JP2002184329A - Image display device and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an image display device that can be easily sealed in a vacuum atmosphere and its manufacturing method. SOLUTION: The vacuum outer case of image display device has a back substrate and a front substrate 11 arranged opposed to each other and a side wall provided between these substrates. A fluorescent screen 16 is formed on the inner face of the front substrate and electron emission elements are provided on the back substrate. A primary coat 31 and an indium layer overlapping this primary coat are formed on the sealing face 11a between the front substrate and the side wall, and at least one of the primary coat and the indium layer has protruded parts 31a, 32a protruding from the sealing face. By heating and melting indium in a vacuum atmosphere, the front substrate and the back substrate are mutually sealed through the side wall.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image display device comprising: an envelope having a rear substrate and a front substrate opposed to each other; and a plurality of image display elements provided inside the envelope. And its manufacturing method.

[0002]

2. Description of the Related Art In recent years, electron-emitting devices (hereinafter referred to as emitters) have been developed as next-generation light-weight and thin flat-panel display devices.
Are being developed, and a display device in which the display device is arranged to face the phosphor screen is being developed. As the emitter, a field emission type or surface conduction type element is assumed. Generally, a display device using a field emission type electron-emitting device as an emitter is a field emission display (hereinafter, referred to as an FED), and a display device using a surface conduction type electron-emitting device as an emitter is a surface emission type. This is called a display (hereinafter, referred to as SED).

For example, an FED generally has a front substrate and a rear substrate opposed to each other with a predetermined gap therebetween.
These substrates constitute a vacuum envelope by joining their peripheral parts to each other via a rectangular frame-shaped side wall.
A phosphor screen is formed on the inner surface of the front substrate, and a number of emitters are provided on the inner surface of the rear substrate as electron emission sources for exciting the phosphor to emit light. In addition, a plurality of support members are disposed between the rear substrate and the front substrate to support the atmospheric load applied thereto.

The potential on the rear substrate side is almost 0 V, and an anode voltage Va is applied to the phosphor screen. An image is displayed by irradiating the red, green, and blue phosphors constituting the phosphor screen with an electron beam emitted from the emitter to cause the phosphors to emit light.

In such an FED, the gap between the front substrate and the rear substrate can be set to several mm or less, and compared with a cathode ray tube (CRT) currently used as a display of a television or a computer. Lightening and thinning can be achieved.

[0006]

SUMMARY OF THE INVENTION The above-mentioned flat panel display device
Then, the degree of vacuum inside the vacuum envelope is set to, for example, 10^-5-10
^-6It is necessary to keep Pa. In the conventional evacuation process, vacuum
Baking process to heat the envelope to about 300 ° C
To release the surface adsorption gas inside the envelope.
However, with such an exhaust method, the surface adsorbed gas
It cannot be released.

For example, Japanese Patent Application Laid-Open No. Hei 9-82245 discloses a configuration in which a metal back formed on a phosphor screen of a front substrate is covered with a getter material made of Ti, Zr, or an alloy thereof. A flat panel display device having a configuration in which the device itself is formed with the above-described getter material, or a configuration in which the getter material as described above is arranged in a portion other than the electron-emitting device in the image display area is described.

However, in the image display device disclosed in Japanese Patent Application Laid-Open No. 9-82245, since the getter material is formed by a normal panel process, the surface of the getter material is naturally oxidized. Since the getter material is particularly important in the degree of surface activity, a getter material whose surface has been oxidized cannot obtain a satisfactory gas adsorption effect.

As a method of increasing the degree of vacuum inside the vacuum envelope, the back substrate, the side walls, and the front substrate are put into a vacuum apparatus, and they are subjected to baking and electron beam irradiation in a vacuum atmosphere to adsorb the surface. After the gas is released, a method of forming a getter film and sealing the side wall to the rear substrate and the front substrate using frit glass or the like in a vacuum atmosphere is considered. According to this method, the surface adsorption gas can be sufficiently released by the electron beam cleaning, and the getter film is not oxidized, and a sufficient gas adsorption effect can be obtained. Further, since no exhaust pipe is required, the space of the image display device is not wasted.

