present invention, since the shielding plate arranged between the fins of the heat sink is formed by cutting and raising a part of the fins, the main stream of air is effectively guided to the high temperature portion of the heat sink. It is possible to easily realize the formation and the holding of the shielding plate.

According to the thirteenth aspect of the present invention, since two or more shield plates are provided between the fins of the heat sink for each fin, the air flow between the shield plates becomes turbulent and cheap. The heat dissipation characteristics can be improved.

According to a fourteenth aspect of the present invention, there is provided a heat transfer plate which is in contact with the heat generating element and projects to the opposite side of the heat receiving surface, and a plurality of fins which are provided upright on the side opposite to the heat receiving surface of the heat transfer plate. A cooling device including a heat sink and a blowing means for the heat sink, wherein the shield plate of the heat sink is arranged on the side wall portion of the heat sink in the air blowing direction, so that the main stream of air is effectively guided to the high temperature portion of the heat sink. The shield plate can be easily formed and held.

According to a fifteenth aspect of the present invention, there is provided a heat transfer plate which is in contact with the heating element and projects to the side opposite to the heat receiving surface, and a plurality of fins which are provided upright on the side opposite to the heat receiving surface on the heat transfer plate. A cooling device comprising a heat sink having a shielding plate, an air blowing means for the heat sink, and a duct for guiding the exhaust heat fluid to the outside, wherein the exhaust heat fluid is placed in the duct to dispose the exhaust heat fluid in the duct. It can be smoothly guided to the outside through, and the heat dissipation characteristics can be further improved.

According to the sixteenth aspect of the present invention, since the air blowing means is arranged in the middle part of the duct, the degree of freedom of arrangement of the air blowing means is increased, and the exhaust heat fluid can be smoothly guided to the outside through the duct. The heat dissipation characteristics can be further improved.

According to a seventeenth aspect of the present invention, a heat transfer plate having a heat receiving surface, a plurality of fins erected on the surface of the heat transfer plate opposite to the heat receiving surface, and an air passage between the fins of the heat sink are provided. By having a heat sink having a regulating member for regulating, a fan that ventilates to the heat sink, and a duct that is an air passage of the fan, it is possible to smoothly guide the exhaust heat fluid to the outside through the duct, and further improve the heat dissipation characteristics. You can

Embodiments of the present invention will be described below with reference to the drawings.

(First Embodiment) FIG. 1 is a front view and a side view of a cooling device according to a first embodiment of the present invention. 1 (a) and 1 (b) are a front view and a side view of a cooling device when a cooling fan according to Embodiment 1 of the present invention is used in a suction system, FIG. 1 (c), and FIG. 1 (d). [Fig. 3] is a front view and a side view of a cooling device of the present invention when a cooling fan is used in a blowing method.

In FIG. 1A, 1 is a heat transfer plate 2.
Is a plate-shaped fin formed on the upper part of. Reference numeral 2 is a heat transfer plate on which the plate-shaped fins 1 are arranged, and reference numeral 3 is a heating element attached to the lower part of the heat transfer plate 2. In this case, the heat sink is composed of the plate-shaped fin 1 and the heat transfer plate 2. Here, as the heating element 3,
It generates heat from semiconductors such as ICs, LSIs and MPUs, and electronic parts such as transistors.

Generally, in a heat dissipation device that is in contact with a small heating element, when heat flows from the heat receiving surface into the isotropic material, it tends to diffuse with a hemispherical temperature distribution, and therefore an ideal heat sink shape. Is a hemispherical heat transfer part and a large number of heat dissipating fins are formed in the radial direction starting from the heat source at the center of the heat transfer part to reduce the temperature distribution of the heat sink as a whole in order to improve the heat dissipation characteristics. Considered to be effective. However, in such a configuration, various problems other than the performance arise, such as a shape and a size that cannot be used in the actual configuration and an extremely high manufacturing cost.

