JP2017087417A - Glass laminate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a glass laminate which suppresses decomposition of a silicone resin layer even after high temperature heating treatment.SOLUTION: There is provided a glass laminate which comprises a support substrate layer, a silicone resin layer and a glass substrate layer in this order. A peel strength at an interface between the support substrate layer and the silicone resin layer is higher than a peel strength at an interface between the glass substrate layer and the silicone resin layer. The silicone resin in the silicone resin layer is a crosslinked product of a crosslinkable organopolysiloxane, and the crosslinkable organopolysiloxane contains a siloxane unit (A) represented by specific formula (1) and substantially has no alkenyl group and alkynyl group.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a glass laminate.

In recent years, devices (electronic devices) such as solar cells (PV), liquid crystal panels (LCD), and organic EL panels (OLED) have been made thinner and lighter, and the glass substrates used in these devices have been made thinner. Progressing. If the strength of the glass substrate is insufficient due to the thinning, the handling property of the glass substrate is lowered in the device manufacturing process.
Recently, in order to cope with the above problems, after preparing a glass laminate in which a thin glass substrate and a reinforcing plate are laminated and forming a member for an electronic device such as a display device on the thin glass substrate of the glass laminate, A method for separating a support plate from a thin glass substrate has been proposed (see, for example, Patent Document 1). The reinforcing plate has a support plate and a silicone resin layer fixed on the support plate, and the silicone resin layer and the thin glass substrate are in close contact with each other in a peelable manner. The reinforcing plate separated from the thin glass substrate is peeled off from the interface between the silicone resin layer of the glass laminate and the thin glass substrate, and can be reused as a glass laminate by being laminated with a new thin glass substrate.

International Publication No. 2007/018028

In recent years, higher heat resistance has been required for the glass laminate described in Patent Document 1. As the electronic device members formed on the glass substrate of the glass laminate become more functional and complex, the temperature at which the electronic device members are formed becomes even higher, and the time exposed to the high temperatures also increases. It often takes a long time.
The glass laminate described in Patent Document 1 can withstand treatment at 300 ° C. for 1 hour in the air. However, according to the study by the present inventors, the silicone resin layer in the glass laminate described in Patent Document 1 decomposes in a short time at 450 ° C., and a large amount of outgas is generated. Generation | occurrence | production of such an outgas contaminates the member for electronic devices formed on a glass substrate, and becomes a cause of reducing the productivity of an electronic device as a result.

  This invention is made | formed in view of the above point, and it aims at providing the glass laminated body by which decomposition | disassembly of the silicone resin layer was suppressed even after high temperature heat processing.

  As a result of intensive studies to achieve the above object, the present inventors have found that decomposition is suppressed even after high-temperature heat treatment by employing a specific silicone resin layer, and the present invention has been completed. .

That is, the present invention provides the following [1] to [5].
[1] A support base layer, a silicone resin layer, and a glass substrate layer are provided in this order, and the peel strength at the interface between the support base layer and the silicone resin layer is the glass substrate layer and the silicone. A glass laminate having a higher peel strength at the interface with the resin layer, wherein the silicone resin of the silicone resin layer is a crosslinked product of a crosslinkable organopolysiloxane, and the crosslinkable organopolysiloxane has a formula described below A glass laminate comprising the siloxane unit (A) represented by (1) and having substantially no alkenyl group or alkynyl group.
[2] The glass laminate according to [1], wherein R ^{1 to} R ⁴ in the siloxane unit (A) are each independently an alkyl group having 4 or less carbon atoms.
[3] The glass laminate according to [1] or [2], wherein the crosslinkable organopolysiloxane further includes a siloxane unit (B) represented by the formula (2) described later.
[4] In the crosslinkable organopolysiloxane, the ratio of the siloxane unit (A) to the total of the siloxane unit (A) and the siloxane unit (B) is 30 to 90 mol%, The glass laminate according to [3], wherein a total ratio of the siloxane unit (A) and the siloxane unit (B) is 80 to 100 mol%.
[5] The siloxane unit (B) is a siloxane unit (B-1) in which R ⁵ and R ⁶ are phenyl groups, or one of R ⁵ and R ⁶ is an alkyl group having 4 or less carbon atoms. The glass laminate according to [3] or [4], wherein the other is a siloxane unit (B-2) which is a phenyl group.

  ADVANTAGE OF THE INVENTION According to this invention, the glass laminated body by which decomposition | disassembly of the silicone resin layer was suppressed even after high temperature heat processing can be provided.

It is typical sectional drawing of one Embodiment of the glass laminated body of this invention. It is typical sectional drawing which shows one Embodiment of the manufacturing method of the glass substrate with a member which concerns on this invention in process order.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. However, the present invention is not limited to the following embodiments, and the following embodiments are not deviated from the scope of the present invention. Various modifications and substitutions can be made.

The glass laminate of the present invention comprises a support base material layer, a silicone resin layer, and a glass substrate layer in this order. That is, a silicone resin layer is provided between the support substrate layer and the glass substrate layer. Therefore, one side of the silicone resin layer is in contact with the layer of the supporting substrate, and the other side is in contact with the layer of the glass substrate.
In the glass laminate of the present invention, the silicone resin of the silicone resin layer is a cross-linked product of a cross-linkable organopolysiloxane described later, thereby exhibiting predetermined adhesion to the glass substrate and under high-temperature treatment conditions. Decomposition of the silicone resin is suppressed. As a result, generation of outgas, displacement of the glass substrate, and the like are further suppressed.
The reason why the decomposition of the silicone resin is suppressed is that the main chain of the crosslinkable organopolysiloxane contains a divalent aromatic hydrocarbon group (for example, a phenylene group). By including this aromatic hydrocarbon group, the bond energy of the crosslinkable organopolysiloxane is improved, the mobility of the crosslinkable organopolysiloxane is lowered, and the cleavage of the siloxane bond is difficult to proceed.
As a result, generation of a cyclic compound of siloxane generated along with cleavage is suppressed, and generation of outgas, displacement of the glass substrate, and the like are further suppressed.

Moreover, according to the glass laminated body of this invention, there exist the following effects.
For example, a silicon atom (Si) in a crosslinkable organopolysiloxane that is cured to form a silicone resin layer is an alkenyl group or an alkynyl group (typically a vinyl group (Vi), and the vinyl group will be described below as an example. ) Are combined. In this case, when the crosslinkable organopolysiloxane is heated and cured at, for example, about 300 ° C. or more, the Si—Vi portion is decomposed or the Si—Vi portion is oxidized to produce Si—OH. Foaming and cracking may occur in the resulting silicone resin layer due to dehydration condensation between them. If foaming or cracking occurs in the silicone resin layer, the adhesion to the glass substrate laminated on the silicone resin layer may be reduced, or the glass substrate may not be laminated on the silicone resin layer in the first place.
Therefore, if the heat-curing temperature is lowered in order to avoid such foaming and cracking, the generated Si—OH remains without being condensed, and the remaining Si—OH causes the silicon resin layer to remain on the silicone resin layer. There is a possibility that the peel strength with respect to the glass substrate laminated on the substrate is increased.
However, in the present invention, since the crosslinkable organopolysiloxane that becomes the silicone resin layer has substantially no alkenyl group and alkynyl group, the remaining Si-Vi portion is decomposed or the Si-Vi portion is oxidized. As a result, generation of foam and cracks in the silicone resin layer and increase in peel strength of the glass substrate when the heat curing temperature is lowered can be suppressed.
In general, as the thickness of the silicone resin layer increases, cracks tend to occur. However, in the glass laminate of the present invention, as described above, cracks are unlikely to occur in the silicone resin layer. It is possible to increase the thickness of the silicone resin layer while suppressing the occurrence of.

FIG. 1 is a schematic cross-sectional view of an example of the glass laminate of the present invention.
As shown in FIG. 1, the glass laminated body 10 is a laminated body in which the layer of the support base material 12, the layer of the glass substrate 16, and the silicone resin layer 14 exist among them. One side of the silicone resin layer 14 is in contact with the layer of the support base 12, and the other side is in contact with the first main surface 16 a of the glass substrate 16. In other words, the silicone resin layer 14 is in contact with the first major surface 16 a of the glass substrate 16.
The two-layer portion including the layer of the support base 12 and the silicone resin layer 14 reinforces the glass substrate 16 in a member forming process for manufacturing a member for an electronic device such as a liquid crystal panel. In addition, the two-layer part which consists of the layer of the support base material 12 manufactured previously for manufacture of the glass laminated body 10, and the silicone resin layer 14 is called the support base material 18 with a silicone resin layer.

  This glass laminated body 10 is used until the member formation process mentioned later. That is, the glass laminate 10 is used until a member for an electronic device such as a liquid crystal display device is formed on the surface of the second main surface 16b of the glass substrate 16. Then, the glass laminated body in which the member for electronic devices was formed is isolate | separated into the support base material 12 and the glass substrate with a member, and the support base material 18 with a silicone resin layer does not become a part which comprises an electronic device. The support base material 18 with the silicone resin layer is laminated with a new glass substrate 16 and can be reused as a new glass laminate 10.

The interface between the support substrate 12 and the silicone resin layer 14 has a peel strength (x), and when a stress in the peeling direction exceeding the peel strength (x) is applied to the interface between the support substrate 12 and the silicone resin layer 14, The interface between the support base 12 and the silicone resin layer 14 is peeled off. The interface between the silicone resin layer 14 and the glass substrate 16 has a peel strength (y). When a stress in the peeling direction exceeding the peel strength (y) is applied to the interface between the silicone resin layer 14 and the glass substrate 16, the silicone resin The interface between the 14 layers and the glass substrate 16 peels off.
In the glass laminate 10 of the present invention (which also means a laminate with an electronic device member described later), the peel strength (x) is higher than the peel strength (y). Therefore, when the stress of the direction which peels the support base material 12 and the glass substrate 16 is applied to the glass laminated body 10 of this invention, the glass laminated body 10 of this invention will be in the interface of the silicone resin layer 14 and the glass substrate 16. FIG. It peels and isolate | separates into the glass substrate 16 and the support base material 18 with a silicone resin layer.