However, when sealing is performed using frit glass in a vacuum, it is necessary to heat the frit glass to a high temperature of 400 ° C. or more. At that time, a number of bubbles are generated from the frit glass, and There is a problem that the hermeticity and sealing strength of the enclosure are deteriorated, and the reliability is reduced. In addition, due to the characteristics of the electron-emitting device, it may be better to avoid raising the temperature to 400 ° C. or higher. In such a case, a method of sealing with frit glass is not preferable.

An object of the present invention is to provide an image display device capable of easily performing sealing in a vacuum atmosphere, and a method of manufacturing the same.

[0012]

In order to achieve the above object, an image display apparatus according to the present invention comprises an envelope having a rear substrate, a front substrate opposed to the rear substrate, and A plurality of pixel display elements provided inside the container, wherein a sealing surface between the front substrate and the back substrate is sealed by a metal sealing material layer, and the metal sealing material The layer is characterized by having a protruding portion protruding from the sealing surface.

According to another aspect of the present invention, there is provided an image display apparatus comprising: an envelope having a rear substrate, a front substrate opposed to the rear substrate, and a plurality of pixel displays provided inside the envelope. An element, and the sealing surface between the front substrate and the rear substrate is sealed with a base layer and a different type of metal sealing material layer provided on the base layer and the base layer. At least one of the underlayer and the metal sealing material layer has a protrusion protruding from the sealing surface.

Another image display apparatus according to the present invention is provided between a rear substrate, a front substrate opposed to the rear substrate, and a peripheral portion of the front substrate and a peripheral portion of the rear substrate. And a plurality of pixel display elements provided inside the envelope, a sealing surface between the front substrate and the sidewall, and the rear substrate and the sidewall. At least one of the sealing surfaces is sealed with a metal sealing material layer, and the metal sealing material layer has a protrusion protruding from the sealing surface. I have.

According to another aspect of the present invention, there is provided an image display apparatus including a rear substrate, a front substrate opposed to the rear substrate, and a peripheral portion of the front substrate and a peripheral portion of the rear substrate. An enclosure having a provided side wall, and a plurality of pixel display elements provided inside the enclosure, a sealing surface between the front substrate and the side wall, and the back substrate At least one of the sealing surfaces between the base layer and the side wall is sealed by an underlayer and a metal sealing material layer provided on the underlayer and the underlayer and a different kind of metal sealing material. At least one of the material layers has a protrusion protruding from the sealing surface.

Further, according to the image display device of the present invention, the sealing surface has a rectangular frame shape extending along the peripheral portion of the front substrate or the rear substrate, and includes a plurality of linear portions and corner portions. And the protruding portion is provided on at least one of the linear portion and the corner portion of the sealing surface.

On the other hand, a method of manufacturing an image display device according to the present invention comprises an envelope having a rear substrate, a front substrate disposed to face the rear substrate, and a plurality of envelopes provided inside the envelope. Forming a base layer along a sealing surface between the back substrate and the front substrate, and a metal seal different from the base layer. A step of forming a bonding material layer on the underlayer, and forming the underlayer and the metal sealing material layer,
Forming a protrusion protruding from the sealing surface on at least one of the base layer and the metal sealing material layer, and forming the base layer and the metal sealing layer on the back substrate and the front substrate in a vacuum atmosphere. Heating the metal sealing material layer to melt the metal sealing material layer and sealing the rear substrate and the front substrate on the sealing surface.

In the image display device and the method of manufacturing the same according to the present invention, the metal sealing material may be 350 ° C.
A low melting point metal material having the following melting point is used, for example, indium or an alloy containing indium is used. The underlayer is preferably a material having good wettability and airtightness with respect to the metal sealing material, that is, a material having high affinity, and at least one of silver, gold, aluminum, nickel, cobalt, and copper is preferable. One containing metal paste, silver,
A metal plating layer or a deposition film containing at least one of gold, aluminum, nickel, cobalt, and copper, a glass material, or the like is used.

According to the image display device and the method of manufacturing the same as described above, the front substrate and the rear substrate are directly or indirectly sealed using the metal sealing material layer, so that the image display device is provided on the rear substrate. The sealing can be performed at a low temperature that does not thermally damage the electron-emitting devices and the like that have been set. Further, unlike the case where frit glass is used, many air bubbles are not generated, and the airtightness and sealing strength of the vacuum envelope can be improved. At the same time, by providing an underlayer different from the metal sealing material layer, even when the metal sealing material is melted and becomes less viscous at the time of sealing, the flow of the metal sealing material is prevented by the underlayer and a predetermined position is provided. Can be held.