In recent miniaturized electronic equipment, a heat sink formed by an aluminum extrusion method is widely used in order to suppress cost and ensure performance, and recently, a fin interval is narrowed to increase the number of fins. Measures are being taken to increase the surface area and improve heat dissipation characteristics. But,
A technical problem that the extrusion method for narrowing the fin interval is extremely difficult, and if the fin interval is too narrow, the amount of inflowing air will be limited, and on the contrary, it will cause performance deterioration, so it is not a good idea. There is also. Therefore, in terms of heat transfer characteristics, higher performance can be expected if it is possible to introduce as much air volume as possible to the high temperature portion as described above. However, as described above with reference to FIG. 15 (a), the example in which the performance is improved by attaching the shield plate 9 to the side surface of the heat sink to control the air flow and guide most of the air flow to the heating element side, However, even in this case, it was not possible to prevent the generation of the dead region 10 that does not contribute to heat dissipation, and there was a problem that the entire surface area of the heat sink could not be used effectively.

Therefore, in order to solve this problem, if the cooling device according to the present invention is a combination of the heat sink and the comb-teeth-shaped shielding plate, it is possible to maximize the performance of the heat sink and realize a cooling device having excellent heat dissipation characteristics. Can be done.

In the cooling device according to the first embodiment shown in FIG. 1, the heat sink has a structure in which the plate-shaped fins 1 are erected on the surface of the heat transfer plate 2 opposite to the heat-generating body 3. The cooling fan 4 is mounted on top of the plate-shaped fin 1. Also, as shown in Figure 1,
A comb-teeth-shaped shield plate 6 is arranged in each gap of the plate-shaped fins 1 in the vicinity of both side surfaces of the heat sink from the mounting surface of the cooling fan 4 on the upper part of the heat sink toward the heat transfer plate 2 side. In FIGS. 1A and 1B, the cooling fan 4 is used.
This is an example of using the suction method. By arranging the comb-teeth-shaped shielding plate 6 in each gap of the plate-shaped fins 1 in this way,
The flow of air from the side of the heat sink is regulated,
An air stream 7c is formed, and the main stream 7a of air is pushed down to the heat generating element 3 side of the heat sink having the highest temperature by this air stream 7c, so that it is possible to improve the heat dissipation characteristics as in FIG.

Furthermore, since the air flow 7b flowing in from the gap between the plate-shaped fin 1 and the comb-teeth shaped shielding plate 6 is formed, the dead air appearing in FIGS. 15 (a) and 15 (b). The generation of the region 10 can be prevented, and the effective surface area of the heat sink that contributes to heat dissipation increases, so that higher heat dissipation characteristics can be realized. The effect of the comb-teeth-shaped shield plate 6 is that the air that has flowed into the gap between the comb-teeth-shaped shield plate 6 and the plate-shaped fin 1 becomes a turbulent flow.
As a result, the dead region in FIG. 15 can be changed to a region with high heat dissipation characteristics (high heat transfer coefficient), and the air flow is regulated so that the main stream 7a of air has the highest heat sink. That is, it is pushed down to the heating element 3 side, and the heat dissipation characteristics can be improved.

Here, the relationship between the heat radiation and the heat transfer coefficient will be briefly described. Generally, when heat is radiated from a metal surface to air, the amount of heat radiation increases as the heat transfer coefficient increases. Further, it is known that the heat transfer coefficient becomes higher as the boundary layer thickness of the fluid becomes thinner, and the boundary layer thickness becomes thinner in the turbulent flow than in the laminar flow. Therefore, it can be seen that generating turbulence is one method of enhancing the heat dissipation characteristics (hereinafter referred to as turbulence effect).

