JP2004287767A - Noncontact communication type information carrier - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a noncontact communication type information carrier having satisfactory communication characteristic and excellent in multifunctionality and versatility. <P>SOLUTION: This noncontact communication type information carrier comprises a semiconductor chip 2 having an antenna coil 1 integrally formed thereon, a booster coil 3 electromagnetic induction-coupled with the antenna coil 1 integrally formed on the semiconductor chip 2 and an antenna coil provided on a reader/writer, and an insulating member 6 supporting the semicondcutor chip 2 and the booster coil 3. The semiconductor chip 2 is set in an angle corner part of the booster coil 3 so that the antenna coil 1 is turned to the insulating member 6 side, and the coil non-forming area 1a of the antenna coil 1 partially overlaps with the coil non-forming area 3a of the booster coil 3. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a non-contact communication type information carrier having a semiconductor chip and a booster coil integrally formed with an antenna coil, and more particularly, to a shape and an arrangement of the antenna coil and the booster coil.
[0002]
[Prior art]
Conventionally, a semiconductor chip and an antenna coil electrically connected to a terminal portion of the semiconductor chip are provided in an insulating member, and electromagnetic waves are used to receive power from a reader / writer and transmit / receive signals to / from the reader / writer. A non-contact type information carrier that performs non-contact operation is known. This type of information carrier has a card shape, a coin shape, a button shape, a tag shape, or the like, depending on its outer shape.
[0003]
Conventionally, as this type of information carrier, one in which an antenna coil is formed in a pattern on an insulating member, or one in which an antenna coil formed of a winding is supported on an insulating member has been used. No need to protect the connection point with the semiconductor chip or take measures against moisture proof, it can be made at low cost, and even if stress such as bending or torsion acts on the insulating member, the coil does not break and has excellent durability. Accordingly, a semiconductor chip in which an antenna coil is integrally formed on a semiconductor chip itself is mounted on an insulating member.
[0004]
When the antenna coil is integrally formed on the semiconductor chip, the coil diameter and the conductor width are smaller than when the antenna coil is patterned on an insulating member or the antenna coil formed of a winding is carried on the insulating member, Since the number of turns is naturally limited, it is difficult to increase the communication distance with the reader / writer, and the necessary communication distance may not be secured. Therefore, conventionally, between an antenna coil integrally formed on a semiconductor chip and an antenna coil provided in a reader / writer, at least one winding has a cross-sectional area in order to strengthen electromagnetic induction coupling between the antenna coils. A second conductor loop having substantially the dimensions of a data medium device (insulating member), and a first conductor loop having at least one winding and having a cross-sectional area connected to the semiconductor chip (an antenna integrally formed with the semiconductor chip). A third loop having substantially the dimensions of a coil), wherein the first and third conductor loops are arranged substantially concentrically, and the first and second conductor loops are inductively coupled to each other via the third loop. A technique has been proposed (see, for example, Patent Document 1).
[0005]
In this specification, a conductor loop for enhancing the electromagnetic induction coupling between the antenna coils is referred to as a “booster coil”.
[0006]
[Patent Document 1]
JP-A-8-532904 (FIG. 1)
[0007]
[Problems to be solved by the invention]
According to the technique described in the patent document, the antenna coil integrally formed on the semiconductor chip and the antenna coil provided on the reader / writer are electromagnetically inductively coupled to each other via the booster coil. The inductive coupling is strengthened, and the communication distance between the non-contact communication type information carrier and the reader / writer can be extended.
[0008]
However, the technology described in the above-mentioned patent document arranges an antenna coil (first conductor loop) integrally formed on a semiconductor chip and a third conductor loop formed on a booster coil in a substantially concentric predetermined positional relationship. Therefore, good electromagnetic induction coupling cannot be obtained unless the position of each conductor loop is strictly regulated. There is a problem that the communication distance between the carrier and the reader / writer tends to vary. In addition, since the arrangement position of each conductor loop must be strictly regulated, there is a problem that the mounting process of the semiconductor chip on the insulating member is complicated and the cost of the non-contact communication information carrier is increased.
[0009]
The present invention has been made to solve the deficiencies of the related art, and an object thereof is to provide a non-contact communication information carrier which can be manufactured at low cost and has stable communication characteristics with a reader / writer. It is in.
