JP2011253833A - Method of manufacturing semiconductor member and adhesive tape - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor member excellent in detachability, transferability, and pickup property.SOLUTION: The method of manufacturing a semiconductor member includes a dividing step in which a semiconductor member is applied with an adhesive resin and is temporarily fixed to a fixing jig, and then the semiconductor member is divided, a laminating step in which an individual semiconductor member is laminated to an adhesive tape, a transfer step in which the adhesive resin is detached from the individual semiconductor member and the semiconductor member is transferred to the adhesive tape, and a pickup step in which the individual semiconductor member on the adhesive tape is picked up. In the transfer step, the adhesive resin is submerged in a liquid within a temperature range between an adhesive force dropping temperature X of the adhesive resin and thermal contraction temperature Y of the adhesive tape.

Description

The present invention relates to a method for producing a semiconductor member and an adhesive tape used in these methods.

Electronic devices such as IC (Integrated Circuit) cards, mobile phones, and PDAs (Personal Digital Assistants) are mounted with chip-shaped electronic components on which circuit patterns are formed.

The semiconductor member is formed by individually dividing a semiconductor member in which a plurality of circuit patterns are formed on a semiconductor wafer such as silicon or gallium-arsenide, an insulating substrate, or the like (Patent Document 1). As a result, electronic components are becoming thinner.

JP 2003-257893 A

However, when the thinned semiconductor component is singulated with a diamond blade, the semiconductor component may be cracked.

In the present invention, an adhesive resin is applied to a semiconductor member and temporarily fixed to a fixing jig, and then an individualization step for separating the semiconductor member into individual pieces, and an adhesive tape is bonded to the separated semiconductor member. A transfer step of separating the adhesive resin and the fixing jig from the separated semiconductor member and transferring the semiconductor member to the adhesive tape; and a pickup step of picking up the separated semiconductor member on the adhesive tape And the transfer step is a semiconductor member manufacturing method in which the transfer step is immersed in a liquid in a temperature range between the adhesive force lowering temperature X of the adhesive resin and the heat shrinkage temperature Y of the adhesive tape.

In this invention, the temperature of the liquid used in the transfer process is preferably 40 ° C. or more and 100 ° C. or less, and the transfer process is arranged from the top as an adhesive tape, a semiconductor member, an adhesive resin, and a fixing jig, The step of immersing in the liquid in this arrangement is preferable. The transfer process is further an arrangement of an adhesive tape, a semiconductor member, an adhesive resin, and a fixing jig from above, and is immersed in a liquid with this arrangement, and the fixing jig is freely dropped together with the adhesive resin. Is preferred. The base film of the pressure-sensitive adhesive tape is preferably a propylene copolymer. The pressure-sensitive adhesive layer of the pressure-sensitive adhesive tape is composed of 100 parts by weight of a (meth) acrylic acid ester copolymer, 0.5 parts by weight to 20 parts by weight of a polyfunctional isocyanate-based curing agent, and 20 parts by weight of a urethane acrylate oligomer having 4 or more vinyl groups. It is preferable to contain 0.1 part by mass or more and 10 parts by mass or less of silicone-modified acrylic resin.

ADVANTAGE OF THE INVENTION According to this invention, the semiconductor member manufacturing method excellent in peelability, transferability, and pick-up property can be provided.

Hereinafter, an embodiment of a semiconductor member manufacturing method according to the present invention and an embodiment of an adhesive tape used in this method will be described in detail.

In the present invention, an adhesive resin is applied to a semiconductor member and temporarily fixed to a fixing jig, and then an individualization step for separating the semiconductor member into individual pieces, and an adhesive tape is bonded to the separated semiconductor member. A transfer step of separating the adhesive resin and the fixing jig from the separated semiconductor member and transferring the semiconductor member to the adhesive tape; and a pickup step of picking up the separated semiconductor member on the adhesive tape And the transfer step is immersed in a liquid in a temperature range between the adhesive strength lowering temperature X of the adhesive resin and the adhesive strength lowering temperature Y of the adhesive employed in the adhesive tape.

(Individualization process)
Semiconductor members used in the singulation process of applying an adhesive resin to a semiconductor member and temporarily fixing it to a fixing jig and then dividing the semiconductor member into pieces include a disk-shaped silicon wafer, glass, and gallium arsenide. . Adhesive resins include acrylic resins and epoxy resins. Fixing jigs include glass and ceramic. As a method of dividing the semiconductor member into pieces, there are cutting and etching with a diamond cutter.

(Bonding process)
For example, the bonding step of bonding the adhesive tape to the separated semiconductor member is not laminated with the adhesive resin of the semiconductor member that has been separated into individual pieces but maintained in a disc shape as a whole. This is a process of sticking an adhesive tape to the surface, and the method of bonding includes, for example, roll pressure bonding and vacuum pressure bonding.

(Transfer process)
Specifically, the transfer process of separating the adhesive resin and the fixing jig from the separated semiconductor member and transferring the semiconductor member to the adhesive tape is performed by peeling the adhesive resin and the fixing jig from the semiconductor member. Means that the semiconductor member is transferred to the adhesive tape. As a peeling method, the transfer step can be achieved by immersing the transfer step in a liquid in a temperature range between the adhesive force lowering temperature X of the adhesive resin and the thermal shrinkage temperature Y of the adhesive tape.
The adhesive resin lowering temperature X of the adhesive resin and the heat shrink temperature Y of the pressure-sensitive adhesive tape need to satisfy the relationship X <Y, and the liquid temperature T needs to satisfy the relationship X <T <Y. . Adhesive strength drop temperature varies depending on the adhesive resin and the synthetic resin used as the base film of the adhesive tape. If the lower limit of the set temperature T of the liquid is low, the adhesive strength of the adhesive resin is less likely to decrease. Yes, if the upper limit of the set value is high, the adhesive tape tends to shrink. Specifically, the set temperature of the liquid is 40 ° C., preferably 75 ° C. as the lower limit, and 120 ° C., preferably 95 ° C. as the upper limit. The liquid includes water and oil, but water is preferable in view of the influence on the semiconductor member.

In the transfer step, it is preferable that the adhesive tape, the semiconductor member, the adhesive resin, and the fixing jig are arranged from above to be immersed in the liquid. By dipping in this arrangement, the adhesive resin can be peeled off due to its own weight with the fixing jig and a decrease in the adhesive strength of the adhesive resin. By adopting peeling by this arrangement, because it is free fall due to its own weight, the load when peeling the fixing jig with adhesive resin is suppressed, and individual pieces when transferring individual semiconductor members to adhesive tape It is possible to prevent cracking and chipping of individual semiconductor members when immersed in a liquid without changing the interval between the formed semiconductor members, and to promote the penetration of the liquid into the adhesive resin. Transfer time could be shortened. Depending on the adhesive strength of the adhesive resin, there are two types of peeling interfaces in the transfer process between the semiconductor member and the adhesive resin, or between the adhesive resin and the fixing jig. In the latter case, the peeling tape is bonded to the adhesive resin, and the peeling tape is peeled off from the separated semiconductor member together with the adhesive resin.

(Adhesive tape)
The pressure-sensitive adhesive tape is composed of a base material and a pressure-sensitive adhesive layer, and a pressure-sensitive adhesive having a pressure-sensitive adhesive force lowering temperature higher than that of the adhesive resin is laminated.