1 (c) and 1 (d) show an example in which a cooling fan is used in a blowing method, but in the case of blowing as well, a comb-teeth-shaped shielding plate is similarly provided in each gap of the plate-shaped fins 1. By arranging 6, the main flow 8a of the air flow in the case of blowing is pushed down to the heat generating element side of the heat sink having the highest temperature. Further, similarly, since the air flow 8b that flows into the gap between the plate-shaped fin 1 and the comb-teeth shaped shielding plate 6 is formed, the dead area of the air is eliminated, the effective surface area of the heat sink is increased, and high heat dissipation characteristics are obtained. It can be realized.

It is to be noted that the heat sink disposed above the heat sink in the figure
The upper cover 5 is necessary only when the heat sink is larger than the fan size as the cooling device becomes higher in performance, and is not necessary when the heat sink size is the same as the fan size. However, even in this case, the dead region 10 shown in FIGS. 14 and 15 does not completely disappear, so that if the size of the heat sink is the same as the fan size, high performance cannot be obtained.

(Second Embodiment) FIG. 2 is a front view and a side view of a cooling device according to a second embodiment of the present invention. 2 (a) and 2 (b) are a front view and a side view of a cooling device when a cooling fan according to a second embodiment of the present invention is used in a suction system, FIGS. 2 (c) and 2 (d). [Fig. 3] is a front view and a side view of a cooling device of the present invention when a cooling fan is used in a blowing method. 2 has almost the same basic configuration as the case of FIG. 1 described in the first embodiment, but here, differences from the case of FIG. 1 will be mainly described. A major difference from FIG. 1 is that the comb-shaped shield plate 6 arranged between the fins near the side surface of the heat sink is inclined to the heat transfer plate 2 side from the end of the fan mounting surface. This allows
2 (a) and 2 (b), an air flow 7c from the outside is generated along the surface of the comb-teeth shaped shield plate 6, and the main air flow 7a is generated.
1 can be positively guided to the vicinity of directly above the heating element, which is the highest temperature portion, as compared with the case of FIG. 1, so that it is possible to realize higher heat dissipation characteristics. 2 (c) and FIG.
Similarly, in the case of (d), a blown air flow 8c is generated along the surface of the comb-teeth-shaped shield plate 6, and the main air flow 8a is positively guided to a position immediately above the heating element, which is the highest temperature part. Therefore, high heat dissipation characteristics can be realized.

(Third Embodiment) FIG. 3 is a front view and a side view of a cooling device according to a third embodiment of the present invention.
3 (a), 3 (b), and 3 (c) are a plan view, a front view, and a side view, respectively. Similar to the case of FIGS. 2 (a) and 2 (b), plate-shaped fins are shown. 1, the comb-teeth-shaped shield plate 6 is arranged in each gap, the cooling fan 4 is arranged on the side surface of the heat sink so that air is sucked along the side surface of the plate-shaped fan 1, and the comb-teeth-shaped cutoff plate 6 is the upper portion of the heat sink. Thus, the cooling fan 4 is inclined from the cooling fan 4 side to the heating element 3 side. The length of the comb-teeth blocking plate 6 is 1 / the length of the lateral hand of the plate fin 1.
The length may be about 3 to 2/3. If it is too long, the air inlet becomes small, and if it is too short, the air stream cannot flow efficiently toward the heat transfer plate 2. The airflow 7c that flows in from the side of the heat sink is formed, and the main airflow 7a
It is possible to improve the heat dissipation characteristic by pushing down to the heating element 3 side of the heat sink having the highest temperature. Furthermore, the point that an air flow 7b that flows in from the gap between the plate-shaped fin 1 and the comb-teeth shaped shielding plate 6 is formed, which is also the same as in the case of FIG. It is possible to increase the surface area and realize high heat dissipation characteristics by the turbulent flow effect described above.

FIG. 4 is a front view and a side view of another cooling device according to the third embodiment of the present invention. Figure 4
4A, FIG. 4B, and FIG. 4C are plan views,
It is a front view and a side view, and also in this case, FIG.
As in the case of (d), a blown air flow 8c is generated along the surface of the comb-teeth shaped shielding plate 6, and the main air flow 8a is positively guided to the vicinity of directly above the heating element, which is the highest temperature part of the heat sink. Therefore, high heat dissipation characteristics can be realized.