The peel strength (x) is preferably sufficiently higher than the peel strength (y). Increasing the peel strength (x) means that the adhesion of the silicone resin layer 14 to the support base 12 can be increased and a relatively higher adhesion can be maintained after the heat treatment than to the glass substrate 18. .
In order to increase the adhesion of the silicone resin layer 14 to the support substrate 12, it is preferable to form a silicone resin layer 14 by crosslinking and curing a crosslinkable organopolysiloxane on the support substrate 12, as will be described later. The silicone resin layer 14 bonded to the support substrate 12 with a high bonding force can be formed by the adhesive force at the time of crosslinking and curing.
On the other hand, the bonding strength of the silicone resin, which is a crosslinked product of the crosslinkable organopolysiloxane, to the glass substrate 16 is usually lower than the bonding strength generated during the crosslinking curing. Therefore, the crosslinkable organopolysiloxane is crosslinked and cured on the support base 12 to form the silicone resin layer 14, and then the glass substrate 16 is laminated on the surface of the silicone resin layer 14 to produce the glass laminate 10. Is preferred.

  Below, each layer (support base material 12, glass substrate 16, silicone resin layer 14) which comprises the glass laminated body 10 is explained in full detail first, Then, the manufacturing method of a glass laminated body and a glass substrate with a member is explained in full detail. .

[Supporting substrate]
The support base material 12 supports and reinforces the glass substrate 16, and the glass substrate 16 is deformed and scratched when the electronic device member is manufactured in a member forming step (step of manufacturing an electronic device member) described later. Prevent damage.
As the support substrate 12, for example, a metal plate such as a glass plate, a plastic plate, or a SUS plate is used. Usually, since the member forming process involves heat treatment, the support base 12 is preferably formed of a material having a small difference in linear expansion coefficient from the glass substrate 16 and more preferably formed of the same material as the glass substrate 16. Preferably, the support base 12 is a glass plate. In particular, the support base 12 is preferably a glass plate made of the same glass material as the glass substrate 16.

  The thickness of the support base 12 may be thicker or thinner than the glass substrate 16. Preferably, the thickness of the support base 12 is selected based on the thickness of the glass substrate 16, the thickness of the silicone resin layer 14, and the thickness of the glass laminate 10. For example, when the current member forming process is designed to process a substrate having a thickness of 0.5 mm, and the sum of the thickness of the glass substrate 16 and the thickness of the silicone resin layer 14 is 0.1 mm, The thickness of the support base 12 is set to 0.4 mm. In general, the thickness of the support base 12 is preferably 0.2 to 5.0 mm.

  When the support substrate 12 is a glass plate, the thickness of the glass plate is preferably 0.08 mm or more for reasons such as easy handling and difficulty in cracking. Further, the thickness of the glass plate is preferably 1.0 mm or less because the rigidity is desired so that the glass plate is appropriately bent without being broken when it is peeled off after forming the electronic device member.

The difference in linear expansion coefficient at 25 to 300 ° C. between the support base 12 and the glass substrate 16 is preferably 500 × 10 ⁻⁷ / ° C. or less, more preferably 300 × 10 ⁻⁷ / ° C. or less, Preferably, it is 200 × 10 ⁻⁷ / ° C. or less. If the difference is too large, the glass laminate 10 may be severely warped or the support substrate 12 and the glass substrate 16 may be peeled off during heating and cooling in the member forming process. When the material of the support base material 12 is the same as the material of the glass substrate 16, it can suppress that such a problem arises.

[Glass substrate]
As for the glass substrate 16, the 1st main surface 16a touches the silicone resin layer 14, and the member for electronic devices is provided in the 2nd main surface 16b on the opposite side to the silicone resin layer 14 side.
The glass substrate 16 may be of a general type, and examples thereof include a glass substrate for a display device such as an LCD or an OLED. The glass substrate 16 is excellent in chemical resistance and moisture permeability and has a low heat shrinkage rate. As an index of the heat shrinkage rate, a linear expansion coefficient defined in JIS R 3102 (revised in 1995) is used.

  When the linear expansion coefficient of the glass substrate 16 is large, the member forming process often involves a heat treatment, and various inconveniences are likely to occur. For example, when a TFT is formed on the glass substrate 16, if the glass substrate 16 on which the TFT is formed is cooled under heating, the TFT may be displaced excessively due to thermal contraction of the glass substrate 16.

  The glass substrate 16 is obtained by melting a glass raw material and molding the molten glass into a plate shape. Such a molding method may be a general one, and for example, a float method, a fusion method, a slot down draw method, a full call method, a rubber method, or the like is used. The glass substrate 16 having a particularly small thickness can be obtained by heating a glass once formed into a plate shape to a moldable temperature and then stretching it by means of stretching or the like to make it thin (redraw method).

  The glass type of the glass substrate 16 is not particularly limited, but non-alkali borosilicate glass, borosilicate glass, soda lime glass, high silica glass, and other oxide-based glasses mainly composed of silicon oxide are preferable. As the oxide glass, a glass having a silicon oxide content of 40 to 90% by mass in terms of oxide is preferable.

  As the glass of the glass substrate 16, glass suitable for the type of electronic device member and its manufacturing process is employed. For example, a glass substrate for a liquid crystal panel is made of glass (non-alkali glass) that does not substantially contain an alkali metal component because the elution of an alkali metal component easily affects the liquid crystal (however, usually an alkaline earth metal) Ingredients are included). Thus, the glass of the glass substrate 16 is appropriately selected based on the type of device to be applied and its manufacturing process.

The thickness of the glass substrate 16 is preferably 0.3 mm or less, more preferably 0.15 mm or less, from the viewpoint of reducing the thickness and / or weight of the glass substrate 16. In the case of 0.3 mm or less, it is possible to give good flexibility to the glass substrate 16. In the case of 0.15 mm or less, the glass substrate 16 can be rolled up.
Further, the thickness of the glass substrate 16 is preferably 0.03 mm or more for reasons such as easy manufacture of the glass substrate 16 and easy handling of the glass substrate 16.

  The glass substrate 16 may be composed of two or more layers. In this case, the material for forming each layer may be the same material or different materials. In this case, “the thickness of the glass substrate 16” means the total thickness of all the layers.

[Silicone resin layer]
The silicone resin layer 14 prevents the glass substrate 16 from being displaced until the operation for separating the glass substrate 16 and the support base 12 is performed, and prevents the glass substrate 16 and the like from being damaged by the separation operation.
The surface 14a of the silicone resin layer 14 that is in contact with the glass substrate 16 is in close contact with the first main surface 16a of the glass substrate 16 in a peelable manner. The silicone resin layer 14 is bonded to the first main surface 16a of the glass substrate 16 with a weak bonding force, and the peeling strength (y) at the interface is the peeling at the interface between the silicone resin layer 14 and the support base 12. Lower than strength (x).
That is, when separating the glass substrate 16 and the support base material 12, the glass substrate 16 is peeled off at the interface between the first main surface 16 a of the glass substrate 16 and the silicone resin layer 14, and the support base material 12 and the silicone resin layer 14 are separated. It is difficult to peel off at the interface.
For this reason, the silicone resin layer 14 is in close contact with the first main surface 16a of the glass substrate 16, but has a surface characteristic that allows the glass substrate 16 to be easily peeled off. That is, the silicone resin layer 14 is bonded to the first main surface 16a of the glass substrate 16 with a certain amount of bonding force to prevent the glass substrate 16 from being displaced, and at the same time, when the glass substrate 16 is peeled off. The glass substrate 16 is bonded with a bonding force that can be easily peeled without breaking the glass substrate 16.
In this invention, the property which can peel this silicone resin layer 14 surface easily is called peelability. On the other hand, the 1st main surface of the support base material 12 and the silicone resin layer 14 are couple | bonded by the bonding force which is hard to peel relatively.
Even if the bonding force at the interface between the silicone resin layer 14 and the glass substrate 16 changes before and after the electronic device member is formed on the surface (second main surface 16b) of the glass substrate 16 of the glass laminate 10. Good (that is, peel strength (x) and peel strength (y) may be changed). However, even after the electronic device member is formed, the peel strength (y) is lower than the peel strength (x).

It is considered that the silicone resin layer 14 and the glass substrate 16 layer are bonded with a bonding force resulting from weak adhesive force or van der Waals force. When the glass substrate 16 is laminated on the surface after the silicone resin layer 14 is formed, if the silicone resin of the silicone resin layer 14 is sufficiently cross-linked so as not to exhibit an adhesive force, the binding force due to van der Waals force It is thought that it is combined with.
However, the silicone resin of the silicone resin layer 14 often has a certain weak adhesive force. Even when the adhesiveness is extremely low, when the electronic device member is formed on the laminated body after the glass laminated body 10 is manufactured, the silicone resin of the silicone resin layer 14 is removed from the glass substrate 16 by a heating operation or the like. It is considered that the bonding strength between the silicone resin layer 14 and the glass substrate 16 is increased by adhering to the surface.
In some cases, the surface of the silicone resin layer 14 before lamination or the first main surface 16a of the glass substrate 16 before lamination can be laminated by performing a treatment for weakening the bonding force between them. By performing non-adhesive treatment or the like on the surface to be laminated and then laminating, the bonding strength at the interface between the silicone resin layer 14 and the glass substrate 16 can be weakened, and the peel strength (y) can be lowered.

The silicone resin layer 14 is bonded to the surface of the support substrate 12 with a strong bonding force such as an adhesive force or an adhesive force.
For example, as described above, by crosslinking and curing the crosslinkable organopolysiloxane on the surface of the support substrate 12, a silicone resin as a crosslinked product can be adhered to the surface of the support substrate 12 and high bonding strength can be obtained. . Moreover, the process (for example, process using a coupling agent) which produces strong bond strength between the support base material 12 surface and the silicone resin layer 14 is given, and between the support base material 12 surface and the silicone resin layer 14 The binding power of can be increased.
The fact that the silicone resin layer 14 and the layer of the supporting substrate 12 are bonded with a high bonding force means that the peel strength (x) at the interface between them is high.