(Adhesive tape substrate)
The base material of the adhesive tape is preferably a material that does not undergo deformation such as expansion and contraction even when immersed, and is preferably a synthetic resin or metal. Shapes include films, sheets, and foils.
The thickness of the substrate is preferably 50 μm or more and 250 μm or less. A more preferable lower limit is 70 μm, and a more preferable upper limit is 150 μm or less. When the thickness of the substrate is reduced, the substrate tends to be cut during expansion in the pickup process, and when the thickness of the substrate is increased, the expandability tends to be inferior.

Synthetic resins include PVC (polyvinyl chloride), polyethylene, PET (polyethylene terephthalate), EVA (ethylene-vinyl acetate copolymer), ethylene-ethyl acrylate copolymer, polypropylene, propylene-based copolymer, ethylene-acrylic. There are acid copolymers, ionomer resins, and polyimides. Among these, PET and propylene copolymers are preferable, and propylene copolymers are more preferable. Examples of the metal include stainless steel, copper, and aluminum. The base material may be a mixture of these synthetic resins, a copolymer, a laminate of synthetic resins, a laminate of metals, or a laminate of synthetic resin and metal.

This is because when a propylene-based copolymer is selected as the substrate, there is no deformation at the time of immersion, no fluctuation of the semiconductor member at the time of peeling, and better pickup properties can be obtained in the next pickup process. Examples of the propylene copolymer include a random copolymer of propylene and other components, a block copolymer of propylene and other components, and an alternating copolymer of propylene and other components. Examples of other components include α-olefins such as ethylene, 1-butene, 1-pentene, 1-hexene and 1-heptene, copolymers composed of at least two kinds of α-olefins, and styrene-diene copolymers. Can be mentioned. Among these, 1-butene is preferable. Thereby, it is possible to particularly suppress chips generated when the semiconductor member is cut.

(Adhesive for adhesive tape)
Adhesives include polymers obtained by polymerizing acrylic acid, methacrylic acid and their ester monomers, and copolymers obtained by copolymerizing unsaturated monomers copolymerizable with these monomers (eg, vinyl acetate, styrene, acrylonitrile). Of these pressure-sensitive adhesives, (meth) acrylic acid ester copolymers are preferred. The pressure-sensitive adhesive layer has a low molecular weight compound such as an acrylate compound or urethane having at least two photopolymerizable carbon-carbon double bonds in the molecule that can be three-dimensionally reticulated by irradiation with ultraviolet rays or radiation. A photocurable pressure-sensitive adhesive using acrylate oligomer or the like can also be employed.

((Meth) acrylic acid ester copolymer)
The (meth) acrylic acid ester copolymer used in the present invention is not particularly limited, but is a copolymer of a main monomer of (meth) acrylic acid ester and another vinyl compound monomer. The vinyl compound monomer is one or more of a functional group consisting of a hydroxyl group, a carboxyl group, an epoxy group, an amide group, an amino group, a methylol group, a sulfonic acid group, a sulfamic acid group, and a (phosphite) ester group. It is preferable to use a functional group-containing monomer having

As the main monomer of (meth) acrylic acid ester, for example, butyl (meth) acrylate, 2-butyl (meth) acrylate, t-butyl (meth) acrylate, pentyl (meth) acrylate, octyl (meth) acrylate, 2 -Ethylhexyl (meth) acrylate, nonyl (meth) acrylate, decyl (meth) acrylate, lauryl (meth) acrylate, methyl (meth) acrylate, ethyl (meth) acrylate, isopropyl (meth) acrylate, tridecyl (meth) acrylate, myristyl (Meth) acrylate, cetyl (meth) acrylate, stearyl (meth) acrylate, cyclohexyl (meth) acrylate, isobornyl (meth) acrylate, dicyclopentanyl (meth) acrylate, benzyl (meth) ) Acrylate, methoxyethyl (meth) acrylate, ethoxyethyl (meth) acrylate, butoxymethyl (meth) acrylate, and ethoxy -n- propyl (meth) acrylate.

As a functional group-containing monomer, for example, a vinyl compound having a hydroxyl group, a carboxyl group, an epoxy group, an amide group, an amino group, a methylol group, a sulfonic acid group, a sulfamic acid group, or a (sub) phosphate group as a functional group Is mentioned.

Examples of the monomer having a hydroxyl group include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, and 2-hydroxybutyl (meth) acrylate.

Examples of the monomer having a carboxyl group include (meth) acrylic acid, crotonic acid, maleic acid, maleic anhydride, itaconic acid, fumaric acid, acrylamide N-glycolic acid, and cinnamic acid.

Examples of the monomer having an epoxy group include allyl glycidyl ether and (meth) acrylic acid glycidyl ether.

Examples of the monomer having an amide group include (meth) acrylamide.

Examples of the monomer having an amino group include N, N-dimethylaminoethyl (meth) acrylate.

Examples of the monomer having a methylol group include N-methylolacrylamide.

As a method for producing the (meth) acrylic acid ester copolymer, known methods such as emulsion polymerization and solution polymerization can be used. Acrylic rubber that can be produced by emulsion polymerization is preferred so that the adhesive tape can be easily separated from the semiconductor member after irradiation.

(Multifunctional isocyanate curing agent)
The polyfunctional isocyanate curing agent is not particularly limited except that it has two or more isocyanate groups, and examples thereof include aromatic polyisocyanates, aliphatic polyisocyanates, and alicyclic polyisocyanates.

The aromatic polyisocyanate is not particularly limited, and for example, 1,3-phenylene diisocyanate, 4,4′-diphenyl diisocyanate, 1,4-phenylene diisocyanate, 4,4′-diphenylmethane diisocyanate, 2,4-tolylene diisocyanate, 2 , 6-tolylene diisocyanate, 4,4'-toluidine diisocyanate, 2,4,6-triisocyanate toluene, 1,3,5-triisocyanate benzene, dianisidine diisocyanate, 4,4'-diphenyl ether diisocyanate, 4,4 ', 4 "-triphenylmethane triisocyanate, ω, ω'-diisocyanate-1,3-dimethylbenzene, ω, ω'-diisocyanate-1,4-dimethylbenzene, ω, ω'-diisocyanate-1,4- Diethyl Benzene, 1,4-tetramethylxylylene diisocyanate, and 1,3-tetramethylxylylene diisocyanate and the like.

The aliphatic polyisocyanate is not particularly limited. For example, trimethylene diisocyanate, tetramethylene diisocyanate, hexamethylene diisocyanate, pentamethylene diisocyanate, 1,2-propylene diisocyanate, 2,3-butylene diisocyanate, 1,3-butylene diisocyanate, dodecamethylene. Examples thereof include diisocyanate and 2,4,4-trimethylhexamethylene diisocyanate.

The alicyclic polyisocyanate is not particularly limited. For example, 3-isocyanate methyl-3,5,5-trimethylcyclohexyl isocyanate, 1,3-cyclopentane diisocyanate, 1,3-cyclohexane diisocyanate, 1,4-cyclohexane diisocyanate, methyl -2,4-cyclohexane diisocyanate, methyl-2,6-cyclohexane diisocyanate, 4,4'-methylenebis (cyclohexyl isocyanate), 1,4-bis (isocyanatomethyl) cyclohexane, and 1,4-bis (isocyanatomethyl) cyclohexane Etc.