(Fourth Embodiment) FIG. 5 is a front view and a side view of a cooling device according to a fourth embodiment of the present invention.
5A and 5B are a front view and a side view of a cooling device when a cooling fan according to a fourth embodiment of the present invention is used in a suction system, FIG. 5C and FIG. It is a front view and a side view of a cooling device of the present invention when a cooling fan is used by a blowing method. The difference between the first embodiment and the embodiment shown in FIG. 1 is that the comb-teeth-shaped shielding plate 6 is arranged not on the fins of the plate-shaped fins 1 but on the side surface of the heat sink, and the heat dissipation characteristics are different. Then, basically, it is possible to achieve substantially the same effect as that of the first embodiment.

(Fifth Embodiment) FIGS. 6 to 10 show another embodiment of the cooling device according to the fifth embodiment of the present invention, and FIG. 6 is a front view of the cooling device according to the fifth embodiment of the present invention. FIG. 7 is a front view and a side view of the cooling device according to the fifth embodiment of the present invention. FIG. 8 is a front view and a side view of the cooling device according to the fifth embodiment of the present invention.
Is a front view and a side view of a cooling device according to a fifth embodiment of the present invention, and FIG. 10 is a front view and a side view of another cooling device according to the fifth embodiment of the present invention. The structure of each figure is
6 shows the first embodiment, FIG. 7 shows the second embodiment, FIG. 8 and FIG.
Corresponds to the third embodiment and FIG. 10 corresponds to the fourth embodiment, and substantially the same effects can be realized. The only difference from Embodiments 1 to 4 is that in Embodiments 1 to 4,
Although the comb-teeth shaped shield plate is used for controlling the air flow, in the fifth embodiment, this shield plate is cut and raised to shield the shield plate 11.
(Hereinafter, the shield plate) is formed by cutting or bending a part of the plate-shaped fin 1. Accordingly, in terms of heat dissipation characteristics, it is possible to achieve basically the same effect as in the first to fourth embodiments.

In other words, the shielding plate 11 existing between the fins does not necessarily have to be arranged only in the central portion between the plate-shaped fins 1 as shown in FIG. 1, but as shown in FIG. 6 or FIG. However, it is sufficient if there is a shielding width effective for air flow control. Therefore, the shield plate 11 disposed between the plate-shaped fins 1 may be in contact with either plate-shaped fin 1 on either side, and in FIG.
The cut-and-raised direction of 1 does not necessarily have to be aligned in one direction. However, when considering the manufacturing aspect,
It is desirable to align in one direction. Further, in the case of a suction method in which air flows in from the left and right, holes formed by cutting and raising the shielding plate 11 allow air to flow in from the left and right sides of the heat sink, so as shown in FIG.
It should be formed at a position behind the shielding plate 11. This is because in the opposite case, the air that has collided with the shield plate cuts and raises the shield plate 11, passes through the holes, and passes through the plate-shaped fin 1 itself, so that the effect of the shield plate is reduced.

(Sixth Embodiment) FIG. 11 is a front view, a side view and a plan view of a cooling device according to a sixth embodiment of the present invention, and FIG. 12 is a front view of another cooling device according to the sixth embodiment of the present invention. FIG.

11 and 12 show some other examples of the arrangement of the shielding plate. In FIG. 11, the position of the shielding plate is an example in which the position of the shielding plate between the fins of the plate-shaped fin 1 is displaced to the left and right. Even with such an arrangement, there is no problem in controlling the air flow, so that the same effect as that in FIG. 6 can be expected as the cooling performance. In addition, in FIG.
In this example, a plurality of shield plates are arranged between the same fins. Even in this case, the plurality of shielding plates are arranged vertically or inclined with respect to the heat receiving surface, so that the same effects as those in FIG. 6 or 7 can be expected.