Although the thickness of the silicone resin layer 14 is not specifically limited, It is preferable that it is 2-100 micrometers, It is more preferable that it is 3-50 micrometers, It is further more preferable that it is 5-20 micrometers.
When the thickness of the silicone resin layer 14 is within such a range, even if air bubbles or foreign matter may be present between the silicone resin layer 14 and the glass substrate 16, the occurrence of distortion defects in the glass substrate 16 is suppressed. can do.
In addition, if the thickness of the silicone resin layer 14 is too thick, it takes time and materials to form it, which is not economical and the heat resistance may decrease. On the other hand, if the thickness of the silicone resin layer 14 is too thin, the adhesion between the silicone resin layer 14 and the glass substrate 16 may decrease.
The silicone resin layer 14 may be composed of two or more layers. In this case, “the thickness of the silicone resin layer 14” means the total thickness of all the layers.
Moreover, when the silicone resin layer 14 consists of two or more layers, resin which forms each layer may consist of a different crosslinked silicone resin.

The silicone resin of the silicone resin layer 14 is a crosslinked product of a crosslinkable organopolysiloxane described later.
Below, the aspect of crosslinkable organopolysiloxane and its crosslinked material is explained in full detail.

(Crosslinkable organopolysiloxane and its cross-linked product)
The crosslinkable organopolysiloxane used in the present invention contains the siloxane unit (A) represented by the formula (1) and has substantially no alkenyl group or alkynyl group.

In the present invention, the term “substantially free of alkenyl groups and alkynyl groups” means that the crosslinkable organopolysiloxane specifically includes silicon atoms (Si), etc. contained in one molecule of the crosslinkable organopolysiloxane. It means that the number of alkenyl groups and alkynyl groups (for example, vinyl group, ethynyl group, etc.) bonded to is 100 or less, preferably 50 or less, more preferably 10 or less, and even more preferably 0 .
The number of alkenyl groups and alkynyl groups bonded to a silicon atom (Si) or the like can be measured using, for example, NMR.

  As described later, the crosslinkable organopolysiloxane used in the present invention can be produced by polymerizing a specific silane compound. For this reason, in the present invention, the crosslinkable organopolysiloxane is substantially “alkenyl group and alkynyl group” by producing a crosslinkable organopolysiloxane without using a silane compound having an alkynyl group and / or an alkenyl group. In other words.

Usually, the basic structural unit of organopolysiloxane is classified according to how many monovalent organic groups represented by methyl group and phenyl group are bonded to silicon atoms. The organic group called D unit shown below is 2 Bifunctional siloxane unit with one bond, trifunctional siloxane unit with one organic group called T unit, monofunctional siloxane unit with three organic groups called M unit, called Q unit It consists of a tetrafunctional siloxane unit having no organic group.
The Q unit is a unit that does not have an organic group bonded to a silicon atom (an organic group having a carbon atom bonded to a silicon atom), but is regarded as a siloxane unit in the present invention. In the following formulas, R represents a monovalent organic group represented by a methyl group or a phenyl group.

In the siloxane unit, the siloxane bond is a bond in which two silicon atoms are bonded through one oxygen atom, so that the oxygen atom per silicon atom in the siloxane bond is regarded as ½, Expressed as O _1/2 .
More specifically, for example, in one D unit, one silicon atom is bonded to two oxygen atoms, and each oxygen atom is bonded to a silicon atom of another unit. The formula is -O1 _{/ 2-} (R) 2Si-O1 _{/ 2-} . Since there are two O _{1/2 s} , the D unit is usually expressed as (R) ₂ SiO _2/2 . However, in the present invention, in accordance with the expression of the siloxane unit (A) described later, the expression of O _1/2 is used for each oxygen atom as follows, and the M unit, D unit, T unit, and Q unit are expressed as follows. Expressed.
In addition, when the terminal unit of the polymer chain is a unit other than the M unit, atoms other than silicon atoms bonded to O _1/2 of the terminal unit are ½ oxygen atoms, and one in total And represents an oxygen atom in a hydroxyl group or an alkoxy group. When expressed in the same manner as the expression of the following siloxane unit, for example, the hydroxyl group bonded to the silicon atom of the terminal unit is —O _1/2 —H.

In the siloxane unit (A) described later in the present invention, each of two silicon atoms is bonded to an oxygen atom, and each oxygen atom is bonded to a silicon atom outside the unit. Expressed as _1/2 . The siloxane unit (A) can be regarded as a D unit because it is bifunctional.
Hereinafter, the crosslinkable organopolysiloxane will be described assuming that the siloxane unit (A) is one type of D unit in the present invention.

R ¹ to R ⁴ of formula (1) each independently represent an alkyl group or a phenyl group having 4 or less carbon atoms.
Examples of the alkyl group having 4 or less carbon atoms include a methyl group, an ethyl group, a propyl group, an isopropyl group, an n-butyl group, a sec-butyl group, an isobutyl group, and a tert-butyl group. Group and ethyl group are preferable, and methyl group is more preferable.
As the R ¹ to R ^4, in that the decomposition of the silicone resin in the high-temperature treatment conditions is further suppressed, a methyl group or a phenyl group is preferable.

In formula (1), Ar represents a divalent aromatic hydrocarbon group which may have a substituent. The two bonds of Ar are bonds of carbon atoms constituting the aromatic ring.
The number of carbon atoms contained in the divalent aromatic hydrocarbon group is not particularly limited, but 6 to 18 is preferable and 6 to 12 is more preferable in that the decomposition of the silicone resin under high temperature treatment conditions is further suppressed. .
Specific examples of the divalent aromatic hydrocarbon group include a phenylene group, a naphthylene group, a biphenylene group, and a terphenylene group. Among these, a phenylene group is preferable in that the cost can be reduced, the flexibility of the silicone resin layer 14 is excellent, and the adhesion and peelability of the silicone resin layer 14 to the glass substrate 16 are more excellent.
In addition, when it is desired to impart excellent heat resistance to the silicone resin layer 14, it is preferable to use a polycyclic aromatic hydrocarbon group as Ar.
The type of the substituent is not particularly limited, and examples thereof include a halogen atom, an aliphatic hydrocarbon group, an aromatic hydrocarbon group, an alkoxy group, an arylalkyl group, an aryloxy group, a heterocyclic group, an amino group, a nitro group, And a cyano group.

The crosslinkable organopolysiloxane in the present invention is a polymer containing only a siloxane unit (A) as a siloxane unit, or a copolymer containing a siloxane unit (A) and another siloxane unit.
The crosslinkable organopolysiloxane in the present invention is preferably a linear polymer, and the other siloxane units are preferably D units other than the siloxane unit (A).
When the crosslinkable organopolysiloxane is a linear polymer, the crosslinkable organopolysiloxane is a polymer containing only the siloxane unit (A), a polymer containing the siloxane unit (A) and other D units, a siloxane unit ( There are polymers containing A) and M units, and polymers containing siloxane units (A), other D units and M units. However, two or more siloxane units (A), other D units, and M units may be present.
The crosslinkable organopolysiloxane in the present invention may be a non-linear polymer having a small number of branches. In this case, except for having a small number of T units and Q units that cause branching, the linear polymer has D units and optionally further M units.
The crosslinkable organopolysiloxane in the present invention is crosslinkable. For example, an organopolysiloxane composed only of a siloxane unit (A) in which R ^{1 to} R ⁴ are all methyl groups and Ar is a phenylene group is crosslinkable, It can be cross-linked with UV light or the like.

As the crosslinkable organopolysiloxane in the present invention, a polymer containing only the siloxane unit (A) as a D unit and a polymer containing a siloxane unit (A) and another D unit are preferred, and the siloxane unit (A). And a polymer containing other D units is more preferred.
The cross-linked product (silicone resin) of organopolysiloxane containing other D units has higher flexibility than the cross-linked product of polyorganosiloxane (silicone resin) not containing other D units, and the silicone resin layer for the glass substrate Good adhesion.
Furthermore, when the other D unit is a D unit containing an alkenyl group, the crosslinkability is improved, and the decomposition of the cross-linked product (silicone resin) under high-temperature treatment conditions is further suppressed.
The D unit other than the siloxane unit (A) is preferably a siloxane unit (B) represented by the formula (2).

In formula (2), R ⁵ and R ⁶ each independently represents an alkyl group having 4 or less carbon atoms or a phenyl group.
Examples of the alkyl group having 4 or less carbon atoms include a methyl group, an ethyl group, a propyl group, an isopropyl group, an n-butyl group, a sec-butyl group, an isobutyl group, and a tert-butyl group. Group and ethyl group are preferable, and methyl group is more preferable.
R ⁵ and R ⁶ are preferably a methyl group or a phenyl group in that the decomposition of the silicone resin under high-temperature treatment conditions is further suppressed.

As a preferred embodiment of the siloxane unit (B), the siloxane unit (B) is a siloxane unit (B-1) in which R ⁵ and R ⁶ are phenyl groups, or one of R ⁵ and R ⁶ is carbon number. The aspect which is a siloxane unit (B-2) which is a 4 or less alkyl group and the other is a phenyl group is mentioned.

The crosslinkable organopolysiloxane may contain siloxane units (for example, M unit, T unit, Q unit) other than the siloxane unit (A) and the siloxane unit (B) described above.
However, if there are many branched units (T units and Q units), the flexibility of the cross-linked product (silicone resin) is lowered, and if there are many M units, the polymer has a low number average molecular weight and has physical properties such as heat resistance. May decrease.
Therefore, it is preferable that the number thereof is small, and the content of units other than D units (siloxane units (A) and siloxane units (B)) is preferably 0 to 20 mol%, more preferably 0 to 5 mol%. .

  When the crosslinkable organopolysiloxane contains the siloxane unit (A) and the siloxane unit (B), the ratio of the siloxane unit (A) to the total of the siloxane unit (A) and the siloxane unit (B) is 10 to 90. Mol% is preferable, 30 to 90 mol% is more preferable, and 40 to 60 mol% is more preferable.