Among polyisocyanates, 1,3-phenylene diisocyanate, 4,4′-diphenyl diisocyanate, 1,4-phenylene diisocyanate, 4,4′-diphenylmethane diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate 4,4'-toluidine diisocyanate and hexamethylene diisocyanate are preferably used.

The blending ratio of the polyfunctional isocyanate curing agent is preferably 0.1 parts by mass or more and 20 parts by mass or less with respect to 100 parts by mass ((meth) acrylic acid ester copolymer), and the lower limit is 0.5 parts by mass or more and the upper limit. Is more preferably 10 parts by mass or less. If the polyfunctional isocyanate curing agent is 0.1 part by mass or more, the adhesive force is not too strong, and hence the occurrence of pickup failure can be suppressed. Moreover, it is preferable if the polyfunctional isocyanate curing agent is 20 parts by mass or less, since the adhesive strength does not decrease and the retention of the separated semiconductor components in the transfer process during liquid immersion is maintained.

(Urethane acrylate oligomers with 4 or more vinyl groups)
A urethane acrylate oligomer having 4 or more vinyl groups (hereinafter simply referred to as “urethane acrylate oligomer”) is a (meth) acrylate oligomer having 4 or more vinyl groups and having a urethane bond in the molecule. It is not limited.

The method for producing the urethane acrylate oligomer is not particularly limited. For example, a urethane acrylate is prepared by reacting a (meth) acrylate compound containing a hydroxyl group and a plurality of (meth) acrylate groups with a compound having a plurality of isocyanate groups (for example, a diisocyanate compound). An example is an oligomer method. A compound having a plurality of isocyanate groups (for example, a diisocyanate compound) is added to and reacted with a polyol oligomer having a plurality of hydroxyl ends to form an oligomer having a plurality of isocyanate ends, and further a hydroxyl group and a plurality of (meth) acrylate groups. It is good also as a urethane acrylate oligomer by making it react with the (meth) acrylate compound containing this.

Examples of the (meth) acrylate compound containing a hydroxyl group and a plurality of (meth) acrylate groups include hydroxypropylated trimethylolpropane triacrylate, pentaerythritol triacrylate, dipentaerythritol-hydroxy-pentaacrylate, and bis (pentaerythritol). -Tetraacrylate, tetramethylolmethane-triacrylate, glycidol-diacrylate, and compounds having a methacrylate group as a part or all of these acrylate groups.

Examples of the isocyanate having a plurality of isocyanate groups include aromatic isocyanate, alicyclic isocyanate, and aliphatic isocyanate. Of these isocyanates, aromatic isocyanates or alicyclic isocyanates having a plurality of isocyanate groups are preferably used. As the form of the isocyanate component, there are a monomer, a dimer, and a trimer, and a trimer is preferably used.

Examples of the aromatic diisocyanate include tolylene diisocyanate, 4,4-diphenylmethane diisocyanate, and xylylene diisocyanate.

Examples of the alicyclic diisocyanate include isophorone diisocyanate and methylene bis (4-cyclohexyl isocyanate).

Examples of the fatty diisocyanate include hexamethylene diisocyanate and trimethylhexamethylene diisocyanate.

Examples of the polyol component include poly (propylene oxide) diol, poly (propylene oxide) triol, copoly (ethylene oxide-propylene oxide) diol, poly (tetramethylene oxide) diol, ethoxylated bisphenol A, and ethoxylated bisphenol S spiroglycol. , Caprolactone-modified diol, carbonate diol and the like.

If the number of vinyl groups in the urethane acrylate oligomer having a vinyl group is 4 or more, it is easy to peel off the adhesive tape after irradiation from the semiconductor member, so that the pickup property can be improved.

Although the compounding quantity of the urethane acrylate oligomer which has 4 or more vinyl groups is not specifically limited, It is preferable to set it as 20 to 200 mass parts with respect to 100 mass parts of (meth) acrylic acid ester copolymers. If the compounding amount of the urethane acrylate oligomer having 4 or more vinyl groups is 20 parts by mass or more, the adhesive tape after radiation irradiation can be easily peeled off from the semiconductor member, and the occurrence of pickup problems can be suppressed. . Moreover, if the compounding quantity of the urethane acrylate oligomer which has 4 or more vinyl groups is 200 mass parts or less, the retention property of the separated semiconductor component in the transfer process at the time of immersion in a liquid can be maintained. .

(Silicone-modified acrylic resin)
A silicone-modified acrylic resin is a polymer of a (meth) acrylic monomer and a monomer having a vinyl group at the end of a polydimethylsiloxane bond (hereinafter referred to as “silicone macromonomer”). There is no particular limitation except that it has a monomer unit derived from a monomer having a vinyl group, such as a homopolymer of a silicone macromonomer, or a vinyl polymer obtained by polymerizing a silicone macromonomer and another vinyl compound. Is mentioned. As the silicone-based macromonomer, a compound in which the terminal of the polydimethylsiloxane bond is a vinyl group such as a (meth) acryloyl group or a styryl group is preferably used (see, for example, JP-A-2000-080135).

Examples of the (meth) acrylic monomer include hydroxyalkyl (meth) acrylate, modified hydroxy (meth) acrylate, and (meth) acrylic acid in addition to alkyl (meth) acrylate.

Examples of the alkyl (meth) acrylate include methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, n-butyl (meth) acrylate, isobutyl (meth) acrylate, and t-butyl (meth) acrylate. , 2-ethylhexyl (meth) acrylate, lauryl (meth) acrylate, stearyl (meth) acrylate, isobornyl (meth) acrylate, and hydroxyalkyl (meth) acrylate.

Examples of the hydroxyalkyl (meth) acrylate include hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate, and hydroxybutyl (meth) acrylate.

Examples of the modified hydroxy (meth) acrylate include ethylene oxide-modified hydroxy (meth-2) acrylate and lactone-modified hydroxy (meth) acrylate.

When (meth) acrylic acid is used, a silicone-modified acrylic resin is synthesized and then reacted with acrylic acid using glycidyl (meth) acrylate having an epoxy group to obtain a polymer having a vinyl group.

In order to prevent minute adhesive residue called particles, reactive hydroxyalkyl (meth) acrylate or modified hydroxy (meth) acrylate, and silicone-modified acrylic resin having at least one vinyl group are preferably used.

The ratio of the silicone-based macromonomer unit in the silicone-modified acrylic resin is not particularly limited, but the silicone-based macromonomer unit is preferably 15 parts by mass or more and 50 parts by mass or less in 100 parts by mass of the silicone-modified acrylic resin. When the content of the silicone-based macromonomer unit is 15 parts by mass or more, the adhesive tape after radiation irradiation can be easily peeled from the semiconductor member, and pickup properties can be improved. Moreover, if content of a silicone type macromonomer unit is 50 mass parts or less, the retainability of the separated semiconductor component in the transfer process at the time of immersion in a liquid can be maintained.

