JP2010080876A - Apparatus and method for mounting electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an apparatus for mounting that prevents dust produced in an apparatus body from sticking on an adhesive tape provided inside. <P>SOLUTION: The apparatus for mounting includes punching devices 5A and 5B provided in the apparatus body 1 and punching TCPs 4 out of a carrier tape 3, first transfer means 6A and 6B of conveying the punched TCPs, index means 18A and 18B having a plurality of holding heads 19 for holding the conveyed TCPs, sticking devices 31A and 31B for sticking adhesive tapes 32 on the TCPs that the holding heads receive, a table device 61 for receiving and positioning a substrate, and a mounting head 53 for mounting the TCPs, having the adhesive tapes stuck, on the positioned substrate. The sticking device includes a supply reel 34 where the adhesive tape is stuck on a release tape and wound and which is provided below, and a heating and pressing means 43 provided above the supply reel, and pressing and sticking the adhesive tape, paid off from the supply reel together with the release tape and parted, on the TCPs while heating the adhesive tape. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an electronic component mounting apparatus and mounting method for mounting a TCP (Tape Carrier Package) as an electronic component on a liquid crystal display panel as a substrate, for example.

  When a liquid crystal display panel as a substrate is manufactured, TCP as an electronic component is mounted on the liquid crystal display panel by a mounting device. The mounting apparatus has a box-shaped apparatus main body. A punching device for punching out the TCP from the carrier tape is provided in the device main body. The TCP punched out by the punching device is received by the receiving body constituting the delivery means.

  The receiving body conveys the punched TCP to a predetermined position, and delivers it to a plurality of holding heads provided on an index table that is rotationally driven intermittently by a predetermined angle at that position. The holding head is provided so as to be driven in the vertical direction.

  The TCP delivered to the index table holding head is positioned at the mounting position after the TCP terminal portion is cleaned with a rotating brush in accordance with the intermittent rotation of the index table. At the mounting position, a substrate on which TCP is mounted is positioned by a table device and is on standby.

  When the holding head holding the TCP is positioned at the mounting position by intermittent rotation of the index table, the holding head is driven downward. Thereby, the TCP held by the holding head is mounted on the side portion of the substrate. Such prior art is disclosed in Patent Document 1 and Patent Document 2.

  Conventionally, an adhesive tape made of an anisotropic conductive member is pasted over the entire length of the side portion of the substrate, and the TCP is mounted there at a predetermined interval. However, sticking the adhesive tape over the entire length of the side portion of the substrate is not preferable because the portion of the adhesive tape where the TCP is not mounted is wasted or dust adheres to the portion where the TCP is not mounted. Sometimes.

  Therefore, recently, if the TCP terminal part held by the holding head of the index table is cleaned with a rotating brush, an adhesive tape cut to approximately the same length as the TCP terminal part by the sticking device is attached to the terminal part. Adhere. The adhesive tape is wound around the supply reel in a state of being attached to the release tape, and after being fed out from the supply reel, it is divided into a predetermined length corresponding to the electronic component.

Then, the TCP with the adhesive tape attached is transferred from the holding head to the mounting head, and the mounting head is positioned above the side portion of the substrate and then lowered, whereby the TCP held by the mounting head is lowered. Mounting on the side of the substrate is performed.
JP 2002-305398 A JP 2006-120929 A

  By the way, when the TCP is punched from the carrier tape by the punching device, it is unavoidable that dust is generated at that time, and the dust may float in the main body of the device. Further, when the TCP terminal portion delivered to the index table is cleaned with a rotating brush, dust removed from the terminal portion may float in the apparatus body.

  When the dust floats in the apparatus main body, the dust adheres to the adhesive tape wound around the supply reel together with the release tape, and may be stuck to the electronic component in that state. When the TCP with the dusty adhesive tape attached is mounted on the terminal of the substrate, the dust may be interposed between the TCP and the terminal of the substrate, which may result in poor mounting of the TCP.

  An object of the present invention is to provide an electronic component mounting apparatus and mounting method capable of preventing dust generated in the apparatus main body from adhering to an adhesive tape wound around a supply reel.