[0010]
[Means for Solving the Problems]
In order to solve the above-described problems, the present invention firstly provides a semiconductor chip having an antenna coil integrally formed thereon, and an electromagnetic induction coupling with an antenna coil formed integrally with the semiconductor chip and an antenna coil provided in a reader / writer. In a non-contact communication type information carrier provided with a booster coil and an insulating member carrying the semiconductor chip and the booster coil, both the booster coil and the antenna coil formed integrally with the semiconductor chip are coiled on the inner peripheral portion. When formed in a spiral shape having a non-formation area, when viewed from the plane direction of the insulating substrate, at least one of the coil non-formation area of the booster coil and the coil non-formation area of the antenna coil integrally formed with the semiconductor chip is provided. A configuration in which the semiconductor chip and the booster coil are arranged so as to overlap each other. It was.
[0011]
Thus, when the semiconductor chip and the booster coil are arranged such that the coil non-formation region of the booster coil and the coil non-formation region of the antenna coil integrally formed on the semiconductor chip at least partially overlap, the number of turns of the booster coil and Regardless of the number of turns of the antenna coil, the conductor of each turn constituting the antenna coil can be exposed in at least a part thereof in the coil-free area of the booster coil. The coupling is performed, so that the electromagnetic induction coupling between the booster coil and the antenna coil can be strengthened, and the communication distance between the non-contact communication type information carrier and the reader / writer can be extended. In addition, as long as the coil non-forming regions are arranged so as to overlap at least in part, good electromagnetic induction coupling between the booster coil and the antenna coil can be achieved even if the arrangement of the semiconductor chip and the booster coil is slightly shifted. Since it can be maintained, the process of mounting the semiconductor chip on the insulating member can be simplified, the cost of the non-contact communication information carrier can be reduced, and the communication distance between the non-contact communication information carrier and the reader / writer varies. Can be reduced.
[0012]
According to another aspect of the present invention, there is provided a non-contact communication information carrier according to the first aspect, wherein the booster coil and the antenna coil are formed integrally with the semiconductor chip. Are formed in a rectangular spiral shape having a coil non-forming region on the inner peripheral portion, and the semiconductor chip is disposed at a corner of the booster coil.
[0013]
As described above, when the semiconductor chip is arranged at the corner of the booster coil formed in a rectangular spiral shape, the electromagnetic induction coupling between the booster coil and the antenna coil formed integrally with the semiconductor chip can be further enhanced. As a result, the communication distance between the non-contact communication type information carrier and the reader / writer can be further extended.
[0014]
Thirdly, in order to solve the above-mentioned problem, in the non-contact communication type information carrier according to the first problem solving means, an antenna coil integrally formed with the booster coil and the semiconductor chip Are formed in a rectangular spiral shape having a coil non-forming region in the inner peripheral portion, and the semiconductor chip is arranged along the side of the booster coil.
[0015]
By arranging the semiconductor chip along the side of the booster coil formed in a rectangular spiral as described above, the degree of freedom of the setting position of the semiconductor chip in the direction along the side of the booster coil can be increased. The process of mounting the semiconductor chip on the insulating member can be simplified, and the cost of the non-contact communication information carrier can be reduced.
[0016]
Fourth, the present invention provides a contactless communication information carrier according to the first problem solving means, wherein one booster coil is formed on the insulating substrate. A plurality of the semiconductor chips are arranged for one booster coil.
[0017]
As described above, when one booster coil is formed on an insulating substrate, compared to a case where a plurality of booster coils are formed on an insulating member, when a plurality of the semiconductor chips are arranged for one booster coil, Since different functions can be exhibited for each chip and can be applied to different uses, multifunctional and multipurpose noncontact communication information carriers can be achieved.
[0018]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, an embodiment of a non-contact communication type information carrier according to the present invention will be described with reference to FIGS. FIG. 1 is a plan view showing an arrangement of a booster coil and a semiconductor chip provided on a non-contact communication type information carrier according to an embodiment, FIG. 2 is a sectional view taken along line AA of FIG. 1, and FIG. FIG. 4 is a diagram schematically illustrating an arrangement of an antenna coil integrally formed on a chip, FIG. 4 is a diagram schematically illustrating an arrangement of an antenna coil integrally formed on a semiconductor chip, and FIG. 5 is a surface of an insulating member; FIG. 6 is a rear view of the insulating member, FIG. 7 is a plan view of the semiconductor chip, and FIG. 8 is an equivalent circuit diagram of a booster coil provided in the non-contact communication type information carrier of this embodiment.