Although the compounding quantity of a silicone modified acrylic resin is not specifically limited, It is preferable to set it as 0.1 to 10 mass parts with respect to 100 mass parts of (meth) acrylic acid ester polymers. When the blending amount of the silicone-modified acrylic resin is 0.1 parts by mass or more, the pressure-sensitive adhesive tape after radiation irradiation can be easily peeled from the semiconductor member, and pickup properties can be improved. Moreover, if the compounding quantity of a silicone modified acrylic resin is 10 mass parts or less, the retainability of the separated semiconductor component in the transfer process at the time of immersion in a liquid can be maintained.

You may add various additives, such as a polymerization initiator, a softening agent, anti-aging agent, a filler, a ultraviolet absorber, and a light stabilizer, to an adhesive layer.

The thickness of the pressure-sensitive adhesive layer is not particularly limited, but is generally about 5 μm to 100 μm, preferably about 5 μm to 40 μm.

The method of forming an adhesive layer on a substrate film to form an adhesive tape is not particularly limited. For example, the adhesive is applied on the substrate with a coater such as a gravure coater, comma coater, bar coater, knife coater, or roll coater. The method of apply | coating directly is mentioned. The pressure-sensitive adhesive layer may be printed on the substrate film by letterpress printing, intaglio printing, planographic printing, flexographic printing, offset printing, screen printing, or the like.

(Adhesive resin)
The adhesive resin needs to have a relationship of X <T <Y, in which the adhesive force lowering temperature X has a relationship of X <Y with respect to the shrinkage temperature Y of the adhesive tape and is lower than the temperature T of the liquid. It is preferable that the adhesive resin does not cause misalignment with respect to the semiconductor member due to swelling even when it comes into contact with water. Specifically, it is preferable that it has hydrophobicity, or does not swell greatly or does not dissolve even when contacted with water. Examples of the adhesive resin having this property include acrylic resins, urethane adhesives, and epoxy adhesives, and acrylic resins are preferable.

More preferably, the adhesive resin is composed of (A) polyfunctional (meth) acrylate, (B) monofunctional (meth) acrylate and (C) polymerization initiator having hydrophobicity. More preferably, these blends are mixed in an amount of 50 to 97 (B) monofunctional (meth) acrylate with respect to 100 parts by mass of the total amount of (A) polyfunctional (meth) acrylate and (B) monofunctional (meth) acrylate. Those containing 0.1 to 20 parts by mass of (C) polymerization initiator are preferred.

(A) As for the addition amount of polyfunctional (meth) acrylate, 3-50 mass parts is preferable in 100 mass parts of total amounts of (A) polyfunctional (meth) acrylate and (B) monofunctional (meth) acrylate. (A) When the addition amount of the polyfunctional (meth) acrylate is small, the property of peeling from the semiconductor member when the temperature of the cured adhesive resin is raised (hereinafter simply referred to as “peelability”) tends not to be exhibited. This is because if the amount is large, the initial adhesiveness tends to decrease.

((A) polyfunctional (meth) acrylate)
(A) As a polyfunctional (meth) acrylate, an oligomer / polymer terminal or side chain has two or more (meth) acryloylated polyfunctional (meth) acrylate oligomer / polymer or two or more (meth) acryloyl groups. The monomer having can be used.

Examples of the polyfunctional (meth) acrylate oligomer / polymer include 1,2-polybutadiene terminated urethane (meth) acrylate (for example, TE-2000, TEA-1000 manufactured by Nippon Soda Co., Ltd.), 1,2-polybutadiene terminated urethane (meta ) Hydrogenated acrylate (for example, TEAI-1000 manufactured by Nippon Soda Co., Ltd.), 1,4-polybutadiene terminated urethane (meth) acrylate (for example, BAC-45 manufactured by Osaka Organic Chemical Co., Ltd.), polyisoprene terminated (meth) acrylate, polyester -Based urethane (meth) acrylate, polyether-based urethane (meth) acrylate, polyester (meth) acrylate, bis-A type epoxy (meth) acrylate (for example, Biscoat # 540 manufactured by Osaka Organic Chemical Co., Ltd., Biscoat VR- manufactured by Showa Polymer Co., Ltd.) 77) That.

As bifunctional (meth) acrylate monomers, 1,3-butylene glycol di (meth) acrylate, 1,4-butanediol di (meth) acrylate, 1,6-hexadiol di (meth) acrylate, 1,9-nonane Diol di (meth) acrylate, neopentyl glycol di (meth) acrylate, dicyclopentanyl di (meth) acrylate, 2-ethyl-2-butyl-propanediol (meth) acrylate, neopentyl glycol modified trimethylolpropane di ( (Meth) acrylate, stearic acid-modified pentaerythritol diacrylate, polypropylene glycol di (meth) acrylate, 2,2-bis (4- (meth) acryloxydiethoxyphenyl) propane, 2,2-bis (4- (meta ) Acryloxypropoxy Eniru) propane, 2,2-bis (4- (meth) acryloxy-tetra-ethoxyphenyl) propane. Examples of the trifunctional (meth) acrylate monomer include tomethylolpropane tri (meth) acrylate and tris [(meth) acryloxyethyl] isocyanurate. As tetrafunctional or higher (meth) acrylate monomers, dimethylolpropane tetra (meth) acrylate, pentaerythritol tetra (meth) acrylate, pentaerythritol ethoxytetra (meth) acrylate, dipentaerystol penta (meth) acrylate, dipenta Examples include erythrole hexa (meth) acrylate.

((B) Monofunctional (meth) acrylate monomer)
(B) Monofunctional (meth) acrylate monomers include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, isooctyl (meth) acrylate , Isodecyl (meth) acrylate, lauryl (meth) acrylate, stearyl (meth) acrylate, phenyl (meth) acrylate, cyclohexyl (meth) acrylate, dicyclopentanyl (meth) acrylate, dicyclopentenyl (meth) acrylate, dicyclo Pentenyloxyethyl (meth) acrylate, isobornyl (meth) acrylate, methoxylated cyclodecatriene (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxy Propyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, 2-hydroxy-3-phenoxypropyl (meth) acrylate, glycidyl (meth) acrylate , Caprolactone-modified tetrahydrofurfuryl (meth) acrylate, 3-chloro-2-hydroxypropyl (meth) acrylate, N, N-dimethylaminoethyl (meth) acrylate, N, N-diethylaminoethyl (meth) acrylate, t-butyl Aminoethyl (meth) acrylate, ethoxycarbonylmethyl (meth) acrylate, phenol ethylene oxide modified acrylate, phenol (ethylene oxide 2 mol modified) acrylate, Nord (ethylene oxide 4 mol modified) acrylate, paracumylphenol ethylene oxide modified acrylate, nonylphenol ethylene oxide modified acrylate, nonylphenol (ethylene oxide 4 mol modified) acrylate, nonylphenol (ethylene oxide 8 mol modified) acrylate, nonylphenol (propylene oxide 2. 5 mol modified) acrylate, 2-ethylhexyl carbitol acrylate, ethylene oxide modified phthalic acid (meth) acrylate, ethylene oxide modified succinic acid (meth) acrylate, trifluoroethyl (meth) acrylate, acrylic acid, methacrylic acid, maleic acid, Fumaric acid, ω-carboxy-polycaprolactone mono (meth) acrylate, phthalic acid monohydroxy ester Le (meth) acrylate, (meth) acrylic acid dimer, beta-(meth) acryloyloxyethyl hydrogen succinate, n-(meth) acryloyloxy alkyl hexahydrophthalimide and the like.