Further, according to the present invention, at least one of the base layer and the metal sealing material layer is provided with a protruding portion projecting from the sealing surface. For this reason, it is possible to reliably seal the sealing surface without causing a leak or the like and without excess metal sealing material protruding onto wiring or the like. That is, since the sealing with the metal sealing material is performed in a state in which the metal sealing material is melted, when the filling amount of the metal sealing material is small, sufficient sealing is not performed and a leak or the like may occur, and On the other hand, if the filling amount is large, it may protrude into an undesired portion, and the display performance as an image display device may be deteriorated. Therefore, by providing the above-described protrusion, the metal sealing material is set sufficiently, and even if excess metal sealing material is generated at the time of sealing, this excess metal sealing material is guided to the protrusion. be able to. Therefore,
It is possible to obtain an image display device which is easy to handle and can easily and reliably perform sealing in a vacuum atmosphere, and a method for manufacturing the same.

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment in which an image display device of the present invention is applied to an FED will be described in detail with reference to the drawings. As shown in FIGS. 1 and 2, the FED includes a front substrate 11 and a rear substrate 12 each made of rectangular glass as an insulating substrate, and these substrates have a gap of about 1.5 to 3.0 mm. They are placed facing each other. Then, the front substrate 11 and the rear substrate 1
Reference numeral 2 denotes a flat rectangular vacuum envelope 10 whose peripheral portions are joined to each other via a rectangular frame-shaped side wall 18 and the inside of which is maintained in a vacuum state.

Inside the vacuum envelope 10, a back substrate 12
And to support the atmospheric pressure load applied to the front substrate 11,
A plurality of support members 14 are provided. These support members 14 extend in a direction parallel to the long sides of the vacuum envelope 10 and are arranged at predetermined intervals along a direction parallel to the short sides. The shape of the support member 14 is not particularly limited to this, and a columnar support member may be used.

As shown in FIG. 3, a phosphor screen 16 is formed on the inner surface of the front substrate 11. The phosphor screen 16 is formed of phosphor layers R, G, and B emitting three colors of red, green, and blue, and a matrix-shaped black light absorbing portion 20. The above-described support member 14 is placed so as to be hidden by the shadow of the black light absorbing portion. On the phosphor screen 16, an aluminum layer (not shown) is deposited as a metal back.

As shown in FIG. 2, on the inner surface of the back substrate 12, a large number of field emission type electron-emitting devices each emitting an electron beam are provided as electron emission sources for exciting the phosphor layers R, G, and B. 22 are provided. These electron-emitting devices 22 are arranged in a plurality of columns and a plurality of rows corresponding to each pixel, and function as a pixel display device.

More specifically, a conductive cathode layer 24 is formed on the inner surface of the back substrate 12, and a silicon dioxide film 26 having a number of cavities 25 is formed on the conductive cathode layer. . On the silicon dioxide film 26, a gate electrode 28 made of molybdenum, niobium or the like is formed. A cone-shaped electron-emitting device 22 made of molybdenum or the like is provided in each cavity 25 on the inner surface of the back substrate 12. In addition, on the back substrate 12, a matrix-like wiring (not shown) connected to the electron-emitting device 22 is formed. These wirings are drawn out from at least one long side and one short side of the back substrate 12.

In the FED configured as described above,
The video signal is input to the electron-emitting device 22 and the gate electrode 28 formed in a simple matrix system. On the basis of the electron-emitting device 22, when the brightness is the highest, +
A gate voltage of 100 V is applied. Further, +10 kV is applied to the phosphor screen 16. The size of the electron beam emitted from the electron-emitting device 22 is modulated by the voltage of the gate electrode 28, and the electron beam excites the phosphor layer of the phosphor screen 16 to emit light, thereby displaying an image. .