The present invention is a mounting device for mounting electronic components on the side of a substrate,
The device body;
A punching device that is provided at one end of the device body in the front-rear direction and punches the electronic component from a tape-like member;
Receiving means for receiving the electronic component punched by the punching device and transporting it to a predetermined position; and
Index means having a plurality of holding heads for receiving and holding the electronic components conveyed by the delivery means;
An attaching device for attaching an adhesive tape to the electronic component delivered to the holding head of the index means;
A table device provided at the other end of the apparatus body in the front-rear direction for receiving and positioning the substrate;
A mounting means for mounting the electronic component having the adhesive tape attached to the substrate positioned by the table device by the attaching device;
The sticking device is
A supply reel provided on the lower part of the apparatus body, the adhesive tape being attached to a release tape and wound;
Affixed to the electronic component while heating the adhesive tape provided above the supply reel in the main body of the apparatus and fed out from the supply reel together with the release tape and divided into a predetermined length. An electronic component mounting apparatus comprising: a heating and pressurizing unit.

  The adhesive tape is fed upward from the supply reel together with the release tape, is horizontally changed so that the adhesive tape faces upward, and faces the lower surface of the electronic component held by the holding head of the index means. It is preferable that the vehicle is allowed to run.

  The heating and pressurizing means is disposed below the adhesive tape that runs horizontally, and presses the adhesive tape divided into a predetermined length from below through the release tape to the lower surface of the electronic component. It is preferable to stick.

  The supply reel is preferably covered with a cover.

  It is preferable that a gas for preventing dust from entering the cover is supplied to the inside of the cover.

The present invention is a mounting method for mounting an electronic component on a side portion of a substrate,
A step of punching out the electronic component from a tape-like member provided at one end of the apparatus body in the front-rear direction;
Receiving the electronic component punched from the tape-shaped member and transporting it to a predetermined position;
Receiving the electronic component conveyed to a predetermined position and delivering it to the holding head of the index means;
A step of paying out the adhesive tape from a supply reel arranged at the lower part of the apparatus main body, dividing the adhesive tape into a predetermined length and sticking it to the electronic component delivered to the holding head of the index means;
Mounting the electronic component having the adhesive tape attached to the substrate held by a table device provided at the other end in the front-rear direction of the device main body. Is in the way.

  According to this invention, the supply reel around which the adhesive tape attached to the release tape is wound is provided in the lower part of the apparatus main body, and the adhesive tape divided into a predetermined length is heated above the supply reel. However, it was attached to the electronic component.

  Therefore, the heat that heats the adhesive tape generates an upward air flow from the lower part in the apparatus main body, and the upward air flow makes it easy for dust to rise from the lower part in the apparatus main body to the upper part. It is possible to prevent dust from adhering to the adhesive tape wound around the provided supply reel.

Embodiments of the present invention will be described below with reference to the drawings.
1 to FIG. 1 show an embodiment of the present invention. FIG. 1 is a plan view showing the internal structure of the mounting apparatus, and FIG. 2 is a side view of the same. As shown in FIGS. 1 and 2, the mounting apparatus includes a box-shaped apparatus main body 1 installed in a clean room. A projecting portion 2 projecting rearward is formed at the center in the width direction on the rear end side in the front-rear direction of the apparatus main body 1, and a second portion for punching out a TCP 4 as an electronic component from the carrier tape 3 is formed in the projecting portion 2. The first punching device 5A and the second punching device 5B are arranged symmetrically with respect to the center line O (shown in FIG. 1) in the width direction of the apparatus main body 1.

  The first punching device 5A and the second punching device 5B are operated alternately, and the TCP 4 punched by one punching device 5A or 5B is received by the pair of first delivery means 6A, 6B.

  That is, when the TCP 4 is punched by the first punching device 5A, the second punching device 5B is on standby, and when the TCP 4 is punched from being supplied to the first punching device 5A, the second punching is performed. The apparatus 5B is operated and a new portion of the carrier tape 3 is supplied to the first punching apparatus 5A. Thereby, the TCP 4 punched out from the carrier tape 3 is alternately supplied to the pair of first delivery means 6A and 6B.

  As shown in FIG. 2, the first and second punching devices 5A and 5B have an upper die 11 having a punch 11a provided on the lower surface and a through hole 12a into which the punch 11a is inserted. A mold 12 is provided. The upper mold 11 is driven in a vertical direction indicated by an arrow by a drive source 13.