(C) What is mix | blended in order to accelerate | stimulate photocuring of adhesive resin by sensitizing with a visible ray or actinic light of an ultraviolet-ray is preferable, and a well-known various photoinitiator can be used.

(C) As for the addition amount of a polymerization initiator, 0.1-20 mass parts is preferable with respect to a total of 100 mass parts with (A) polyfunctional (meth) acrylate and (B) monofunctional (meth) acrylate. More preferably, it is 3-20 mass parts. If it is 0.1 mass part or more, the effect of hardening acceleration | stimulation will be acquired reliably, and sufficient curing rate can be obtained if it is 20 mass parts or less. By adding 3 parts by mass or more of component (C) as a more preferable form, it becomes possible to cure without depending on the amount of light irradiation, and further the degree of cross-linking of the cured body of the adhesive resin is increased, resulting in misalignment during cutting. It is more preferable at the point which loses and the peelability improves.

(C) Specific examples of the polymerization initiator include benzophenone and derivatives thereof, benzyl and derivatives thereof, entraquinone and derivatives thereof, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, benzoin isobutyl ether, and benzyl dimethyl ketal. Benzoin derivatives such as diethoxyacetophenone, acetophenone derivatives such as 4-t-butyltrichloroacetophenone, 2-dimethylaminoethylbenzoate, p-dimethylaminoethylbenzoate, diphenyldisulfide, thioxanthone and its derivatives, camphorquinone, 7,7- Dimethyl-2,3-dioxobicyclo [2.2.1] heptane-1-carboxylic acid, 7,7-dimethyl-2,3-dioxobicyclo [2.2.1] Tan-1-carboxy-2-bromoethyl ester, 7,7-dimethyl-2,3-dioxobicyclo [2.2.1] heptane-1-carboxy-2-methyl ester, 7,7-dimethyl-2 , 3-Dioxobicyclo [2.2.1] heptane-1-carboxylic acid chloride and other camphorquinone derivatives, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropan-1-one Α-aminoalkylphenone derivatives such as 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1, benzoyldiphenylphosphine oxide, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, benzoyl Diethoxyphosphine oxide, 2,4,6-trimethylbenzoyldimethoxypheny And acylphosphine oxide derivatives such as ruphosphine oxide and 2,4,6-trimethylbenzoyldiethoxyphenylphosphine oxide. A photoinitiator can be used 1 type or in combination of 2 or more types.

In the present invention, a polar organic solvent may be used in the adhesive resin. By using a polar organic solvent together, the resin layer can easily swell upon contact with the liquid and reduce the adhesive strength.

The addition amount of the polar organic solvent is preferably 0.5 to 10 parts by mass with respect to 100 parts by mass of the total amount of (A) polyfunctional (meth) acrylate and (B) monofunctional (meth) acrylate. If it is 0.5 parts by mass or more, releasability can be ensured, and if it is 10 parts by mass or less, the adhesive property tends to be peeled into a film without fear of lowering the initial adhesiveness.

The polar organic solvent preferably has a boiling point of 30 ° C. or more and 200 ° C. or less in order to more reliably develop a phenomenon in which the adhesive resin is brought into contact with the liquid and the adhesive strength is lowered. Examples of such a polar organic solvent include alcohols, ketones, and esters, and preferably alcohols.

Examples of the alcohol include methanol, ethanol, n-propanol, isopropanol, n-butanol, isobutanol, sec-butanol, tert-butanol, n-amyl alcohol, isoamyl alcohol, 2-ethylbutyl alcohol and the like. Further, among the alcohols, methanol, ethanol, n-propanol, isopropanol, n-butanol, isobutanol, sec-butanol, and tert-butanol having a boiling point of 120 ° C. or less are preferred, and among them, methanol, ethanol More preferred are isopropanol and n-butanol.

In the present invention, (A) a polyfunctional (meth) acrylate, (B) a monofunctional (meth) acrylate, and (C) a particulate substance that does not dissolve in the polymerization initiator may be used together. Thereby, since the resin layer can hold | maintain fixed thickness, thickness accuracy improves.

The added amount of the particulate material is preferably 0.1 to 20 parts by mass, particularly 0.1 to 100 parts by mass of the total amount of (A) polyfunctional (meth) acrylate and (B) monofunctional (meth) acrylate. -10 mass parts is preferable. If it is 0.1 parts by mass or more, the film thickness of the adhesive resin is almost constant, and if it is 20 parts by mass or less, there is no fear that the initial adhesiveness is lowered.

The material of the particulate material includes commonly used organic particles and inorganic particles. Specifically, the organic particles include polyethylene particles, polypolypropylene particles, crosslinked polymethyl methacrylate particles, crosslinked polystyrene particles, and the like, and the inorganic particles include ceramic particles such as glass, silica, alumina, and titanium.

From the viewpoint of uniformly controlling the film thickness of the adhesive resin, the granular material is preferably spherical and has a constant particle size, little deformation of the particle, and small variation in particle size. Preferred organic particles having these conditions include methyl methacrylate monomers, crosslinked polymethyl methacrylate particles obtained as monodisperse particles by a known emulsion polymerization method of a styrene monomer and a crosslinkable monomer, crosslinked polystyrene particles, and inorganic particles. Has spherical silica. Among these granular materials, crosslinked polymethyl methacrylate particles and crosslinked polystyrene particles are more preferable from the viewpoint of storage stability such as sedimentation of particles and reactivity of the composition.

The adhesive resin of the present invention includes various elastomers such as acrylic rubber, urethane rubber, ABS (acrylonitrile-butadiene-styrene rubber), inorganic fillers, solvents, and extenders that are generally used within a range that does not impair the object of the present invention. Additives such as reinforcing materials, plasticizers, thickeners, dyes, pigments, flame retardants, polymerization inhibitors, silane coupling agents, and surfactants may be used.

(Application method of adhesive resin)
As a method for applying the adhesive resin, bar coating, spray gun, spin coating, or the like can be employed.

(Peeling tape)
The peeling tape is composed of a base material and an adhesive layer, and the adhesive strength between the adhesive resin and the peeling tape is higher than the adhesive strength between the semiconductor member and the adhesive resin.

(Base material for peeling tape)
As a base material for the peeling tape, a synthetic resin is preferable. The shape includes a film and a sheet. The thickness of the substrate is preferably 50 μm or more and 250 μm or less. A more preferable lower limit is 70 μm, and a more preferable upper limit is 150 μm.

Synthetic resins include PVC (polyvinyl chloride), polyethylene, PET (polyethylene terephthalate), EVA (ethylene-vinyl acetate copolymer), ethylene-ethyl acrylate copolymer, polypropylene, propylene-based copolymer, ethylene-acrylic. There are acid copolymers, ionomer resins, and polyimides. Among these, EVA (ethylene-vinyl acetate copolymer) ethylene-ethyl acrylate copolymers are preferable. The base material may be a mixture of these synthetic resins, a copolymer, or a laminate of synthetic resins.