  Moreover, 80-100 mol% is preferable and, as for the ratio of the sum total of the siloxane unit (A) and siloxane unit (B) with respect to all the siloxane units in crosslinkable organopolysiloxane, 95-100 mol% is more preferable.

  Further, the bonding type of the siloxane unit (A) and the siloxane unit (B) in the crosslinkable organopolysiloxane is not particularly limited, and may be any of a random copolymer, a block copolymer, and an alternating copolymer. Also good. Especially, an alternating copolymer is preferable at the point by which decomposition | disassembly of the silicone resin under high temperature processing conditions is suppressed more.

In the present invention, the alternating copolymer of the siloxane unit (A) and the siloxane unit (B) means that the bond between the siloxane unit (A) and the siloxane unit (B) is a combination of the siloxane unit (A) and the siloxane unit (A). ) And the sum of the bonds of the siloxane unit (B) and the siloxane unit (B).
These three types of bonds can be distinguished by, for example, ¹ H NMR measurement and ²⁹ Si NMR measurement, and the relative number ratio of these bonds can be calculated by the measurement.
The alternating copolymer of the siloxane unit (A) and the siloxane unit (B) in the present invention may contain a small number of random bond portions or block bond portions.
The proportion of the bond between the siloxane unit (A) and the siloxane unit (B) in the alternating copolymer is preferably 80 to 100 mol%, more preferably 90 to 100 mol%, based on the total of the three types of bonds. 95 to 100 mol% is more preferable.
In addition, although it does not distinguish whether it is an alternating copolymer, when the crosslinkable polysiloxane in this invention is an alternating copolymer, the siloxane unit (A) in the alternating copolymer and a siloxane unit (B The proportion of the siloxane unit (A) with respect to the total of 50) is preferably 50 ± 5 mol%.
The alternating copolymer in the present invention may be one kind of silicone resin, or two or more kinds of silicone resins are mixed and the ratio of the bond between the siloxane unit (A) and the siloxane unit (B) is as described above. You may adjust and obtain so that it may become a desirable ratio.

The number average molecular weight of the crosslinkable organopolysiloxane is not particularly limited, but it is excellent in handleability, excellent in film formability, and is more resistant to decomposition of the silicone resin under high temperature processing conditions. The number average molecular weight in terms of polystyrene as determined by chromatography) is preferably from 5,000 to 100,000, more preferably from 10,000 to 50,000.
The number average molecular weight of the crosslinkable organopolysiloxane can be adjusted by controlling the reaction conditions. For example, the molecular weight can be controlled by changing the amount and type of terminal groups and the monomer mixing ratio. When the amount of terminal groups is increased, a low molecular weight product is obtained, and when the amount is decreased, a high molecular weight is obtained. Further, when the monomer ratio is biased, a low molecular weight product is obtained, and when the ratio is made equal, a high molecular weight product is obtained.

The method for producing the crosslinkable organopolysiloxane is not particularly limited as long as the siloxane unit (A) represented by the above formula (1) is included. For example, the silane compound represented by the formula (3) can be produced by polymerizing by a condensation reaction or a hydrolysis / condensation reaction.
In the case of a crosslinkable organopolysiloxane having a siloxane unit (B), it can be produced using a silane compound represented by the formula (4).
Furthermore, the crosslinkable organopolysiloxane having other siloxane units can be produced using a silane compound having at least one silanol group or hydrolyzable group.
The polymerization reaction is usually carried out in an inert solvent, and the reaction can be carried out only by heating in the absence of a catalyst. If necessary, a reaction catalyst can be used.
The crosslinkable organopolysiloxane having a siloxane unit (A) and a method for producing the same are basically known, and are described, for example, in JP-A-9-59387 and JP-A-2008-280402. As the crosslinkable organopolysiloxane and the method for producing the same in the present invention, those described in the known literature can be used.

Equation (3) and in the formula (4), R ¹ to R ⁶ have the same meanings as R ¹ to R ⁶ of formula (1) and formula (2).
In the formula (3), X and Y are each independently a hydroxyl group or a hydrolyzable group (for example, a primary to tertiary amino group such as an amino group, a monoalkylamino group, a dialkylamino group; a halogen group; an alkoxy group. ; Etc.).

The alternating copolymer can be obtained by polymerizing two kinds of monomers having different reactivities. For example, X, which is a polymerization reactive group of the silane compound represented by the above formula (3) that becomes the siloxane unit (A), and a polymerization reactivity of the silane compound represented by the above formula (4) that becomes the siloxane unit (B). A substance having a mutual reactivity with Y as a group higher than the reactivity between X and the reactivity between Y is selected, and the above two silane compounds are reacted in substantially equimolar amounts. Thus, an alternating copolymer can be produced. By setting the reactivity between X and Y to be higher than both the reactivity between X and the reactivity between Y, an alternating copolymer with less random bond portions and block bond portions can be obtained.
When producing an alternating copolymer, it is preferable that either one of X and Y is a hydroxyl group, and the other is a primary to tertiary amino group such as an amino group, a monoalkylamino group, or a dialkylamino group. In particular, one is preferably a hydroxyl group and the other is a dialkylamino group, more preferably X is a hydroxyl group and Y is a dialkylamino group. The alkyl group in the monoalkylamino group or dialkylamino group is preferably an alkyl group having 4 or less carbon atoms, and particularly preferably a methyl group.
Alternating copolymers of organopolysiloxanes and their production methods are basically known. For example, Macromolecules 1998, 31, 8501 or Journal of Applied Polymer Science, Vol. 106, 1007, 2007). The polymer and its manufacturing method are described. As the alternating copolymer and the production method thereof in the present invention, those described in these known documents can be used.
As a specific production method, for example, an organic solvent solution of a silane compound represented by the above formula (3) (where X is a hydroxyl group) and a silane compound represented by the above formula (4) (Y is a dimethylamino group). A mixture of the two silane compounds in an equimolar amount and reacting with heating and stirring; dividing one organic solvent solution into the other organic solvent solution with heating and stirring; Alternatively, the alternating copolymer can be produced by a method of reacting while continuously adding;

The crosslinkable organopolysiloxane is cross-linked and cured through a predetermined cross-linking reaction to become a cross-linked product which is the silicone resin in the present invention.
Examples of the cross-linking method in the present invention include heat treatment and cross-linking by ultraviolet rays, and cross-linking by heat treatment is preferable.
In the case of heat treatment, any ^one of R ^{1 to} R ⁴ in the formula (1) included in the crosslinkable organopolysiloxane used in the present invention is an alkyl group having 4 or less carbon atoms (typically a methyl group ( For example, at a temperature of 300 ° C. or higher, some of the Si—Me bonds are cleaved, and the cleaved parts become new siloxane bonds (Si). -O-Si), i.e. cross-linking.
Hereinafter, forming a silicone resin as a crosslinked product by crosslinking and curing the crosslinkable organopolysiloxane is simply referred to as curing of the crosslinkable organopolysiloxane.

[Glass laminate and manufacturing method thereof]
As described above, the glass laminate 10 of the present invention is a laminate in which the support base 12, the glass substrate 16, and the silicone resin layer 14 exist therebetween.
The method for producing the glass laminate 10 of the present invention is not particularly limited, but in order to obtain a laminate having a peel strength (x) higher than the peel strength (y), a predetermined crosslinkable organopolysiloxane is formed on the surface of the support substrate 12. A method of forming the silicone resin layer 14 by curing siloxane is preferable. That is, a layer of a crosslinkable organopolysiloxane is formed on the surface of the support substrate 12, the crosslinkable organopolysiloxane is cured on the surface of the support substrate 12 to form the silicone resin layer 14, and then the silicone resin layer 14 This is a method of manufacturing the glass laminate 10 by laminating the glass substrate 16 on the silicone resin surface.
When the crosslinkable organopolysiloxane is cured on the surface of the support substrate 12, it is considered that the crosslinkable organopolysiloxane adheres due to the interaction with the surface of the support substrate 12 during the curing reaction, and the peel strength between the silicone resin and the surface of the support substrate 12 increases. . Therefore, even if the glass substrate 16 and the support base 12 are made of the same material, a difference can be provided in the peel strength between the silicone resin layer 14 and the both.
Hereinafter, a step of forming a silicone resin layer 14 by forming a layer of the crosslinkable organopolysiloxane on the surface of the support substrate 12 and curing the crosslinkable organopolysiloxane on the surface of the support substrate 12 is referred to as “resin layer forming step”. “The process of laminating the glass substrate 16 on the silicone resin surface of the silicone resin layer 14 to form the glass laminate 10 is referred to as“ lamination process ”, and the procedure of each process will be described in detail.

(Resin layer forming process)
In the resin layer forming step, a layer of a crosslinkable organopolysiloxane is formed on the surface of the support base 12, and the crosslinkable organopolysiloxane is cured on the surface of the support base 12 to form the silicone resin layer 14.
In order to form a crosslinkable organopolysiloxane layer on the support substrate 12, a coating composition in which the crosslinkable organopolysiloxane is dissolved in a solvent is used, and this composition is applied onto the support substrate 12. It is preferable to form a solution layer and then remove the solvent to form a crosslinkable organopolysiloxane layer. The thickness of the crosslinkable organopolysiloxane layer can be controlled by adjusting the concentration of the crosslinkable organopolysiloxane in the composition.
The solvent is not particularly limited as long as it can easily dissolve the crosslinkable organopolysiloxane in a working environment and can be easily volatilized and removed. Specifically, toluene, xylene, THF, chloroform etc. can be illustrated, for example.

  The method for applying the composition containing the crosslinkable organopolysiloxane on the surface of the support substrate 12 is not particularly limited, and a known method can be used. Examples thereof include spray coating, die coating, spin coating, dip coating, roll coating, bar coating, screen printing, and gravure coating.

Next, the crosslinkable organopolysiloxane on the support substrate 12 is cured to form the silicone resin layer 14. More specifically, as shown in FIG. 2A, in this step, a silicone resin layer 14 is formed on the surface of at least one side of the support base 12.
As described above, the curing method is preferably crosslinking by heat treatment. That is, it is preferable to manufacture the silicone resin layer 14 by thermosetting. Hereinafter, the aspect of thermosetting is explained in full detail.