As described above, since a high voltage is applied to the phosphor screen 16, high strain point glass is used for the front substrate 11, the rear substrate 12, the side wall 18, and the plate glass for the support member 14. . As will be described later, the sealing surface between the rear substrate 12 and the side wall 18 is sealed with a low-melting glass 30 such as frit glass.
A base layer 31 formed on the sealing surface
And an indium layer 32 formed on the underlayer are sealed by a sealing layer 33 which is fused.

Next, a method of manufacturing the FED configured as described above will be described in detail. First, the phosphor screen 16 is formed on a plate glass to be the front substrate 11. For this, a glass sheet having the same size as the front substrate 11 is prepared, and a stripe pattern of the phosphor layer is formed on the glass sheet by a plotter machine. Exposure is achieved by placing the plate glass on which the phosphor stripe pattern is formed and the plate glass for the front substrate on a positioning jig and setting it on an exposure table.
Develop to produce phosphor screen 16.

Subsequently, the electron-emitting devices 22 are formed on the glass plate for the rear substrate. In this case, a matrix-shaped conductive cathode layer is formed on a sheet glass, and an insulating film of a silicon dioxide film is formed on the conductive cathode layer by, for example, a thermal oxidation method, a CVD method, or a sputtering method.

Thereafter, a metal film for forming a gate electrode such as molybdenum or niobium is formed on the insulating film by, for example, a sputtering method or an electron beam evaporation method. Next, a resist pattern having a shape corresponding to the gate electrode to be formed is formed on the metal film by lithography. Using the resist pattern as a mask, the metal film is etched by a wet etching method or a dry etching method to form a gate electrode 28.

Next, the cavity is formed by etching the insulating film by wet etching or dry etching using the resist pattern and the gate electrode as a mask. Then, after removing the resist pattern, a release layer made of, for example, aluminum or nickel is formed on the gate electrode 28 by performing electron beam evaporation from a direction inclined at a predetermined angle with respect to the rear substrate surface. Thereafter, for example, molybdenum as a material for forming a cathode is deposited by an electron beam evaporation method from a direction perpendicular to the surface of the rear substrate. Thereby, each cavity 25
Is formed inside the device. Subsequently, the release layer is removed by a lift-off method together with the metal film formed thereon.

Subsequently, the space between the peripheral portion of the rear substrate 12 on which the electron-emitting devices 22 are formed and the rectangular frame-shaped side wall 18 are sealed to each other in the atmosphere with low-melting glass 30. At the same time, the plurality of support members 14 are sealed on the rear substrate 12 with the low-melting glass 30 in the atmosphere.

Thereafter, the rear substrate 12 and the front substrate 11 are sealed to each other via the side wall 18. In this case, as shown in FIG. 4, first, a base layer 31 is formed over the entire periphery of the upper surface of the side wall 18 which becomes the sealing surface 18b. The width of the base layer 31 is formed to be slightly smaller than the width of the upper surface of the side wall 18, that is, the width of the sealing surface 18a.

On the other hand, as shown in FIG. 5, the sealing surface 11a on the front substrate 11 side has a rectangular frame shape along the peripheral portion of the inner surface of the front substrate 11 and has two pairs of straight portions and four corners facing each other. And have substantially the same dimensions and the same width as the sealing surface 18a of the side wall 18. And this sealing surface 1
A base layer 31 is formed over the entire periphery of the base 1a. The width of the base layer 31 is formed slightly smaller than the width of the sealing surface 11a.

In this embodiment, the front substrate 1
The base layer 31 formed on the first substrate 1 has four protrusions 31a that protrude outward from the four corners of the sealing surface 11a beyond the sealing surface. The underlayer 31 is formed by applying a silver paste.

Subsequently, as shown in FIGS. 4 and 5, indium is applied as a metal sealing material on each of the underlayers 31, and an indium layer 32 extending over the entire circumference of each underlayer 31 is formed. Form. The width of the indium layer 32 is
The indium layer is formed to be narrower than the width of the underlayer 31, and is applied in such a manner that both side edges of the indium layer are separated from the both side edges of the underlayer 31 by a predetermined gap. For example, if the width of the side wall 18 is 9 mm, the width of the underlayer 31 is 8 mm, and the width of the indium layer 32 is about 6 mm.