  The carrier tape 3 is unwound from the supply reel 14, changed in direction by a plurality of guide rollers 15, and partially guided to run along the upper surface of the lower mold 12 and taken up on the take-up reel 16. It is supposed to be.

  A protective tape 17 that protects the carrier tape 3 is wound around the supply reel 14 so as to overlap the carrier tape 3. The carrier tape 3 is separated from the supply reel 14 together with the carrier tape 3 and the carrier tape 3 and is wound around the take-up reel 16 together with the carrier tape 3 from which the TCP 4 is punched by the punching devices 5A and 5B. It is like that.

  The TCP 4 received by one of the first delivery means 6A is transported to the first index means 18A and is received by the holding head 19 provided in the first index means 18A.

  The TCP 4 received by the other first delivery means 6B is transported to the second index means 18B and is received by the holding head 19 provided in the second index means 18B.

  As shown in FIG. 2, the first and second index means 18A and 18B have an index table 22 that is intermittently rotated at 90 ° intervals in the circumferential direction by a first θ drive source 21. The holding heads 19 are provided on the lower surface of each index table 22 at intervals of 90 degrees in the circumferential direction.

Thereby, the TCP 4 conveyed by the pair of first delivery means 6A and 6B is sucked and held by the holding head 19 of each index means 18A and 18B. That is, the TCP 4 is delivered from the first delivery means 6A, 6B to the holding head 19 of the index means 18A, 18B. A receiving position where the holding head 19 of the index means 18A, 18B receives the TCP 4 is indicated by A in FIG.
The rotation direction of each index table 22 is reverse as shown by the arrow in FIG.

  The TCP 4 punched by the first and second punching devices 5A and 5B is alternately received by the respective receiving tools 24 of the transfer means 6A and 6B. The receiver 24 is moved in the X direction indicated by the arrow in FIG. 2, that is, the X table 25 driven along the front-rear direction of the apparatus body 1 in the Z direction which is the vertical direction and the θ direction which is the rotational direction by the Zθ drive source 23. It is provided so that it can be driven. The X table 25 is movably provided on an X guide body 26 provided along the X direction, and can be driven along the X guide body 26 by a linear motor or the like (not shown).

  When receiving the TCP 4 from the first punching device 5A, the receiving member 24 of the first delivery means 6A is driven in the front-rear direction of the device body 1 indicated by the arrow X in FIG. The receiving position of the four holding heads 19 in which one end portion of the TCP 4 held on the upper surface of the receiver 24 is provided on the lower surface of the index table 22 of the first index means 18A at intervals of 90 degrees in the circumferential direction. Drive positioning is performed so as to face the lower side of the holding head 19 positioned at A.

  Similarly, the receiving tool 24 of the other first delivery means 6B receives the TCP 4, and the four holding heads 19 provided at intervals of 90 degrees in the circumferential direction on the lower surface of the index table 22 of the second index means 18B. Among them, the drive positioning is performed so as to face the lower side of the holding head 19 positioned at the receiving position A.

  The positioned receiver 24 is driven in the upward direction by the Zθ drive source 23. As a result, the TCP 4 held by the holder 24 comes into close contact with the lower surface of the holding head 19 provided on the index table 22, and in this state, the TCP 4 is transferred from the holder 24 to the holding head 19 and sucked. Retained.

  When the TCP 4 is delivered to the holding head 19 provided in the index table 22 of the first and second index means 18A, 18B, the pair of index tables 22 are indicated by arrows in FIG. Each of them is driven to rotate intermittently at an angle of 90 degrees in the opposite direction shown. Accordingly, the holding head 19 of each index table 22 that holds the TCP 4 by suction is positioned at the brushing position indicated by B in FIG.

  When the holding head 19 receiving the TCP 4 from the support 24 is rotated 90 degrees in the circumferential direction together with the index table 22 and positioned at the brushing position B, the terminal portion of the TCP 4 held by the holding head 19 (FIG. (Not shown) is brushed, that is, cleaned by the rotating brush 28 shown in FIG. Thereby, dust adhering to the terminal portion is removed. The rotary brush 28 is rotationally driven in the direction indicated by the arrow R by a motor (not shown).