  The temperature condition for thermosetting the crosslinkable organopolysiloxane is preferably 300 to 475 ° C, more preferably 350 to 450 ° C. The heating time is usually preferably 10 to 300 minutes and more preferably 20 to 120 minutes.

The crosslinkable organopolysiloxane is preferably cured by precuring (precuring) and then curing (main curing). By performing precure, the silicone resin layer 14 excellent in heat resistance can be obtained.
Precuring is preferably carried out following the removal of the solvent. In that case, there is no particular distinction between the step of removing the solvent from the layer to form a layer of the crosslinkable organopolysiloxane and the step of precuring.
The removal of the solvent is preferably performed by heating to 100 ° C. or higher, and precure can be continued by heating to 150 ° C. or higher.
The temperature at which the solvent is removed and precured and the heating time are preferably 100 to 420 ° C. and 5 to 60 minutes, and more preferably 150 to 300 ° C. and 10 to 30 minutes. When the temperature is 420 ° C. or lower, a silicone resin layer that can be easily peeled is easily obtained.

(Lamination process)
In the laminating step, the glass substrate 16 is laminated on the silicone resin surface of the silicone resin layer 14 obtained in the resin layer forming step, and the layer of the supporting base 12, the silicone resin layer 14, and the glass substrate 16 are laminated. This is a step of obtaining the glass laminate 10 provided in this order.
More specifically, as shown in FIG. 2 (B), a glass substrate having a surface 14a opposite to the support base 12 side of the silicone resin layer 14, and a first main surface 16a and a second main surface 16b. The silicone resin layer 14 and the glass substrate 16 are laminated by using the first principal surface 16a of 16 as a lamination surface, and the glass laminate 10 is obtained.

The method in particular of laminating | stacking the glass substrate 16 on the silicone resin layer 14 is not restrict | limited, A well-known method is employable.
For example, a method of stacking the glass substrate 16 on the surface of the silicone resin layer 14 under a normal pressure environment can be mentioned. If necessary, after the glass substrate 16 is overlaid on the surface of the silicone resin layer 14, the glass substrate 16 may be pressure-bonded to the silicone resin layer 14 using a roll or a press. Air bubbles mixed between the silicone resin layer 14 and the glass substrate 16 can be removed relatively easily by pressure bonding using a roll or a press, which is preferable.

  When pressure bonding is performed by a vacuum laminating method or a vacuum pressing method, it is more preferable because it suppresses mixing of bubbles and secures good adhesion. By press-bonding under vacuum, even if minute bubbles remain, there is an advantage that the bubbles do not grow by heating and are not likely to lead to a distortion defect of the glass substrate 16.

  When laminating the glass substrate 16, it is preferable that the surface of the glass substrate 16 in contact with the silicone resin layer 14 is sufficiently washed and laminated in an environment with a high degree of cleanliness. The higher the degree of cleanliness, the better the flatness of the glass substrate 16, which is preferable.

After laminating the glass substrate 16, a pre-annealing process (heating process) may be performed as necessary. By performing the pre-annealing treatment, the adhesion of the laminated glass substrate 16 to the silicone resin layer 14 can be improved, and an appropriate peel strength (y) can be obtained. Misalignment of members is less likely to occur, and the productivity of electronic devices is improved.
The conditions for the pre-annealing treatment are appropriately selected according to the type of the silicone resin layer 14 to be used, but the peel strength (y) between the glass substrate 16 and the silicone resin layer 14 is more appropriate. In view of the above, it is preferable to perform heat treatment at 300 ° C. or higher (preferably 300 to 400 ° C.) for 5 minutes or longer (preferably 5 to 30 minutes).

The formation of the silicone resin layer 14 with a difference between the peel strength with respect to the first main surface of the glass substrate 16 and the peel strength with respect to the first main surface of the support base 12 is not limited to the above method.
For example, in the case of using a support base material 12 having a higher adhesion to the silicone resin surface than the glass substrate 16, a crosslinkable organopolysiloxane is cured on some peelable surface to produce a silicone resin film, This film can be interposed between the glass substrate 16 and the support base 12 and laminated simultaneously.
Moreover, when the adhesiveness by hardening of crosslinkable organopolysiloxane is low enough with respect to the glass substrate 16, and the adhesiveness is high enough with respect to the support base material 12, it bridge | crosslinks between the glass substrate 16 and the support base material 12. The silicone resin layer 14 can be formed by curing the functional organopolysiloxane.
Furthermore, even when the support base 12 is made of the same glass material as that of the glass substrate 16, it is possible to increase the peel strength with respect to the silicone resin layer 14 by performing a process for improving the adhesion of the support base 12 surface. For example, a chemical method (primer treatment) that improves the fixing force chemically such as a silane coupling agent, a physical method that increases surface active groups such as a flame (flame) treatment, or a surface such as a sandblast treatment Examples of such a mechanical processing method increase the catch by increasing the roughness of the material.

(Glass laminate)
The glass laminate 10 of the present invention can be used for various applications, for example, manufacturing electronic parts such as a display device panel, PV, a thin film secondary battery, and a semiconductor wafer having a circuit formed on the surface, which will be described later. The use to do is mentioned. In this application, the glass laminate 10 is often exposed (for example, 1 hour or longer) under high temperature conditions (for example, 400 ° C. or higher).
Here, the display device panel includes LCD, OLED, electronic paper, plasma display panel, field emission panel, quantum dot LED panel, MEMS (Micro Electro Mechanical Systems) shutter panel, and the like.

[Glass substrate with member and method for producing the same]
In this invention, the glass substrate with a member (glass substrate with a member for electronic devices) containing a glass substrate and the member for electronic devices is manufactured using the laminated body mentioned above.
Although the manufacturing method of this glass substrate with a member is not specifically limited, From the point which is excellent in productivity of an electronic device, the member for electronic devices is formed on the glass substrate in the said glass laminated body, and the laminated body with an electronic device member is used. A method in which the manufactured and obtained laminate with a member for electronic devices is separated into a glass substrate with a member and a supporting substrate with a silicone resin layer by using the glass substrate side interface of the silicone resin layer as a release surface is preferable.
Hereinafter, the step of forming the electronic device member on the glass substrate in the glass laminate to produce the electronic device member laminated body is referred to as “member forming step”, from the electronic device member laminated body to the silicone resin layer. The process of separating the glass substrate with the member into the glass substrate with the member and the support base with the silicone resin layer using the glass substrate side interface as the release surface is referred to as “separation process”.
The materials and procedures used in each process are described in detail below.

(Member formation process)
A member formation process is a process of forming the member for electronic devices on the glass substrate 16 in the glass laminated body 10 obtained in the said lamination process. More specifically, as shown in FIG. 2C, the electronic device member 20 is formed on the second main surface 16b (exposed surface) of the glass substrate 16 to obtain the laminate 22 with the electronic device member. .
First, the electronic device member 20 used in this step will be described in detail, and the procedure of the subsequent steps will be described in detail.

(Electronic device components (functional elements))
The electronic device member 20 is a member that is formed on the glass substrate 16 in the glass laminate 10 and constitutes at least a part of the electronic device.
More specifically, as the electronic device member 20, a member used for an electronic component such as a display panel, a solar cell, a thin film secondary battery, or a semiconductor wafer having a circuit formed on the surface (for example, Display member, solar cell member, thin film secondary battery member, electronic component circuit).

For example, as a member for a solar cell, a silicon type includes a transparent electrode such as tin oxide of a positive electrode, a silicon layer represented by p layer / i layer / n layer, a metal of a negative electrode, and the like. And various members corresponding to the dye-sensitized type, the quantum dot type, and the like.
Further, as a member for a thin film secondary battery, in the lithium ion type, a transparent electrode such as a metal or a metal oxide of a positive electrode and a negative electrode, a lithium compound of an electrolyte layer, a metal of a current collecting layer, a resin as a sealing layer In addition, various members corresponding to nickel hydrogen type, polymer type, ceramic electrolyte type and the like can be mentioned.
In addition, as a circuit for an electronic component, in a CCD or CMOS, a metal of a conductive part, a silicon oxide or a silicon nitride of an insulating part, and the like, various sensors such as a pressure sensor and an acceleration sensor, a rigid printed board, a flexible printed board And various members corresponding to a rigid flexible printed circuit board.

(Process procedure)
The manufacturing method of the laminated body 22 with the member for electronic devices mentioned above is not specifically limited, According to the conventionally well-known method according to the kind of structural member of the member for electronic devices, the 2nd main of the glass substrate 16 of the glass laminated body 10 is used. The electronic device member 20 is formed on the surface 16b.
The electronic device member 20 is not all of the members finally formed on the second main surface 16b of the glass substrate 16 (hereinafter referred to as “all members”), but a part of all members (hereinafter referred to as “parts”). May be referred to as a member. The glass substrate with a partial member peeled from the silicone resin layer 14 can be used as a glass substrate with an all member (corresponding to an electronic device described later) in the subsequent steps.
Other electronic device members may be formed on the peeling surface (first main surface 16a) of the glass substrate with all members peeled from the silicone resin layer 14.
Moreover, the laminated body with all members can be assembled, and then the support substrate 18 with the silicone resin layer can be peeled from the laminated body with all members to manufacture an electronic device. Furthermore, the laminate with all members is assembled using two sheets, and then the two support bases 18 with the silicone resin layer are peeled from the laminate with all members to form a glass substrate with a member having two glass substrates. It can also be manufactured.

  For example, when an OLED is manufactured as an example, an organic EL is formed on the surface of the glass laminate 10 opposite to the silicone resin layer 14 side of the glass substrate 16 (corresponding to the second main surface 16b of the glass substrate 16). In order to form a structure, a transparent electrode is formed, and a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, etc. are deposited on the surface on which the transparent electrode is formed, a back electrode is formed, and sealing is performed. Various layers are formed and processed, such as sealing with a plate. Specific examples of the layer formation and processing include film formation processing, vapor deposition processing, sealing plate adhesion processing, and the like.