As can be clearly understood from FIG. 5, the front substrate 11
The indium layer 32 formed on the base layer 31 on the side has four protruding portions 32a protruding outward from the four corners of the sealing surface 11a beyond the sealing surface. Are formed on the protruding portion 31a of the underlayer 31 so as to overlap.

The metal sealing material has a melting point of about 3
It is desirable to use a low melting point metal material excellent in adhesion and bonding at 50 ° C. or lower. Indium (In) used in the present embodiment has a melting point as low as 156.7 ° C.,
It has excellent features such as low vapor pressure, soft and strong impact resistance, and does not become brittle even at low temperatures. In addition, it can be directly bonded to glass depending on conditions, and is a material suitable for the purpose of the present invention.

Further, as the low melting point metal material, an alloy to which elements such as silver oxide, silver, gold, copper, aluminum, zinc, tin and the like are added alone or in combination can be used instead of simple substance of In. For example, in the eutectic alloy of In97% -Ag3%, the melting point is further reduced to 141 ° C., and the mechanical strength can be increased.

In the above description, the expression "melting point" is used, but in the case of an alloy composed of two or more kinds of metals, the melting point may not be determined singly. Generally, in such a case, the liquidus temperature and the solidus temperature are defined. The former is the temperature at which part of the alloy starts to solidify when the temperature is lowered from the liquid state, and the latter is the temperature at which all of the alloy solidifies. In the present embodiment, for convenience of explanation,
In such a case, the expression "melting point" will be used, and the solidus temperature will be called the melting point.

On the other hand, for the underlayer 31 described above, a material having good wettability and airtightness with respect to the metal sealing material, that is, a material having high affinity with the metal sealing material is used. In addition to the silver paste described above, a metal paste such as gold, aluminum, nickel, cobalt, and copper can be used. In addition to the metal paste, as the base layer 31, a metal plating layer of silver, gold, aluminum, nickel, cobalt, copper, or the like, a deposited film, or a glass material layer can be used.

Next, the front substrate 11 in which the underlayer 31 and the indium layer 32 are formed on the sealing surface 11a, the side wall 18 is sealed to the back substrate 12, and the underlayer 31 and the indium layer are formed on the upper surface of the side wall. As shown in FIG. 6, the back side assembly on which the sealing surface 11a, 18 is formed.
The pieces a are held by a jig or the like in a state of facing each other and at a predetermined distance, and are put into a vacuum processing apparatus.

As shown in FIG. 7, this vacuum processing apparatus 10
Numeral 0 has a load chamber 101, a baking, electron beam cleaning chamber 102, a cooling chamber 103, a getter film deposition chamber 104, an assembling chamber 105, a cooling chamber 106, and an unloading chamber 107 provided in order. . Each of these chambers is configured as a processing chamber capable of performing vacuum processing, and all the chambers are evacuated during the manufacture of the FED. Adjacent processing chambers are connected by a gate valve or the like.

The rear-side assembly and the front substrate 11 facing each other at a predetermined interval are put into a load chamber 101, and the inside of the load chamber 101 is evacuated to a vacuum atmosphere. In the baking and electron beam cleaning chamber 102, when a high degree of vacuum of about 10 ⁻⁵ Pa is reached, the back assembly and the front substrate are heated to a temperature of about 300 ° C. and baked, and the surface of each member is adsorbed. Allow sufficient gas to be released.

At this temperature, the indium layer (having a melting point of about 156)
C) 32 melts. However, since the indium layer 32 is formed on the base layer 31 having a high affinity, the indium is held on the base layer 31 without flowing, and the indium layer 32 is provided on the electron emission element 22 side, the outside of the back substrate, or the phosphor screen. Outflow to the 16 side is prevented.

In the baking / electron beam cleaning chamber 102, simultaneously with heating, an electron beam generator (not shown) attached to the baking / electron beam cleaning chamber 102 transmits the phosphor screen surface of the front substrate 11 and the back surface. An electron beam is irradiated on the electron-emitting device surface of the substrate 12. Since the electron beam is deflected and scanned by a deflecting device mounted outside the electron beam generator, it is possible to clean the entire surface of the phosphor screen surface and the electron emission element surface with the electron beam.