  A part of the rotating brush 28 is immersed in the cleaning liquid L accommodated in the cleaning container 29. Further, a portion facing the rotating brush 28, that is, a radially outer portion of the index table 22 is covered with a box-shaped cover 30 whose bottom surface is opened. A suction tube 30 a communicating with a suction pump (not shown) is connected to the cover 30. Thereby, the internal atmosphere of the cover 30 is discharged by the suction tube 30a.

  The rotating brush 28, the cleaning container 29, and the cover 30 are mounted on the mounting table 27. The mounting table 27 is driven in the vertical direction by a vertical driving source 27a.

  When the mounting table 27 is driven in the upward direction and the rotating brush 28 contacts the terminal portion of the TCP 4 while rotating in the direction of the arrow R, dust attached to the terminal portion is removed. Part of the removed dust is scattered in the cover 30 as indicated by the arrow S, and the rest adheres to the rotating brush 28. The dust scattered in the cover 30 is sucked and discharged by the suction tube 30a, and the dust adhering to the rotating brush 28 is cleaned and removed by the cleaning liquid L in the cleaning container 29.

  Therefore, even if the dust attached to the terminal portion of the TCP 4 is removed by the rotating brush 28, the ratio of the dust removed from the terminal portion floating inside the apparatus main body 1 can be greatly reduced.

  When the terminal portion of the TCP 4 is cleaned by the rotary brush 28, the holding head 19 holding the TCP 4 is rotated 90 degrees in the circumferential direction together with the index table 22 and positioned at the sticking position indicated by C in FIG. .

  The TCP 4 positioned at the sticking position C is anisotropically cut by the first and second sticking devices 31 </ b> A and 31 </ b> B to the cleaned terminal part of the TCP 4 to a length corresponding to the terminal part. If it consists of a member, the adhesive tape 32 will be stuck so that it may mention later.

  The first and second indexing means 18A and 18B and the first and second sticking devices 31A and 31B are the center line in the width direction of the device main body 1, as with the first and second punching devices 5A and 5B. They are arranged symmetrically with respect to O.

  The first and second indexing means 18A and 18B are arranged on the outer side in the width direction of the apparatus main body 1 relative to the first and second punching apparatuses 5A and 5B, and the first and second sticking apparatuses 31A and 31B are The first and second indexing means 18A and 18B are disposed outward in the width direction.

  The first and second sticking devices 31A and 31B have a supply reel 34 disposed at a lower portion near the bottom surface in the device main body 1 as shown in FIG. The supply tape 34 is wound with the adhesive tape 32 attached to one side of the release tape 35.

  The supply reel 34 is covered with a bag-like cover 135 having an opening 134 as shown in FIG. The cover 135 is provided with an air supply port 136. An air supply pump 137 that supplies clean gas to the inside of the cover 135 is connected to the air supply port 136 by an air supply tube 138.

  The gas from the air supply pump 137 is supplied into the cover 135 from the air supply port 136 and flows out from the opening 134 of the cover 135 to the outside as indicated by an arrow in FIG. As a result, dust generated in the apparatus main body 1 is difficult to enter the cover 135, so that dust floating in the apparatus main body 1 is difficult to adhere to the adhesive tape 32 wound around the supply reel 34.

  The adhesive tape 32 adhered to one side surface of the release tape 35 is pulled out from the supply reel 34 through the opening 134 of the cover 135 as shown in FIG. The adhesive tape 32 drawn out together with the release tape 35 from the opening is guided by the guide roller 139, and the release tape 35 is guided substantially vertically upward along the plate surface of the belt-like support block 33.

  The adhesive tape 32 attached to one side surface of the release tape 35 is changed in the horizontal direction so as to face upward by the first guide roller 36, and the adhesive tape attached to the release tape 35. Drive with 32 facing up.

  As shown in an enlarged view in FIG. 4, in a portion where the adhesive tape 32 runs vertically facing the support block 33, a cutter 37 b having two blades is indicated by an arrow by a drive source 37 a constituting the cutting means 37. By being driven in a direction approaching the adhesive tape 32 shown, two cutting lines 32a are formed on the adhesive tape 32 at a predetermined interval. The amount of cut by the cutter 37b is set so that the release tape 35 to which the adhesive tape 32 is attached is not cut by the cutter 37b.