  Further, for example, when manufacturing a TFT-LCD, a resist film is used on the second main surface 16b of the glass substrate 16 of the glass laminate 10 by a general film forming method such as a CVD method or a sputtering method. A TFT forming step of forming a thin film transistor (TFT) by patterning the formed metal film, metal oxide film, etc., patterning a resist solution on the second main surface 16b of the glass substrate 16 of another glass laminate 10 Various processes such as a CF forming process for forming a color filter (CF) and a laminating process for laminating a laminated body with TFT obtained in the TFT forming process and a laminated body with CF obtained in the CF forming process. Process.

In the TFT formation process and the CF formation process, the TFT and the CF are formed on the second main surface 16b of the glass substrate 16 by using a well-known photolithography technique, etching technique, or the like. At this time, a resist solution is used as a coating solution for pattern formation.
In addition, before forming TFT and CF, you may wash | clean the 2nd main surface 16b of the glass substrate 16 as needed. As a cleaning method, known dry cleaning or wet cleaning can be used.

  In the laminating step, the thin film transistor forming surface of the laminated body with TFT and the color filter forming surface of the laminated body with CF are opposed to each other using a sealing agent (for example, an ultraviolet curable sealing agent for cell formation). Thereafter, a liquid crystal material is injected into a cell formed by the laminate with TFT and the laminate with CF. Examples of the method for injecting the liquid crystal material include a reduced pressure injection method and a drop injection method.

(Separation process)
As shown in FIG. 2 (D), the separation step is performed by using the electronic device member-attached laminate 22 obtained in the member formation step, with the interface between the silicone resin layer 14 and the glass substrate 16 as a release surface. The process which isolate | separates into the glass substrate 16 (glass substrate with a member) on which the member 20 for lamination | stacking laminated | stacked, and the support base material 18 with a silicone resin layer, and obtains the glass substrate 24 with a member containing the member 20 for electronic devices and the glass substrate 16 It is.
When the electronic device member 20 on the glass substrate 16 at the time of peeling is a part of the formation of all the necessary constituent members, the remaining constituent members can be formed on the glass substrate 16 after separation.

The method of peeling the glass substrate 16 and the support base material 18 with a silicone resin layer is not specifically limited. Specifically, for example, a sharp blade-like object is inserted into the interface between the glass substrate 16 and the silicone resin layer 14 to give a trigger for peeling, and then a mixed fluid of water and compressed air is sprayed. Can be peeled off.
Preferably, the electronic device member-attached laminate 22 is placed on the surface plate so that the support substrate 12 is on the upper side and the electronic device member 20 side is on the lower side, and the electronic device member 20 side is vacuumed on the surface plate. Adsorbed (sequentially performed when the supporting base material is laminated on both surfaces). In this state, the blade is first allowed to enter the interface between the glass substrate 16 and the silicone resin layer 14. Then, the support substrate 12 side is sucked by a plurality of vacuum suction pads, and the vacuum suction pads are raised in order from the vicinity of the place where the blade is inserted. As a result, an air layer is formed on the interface between the silicone resin layer 14 and the glass substrate 16 and on the cohesive failure surface of the silicone resin layer 14, and the air layer spreads over the entire interface and cohesive failure surface, so that the supporting substrate 12 can be easily peeled off. can do.
Moreover, the support base material 12 can be laminated | stacked with a new glass substrate, and the glass laminated body 10 of this invention can be manufactured.

  When separating the glass substrate 24 with a member from the glass laminate 10, it is more likely that the fragments of the silicone resin layer 14 are electrostatically adsorbed to the glass substrate 24 with a member by controlling the spraying and humidity with an ionizer. Can be suppressed.

  The manufacturing method of the glass substrate 24 with a member mentioned above is suitable for manufacture of the small display apparatus used for mobile terminals, such as a smart phone and a tablet-type PC. The display device is mainly an LCD or an OLED, and the LCD includes a TN type, STN type, FE type, TFT type, MIM type, IPS type, VA type, and the like. Basically, the present invention can be applied to both passive drive type and active drive type display devices.

  As the glass substrate 24 with a member manufactured by the above method, a display device panel having a glass substrate and a display device member, a solar cell having a glass substrate and a solar cell member, a glass substrate and a thin film secondary battery. Examples thereof include a thin film secondary battery having a member, an electronic component having a glass substrate and an electronic device member. Examples of the display device panel include a liquid crystal panel, an organic EL panel, a plasma display panel, a field emission panel, and the like.

  EXAMPLES The present invention will be specifically described below with reference to examples and the like, but the present invention is not limited to these examples.

Below, a glass plate (length 274 mm, width 274 mm, plate thickness 0.2 mm, coefficient of linear expansion 38 × 10 ⁻⁷ / ° C., trade name “AN100” manufactured by Asahi Glass Co., Ltd.) made of non-alkali borosilicate glass is used as the glass substrate. used.
Further, as a supporting base material, a glass plate made of non-alkali borosilicate glass (length 274 mm, width 274 mm, plate thickness 0.4 mm, linear expansion coefficient 38 × 10 ⁻⁷ / ° C., trade name “AN100” manufactured by Asahi Glass Co., Ltd.) )It was used.

<Production Example 1: Production of crosslinkable organopolysiloxane (Sx1)>
In a nitrogen atmosphere, 1,4-bis (hydroxydimethylsilyl) benzene (41.6 parts by mass, manufactured by Gelest Co.) as a compound constituting the siloxane unit (A) and bis ( Dimethylamino) diphenylsilane (54 parts by mass, manufactured by Gerest) was added to dehydrated toluene (160 parts by mass, manufactured by Kanto Chemical Co., Inc.). After the reaction solution was stirred at 85 ° C. for 1 hour, the reaction solution was further heated to 110 ° C. and stirred for 1 hour. After completion of the stirring, the reaction solution was naturally cooled to room temperature, and the reaction solution was added into methanol (1500 parts by mass) for reprecipitation treatment. Next, the precipitate was collected and vacuum-dried to obtain a colorless and transparent liquid crosslinkable organopolysiloxane (Sx1).

The obtained crosslinkable organopolysiloxane (Sx1) had a number average molecular weight (polystyrene conversion) of 5.0 × 10 ³ measured using a GPC (gel permeation chromatography) apparatus (manufactured by Tosoh Corporation). .

Furthermore, the structure of the crosslinkable organopolysiloxane (Sx1) was identified by ¹ H NMR measurement, ²⁹ Si NMR measurement, and ¹³ C NMR measurement. ^For assignment of spectra in ¹ H NMR measurement and ²⁹ Si NMR measurement, Journal of Applied Polymer Science, 2007, 106, 1007-1013 was referred.
¹ H NMR, ²⁹ Si NMR, and ¹³ C NMR measuring apparatus: ECA600 manufactured by JEOL RESONANCE
¹ H NMR measurement method: CDCL ₃ was added to a sample to prepare a sample concentration of 10% by mass. Tetramethylsilane was used as a standard.
²⁹ Si NMR measurement method: CDCL ₃ was added to a sample to prepare a sample concentration of 30% by mass. Moreover, acetylacetone chromium salt was added as a relaxation reagent, and it prepared so that it might become 0.1 mass% with respect to a sample. Tetramethylsilane was used as a standard.
¹³ C NMR measurement: CDCL ₃ was added to the sample, and the sample concentration was adjusted to 10% by mass. Tetramethylsilane was used as a standard.
The composition of the copolymer is determined from ¹ H NMR measurement. Each assignment was determined for the spectrum obtained from ¹ H NMR measurement by the method described in Journal of Applied Polymer Science, 2007, 106, 1007-1013.
²⁹ Si NMR and ¹³ C NMR give information about the bonds.
Each assignment was determined for the spectrum obtained from ²⁹ Si NMR measurement by the method described in Journal of Applied Polymer Science, 2007, 106, 1007-1013.
As a result of the measurement, it was confirmed that the copolymer was an alternating copolymer in which the siloxane unit (A) and the siloxane unit (B) were alternately arranged. Moreover, it was confirmed that the bond between the siloxane unit (A) and the siloxane unit (B) is 90 mol% in the crosslinkable organopolysiloxane (Sx1).
Moreover, the ratio with respect to all the siloxane units in crosslinkable organopolysiloxane (Sx1) was 50 mol% of siloxane units (A), and 50 mol% of siloxane units (B).

<Production Example 2: Production of crosslinkable organopolysiloxane (Sx2)>
In a nitrogen atmosphere, 1,4-bis (hydroxydimethylsilyl) benzene (41.6 parts by mass, manufactured by Gelest Co.) as a compound constituting the siloxane unit (A) and bis ( Dimethylamino) methylphenylsilane (41.6 parts by mass, manufactured by Gerest) was added to dehydrated toluene (183 parts by mass, manufactured by Kanto Chemical Co., Inc.). After the reaction solution was stirred at 85 ° C. for 1 hour, the reaction solution was further heated to 110 ° C. and stirred for 1 hour. After completion of the stirring, the reaction solution was naturally cooled to room temperature, and the reaction solution was added into methanol (1700 parts by mass) for reprecipitation treatment. Next, the precipitate was collected and vacuum-dried to obtain a colorless and transparent liquid crosslinkable organopolysiloxane (Sx2).
The resulting crosslinkable organopolysiloxane (Sx2) had a number average molecular weight (polystyrene conversion) of 1.0 × 10 ⁴ measured using a GPC (gel permeation chromatography) apparatus (manufactured by Tosoh Corporation). .
Furthermore, when the structure of the crosslinkable organopolysiloxane (Sx2) was identified in the same manner as in Production Example 1, it was an alternating copolymer in which siloxane units (A) and siloxane units (B) were alternately arranged. Was confirmed. Further, it was confirmed that the bond between the siloxane unit (A) and the siloxane unit (B) was 90 mol% in the crosslinkable organopolysiloxane (Sx2).
And the ratio with respect to all the siloxane units in crosslinkable organopolysiloxane (Sx2) was 50 mol% of siloxane units (A), and 50 mol% of siloxane units (B).