[0019]
As shown in FIGS. 1 and 2, the non-contact communication type information carrier of the present embodiment includes a semiconductor chip 2 integrally formed with an antenna coil 1, a booster coil 3, and conductor films 4 a, 4 b, and 4. It comprises an insulating member 6 on which 5a and 5b are formed, and a base 7 casing the semiconductor chip 2 and the insulating member 6 integrally.
[0020]
As shown in FIG. 7, the semiconductor chip 2 has a rectangular spiral antenna having a coil non-formation area 1a on the inner periphery thereof via an insulating layer 2b made of a polyimide resin film or the like on the surface on which the input / output terminals 2a are formed. The coil 1 is formed integrally. The antenna coil 1 is formed by a photoresist method, that is, a photolithography method except for an input / output terminal forming portion, on an insulating layer forming surface of a semiconductor chip 2 (more practically, a completed wafer before being divided into individual semiconductor chips). After forming a resist layer to a uniform thickness, exposing and developing a required coil pattern on the photoresist layer, a conductive metal material is sputtered or vacuum-formed on the insulating layer 2b of the semiconductor chip 2 using the photoresist layer as a mask. After the vapor deposition, the photoresist layer is removed, and a coil pattern made of a conductive metal material is formed on the formation surface of the input / output terminal 2a. In order to reduce the electric resistance of the coil pattern, a copper plating layer may be formed on the surface of the conductive metal film.
[0021]
In the example of FIG. 7, the antenna coil 1 is formed in a rectangular spiral shape having a plurality of turns, but the number of turns and the planar shape of the antenna coil 1 are not limited thereto. That is, the number of turns can be any number of one or more turns, and the planar shape can be formed into an arbitrary shape such as a rectangle or a circle having a diagonal or arcuate chamfer at a corner. it can.
[0022]
As shown in FIG. 5, the booster coil 3 is formed on the surface of the insulating member 6 in a rectangular spiral shape having a coil non-formation region 3a on the inner periphery. The booster coil 3 is formed as large as possible within a range that can be accommodated in the base 7, and conductor films 4 a and 4 b that form a capacitance are connected to both ends of the booster coil 3.
[0023]
In the example shown in FIG. 5, the booster coil 3 is formed in a rectangular spiral shape having a plurality of turns. However, the number of turns and the planar shape of the booster coil 3 are not limited to this, and the above-described antenna is used. Like the coil 1, it can be formed into an arbitrary number of turns and a shape.
[0024]
As shown in FIGS. 1 to 4, the semiconductor chip 2 has the antenna coil 1 facing the insulating member 6, and the coil non-formation region 1 a of the antenna coil 1 and the coil non-formation region 3 a of the booster coil 3 are in one. The booster coil 3 is set at the corner of the booster coil 3 so as to overlap each other.
[0025]
The conductor films 4a and 5a and 4b and 5b forming the capacitance are formed on the front and back surfaces of the insulating member 6 so as to face each other. In addition, the conductor films 4a and 4b that form the capacitance formed on the front surface side of the insulating member 6 are electrically connected via the booster coil 3 and formed on the back surface side of the insulating member 6 as described above. As shown in FIG. 6, the conductor films 5a and 5b which form the formed capacitance are electrically connected via the conducting wire 5c. Therefore, the booster coil 3 is capacitively coupled at both ends thereof through conductor films 4a and 5a and 4b and 5b which form capacitances which are arranged opposite to each other, as schematically shown in FIG. Then, the booster coil 3 in which the capacitance Ca formed by the conductor films 4a and 5a and the capacitance Cb formed by the conductor films 4b and 5b are connected to both ends is obtained. The area of each of the conductor films 4a, 5a, 4b, 5b is determined by considering the series impedance of the two capacitances Ca, Cb in the system including the antenna coil 1 and the booster coil 3 integrally formed on the semiconductor chip 2. It is adjusted so that the maximum voltage is obtained at both ends of the coil 1.
[0026]
The booster coil 3 and the conductive films 4a, 5a, 4b, 5b forming the capacitance are formed by etching a conductive metal layer having a uniform thickness formed on one surface of the insulating member 6 to form a required coil pattern. The insulating member 6 can be formed by a printing method of printing a required conductive pattern on one surface of the insulating member 6 using conductive ink.