  The part separated from the other part by the two cutting lines 32 a of the adhesive tape 32, that is, the extraction part 32 b is extracted by the extraction means 39 disposed above the cutting means 37. Thereby, the adhesive tape 32 is separated into a predetermined length, that is, a length corresponding to the TCP 4.

  The extraction means 39 includes a drive source 39a, a pressing portion 39b that is driven by the drive source 39a in a direction of coming into contact with and separating from the adhesive tape 32, and a removal tape 40 that is pressed against the extraction portion 32b by the pressing portion 39b. Have

  When a part of the removal tape 40 is pressed against the extraction portion 32b of the adhesive tape 32 by the pressing portion 39b, the extraction portion 32b is adhered to the removal tape 40 and removed. The removal tape 40 is fed out from a supply reel (not shown) and is wound up by a predetermined length by a take-up reel (not shown).

  As shown in FIG. 2, the adhesive tape 32 separated into a predetermined length travels with the release tape 35 in the direction changed in the horizontal direction by the first guide roller 36, and moves with respect to the first guide roller 36. The direction is changed downward by the second guide rollers 41 arranged at predetermined intervals.

  The portion of the release tape 35 between the first guide roller 36 and the second guide roller 41 is for cleaning the TCP 4 held by the holding head 19 positioned at the sticking position C of the index table 22. It travels on the lower surface of the terminal portion.

  The release tape 35 is sandwiched and conveyed intermittently by a predetermined length by a chuck mechanism 42 that is opened and closed by a drive source (not shown) and reciprocated in the vertical direction indicated by Z in FIG. In other words, the portion of the release tape 35 to which the adhesive tape 32 divided into a predetermined length is attached travels horizontally below the holding head 19 positioned at the attachment position C by the chuck mechanism 42. Yes.

  The release tape 35 is intermittently conveyed by the chuck mechanism 42, and the adhesive tape 32 separated into a predetermined length is opposed to the lower part of the terminal portion of the TCP 4 held by the holding head 19 positioned at the attaching position C. Then, the adhesive tape 32 is pressure-bonded to the TCP 4 while being heated by the heat-pressing means 43. That is, in the apparatus main body 1, the heating and pressurizing means 43 is disposed above the supply reel 34 and below the portion of the adhesive tape 32 that runs horizontally.

The heating and pressurizing means 43 has a pressurizing body 45 that is driven in the upward direction by a drive source 44. The pressure body 45 has a built-in heater 45a serving as a heat source. When the pressure body 45 is driven in the upward direction, the pressure body 45 is applied to the terminal portion of the TCP 4 while heating the adhesive tape 32 separated to a predetermined length via the release tape 35. Press. Thereby, the adhesive tape 32 is stuck to the terminal part of TCP4.
In addition, since adhesiveness improves by heating the adhesive tape 32 with the heater 45a provided in the pressurization body 45, it adheres to the terminal part of TCP4 reliably.

  As described above, the heater 45a is built in the pressurizing body 45 of the heating and pressurizing means 43. Therefore, the temperature around the pressurizing body 45 rises due to the heat of the heater 45a, and as the temperature rises, an upward air flow is generated in the apparatus main body 1 from the lower part to the upper part. That is, the ascending airflow flows along the supply reel 34 disposed relatively close to the pressurizing body 45 in the lower part of the apparatus main body 1.

  When the adhesive tape 32 is attached to the TCP 4, the release tape 35 is peeled from the adhesive tape 32 by a release roller (not shown). After peeling, the index table 22 is further rotated 90 degrees. Thereby, the holding head 19 holding the TCP 4 to which the adhesive tape 32 is attached is positioned at a delivery position indicated by D in FIG. At the same time, the release tape 35 is conveyed by the chuck mechanism 42, and a new portion of the adhesive tape 32 cut to a predetermined length is positioned opposite to the TCP 4 at the sticking position C. The portion of the release tape 35 from which the adhesive tape 32 has been adhered and removed is stored in the collection container 46.

  The TCP 4 having the adhesive tape 32 attached and positioned at the delivery position D is delivered to the pair of mounting heads 53 as the mounting means by the pair of second delivery means 51A and 51B. Note that the transfer of the TCP 4 from the pair of second delivery means 51A, 51B to the pair of mounting heads 53 was performed from one of the pair of second delivery means 51A, 51B to one of the pair of mounting heads 53. After that, the other mounting head 53 is performed. That is, the TCP 4 is alternately transferred to the pair of mounting heads 53.