<Example 1>
(Manufacture of support substrate with silicone resin layer)
First, the obtained crosslinkable organopolysiloxane (Sx1) (30 parts by mass) was dissolved in xylene (70 parts by mass) to prepare a liquid material containing the crosslinkable organopolysiloxane (Sx1).
Next, the supporting substrate was cleaned with pure water, and further cleaned by UV cleaning.
Next, a liquid material containing a crosslinkable organopolysiloxane (Sx1) was applied onto the first main surface of the support substrate with a spin coater (coating amount 120 g / m ² ).
Next, it was heat-cured in the atmosphere at 350 ° C. for 60 minutes to form a silicone resin layer having a thickness of 10 μm on the first main surface of the supporting substrate to obtain a supporting substrate with a silicone resin layer. In addition, in the obtained support base material with a silicone resin layer, the crack was not confirmed by the silicone resin layer.

(Production of glass laminate S1)
Next, the peelable surface of the silicone resin layer of the support substrate with the silicone resin layer is opposed to the first main surface of the glass substrate, and the centers of gravity of both substrates overlap at room temperature and atmospheric pressure in the laminating apparatus. Thus, both substrates were overlapped to obtain a glass laminate S1.
The obtained glass laminate S1 corresponds to the glass laminate 10 shown in FIG. 1 described above. In the glass laminate S1, the peel strength (x) at the interface between the support substrate layer and the silicone resin layer is silicone. It was higher than the peel strength (y) at the interface between the resin layer and the glass substrate.
Next, the following evaluation was performed using the obtained glass laminate S1.

(Heat resistance evaluation)
A 50 mm square sample was cut out from the glass laminate S1, and this sample was placed in a hot air oven heated to 450 ° C. (in a nitrogen atmosphere), left for 60 minutes, and then taken out. Since foaming or coloring was not confirmed in the silicone resin layer in the sample taken out, it can be evaluated that decomposition of the silicone resin layer was suppressed.

(Peelability evaluation)
A 50 mm square sample was cut out from the glass laminate S1, and this sample was placed in a hot air oven heated to 450 ° C. (in a nitrogen atmosphere), left for 60 minutes, and then taken out. Next, after the second main surface of the glass substrate of the glass laminate S1 is vacuum-adsorbed on a surface plate, the thickness 0. A 1 mm stainless steel cutting tool was inserted, and a trigger for peeling was given between the first main surface of the glass substrate and the peelable surface of the silicone resin layer. And after adsorbing the 2nd main surface of the support base material of glass laminated body S1 with a several vacuum suction pad by 90 mm pitch, it raises in order from the suction pad near the said corner part, and is made into the 1st main surface of a glass substrate. The surface and the peelable surface of the silicone resin layer were peeled off.
From the above results, it was confirmed that the glass substrate can be peeled (interfacial peeling) even after the high-temperature heat treatment.
In addition, the main part of the silicone resin layer is separated from the glass substrate together with the support base material, and from the result, the peel strength (x) at the interface between the support base material layer and the resin layer is determined at the interface between the silicone resin layer and the glass substrate. It was confirmed that it was higher than the peel strength (y).

<Example 2>
Except for using the crosslinkable organopolysiloxane (Sx1) in place of the crosslinkable organopolysiloxane (Sx1), following the same procedure as in Example 1, after obtaining the support substrate with the silicone resin layer, the same procedure was performed. Thus, a glass laminate S2 was obtained.
In addition, in the obtained support base material with a silicone resin layer, the crack was not confirmed in the silicone resin layer.
In the obtained glass laminate S2, the peel strength (x) at the interface between the support base layer and the silicone resin layer was higher than the peel strength (y) at the interface between the silicone resin layer and the glass substrate.

(Heat resistance evaluation)
Using the obtained glass laminate S2, the heat resistance was evaluated in the same manner as in Example 1. As a result, since foaming or coloring was not confirmed in the silicone resin layer in the sample taken out, it can be evaluated that decomposition of the silicone resin layer was suppressed.

(Peelability evaluation)
Using the obtained glass laminate S2, peelability evaluation was carried out in the same manner as in Example 1. As a result, it was confirmed that the glass substrate can be peeled (interfacial peeling) even after the high-temperature heat treatment.
In addition, the main part of the silicone resin layer is separated from the glass substrate together with the support base material, and from the result, the peel strength (x) at the interface between the support base material layer and the resin layer is determined at the interface between the silicone resin layer and the glass substrate. It was confirmed that it was higher than the peel strength (y).

<Comparative Example 1>
Instead of a liquid material containing a crosslinkable organopolysiloxane (Sx1), a solvent-free addition reaction type release paper silicone (trade name KNS-320A, manufactured by Shin-Etsu Silicone Co., Ltd.) 100 having no structure represented by the formula (1) 100 A glass laminate C1 was obtained according to the same procedure as in Example 1 except that a mixture of parts by mass and 2 parts by mass of a platinum-based catalyst (trade name CAT-PL-56 manufactured by Shin-Etsu Silicone Co., Ltd.) was used.
The aspect of the glass laminate C1 corresponds to the aspect described in Patent Document 1.

(Heat resistance evaluation)
Using the obtained glass laminate C1, heat resistance evaluation was performed in the same manner as in Example 1. As a result, foaming and coloring were confirmed in the silicone resin layer in the sample taken out. For this reason, it is considered that the silicone resin layer was decomposed.

(Peelability evaluation)
Using the obtained glass laminate C1, peelability evaluation was carried out in the same manner as in Example 1. As a result, the silicone resin layer was foamed, and a part of the silicone resin layer was peeled off in the state of cohesive failure adhered to the first main surface of the glass substrate.

<Example 3>
In this example, an OLED is manufactured using the glass laminate S1 obtained in Example 1.
First, silicon nitride, silicon oxide, and amorphous silicon are formed in this order on the second main surface of the glass substrate in the glass laminate S1 by plasma CVD. Next, low concentration boron is injected into the amorphous silicon layer by an ion doping apparatus, and a dehydrogenation process is performed by heating at 450 ° C. for 60 minutes in a nitrogen atmosphere. Next, the amorphous silicon layer is crystallized by a laser annealing apparatus. Next, low concentration phosphorus is implanted into the amorphous silicon layer by an etching and ion doping apparatus using a photolithography method, thereby forming N-type and P-type TFT areas. Next, a silicon oxide film is formed on the second main surface side of the glass substrate by a plasma CVD method to form a gate insulating film, then molybdenum is formed by a sputtering method, and etching is performed using a photolithography method. A gate electrode is formed. Next, high concentration boron and phosphorus are implanted into desired areas of the N-type and P-type by photolithography and an ion doping apparatus, thereby forming a source area and a drain area. Next, an interlayer insulating film is formed on the second main surface side of the glass substrate by silicon oxide film formation by plasma CVD, and a TFT electrode is formed by aluminum film formation by sputtering and etching using photolithography. Next, after heat treatment is performed at 450 ° C. for 60 minutes in a hydrogen atmosphere, a passivation layer is formed by film formation of nitrogen silicon by a plasma CVD method. Next, an ultraviolet curable resin is applied to the second main surface side of the glass substrate, and a planarization layer and a contact hole are formed by photolithography. Next, a film of indium tin oxide is formed by a sputtering method, and a pixel electrode is formed by etching using a photolithography method.
Subsequently, by vapor deposition, 4,4 ′, 4 ″ -tris (3-methylphenylphenylamino) triphenylamine as the hole injection layer and bis [ (N-naphthyl) -N-phenyl] benzidine, 8-quinolinol aluminum complex (Alq ₃ ) as a light emitting layer, 2,6-bis [4- [N- (4-methoxyphenyl) -N-phenyl] aminostyryl] A mixture of 40% by volume of naphthalene-1,5-dicarbonitrile (BSN-BCN) and Alq ₃ as an electron transport layer are formed in this order, and then aluminum is formed by sputtering, followed by photolithography. Next, another glass substrate is pasted on the second main surface side of the glass substrate through an ultraviolet curable adhesive layer. According to the above procedure, an organic EL structure is formed on a glass substrate, and a glass laminate S1 having an organic EL structure on the glass substrate (hereinafter referred to as panel S1) is an electron in the present invention. It is a laminated body with a member for devices (panel for display devices with a supporting substrate).
Subsequently, after the panel S1 sealing body side is vacuum-adsorbed to the surface plate, a stainless steel knife having a thickness of 0.1 mm is inserted into the interface between the glass substrate and the silicone resin layer at the corner portion of the panel S1, and glass Provides a trigger for peeling at the interface between the substrate and the silicone resin layer. And after adsorb | sucking the support base material surface of panel S1 with a vacuum suction pad, a suction pad is raised. Here, the blade is inserted while spraying a static eliminating fluid on the interface from an ionizer (manufactured by Keyence Corporation). Next, the vacuum suction pad is pulled up while the static elimination fluid is continuously sprayed from the ionizer toward the formed gap. As a result, only the glass substrate on which the organic EL structure is formed on the surface plate is left, and the supporting base material with the silicone resin layer can be peeled off.
Subsequently, the separation surface of the glass substrate separated by the same method as in Example 1 was cleaned, the separated glass substrate was cut using a laser cutter or a scribe-break method, and divided into a plurality of cells. The glass substrate on which the EL structure is formed and the counter substrate are assembled, and a module forming process is performed to manufacture an OLED. The OLED obtained in this way does not have a problem in characteristics.