[0027]
The insulating member 6 is formed of an insulating material having a required permittivity and rigidity. Examples of an insulating material suitable for forming the insulating member 6 include a glass epoxy resin, a polyimide resin, a polyamide resin, a polyethylene terephthalate resin (hereinafter abbreviated as PET), a vinyl chloride resin, and the like.
[0028]
The base 7 includes a cover sheet 8 and an adhesive layer 9. Of these, the cover sheet 8 can be formed of any sheet-like material such as paper or plastic sheet. However, the cover sheet 8 decomposes when discarded and does not generate harmful substances such as dioxin when incinerated. It is most preferable to form with. When a plastic sheet is used as a cover sheet material, it is particularly preferable to use a chlorine-free plastic sheet such as PET because it does not generate harmful substances such as dioxin even when incinerated. On the other hand, as the adhesive constituting the adhesive layer 9, any adhesive having a required hardness after curing can be used. However, in order to enhance the protection effect of the booster coil 1, the antenna coil 3, and the semiconductor chip 4, For example, it is particularly preferable to use a resin material having low hygroscopicity such as an epoxy resin.
[0029]
The non-contact communication type information carrier of the present example is configured so that the coil non-forming region 1a of the antenna coil 1 and the coil non-forming region 3a of the booster coil 3 which are integrally formed on the semiconductor chip 2 partially overlap each other. Since the booster coil 3 is disposed, the antenna coil 1 is configured in the coil non-forming region 3a of the booster coil 3 regardless of the number of turns of the antenna coil 1 and the number of turns of the booster coil 3, as schematically shown in FIG. A portion of the conductor of each turn can be exposed. In the exposed portion, since no interference occurs with the magnetic lines of force radiated from the booster coil 3, optimal electromagnetic induction coupling is performed, and the electromagnetic induction coupling between the non-contact communication type information carrier and the reader / writer is enhanced. Can be. When transmitting from the antenna coil 1 to the booster coil 3, optimum electromagnetic induction coupling is performed for the same reason. Further, in the non-contact communication type information carrier of this example, as long as the coil non-forming regions 1a and 3a are arranged so as to partially overlap each other, even if the arrangement of the semiconductor chip 2 and the booster coil 3 is slightly shifted. Since good electromagnetic induction coupling between the antenna coil 1 and the booster coil 3 can be maintained, the process of mounting the semiconductor chip 2 on the insulating member 6 can be simplified, and the cost of the non-contact communication information carrier can be reduced. At the same time, variation in the communication distance between the non-contact communication type information carrier and the reader / writer can be reduced. Further, in the non-contact communication type information carrier of this embodiment, the semiconductor chip 2 is arranged at the corner of the booster coil 3 formed in a rectangular spiral shape, so that the electromagnetic induction coupling between the antenna coil 1 and the booster coil 3 can be improved. It can be more robust.
[0030]
Hereinafter, other embodiments of the present invention will be listed. FIG. 9 is a diagram schematically showing another example of the arrangement of the antenna coil 1 with respect to the booster coil 3.
[0031]
(1) In the above embodiment, the semiconductor chip 2 and the booster coil 3 are arranged such that the coil non-formation region 1a of the antenna coil 1 and the coil non-formation region 3a of the booster coil 3 partially overlap. The gist of the present invention is not limited to this. As shown in FIG. 9A, the coil non-forming region 1a of the antenna coil 1 and the coil non-forming region 3a of the booster coil 3 completely overlap each other. The semiconductor chip 2 and the booster coil 3 can be arranged.
[0032]
(2) In the above embodiment, the semiconductor chip 2 is arranged at the corner of the booster coil 3, but the gist of the present invention is not limited to this, and as shown in FIG. The semiconductor chip 2 can be arranged along the side of the booster coil 3. By arranging the semiconductor chip 2 along the side of the booster coil 3 as described above, the degree of freedom of the setting position of the semiconductor chip 2 with respect to the direction along the side of the booster coil 3 can be increased. Can be simplified, and the cost of the non-contact communication type information carrier can be reduced.
[0033]
(3) In the above embodiment, only one semiconductor chip 2 is mounted on one insulating substrate 6, but the gist of the present invention is not limited to this, and is shown in FIG. As described above, a plurality of semiconductor chips 2 can be mounted on one insulating substrate 6. As described above, when a plurality of semiconductor chips 2 are mounted on one insulating substrate 6, each semiconductor chip 2 exerts a different function and can be applied to different uses. Can be multifunctional and versatile.