  As shown in FIG. 5, the second delivery means 51 </ b> A, 51 </ b> B has an X guide body 55 arranged along the X direction. The X guide body 55 is provided with a movable body 56 that can be driven by a drive source (not shown). The movable body 56 is provided with a Z drive source 57. The drive shaft 57a of the Z drive source 57 is driven in the Z direction which is the vertical direction, and a receiving member 54 having an L-shaped side surface is attached to the tip thereof.

  The support 54 is driven in the X direction by the movable body 56, and the adhesive tape 32 of the TCP 4 that is sucked and held by the holding head 19 whose upper surface (suction surface) is positioned at the delivery position D is not attached. Positioned to face the other end.

  Next, the receiver 54 is driven upward in the Z direction as indicated by a chain line, and sucks the lower surface of the other end of the TCP 4. At the same time, the suction holding of the TCP 4 by the holding head 19 is released. Thereby, the TCP 4 is transferred from the holding head 19 of the index table 22 to the receiving tool 54.

  When the receiving member 54 receiving the TCP 4 is lowered, the movable body 56 is driven in the direction indicated by the arrow X in FIG. 5 and is positioned at the position indicated by the chain line. As a result, the receiving member 54 is positioned so as to face the lower side of the mounting head 53 that has been waiting above the moving direction. The mounting head 53 is driven in the X, Y, Z, and θ directions by an X / Y / Z / θ drive source 58.

  When the receptacle 54 is positioned below the mounting head 53, the mounting head 53 is driven in the downward direction so that the upper surface of one end portion to which the TCP4 adhesive tape 32 adsorbed and held by the receptacle 54 is attached is attached. Adsorb. At the same time, the TCP4 adsorption state by the receptacle 54 is released. As a result, the TCP 4 is delivered from the receiver 54 to the mounting head 53.

  The mounting head 53 that has received the TCP 4 is positioned above the side portion on which the TCP 4 is mounted on the substrate W sucked and held on the upper surface of the table device 61 as shown in FIG. The mounting head 53 and the substrate W are imaged by an imaging unit (not shown), and the X, Y, Z, and θ drives are performed so that the TCP 4 is positioned above the mounting position of the substrate W based on an imaging signal from the imaging unit. Driven by the source 58 in the X, Y and θ directions.

  When the TCP 4 attracted and held by the mounting head 53 is positioned above the mounting position of the substrate W, the mounting head 53 is driven in the downward direction by the X, Y, Z, and θ driving sources 58. As a result, the TCP 4 attracted and held by the mounting head 53 is mounted on the side portion of the substrate W.

  In this way, the plurality of TCPs 4 to which the adhesive tapes 32 are attached are sequentially mounted at predetermined intervals on the side portions of the substrate W sucked and held on the upper surface of the table device 61 as indicated by chain lines in FIG. The

  A pair of Y guide rails 62 are laid along the width direction of the apparatus main body 1, that is, in the Y direction orthogonal to the X direction, at the front end portion in the apparatus main body 1. The table device 61 is movably provided on the Y guide rail 62 and is driven along the Y guide rail 62 by a drive source (not shown).

  As shown in FIG. 1, a supply port 64 is formed in one side portion in the width direction of the front end portion of the apparatus main body 1. When the table device 61 moves along the Y guide rail 62 to one side in the width direction of the device main body 1, the supply device 63 indicated by a chain line in FIG. 1 is connected to the table in the device main body 1 from the supply port 64. A substrate W is supplied to the apparatus 61.

  A discharge port 66 is formed in the other side in the width direction of the front end of the apparatus main body 1. When the table device 61 moves along the Y guide rail 62 to the other side in the width direction of the device body 1, the discharge device 65 indicated by a chain line in FIG. 1 enters the device body 1 from the discharge port 66. The substrate W of the table device 61, that is, the substrate W on which the plurality of TCPs 4 are mounted on the side portion is carried out.

  As shown in FIG. 6, a nozzle body 67 as a gas jetting unit is provided over the entire length in the width direction at portions facing the upper sides of the supply port 64 and the discharge port 66 on both sides of the apparatus main body 1. The nozzle body 67 is provided with a plurality of injection nozzles 68 at predetermined intervals, and an air curtain is formed at the supply port 64 and the discharge port 66 by clean gas injected from the injection nozzles 68. This prevents outside air including dust from entering the inside of the apparatus body 1 from the outside.