<Example 4>
In this example, an LCD is manufactured using the glass laminate S1 obtained in Example 1.
First, two glass laminates S1 are prepared, and silicon nitride is formed on the second main surface of the glass substrate in one glass laminate S1 (hereinafter also referred to as “glass laminate S1-1”) by plasma CVD. Then, silicon oxide and amorphous silicon are deposited in this order. Next, low concentration boron is injected into the amorphous silicon layer by an ion doping apparatus, and a dehydrogenation process is performed by heating at 450 ° C. for 60 minutes in a nitrogen atmosphere. Next, the amorphous silicon layer is crystallized by a laser annealing apparatus. Next, low concentration phosphorus is implanted into the amorphous silicon layer by an etching and ion doping apparatus using a photolithography method, thereby forming N-type and P-type TFT areas. Next, after a silicon oxide film is formed on the second main surface side of the glass substrate by a plasma CVD method and a gate insulating film is formed, molybdenum is formed by a sputtering method, and the gate is etched by photolithography. An electrode is formed. Next, high concentration boron and phosphorus are implanted into desired areas of the N-type and P-type by photolithography and an ion doping apparatus, thereby forming a source area and a drain area. Next, an interlayer insulating film is formed on the second main surface side of the glass substrate by silicon oxide film formation by plasma CVD, and a TFT electrode is formed by aluminum film formation by sputtering and etching using photolithography. Next, after heat treatment is performed at 450 ° C. for 60 minutes in a hydrogen atmosphere, a passivation layer is formed by film formation of nitrogen silicon by a plasma CVD method. Next, an ultraviolet curable resin is applied to the second main surface side of the glass substrate, and a planarization layer and a contact hole are formed by photolithography. Next, a film of indium tin oxide is formed by a sputtering method, and a pixel electrode is formed by etching using a photolithography method.
Next, the other glass laminate S1 (hereinafter also referred to as “glass laminate S1-2”) is heat-treated at 450 ° C. for 60 minutes in an air atmosphere. Next, a chromium film is formed on the second main surface of the glass substrate in the glass laminate S1 by a sputtering method, and a light shielding layer is formed by etching using a photolithography method. Next, a color resist is applied to the second main surface side of the glass substrate by a die coating method, and a color filter layer is formed by a photolithography method and heat curing. Next, a film of indium tin oxide is formed by a sputtering method to form a counter electrode. Next, an ultraviolet curable resin liquid is applied to the second main surface side of the glass substrate by a die coating method, and columnar spacers are formed by a photolithography method and thermal curing. Next, a polyimide resin solution is applied by a roll coating method, an alignment layer is formed by thermosetting, and rubbing is performed.
Next, the sealing resin liquid is drawn in a frame shape by the dispenser method, and after dropping the liquid crystal in the frame by the dispenser method, two glass sheets S1-1 on which the pixel electrodes are formed are used. The second main surface sides of the glass substrates of the glass laminate S1 are bonded together, and an LCD panel is obtained by ultraviolet curing and thermal curing.

  Subsequently, the second main surface of the glass laminate S1-1 is vacuum-adsorbed on a surface plate, and stainless steel having a thickness of 0.1 mm is formed at the interface between the glass substrate and the silicone resin layer at the corner of the glass laminate S1-2. A blade is inserted to provide a trigger for peeling between the first main surface of the glass substrate and the peelable surface of the silicone resin layer. Here, the blade is inserted while spraying a static eliminating fluid on the interface from an ionizer (manufactured by Keyence Corporation). Next, the vacuum suction pad is pulled up while the static elimination fluid is continuously sprayed from the ionizer toward the formed gap. And after adsorb | sucking the 2nd main surface of the support base material of glass laminated body S1-2 with a vacuum suction pad, a suction pad is raised. As a result, it is possible to leave only the empty cell of the LCD with the supporting substrate of the glass laminate S1-1 on the surface plate, and to peel the supporting substrate with the silicone resin layer.

  Next, the second main surface of the glass substrate on which the color filter is formed on the first main surface is vacuum-adsorbed on the surface plate, and at the interface between the glass substrate and the silicone resin layer at the corner of the glass laminate S1-1, A stainless steel knife having a thickness of 0.1 mm is inserted to give an opportunity for peeling between the first main surface of the glass substrate and the peelable surface of the silicone resin layer. And after adsorb | sucking the 2nd main surface of the support base material of glass laminated body S1-1 with a vacuum suction pad, a suction pad is raised. As a result, only the LCD cell is left on the surface plate, and the supporting substrate to which the silicone resin layer is fixed can be peeled off. Thus, a plurality of LCD cells composed of a glass substrate having a thickness of 0.1 mm are obtained.

  Subsequently, it is divided into a plurality of LCD cells by a cutting step. A step of attaching a polarizing plate to each completed LCD cell is performed, and then a module forming step is performed to obtain an LCD. The LCD obtained in this way does not have a problem in characteristics.

<Example 5>
In this example, an OLED is manufactured using the glass laminate S1 obtained in Example 1.
First, a film of molybdenum is formed on the second main surface of the glass substrate in the glass laminate S1 by a sputtering method, and a gate electrode is formed by etching using a photolithography method. Next, a silicon nitride film is further formed on the second main surface side of the glass substrate by a plasma CVD method to form a gate insulating film, and then an indium gallium zinc oxide film is formed by a sputtering method to perform a photolithography method. An oxide semiconductor layer is formed by the etching used. Next, a silicon nitride film is further formed on the second main surface side of the glass substrate by plasma CVD to form a channel protective layer, and then molybdenum is formed by sputtering and etching using a photolithography method is performed. Thus, a source electrode and a drain electrode are formed. Next, heat treatment is performed in the atmosphere at 450 ° C. for 60 minutes. Next, a silicon nitride film is further formed on the second main surface side of the glass substrate by a plasma CVD method to form a passivation layer, followed by an indium tin oxide film formed by a sputtering method and etching using a photolithography method. Thus, a pixel electrode is formed.
Subsequently, by vapor deposition, 4,4 ′, 4 ″ -tris (3-methylphenylphenylamino) triphenylamine as the hole injection layer and bis [ (N-naphthyl) -N-phenyl] benzidine, 8-quinolinol aluminum complex (Alq ₃ ) as a light emitting layer, 2,6-bis [4- [N- (4-methoxyphenyl) -N-phenyl] aminostyryl] A mixture of 40% by volume of naphthalene-1,5-dicarbonitrile (BSN-BCN) and Alq ₃ as an electron transport layer are formed in this order, and then aluminum is formed by sputtering, followed by photolithography. Next, another glass substrate is pasted on the second main surface side of the glass substrate through an ultraviolet curable adhesive layer. According to the above procedure, an organic EL structure is formed on a glass substrate, and a glass laminate S1 having an organic EL structure on the glass substrate (hereinafter referred to as panel S1) is an electron in the present invention. It is a laminated body with a member for devices (panel for display devices with a supporting substrate).
Subsequently, after the panel S1 sealing body side is vacuum-adsorbed to the surface plate, a stainless steel knife having a thickness of 0.1 mm is inserted into the interface between the glass substrate and the silicone resin layer at the corner portion of the panel S1, and glass Provides a trigger for peeling at the interface between the substrate and the silicone resin layer. And after adsorb | sucking the support base material surface of panel S1 with a vacuum suction pad, a suction pad is raised. Here, the blade is inserted while spraying a static eliminating fluid on the interface from an ionizer (manufactured by Keyence Corporation). Next, the vacuum suction pad is pulled up while the static elimination fluid is continuously sprayed from the ionizer toward the formed gap. As a result, only the glass substrate on which the organic EL structure is formed on the surface plate is left, and the supporting base material with the silicone resin layer can be peeled off.
Subsequently, the separation surface of the glass substrate separated by the same method as in Example 1 was cleaned, the separated glass substrate was cut using a laser cutter or a scribe-break method, and divided into a plurality of cells. The glass substrate on which the EL structure is formed and the counter substrate are assembled, and a module forming process is performed to manufacture an OLED. The OLED obtained in this way does not have a problem in characteristics.

  As shown in Examples 1 and 2, in the laminate of the present invention, since the crosslinkable organopolysiloxane has substantially no alkenyl group and alkynyl group, generation of outgas is suppressed even when subjected to high heat treatment. And peelability is good.

DESCRIPTION OF SYMBOLS 10 Glass laminated body 12 Support base material 14 Silicone resin layer 14a 1st main surface of a silicone resin layer 16 Glass substrate 16a 1st main surface of a glass substrate 16b 2nd main surface of a glass substrate 18 Support base material with a silicone resin layer 20 Electron Device member 22 Laminated body with electronic device member 24 Glass substrate with member

Claims (5)

The support substrate layer, the silicone resin layer, and the glass substrate layer are provided in this order, and the peel strength at the interface between the support substrate layer and the silicone resin layer is the glass substrate layer and the silicone resin layer. It is a glass laminate that is higher than the peel strength of the interface,
The silicone resin of the silicone resin layer is a crosslinked product of a crosslinkable organopolysiloxane,
The glass laminated body in which the said crosslinkable organopolysiloxane contains the siloxane unit (A) represented by Formula (1), and does not have an alkenyl group and an alkynyl group substantially.

(In the formula (1), R ¹ to R ⁴ each independently represents an alkyl group or a phenyl group having 4 or less carbon atoms. However, any one of R ¹ to R ⁴ is 4 or less carbon atoms Represents an alkyl group, and Ar represents a divalent aromatic hydrocarbon group which may have a substituent. The glass laminate according to claim 1, wherein R ^{1 to} R ⁴ in the siloxane unit (A) are each independently an alkyl group having 4 or less carbon atoms. The glass laminated body of Claim 1 or 2 in which the said crosslinkable organopolysiloxane further contains the siloxane unit (B) represented by Formula (2).

(In Formula (2), R ⁵ and R ⁶ each independently represents an alkyl group having 4 or less carbon atoms or a phenyl group.)   In the crosslinkable organopolysiloxane, the ratio of the siloxane unit (A) to the total of the siloxane unit (A) and the siloxane unit (B) is 30 to 90 mol%, and the siloxane unit ( The glass laminated body of Claim 3 whose ratio of the sum total of A) and the said siloxane unit (B) is 80-100 mol%. The siloxane unit (B) is a siloxane unit (B-1) in which R ⁵ and R ⁶ are phenyl groups, or one of R ⁵ and R ⁶ is an alkyl group having 4 or less carbon atoms and the other is phenyl The glass laminated body of Claim 3 or 4 which is a siloxane unit (B-2) which is group.

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