[0034]
(4) In the above embodiment, the conductor films 4a, 5a, 4b, 5b for forming capacitance are formed on the insulating substrate 6, but the gist of the present invention is not limited to this. And the like can be connected to the booster coil 3 formed on the insulating substrate 6.
[0035]
【The invention's effect】
As described above, the non-contact communication type information carrier of the present invention is configured such that the semiconductor chip is formed such that the coil-free area of the antenna coil and the coil-free area of the booster coil which are integrally formed on the semiconductor chip at least partially overlap. And the booster coil are arranged, so that a part of the conductor of each turn constituting the antenna coil can be exposed in the coil-free area of the booster coil regardless of the number of turns of the antenna coil and the number of turns of the booster coil. Optimal electromagnetic induction coupling between the antenna coil and the booster coil without magnetic interference can be performed in the exposed portion, and the electromagnetic induction coupling between the non-contact communication type information carrier and the reader / writer can be enhanced. . Further, the non-contact communication type information carrier of the present invention, the semiconductor chip and the booster coil, as long as the coil non-formation area of the antenna coil and the coil non-formation area of the booster coil are arranged so as to at least partially overlap each other. Even if the arrangement is slightly deviated, good electromagnetic induction coupling between the antenna coil and the booster coil can be maintained, so that the process of mounting the semiconductor chip on the insulating member can be simplified and the contactless communication information carrier can be reduced. The cost can be reduced, and the variation in the communication distance between the non-contact communication type information carrier and the reader / writer can be reduced.
[Brief description of the drawings]
FIG. 1 is a plan view showing an arrangement of a booster coil and a semiconductor chip provided on a non-contact communication type information carrier according to an embodiment.
FIG. 2 is a sectional view taken along line AA of FIG.
FIG. 3 is a diagram schematically showing an arrangement of a booster coil and an antenna coil formed integrally with a semiconductor chip.
FIG. 4 is a diagram schematically showing an arrangement of a booster coil and an antenna coil formed integrally with a semiconductor chip.
FIG. 5 is a front view of the insulating member.
FIG. 6 is a rear view of the insulating member.
FIG. 7 is a plan view of a semiconductor chip.
FIG. 8 is an equivalent circuit diagram of a booster coil provided on the non-contact communication type information carrier.
FIG. 9 is a diagram schematically showing another example of the arrangement of the semiconductor chips with respect to the booster coil.
[Explanation of symbols]
REFERENCE SIGNS LIST 1 antenna coil 1 a coil-free area 2 semiconductor chip 3 booster coil 3 a coil-free area 4 a, 4 b, 5 a, 5 b conductive film 6 forming capacitance 6 insulating member 7 base 8 cover sheet 9 adhesive layer

Claims (4)

A semiconductor chip in which an antenna coil is integrally formed, a booster coil electromagnetically inductively coupled to the antenna coil integrally formed in the semiconductor chip and an antenna coil provided in a reader / writer, and an insulating member carrying the semiconductor chip and the booster coil In the non-contact communication type information carrier provided with the above, both the booster coil and the antenna coil formed integrally with the semiconductor chip are formed in a spiral shape having a coil non-forming area on the inner peripheral part, and the plane of the insulating substrate When viewed from the direction, the semiconductor chip and the booster coil are arranged such that the coil non-formed area of the booster coil and the coil non-formed area of the antenna coil integrally formed on the semiconductor chip at least partially overlap. Non-contact communication type information carrier characterized by the above-mentioned. 2. The non-contact communication type information carrier according to claim 1, wherein both the booster coil and the antenna coil formed integrally with the semiconductor chip are formed in a rectangular spiral shape having a coil non-formation area on an inner peripheral portion. A non-contact communication type information carrier, wherein the semiconductor chip is arranged at a corner of a coil. 2. The non-contact communication type information carrier according to claim 1, wherein both the booster coil and the antenna coil formed integrally with the semiconductor chip are formed in a rectangular spiral shape having a coil non-formation area on an inner peripheral portion. A non-contact communication type information carrier, wherein the semiconductor chip is arranged along a side portion of a coil. 2. The non-contact communication information carrier according to claim 1, wherein one booster coil is formed on the insulating substrate, and a plurality of the semiconductor chips are arranged for the one booster coil. Contact communication type information carrier.

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