  According to the mounting apparatus having the above-described configuration, the TCP 4 is punched from the carrier tape 3 in the apparatus main body 1 so that dust is generated in the first and second punching apparatuses 5A and 5B, and the terminal portions of the TCP 4 have a predetermined length. The first and second indexing means 18A and 18B that generate dust by cleaning the terminal portion with the rotating brush 28 before the adhesive tape 32 that has been divided is attached, and further, dust may be generated. Various drive mechanisms are arranged.

  Dust generated from the first and second punching devices 5A and 5B, the first and second indexing means 18A and 18B, and various drive mechanisms floats in the apparatus main body 1. Then, after being wound around the supply reel 34 or being fed out from the supply reel 34 and divided into a predetermined length, the TCP 4 is attached to the adhesive tape 32 having adhesiveness and is run horizontally. There is a risk of inviting.

  However, the supply reel 34 is disposed in the lower part of the apparatus main body 1, and a heating / pressurizing means 43 for heating the adhesive tape 32 divided into a predetermined length and sticking it to the TCP 4 is provided above the supply reel 34. It has been.

  The pressure body 45 of the heating and pressurizing means 43 is provided with a heater 45a, and the atmosphere around the pressure body 45 is heated by the heat of the heater 45a. As a result, an upward air flow shown by an arrow U in FIG. 2 is generated in the portion of the apparatus main body 1 where the heating and pressing means 43 is provided.

  In other words, the atmosphere in the apparatus main body 1 gently flows upward from the lower part where the supply reel 34 is provided due to the rising airflow, and dust floating in the apparatus main body 1 also rises with the airflow. This makes it difficult for dust to stay in the lower part of the apparatus main body 1, so that it is possible to prevent dust from adhering to the adhesive tape 32 wound around the supply reel 34 disposed at the lower part of the apparatus main body 1. .

  The supply reel 34 is disposed below the pressurizing body 45 provided with the heater 45a of the pressurizing and heating means 43, and a rising air flow U is generated in the apparatus main body 1 by the heat of the heater 45a. If the updraft U is generated, the outside air having a low temperature is introduced from the bottom in the apparatus main body 1 and rises by the updraft U.

  For this reason, the adhesive tape 32 wound around the supply reel 34 disposed at the bottom of the apparatus main body 1 is not affected by the heat of the heater 45a, so that the adhesive tape 32 can be prevented from deteriorating. it can.

  The adhesive tape 32 is fed upward together with the release tape 35 from the supply reel 34, and then is guided by the first and second guide rollers 36 and 41 to run horizontally. At this time, the release tape 35 is positioned on the lower side, and the adhesive tape 32 is positioned on the upper side and travels horizontally.

  Therefore, even if the rising airflow is generated in the apparatus main body 1 by the heat of the heater 45a of the heating and pressurizing means 43, and the dust in the apparatus main body 1 flows upward from the lower part due to the rising airflow, the upper surface of the release tape 35 It is difficult for dust to adhere to the adhesive tape 32 provided on the surface.

  The heating and pressurizing means 43 for applying pressure while adhering the adhesive tape 32 divided to a predetermined length to the TCP 4 held by the holding head 19 of the index table 22 at the attaching position C is the release tape 35. In addition, it is disposed below the adhesive tape 32 that runs horizontally.

  For this reason, even when the heating and pressing means 43 repeatedly operates to stick the adhesive tape 32 to the TCP 4, dust is generated from the driving portion, and even if the dust flows in the upward direction by the rising airflow, the mold release is performed. Adhesion to the adhesive tape 32 located on the upper surface side of the tape 35 is prevented.

  In addition, when the dust generated by the heating and pressurizing means 43 is relatively large, the dust does not rise with the rising air flow generated by the heat of the heater 45a, but falls due to its own weight. Since the heating and pressurizing means 43 is disposed below the portion of the adhesive tape 32 that travels horizontally, the dust generated by the heating and pressurizing means 43 and falling under its own weight adheres to the adhesive tape 32. Absent.