(Peeling tape adhesive)
As the pressure-sensitive adhesive, an acrylic pressure-sensitive adhesive, a urethane-based pressure-sensitive adhesive, a silicone-based pressure-sensitive adhesive, and the like are preferable, and an acrylic pressure-sensitive adhesive is preferable. As acrylic pressure-sensitive adhesives, polymers obtained by polymerizing acrylic acid, methacrylic acid and ester monomers thereof, and unsaturated monomers copolymerizable with these monomers (for example, vinyl acetate, styrene, acrylonitrile) are copolymerized. Among these pressure-sensitive adhesives, (meth) acrylic acid ester copolymers are preferred. The pressure-sensitive adhesive layer has a low molecular weight compound such as an acrylate compound or urethane having at least two photopolymerizable carbon-carbon double bonds in the molecule that can be three-dimensionally reticulated by irradiation with ultraviolet rays or radiation. A photocurable pressure-sensitive adhesive using acrylate oligomer or the like can also be employed.

You may add various additives, such as a polymerization initiator, a softening agent, anti-aging agent, a filler, a ultraviolet absorber, and a light stabilizer, to an adhesive layer.

The thickness of the pressure-sensitive adhesive layer is not particularly limited, but is generally about 5 μm to 100 μm, preferably 5 μm as the lower limit and 40 μm as the upper limit.

The method of forming an adhesive layer on a substrate film to form an adhesive tape is not particularly limited. For example, the adhesive is applied on the substrate with a coater such as a gravure coater, comma coater, bar coater, knife coater, or roll coater. The method of apply | coating directly is mentioned. The pressure-sensitive adhesive layer may be printed on the substrate film by letterpress printing, intaglio printing, planographic printing, flexographic printing, offset printing, screen printing, or the like.

(Fixing jig)
As the fixing jig, the semiconductor member is fixed via an adhesive resin. Therefore, if the semiconductor member is plate-like, a smooth material is good, and a plate-like body or a film-like body alone or two or more kinds are used. Can be used. Fixing jigs are made of metal plates such as stainless steel, aluminum and iron, acrylic, polycarbonate, ABS (acrylonitrile butadiene styrene), PET, nylon, urethane, polyimide, synthetic resins such as polyolefin and PVC, glass, ceramics, etc. There is. In the present invention, the fixing jig preferably transmits 20% or more of a wavelength of 365 nm. If the wavelength of 365 nm is 20% or more, it is good without taking too much time to cure the adhesive resin. The thickness of the fixing jig is not particularly limited as long as it satisfies the above conditions, but is preferably 100 μm to 10 mm, and more preferably 2 to 5 mm. The measurement of transmittance is based on the transmittance at a wavelength of 365 nm using UVR-2 manufactured by Topcon as a measuring instrument.

Embodiments of the semiconductor member manufacturing method of the present invention will be described with reference to the drawings.
The semiconductor member manufacturing method in the present embodiment includes an individualization process, a bonding process, a transfer process, and a pickup process. Hereinafter, each process will be described. 1 to 10 are schematically shown and are different from the actual scale.

<Individualization process>
In the singulation process, adhesive resin 2 is applied to a silicon wafer as a semiconductor member 1 having a diameter of 8 inches and a thickness of 725 μm by spin coating, and a glass plate as a fixing jig 3 having a thickness of 700 μm is bonded. The adhesive resin was hardened under a condition of 300 mJ / cm ² at a wavelength of 365 nm using a black light, weighted so that a uniform surface was obtained, and then diced. Dicing was performed with a chip size of 7.2 mm × 14.4 mm using DAD341 (not shown) manufactured by DISCO and NBC-ZH205O-27HEEE (not shown) manufactured by DISCO. The glass plate transmits 80% of light having a wavelength of 365 nm. The state after the singulation process is shown in FIG.

<Bonding process>
The pasting step was performed after further curing the adhesive resin under the condition of 16000 mJ / cm ² at a wavelength of 365 nm using a fusion device (not shown) using an electrodeless discharge lamp. An adhesive tape 4 is bonded to a divided chip surface as the semiconductor member 1 through a ring frame 5 using a roll mounter. The state after the bonding step is shown in FIG.

<Transfer process>
In the transfer process, the adhesive resin 2 and the fixing jig 3 are freely dropped from the semiconductor member 1 and peeled off after being immersed in warm water 6 at 90 ° C. in the state after the bonding process. FIG. 3 shows the immersed state, and FIG. 4 shows the state after free fall. In this transfer step, the temperature of the hot water 6 is set to 90 ° C., the adhesive force lowering temperature X of the adhesive resin 2 is set lower than 90 ° C., and the heat shrink temperature Y of the adhesive tape 4 is set higher than 90 ° C. Thus, it was possible to peel off at the interface between the semiconductor member 1 and the adhesive resin 2, not at the interface between the semiconductor member 1 and the adhesive tape 4, and the interface between the adhesive resin 2 and the fixing jig 3. In FIG. 3, reference numeral 7 denotes a column supporting the ring frame 5, and reference numeral 9 denotes a container containing hot water 6.

<Pickup process>
After the transfer process, the pressure-sensitive adhesive tape 4 bonded to the ring frame 5 is pulled up together with the semiconductor member 1 (see FIG. 5), and the high-pressure mercury lamp manufactured by USHIO INC. From the base film side of the pressure-sensitive adhesive tape 4 (lower side in FIG. 5). After irradiating with ultraviolet rays under the condition of 150 mJ / cm ² and curing the adhesive layer of the adhesive tape 4, using CAP-300II manufactured by Canon Machinery not shown in the figure, under the condition of needle pin height 0.3 mm. It was. The state at the time of pick-up is shown in FIG.

FIG. 7 is a schematic cross-sectional view showing a transfer process of another embodiment.
This embodiment has the same configuration as the above-described embodiment except that the semiconductor member 1 is changed to a silicon wafer in which a polyimide vapor deposition film (not shown) is formed on the surface (contact surface with the adhesive resin 2). In this embodiment, since the silicon wafer is formed by forming a polyimide vapor deposition film on the surface of the semiconductor member 1 (contact surface with the adhesive resin 2), the interface between the semiconductor member 1 and the adhesive tape 4 and the adhesiveness in the transfer process. It is peeled off not at the interface between the resin 2 and the fixing jig 3 but at the interface between the adhesive resin 2 and the fixing jig 3.

After this transfer step, the peeling tape 8 is attached to the surface of the adhesive resin 2 (see FIG. 9) from the state where it is pulled up from the hot water 6 shown in FIG. 8, and the peeling tape 8 is peeled off together with the adhesive resin 2 (FIG. 10). reference). The subsequent steps are as shown in FIGS.

Hereinafter, the adhesive tape and the adhesive resin used in the above-described examples will be described with reference to Table 1.

(Adhesive tape)
The following base material was used for the adhesive tape.
Base material A: Propylene copolymer (Propylene, ethylene, 1-butene as a polymerization component, MFR (melt flow rate) value 7.5 g / 10 min, density 0.89 g / cm ³ (manufactured by Sun Allomer, X500F )). 80 μm thick.
Base material B: random copolymer of ethylene and vinyl acetate (MFR value 2.5 g / 10 min, vinyl acetate content 12%, density 0.93 g / cm ³ (manufactured by Mitsui DuPont Polychemical Co., Ltd.), thickness 80 μm.
Substrate C: PET, thickness 38 μm.