After heating and electron beam cleaning, the rear substrate side assembly and the front substrate 11 are sent to the cooling chamber 103, for example, about 1
Cool to a temperature of 00 ° C. Subsequently, the back-side assembly and the front substrate 11 are sent to a getter film deposition chamber 104, where a Ba film is deposited as a getter film outside the phosphor screen. The surface of the Ba film is prevented from being contaminated with oxygen, carbon, or the like, and can maintain an active state.

Next, the rear-side assembly and the front substrate 11 are sent to the assembly chamber 105, where they are heated to 200 ° C., and the indium layer 32 is again melted or softened into a liquid state.
In this state, the front substrate 11 and the side wall 18 are joined and pressurized at a predetermined pressure, and then the indium is cooled and solidified. Thus, the front substrate 11 and the side wall 18 are sealed by the sealing layer 33 in which the indium layer 32 and the base layer 31 are fused, and the vacuum envelope 10 is formed.

Here, the underlayer 31 and the indium layer 32 on the front substrate 11 side have protrusions 31a and 32a, respectively, protruding from each corner of the sealing surface 11a. Therefore, even if extra indium melts during sealing, this excess indium is guided from the corners of the sealing surface 11a to the protruding portions 31a and 32a, and is sent to the outside of the sealing surface. Therefore, even when the indium layer 32 is formed in a sufficient amount for reliable sealing, surplus indium does not flow out onto the phosphor screen 16, wiring, or the electron-emitting device side. The sealing surface can be reliably sealed without deteriorating the display performance of the FED.

The vacuum envelope 10 thus formed is
Is cooled to room temperature in the cooling chamber 106 and then taken out of the unloading chamber 107. By the above process, FED
Is completed.

According to the FED and the method of manufacturing the same as described above, the front substrate 11 and the rear substrate 12 are sealed in a vacuum atmosphere, so that the surface of the substrate can be combined with baking and electron beam cleaning. The adsorbed gas can be sufficiently released, and the getter film is not oxidized, so that a sufficient gas adsorbing effect can be obtained. Thereby, an FED that can maintain a high degree of vacuum can be obtained.

Also, by using indium as a sealing material, foaming during sealing can be suppressed, and an FED having high airtightness and sealing strength can be obtained.
At the same time, by providing the underlayer 31 under the indium layer 32, even when indium is melted in the sealing step, inflow of indium can be prevented and the indium can be held at a predetermined position. Therefore, handling of indium becomes simple, and even a large-sized image display device having a size of 50 inches or more can be easily and reliably sealed.

Further, according to the present embodiment, front substrate 1
The underlayer 31 and the indium layer 32 on one side are formed on the sealing surface 1.
1a has protrusions 31a and 32a protruding from the respective corners. Therefore, even if excess indium melts during sealing, the excess indium can be prevented from being guided to the protrusions 31a and 32a and flowing out onto the phosphor screen 16, wiring, or the electron-emitting device side. Therefore, it is possible to reliably seal the sealing surface using a sufficient amount of indium without deteriorating the display performance of the FED. From the above, it is possible to obtain an image display device that is easy to handle and can easily and reliably perform sealing in a vacuum atmosphere, and a method for manufacturing the same.

In the above-described embodiment, the sealing is performed with the base layer 31 and the indium layer 32 formed on both the sealing surface 11a of the front substrate 11 and the sealing surface 18a of the side wall 18. But only on one of the sealing surfaces,
For example, as shown in FIG.
The sealing may be performed in a state in which the underlayer 31 and the indium layer 32 are formed only on a.

The underlayer 31 and the indium layer 32
The positions where the protrusions 31a and 32a are formed are not limited to the corners of the sealing surface 11a, but may be provided on the linear portions of the sealing surface 11a as shown in FIG. In this case, the protrusions 31a,
31b may protrude outward or inward from the sealing surface 11a, but is desirably provided avoiding the lead-out portion of the wiring provided on the back substrate 12. Further, the protrusions 31 of the underlayer 31 and the indium layer 32 are formed.
The a and 32a need not be provided at the same position so as to overlap each other, and may be provided at different positions without overlapping each other. And the number of protrusions can be increased or decreased as needed.