(Seventh Embodiment) FIG. 13 is a front view and a side view of a cooling device according to a seventh embodiment of the present invention. FIG. 13 is an example in which the above-described cooling device of the present invention and a duct are combined, and the cooling fan 4 which is a blower is a suction type, and the cooling fan 4 and the duct 12 are provided between the heat sink and the housing wall 13 of the electronic device. It is shown in a state of being arranged in. 13A shows the case where the cooling fan 4 is arranged on the housing wall 13, and FIG. 13B shows the case where the cooling fan 4 is arranged in the middle of the duct 12. With this configuration,
The air in the case is sucked in by the suction method, and the hot air radiated from the heat sink can be directly discharged to the outside of the case through the duct, so that the temperature rise in the case due to self-exhausted heat from the heat sink can be prevented, and as a result, the heat sink The temperature of the inflowing air into the can be kept low and extremely high cooling performance can be achieved. Although the cooling fan 4 is arranged on the housing wall 13 side in FIG. 13A, it may be arranged on the heat sink side so that the duct 12 abuts on the housing wall 13.

As described above, the cooling device of this embodiment is
By placing the comb-shaped shield plate or the cut-and-raised shield plate between the fins of the heat sink and on the side wall of the heat sink in the air blowing direction, the main region of the cooling air is guided to directly above the heating element while preventing the dead area of air. Therefore, it becomes possible to realize a cooling device having an extremely high heat dissipation performance. Further, by constructing a new cooling device in which the cooling device of the present embodiment is combined with a duct, it is possible to maximize the original performance of the cooling device.

The shape of the comb-teeth-shaped shield plate and the cut-and-raised shield plate shown in the embodiments is plate-like, but the original purpose of the shield plate is to guide air to the vicinity of directly above the heat generator of the heat sink. Therefore, it does not have to be plate-shaped,
It may be a rod, a cylinder, or a prism.

[0062]

According to the cooling device of the present embodiment, by disposing the comb-teeth-shaped shield plate or the cut-and-raised shield plate between the fins of the heat sink or on the side wall portion of the heat sink in the air blowing direction,
It is possible to provide a cooling device for electronic components having excellent cooling performance by guiding the main stream of cooling air to the vicinity of immediately above the heating element and drawing out the heat dissipation characteristic of the heat sink.

[Brief description of drawings]

FIG. 1 is a front view and a side view of a cooling device according to a first embodiment of the present invention.

FIG. 2 is a front view and a side view of a cooling device according to a second embodiment of the present invention.

FIG. 3 is a front view and a side view of a cooling device according to a third embodiment of the present invention.

FIG. 4 is a front view and a side view of another cooling device according to the third embodiment of the present invention.

FIG. 5 is a front view and a side view of a cooling device according to a fourth embodiment of the present invention.

FIG. 6 is a front view and a side view of a cooling device according to a fifth embodiment of the present invention.

FIG. 7 is a front view and a side view of a cooling device according to a fifth embodiment of the present invention.

FIG. 8 is a front view and a side view of a cooling device according to a fifth embodiment of the present invention.

FIG. 9 is a front view and a side view of a cooling device according to a fifth embodiment of the present invention.

FIG. 10 is a front view and a side view of another cooling device according to the fifth embodiment of the present invention.

FIG. 11 is a front view, a side view, and a plan view of a cooling device according to a sixth embodiment of the present invention.

FIG. 12 is a front view and a side view of another cooling device according to the sixth embodiment of the present invention.

FIG. 13 is a front view and a side view of a cooling device according to a seventh embodiment of the present invention.

FIG. 14 is a front view and a side view of a conventional cooling device.