(Adhesive for adhesive tape)
The following was adopted as the adhesive. The numbers in Table 1 are parts by mass.
(Meth) acrylic acid ester copolymer: made of a copolymer of 54% ethyl acrylate, 19% butyl acrylate and 24% methoxyethyl acrylate, obtained by emulsion polymerization (our polymer).
Multifunctional isocyanate curing agent: Commercial product of trimethylolpropane adduct of hexamethylene diisocyanate (product name: Coronate HL, manufactured by Nippon Polyurethane Co., Ltd.).
Urethane acrylate oligomer A: terminal acrylate oligomer obtained by further reacting dipetaerythritol pentaacrylate with a terminal isocyanate oligomer obtained by reacting hexamethylene diisocyanate (aliphatic diisocyanate) trimer with poly (propylene oxide) diol. A urethane acrylate oligomer having a number average molecular weight (Mn) of 3,700 and 15 acrylate functional groups (our polymerized product).
Urethane acrylate oligomer B: a terminal acrylate oligomer obtained by further reacting 2-hydroxyethyl acrylate with a terminal isocyanate oligomer obtained by reacting 2-hydroxyethyl acrylate with the terminal of poly (propylene oxide) diol, and having a number average molecular weight (Mn) is 3,400 and the number of vinyl groups is 2 urethane acrylate oligomers per molecule (our polymerized product).
Silicone-modified acrylic resin: Commercially available silicone graft copolymer obtained by polymerizing an acrylic vinyl unit composed of a silicone oligomer having a (meth) acryloyl group at the end of a silicone molecular chain and methyl methacrylate (Soken Chemical Co., Ltd.) Product name Act Flow UTMM-LS2).
Although not described in Table 1, 6 parts by mass of a photopolymerization initiator (benzyldimethyl ketal, commercially available product) was blended with the adhesive of the adhesive tape.

The pressure-sensitive adhesive is composed of 100 parts by weight of (meth) acrylic acid ester copolymer A, 3 parts by weight of polyfunctional isocyanate curing agent A, 100 parts by weight of urethane acrylate oligomer A, 2 parts by weight of silicone-modified acrylic resin A, and 6 parts by weight of a photopolymerization initiator. It is a thing.

The pressure-sensitive adhesive tape is obtained by applying a pressure-sensitive adhesive having the composition shown in Table 1 on a PET separator film, applying the pressure-sensitive adhesive layer after drying so as to have a thickness of 10 μm, and laminating it on a substrate.

(Adhesive resin)
The adhesive resin used was a blend of (A) polyfunctional (meth) acrylate, (B) monofunctional (meth) acrylate and (C) polymerization initiator. Specifically, as (A) polyfunctional (meth) acrylate, 8 parts by mass of urethane acrylate (“UV-3000B” manufactured by Nippon Synthetic Chemical Co., Ltd.), dicyclopentanyl diacrylate (“KAYARAD R— manufactured by Nippon Kayaku Co., Ltd.) 684 ") 20 parts by mass in total of 12 parts by mass, (B) as monofunctional (meth) acrylate, 2- (1,2-cyclohexacarboximide) ethyl acrylate (" Aronix M-140 "manufactured by Toagosei Co., Ltd.) 30 80 parts by mass in total of 50 parts by mass of dicyclopentenyloxyethyl methacrylate (Rohm & Haas “QM-657”), (C) 2-methyl-1- [4- (methylthio) phenyl as a polymerization initiator ] -2-Morpholinopropan-1-one ("IRGACURE907" manufactured by Ciba Specialty Chemicals) An adhesive resin was prepared by adding 0.1 part by weight of 2,2-methylene-bis (4-methyl-6-tertiarybutylphenol) as a polymerization inhibitor.

(Peeling tape)
The following base material and adhesive were used for the peeling tape.
Base material: A random copolymer of ethylene and vinyl acetate (MFR value 2.5 g / 10 min, vinyl acetate content 12%, density 0.93 g / cm ³ , manufactured by Mitsui DuPont Polychemical Co., Ltd.) is formed to a thickness of 100 μm. We adopted what we did.
Adhesive: Blended with the following ingredients, this adhesive was coated on a PET separator film, coated so that the thickness of the adhesive layer after drying was 20 μm, and laminated on the substrate thing.
<Combination material>
(Meth) acrylic acid ester copolymer: copolymer of 54% ethyl acrylate, 19% butyl acrylate and 24% methoxyethyl acrylate, obtained by emulsion polymerization (our polymer) 100 parts by weight polyfunctional isocyanate Curing agent: Commercially available product of trimethylolpropane adduct of 2,4-tolylene diisocyanate (manufactured by Nippon Polyurethane Co., Ltd., product name Coronate HL) 3 parts by mass urethane acrylate oligomer: Hexamethylene diisocyanate (terminated with poly (propylene oxide) diol A terminal acrylate oligomer obtained by reacting a diisocyanate pentaacrylate with a terminal isocyanate oligomer obtained by reacting an aliphatic diisocyanate) trimer, and having an average molecular weight (Mn) of 3,700. Functionality 15 urethane acrylate oligomer (Company polymerization product) 100 parts by mass Photopolymerization initiator: benzyl dimethyl ketal (commercially available) 6 parts by weight

(Fixing jig)
As the fixing jig, a glass plate having a thickness of 700 μm that transmits 80% of light having a wavelength of 365 nm was used.

A silicon wafer was used as an adhesive tape, an adhesive resin, a peeling tape, a fixing jig, and a semiconductor member, and the transfer process of the present invention was carried out and evaluated by the following method. The evaluation results are shown in Table 1. In Example 21 only, the peeling tape was used, and the adhesive resin was peeled from the separated semiconductor member.

(Peelability)
An adhesive resin is applied to a silicon wafer having a diameter of 8 inches and a thickness of 725 μm by spin coating, a glass plate having a thickness of 700 μm is bonded, and 10 kg is applied so that a uniform surface can be obtained. Thereafter, the adhesive resin is cured using a black light under a condition of 300 mJ / cm ² at a wavelength of 365 nm. The dicing is performed using a DAD341 manufactured by DISCO and NBC-ZH205O-27HEEE manufactured by DISCO, with a chip size of 7.2 mm × 14.4 mm, and a wavelength of 365 nm by a curing device manufactured by Fusion using an electrodeless discharge lamp. After further curing the adhesive resin under the condition of 16000 mJ / cm ² , the adhesive tape is bonded to the divided chip surface through a ring frame using a roll mounter, and the semiconductor member is faced down to a 90 ° C. liquid. Immersion was performed, and the adhesive resin and glass were freely dropped from the fixing jig and separated from the semiconductor member. The case where the chip was able to be peeled off from the adhesive resin and glass within 1 minute at the time of peeling was rated as ◎, the case where the chip could be peeled off within 30 minutes was marked as ◯, and the case where peeling was not possible after 30 minutes or more was marked as x. In addition, when the semiconductor member is immersed downward in a liquid at 90 ° C, if only the glass peels from the semiconductor member and the adhesive resin adheres to the semiconductor member, after drying, peel off the adhesive resin and attach the tape. Then, the tape was peeled off from the separated semiconductor member together with the adhesive resin.