In the above-described embodiment, the protrusion is provided on both the base layer 31 and the indium layer. However, the protrusion is provided on at least one of the base layer and the indium layer. Just do it. For example,
As shown in FIG. 10, the protrusion 31a may be provided only on the underlayer 31. Alternatively, as shown in FIG. 11, the protrusion 32a may be provided only on the indium layer 32. And in any case,
At the time of sealing, excess indium is guided to the projecting portion, so that indium can be prevented from flowing out to an undesired portion. Therefore, the same operation and effect as those of the above-described embodiment can be obtained.

In addition, the present invention is not limited to the above-described embodiment, but can be variously modified within the scope of the present invention. For example, the space between the rear substrate and the side wall may be sealed by a sealing layer in which the underlayer 31 and the indium layer 32 are fused as described above. Further, in each of the above-described embodiments, the indium layer is provided so as to overlap with the underlayer, but the underlayer may be omitted.

Further, one of the front substrate and the rear substrate may be formed by bending one peripheral portion thereof, and these substrates may be directly joined without interposing a side wall. Also,
The indium layer is formed to have a width smaller than the width of the underlayer over the entire circumference. However, if at least a portion of the underlayer is formed to have a width smaller than the width of the underlayer, the indium layer is formed of indium. Flow can be prevented.

In the above-described embodiment, a field emission type electron-emitting device is used as the electron-emitting device. However, the present invention is not limited to this. Emission elements may be used. The present invention is also applicable to other image display devices such as a plasma display panel (PDP) and electroluminescence (EL).

[0060]

As described in detail above, according to the present invention, the substrates are sealed with each other by using the underlayer and the metal sealing material layer formed on the underlayer, By providing a projection on at least one of the metal sealing layers, it is possible to easily perform sealing in a vacuum atmosphere and to provide an image display device having high airtightness and sealing strength, and a method for manufacturing the same. it can.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an FED according to an embodiment of the present invention.

FIG. 2 is a sectional view taken along the line AA of FIG. 1;

FIG. 3 is a plan view showing a phosphor screen of the FED.

FIG. 4 is a perspective view showing a state where an underlayer and an indium layer are formed on a sealing surface of a side wall constituting a vacuum envelope of the FED.

FIG. 5 is a plan view and a perspective view showing a state in which a base layer and an indium layer are formed on a sealing surface of a front substrate constituting a vacuum envelope of the FED.

FIG. 6 is a cross-sectional view showing a state in which a back-side assembly in which a base layer and an indium layer are formed in the sealing portion and a front substrate are opposed to each other.

FIG. 7 is a view schematically showing a vacuum processing apparatus used for manufacturing the FED.

FIG. 8 is a cross-sectional view showing a state in which a base layer and an indium layer are formed on a sealing surface of a front substrate in a step of forming a vacuum envelope of an FED according to another embodiment of the present invention.

FIG. 9 shows the protrusions of the underlayer and the indium layer formed on the sealing surface of the front substrate constituting the vacuum envelope of the FED.
The top view which shows the modification provided in the linear part of the sealing surface.

FIG. 10 is a perspective view showing a modification in which a projection is provided only on the underlayer of the underlayer and the indium layer formed on the sealing surface of the front substrate constituting the vacuum envelope of the FED.

FIG. 11 is a perspective view showing a modified example in which a protruding portion is provided only on the indium layer among the underlayer and the indium layer formed on the sealing surface of the front substrate constituting the vacuum envelope of the FED.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Vacuum envelope 11 ... Front board 11a, 18a ... Sealing surface 12 ... Back board 14 ... Support member 16 ... Phosphor screen 18 ... Side wall 22 ... Electron emission element 30 ... Low melting point glass 31 ... Base layer 31a ... Projection Part 32: Indium layer 32a: Projecting part 100: Vacuum processing device

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5C012 AA05 BC03 5C032 AA01 BB18 5C036 EE14 EE17 EF01 EF06 EF09 EG05 EG06 EH01 EH26

Claims (23)