  The supply reel 34 is covered with a cover 135, and gas is supplied into the cover 135 from an air supply port 136. The gas supplied into the cover 135 flows out from the opening 134.

  Therefore, it is difficult for dust to enter into the cover 135 due to the flow of gas supplied into the cover 135 covering the supply reel 34, so that it is difficult for dust to adhere to the adhesive tape 32 wound around the supply reel 34. Become.

  In the above embodiment, the punching device, the index means, the sticking device, etc. are provided in the apparatus main body symmetrically, that is, one pair is provided. However, depending on the size of the substrate on which the TCP is mounted, the punching device, the index means, etc. The sticking device or the like may be one set, and even in such a case, the present invention can be applied.

The top view which shows the internal structure of the mounting apparatus of one embodiment of this invention. The side view which shows the internal structure of a mounting apparatus. The side view which shows the state which cleans TCP hold | maintained at the holding head in a brushing position. The side view which shows the state which divides | segments the adhesive tape affixed on the release tape from the supply reel, and having been drawn out to predetermined length. The side view which shows the state which delivers TCP with the adhesive tape stuck at the delivery position to a mounting head. The front view of the part in which the supply port and discharge port of the side wall of the apparatus main body were formed. The front view which shows the supply reel covered with the cover.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Apparatus body, 3 ... Carrier tape, 4 ... TCP (electronic component), 5A, 5B ... Punching device, 6A, 6B ... 1st delivery means, 11 ... Upper metal mold, 12 ... Lower metal mold, 18A, 18B ... Indexing means, 19 ... Holding head, 31A, 31B ... Sticking device, 32 ... Adhesive tape, 35 ... Release tape, 51A, 51B ... Second delivery means, 53 ... Mounting head (mounting means), 61 ... Table Device: 136 ... Air supply port body, 137 ... Air supply pump, 134 ... Opening, 135 ... Cover.

Claims (6)

A mounting device for mounting electronic components on the side of a substrate,
The device body;
A punching device that is provided at one end of the device body in the front-rear direction and punches the electronic component from a tape-like member;
Receiving means for receiving the electronic component punched by the punching device and transporting it to a predetermined position; and
Index means having a plurality of holding heads for receiving and holding the electronic components conveyed by the delivery means;
An attaching device for attaching an adhesive tape to the electronic component delivered to the holding head of the index means;
A table device provided at the other end of the apparatus body in the front-rear direction for receiving and positioning the substrate;
A mounting means for mounting the electronic component having the adhesive tape attached to the substrate positioned by the table device by the attaching device;
The sticking device is
A supply reel provided on the lower part of the apparatus body, the adhesive tape being attached to a release tape and wound;
Affixed to the electronic component while heating the adhesive tape provided above the supply reel in the main body of the apparatus and fed out from the supply reel together with the release tape and divided into a predetermined length. An electronic component mounting apparatus comprising: a heating and pressurizing unit.   The adhesive tape is fed upward from the supply reel together with the release tape, is horizontally changed so that the adhesive tape faces upward, and faces the lower surface of the electronic component held by the holding head of the index means. The electronic component mounting apparatus according to claim 1, wherein the electronic component mounting apparatus is allowed to travel.   The heating and pressurizing means is disposed below the adhesive tape that runs horizontally, and presses the adhesive tape divided into a predetermined length from below through the release tape to the lower surface of the electronic component. The electronic component mounting apparatus according to claim 1, wherein the electronic component mounting apparatus is attached.   2. The electronic component mounting apparatus according to claim 1, wherein the supply reel is covered with a cover.   5. The electronic component mounting apparatus according to claim 4, wherein a gas for preventing dust from entering the cover is supplied into the cover. A mounting method for mounting an electronic component on a side of a substrate,
A step of punching out the electronic component from a tape-like member provided at one end of the apparatus body in the front-rear direction;
Receiving the electronic component punched from the tape-shaped member and transporting it to a predetermined position;
Receiving the electronic component conveyed to a predetermined position and delivering it to the holding head of the index means;
A step of paying out the adhesive tape from a supply reel arranged at the lower part of the apparatus main body, dividing the adhesive tape into a predetermined length and sticking it to the electronic component delivered to the holding head of the index means;
Mounting the electronic component having the adhesive tape attached to the substrate held by a table device provided at the other end in the front-rear direction of the device main body. Method.

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