FIG. 15 is a front view and a side view of another conventional cooling device.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 plate fin 2 heat transfer plate 3 heating element 4 cooling fan 5 upper cover 6 comb-teeth-shaped shield plates 7a, 7b, 7c air flow 8a, 8b, 8c in case of suction method air flow 9 in case of inhalation method 10 Dead area (area of heat radiation fins that does not contribute to heat dissipation) 11 Cut-and-raised shield 12 Duct 13 Housing wall

Claims (17)

[Claims] 1. A heat transfer plate having a heat receiving surface, a heat sink having a plurality of fins provided upright on a surface of the heat transfer plate opposite to the heat receiving surface, and a ventilation means for the heat sink. A cooling device for an electronic component, comprising a regulating member for regulating an air passage between fins of the heat sink. 2. The cooling device for an electronic component according to claim 1, wherein a gap between the fins is made narrower than other portions by the restriction member. 3. The cooling device for an electronic component according to claim 1, wherein the regulating member and the fin are in contact with each other. 4. The cooling device for an electronic component according to claim 1, wherein the shape of the regulating member is one of a plate shape and a comb tooth shape. 5. A heat transfer plate having a heat receiving surface, a heat sink having a plurality of fins provided upright on a surface of the heat transfer plate opposite to the heat receiving surface, and a ventilation means for the heat sink. A cooling device for an electronic component, comprising an air guide member that is inserted between fins of the heat sink and guides a flow path to a central portion of the heat sink. 6. The cooling device for electronic parts according to claim 5, wherein the air guide member and the fin are in contact with each other. 7. A heat transfer plate having a heat receiving surface, a heat sink having a plurality of fins provided upright on a surface of the heat transfer plate opposite to the heat receiving surface, and a ventilation means for the heat sink. A cooling device for an electronic component, comprising an air guide member that is inserted between fins of the heat sink and guides a flow path to a central portion of the heat transfer plate. 8. A heat transfer plate that is in contact with a heating element and projects to the opposite side of the heat receiving surface, a heat sink having a plurality of fins provided upright on the side of the heat transfer plate opposite to the heat receiving surface, and the heat sink. A cooling device having a fan as a blowing means to the electronic component, wherein a shielding plate is arranged between the fins of the heat sink. 9. The cooling device for an electronic component according to claim 8, wherein the shielding plate arranged between the fins of the heat sink is perpendicular to the fan mounting surface. 10. The cooling device for an electronic component according to claim 8, wherein the shield plate arranged between the fins of the heat sink is inclined with respect to the fan mounting surface. 11. The cooling device for an electronic component according to claim 9, wherein the shield plate arranged between the fins of the heat sink is comb-shaped. 12. The cooling device for an electronic component according to claim 9, wherein the shielding plate arranged between the fins of the heat sink is formed by cutting and raising a part of the fins. 13. The cooling device for an electronic component according to claim 9, wherein two or more shield plates arranged between the fins of the heat sink are arranged per one fin. 14. A heat transfer plate that is in contact with a heating element and projects to the opposite side of the heat receiving surface, a heat sink having a plurality of fins provided upright on the side of the heat transfer plate opposite to the heat receiving surface, and the heat sink. A cooling device for electronic components, comprising: a shielding plate of the heat sink disposed on a side wall portion of the heat sink in a blowing direction. 15. A heat sink having a heat transfer plate that is in contact with a heating element and projects to the opposite side of the heat receiving surface, and a plurality of fins and a shield plate that are provided upright on the side of the heat transfer plate opposite to the heat receiving surface. A cooling device having a blower for blowing to the heat sink and a duct for guiding the exhaust heat fluid to the outside, wherein the blower is arranged at an end of the duct. 16. The cooling device for an electronic component according to claim 15, wherein the blower means is arranged in an intermediate portion of the duct. 17. A heat transfer plate having a heat receiving surface, a plurality of fins erected on a surface of the heat transfer plate opposite to the heat receiving surface, and a restricting member for restricting an air passage between the fins of the heat sink. An electronic component cooling device, comprising: a heat sink having: a fan that ventilates the heat sink; and a duct that is an air passage of the fan.