(Transferability)
The distance between the chips transferred by the above method was measured in one row each in the vertical direction and the horizontal direction, and compared with the chip distance before transfer. When the maximum variation from the chip interval before transfer is less than 10 μm, ◎ is 10 μm or more and less than 20 μm, and × is 20 μm or more.

(Pickup property)
After the transfer by the above method, UV light is irradiated from the base film surface of the adhesive tape with a high pressure mercury lamp manufactured by USHIO INC. Under the condition of 150 mJ / cm ² to cure the adhesive layer, and then CAP manufactured by Canon Machinery. -300II was evaluated under the condition of a needle pin height of 0.3 mm. A case where 100% of the chip was picked up was marked as ◎, a case where it was 90% or more and less than 100% was marked as ○, and a case where it was less than 90% was marked as ×.

The semiconductor member manufacturing method of the present invention provides a semiconductor member manufacturing method excellent in peelability, transferability and pick-up property.

The schematic of the cross section which shows the semiconductor member after the division | segmentation process in the Example of this invention, adhesive resin, and the jig for fixing. The schematic of the cross section which shows after the bonding process. The schematic of the cross section which shows the state immersed in the transcription | transfer process. The schematic of the cross section which shows the state after free fall in a transcription | transfer process. The schematic of the cross section which shows the state which pulled up the adhesive tape 4 adhere | attached on the ring frame 5 with the semiconductor member 1 after the transcription | transfer process. The schematic of a cross section in the state at the time of pick-up. The schematic of the cross section which shows the transcription | transfer process of another Example. The schematic of the cross section which shows the state pulled up from the warm water 6 after the transfer process of another Example. The schematic of the cross section which shows the state which peeled from the state pulled up from the warm water 6 shown in FIG. 8, and affixed the tape 8 on the surface of the adhesive resin 2. FIG. The schematic of the cross section which shows the state which peeled off the peeling tape 8 with the adhesive resin 2. FIG.

Explanation of symbols

1 Semiconductor materials
2 Adhesive resin
3 Fixing jig
4 Adhesive tape
5 Ring frame
6 Hot water
7 Prop
8 Stripping tape
9 containers

In the present invention, an adhesive resin is applied to a semiconductor member and temporarily fixed to a fixing jig, and then an individualization step for separating the semiconductor member into individual pieces, and an adhesive tape is bonded to the separated semiconductor member. A transfer step of separating the adhesive resin and the fixing jig from the separated semiconductor member and transferring the semiconductor member to the adhesive tape; and a pickup step of picking up the separated semiconductor member on the adhesive tape And the transfer step is a semiconductor member manufacturing method in which the transfer step is immersed in a liquid in a temperature range between the adhesive force lowering temperature X of the adhesive resin and the heat shrinkage temperature Y of the adhesive tape .

In the transfer step, it is preferable that the adhesive tape, the semiconductor member, the adhesive resin, and the fixing jig are arranged from above to be immersed in the liquid. By dipping in this arrangement, the adhesive resin can be peeled off due to its own weight with the fixing jig and a decrease in the adhesive strength of the adhesive resin. By adopting peeling by this arrangement, because it is free fall due to its own weight, the load when peeling the fixing jig with adhesive resin is suppressed, and individual pieces when transferring individual semiconductor members to adhesive tape It is possible to prevent cracking and chipping of individual semiconductor members when immersed in a liquid without changing the interval between the formed semiconductor members, and to promote the penetration of the liquid into the adhesive resin. Transfer time could be shortened. Depending on the adhesive strength of the adhesive resin, there are two types of peeling interfaces in the transfer process between the semiconductor member and the adhesive resin, or between the adhesive resin and the fixing jig. In the latter case, the peeling tape is bonded to the adhesive resin, and the peeling tape is peeled off from the separated semiconductor member together with the adhesive resin.

(Adhesive tape)
The pressure-sensitive adhesive tape is composed of a base material and a pressure-sensitive adhesive layer , and does not cause thermal contraction of the pressure-sensitive adhesive tape even at a temperature higher than the adhesive force lowering temperature of the adhesive resin.

(Adhesive resin)
The adhesive resin needs to have a relationship of X <T <Y, in which the adhesive force lowering temperature X has a relationship of X <Y with respect to the shrinkage temperature Y of the adhesive tape and is lower than the temperature T of the liquid. It is preferable that the adhesive resin does not cause misalignment with respect to the semiconductor member due to swelling even when it comes into contact with water. Specifically, it is preferable that it has hydrophobicity, or does not swell greatly or does not dissolve even when contacted with water. Examples of the adhesive resin having this property include acrylic resins, urethane adhesives, and epoxy adhesives, and acrylic resins are preferable.

Claims (7)

After the adhesive resin is applied to the semiconductor member and temporarily fixed to the fixing jig, the individualization step of dividing the semiconductor member into pieces,
A bonding step of bonding an adhesive tape to the separated semiconductor member;
A transfer step of peeling the adhesive resin and the fixing jig from the separated semiconductor member and transferring the semiconductor member to an adhesive tape;
Having a pick-up process for picking up individual semiconductor members on the adhesive tape;
A semiconductor member manufacturing method in which the transfer step is immersed in a liquid in a temperature range between the adhesive force lowering temperature X of the adhesive resin and the heat shrinkage temperature Y of the adhesive tape. The method of manufacturing a semiconductor member according to claim 1, wherein the temperature of the liquid used in the transfer step is 40 ° C. or higher and 100 ° C. or lower. The semiconductor member manufacturing method according to claim 1 or 2, wherein the transfer step is a step of arranging an adhesive tape, a semiconductor member, an adhesive resin, and a fixing jig from above, and immersing them in a liquid in this arrangement. The transfer process is an arrangement of adhesive tape, semiconductor member, adhesive resin, and fixing jig from the top, soak in the liquid in this arrangement and float the semiconductor member in the liquid via the adhesive tape. The semiconductor member manufacturing method according to claim 3, wherein the jig is a step of freely dropping the jig together with the adhesive resin. After the adhesive resin is applied to the semiconductor member and temporarily fixed to the fixing jig, the individualization step of dividing the semiconductor member into pieces,
A bonding step of bonding an adhesive tape to the separated semiconductor member;
A transfer step of transferring the semiconductor member to the adhesive tape;
A peeling step of peeling the fixing jig from the adhesive resin;
A second bonding step in which the adhesive resin is peeled off and the tape is bonded;
A second peeling step of peeling the tape from the separated semiconductor member together with the adhesive resin;
Having a pick-up process for picking up individual semiconductor members on the adhesive tape;
A semiconductor member manufacturing method in which the transfer step is immersed in a liquid in a temperature range between the adhesive force lowering temperature X of the adhesive resin and the heat shrinkage temperature Y of the adhesive tape. The method for producing a semiconductor member according to claim 1, wherein the base film of the adhesive tape is a propylene-based copolymer. The pressure-sensitive adhesive layer of the pressure-sensitive adhesive tape has 100 parts by weight of a (meth) acrylic acid ester copolymer, 0.5 parts by weight or more and 20 parts by weight or less of a polyfunctional isocyanate-based curing agent, and 20 parts by weight of a urethane acrylate oligomer having 4 or more vinyl groups. 7 to 200 parts by mass, and 0.1 to 10 parts by mass of a silicone-modified acrylic resin.