[Claims] An enclosure having a rear substrate, a front substrate opposed to the rear substrate, and a plurality of pixel display elements provided inside the enclosure; The sealing surface between the metal substrate and the back substrate is sealed with a metal sealing material layer, and the metal sealing material layer has a protrusion protruding from the sealing surface. Image display device. 2. An enclosure having a rear substrate, a front substrate opposed to the rear substrate, and a plurality of pixel display elements provided inside the enclosure. The sealing surface between the substrate and the back substrate is sealed by an underlayer and a metal sealing material layer provided on the underlayer and different from the underlayer, and the underlayer and the metal sealing material. An image display device, wherein at least one of the layers has a protrusion protruding from the sealing surface. 3. An envelope having a rear substrate, a front substrate opposed to the rear substrate, and a side wall disposed between a peripheral edge of the front substrate and a peripheral edge of the rear substrate. And a plurality of pixel display elements provided inside the envelope, at least a sealing surface between the front substrate and the side wall, and a sealing surface between the rear substrate and the side wall. One side is sealed by a metal sealing material layer, and the metal sealing material layer has a projection protruding from the sealing surface. 4. An envelope having a rear substrate, a front substrate opposed to the rear substrate, and a side wall disposed between a peripheral edge of the front substrate and a peripheral edge of the rear substrate. And a plurality of pixel display elements provided inside the envelope, at least a sealing surface between the front substrate and the side wall, and a sealing surface between the rear substrate and the side wall. One is provided on the underlayer and is sealed with the underlayer and a metal sealing material layer of a different kind, and at least one of the underlayer and the metal sealing material layer is provided on the sealing surface. An image display device having a protruding portion protruding from the image display device. 5. The method according to claim 1, wherein each of the underlayer and the metal sealing material layer comprises:
The image display device according to claim 2, further comprising a protrusion protruding from the sealing surface, wherein the protrusion of the metal sealing layer is provided on the protrusion of the base layer. . 6. The sealing surface has a rectangular frame shape extending along a peripheral portion of the front substrate or the rear substrate, and has a plurality of straight portions and corner portions. 6. The light-emitting device according to claim 1, which is provided on a straight portion of the attachment surface.
The image display device according to any one of the above. 7. The image display device according to claim 6, wherein said projecting portion projects from said linear portion to outside of said sealing surface. 8. The sealing surface has a rectangular frame shape extending along the periphery of the front substrate or the rear substrate, has a plurality of straight portions and corners, and the projecting portion is The image display device according to any one of claims 1 to 5, wherein the image display device is provided at at least one corner of the attachment surface. 9. The image display device according to claim 8, wherein the projecting portion projects from the corner to the outside of the sealing surface. 10. The image display device according to claim 8, wherein the projecting portions are provided at four corners of the sealing surface, respectively. 11. The image display device according to claim 1, wherein the metal sealing material layer is formed of a low melting point metal material having a melting point of 350 ° C. or less. 12. The image display device according to claim 11, wherein said low melting point metal material is indium or an alloy containing indium. 13. The method according to claim 12, wherein the underlayer is silver, gold, aluminum,
3. The semiconductor device according to claim 2, wherein the metal paste includes at least one of nickel, cobalt, and copper.
Or the image display device according to 4. 14. The underlayer is made of silver, gold, aluminum,
The image display device according to claim 2, wherein the image display device is formed of a metal plating layer or a deposition film containing at least one of nickel, cobalt, and copper, or a glass material. 15. The image display device according to claim 2, wherein the width of the metal sealing material layer is formed to be smaller than the width of the underlayer in at least a part of the underlayer. . 16. An envelope having a rear substrate, a front substrate disposed opposite to the rear substrate, a phosphor screen formed on an inner surface of the front substrate, and the fluorescent screen provided on the rear substrate, An electron emission source that emits an electron beam to the body screen to emit a phosphor screen, and a sealing surface between the front substrate and the rear substrate is sealed with a metal sealing material layer, The image display device, wherein the metal sealing material layer has a protrusion protruding from the sealing surface. 17. An image display device comprising: an envelope having a rear substrate, a front substrate opposed to the rear substrate, and a plurality of pixel display elements provided inside the envelope. Forming a base layer along a sealing surface between the rear substrate and the front substrate; and forming a metal sealing material layer different from the base layer on the base layer. A step of forming a protrusion protruding from the sealing surface on at least one of the underlayer and the metal sealing material layer when forming the underlayer and the metal sealing material layer; After forming the sealing layer, heating the back substrate and the front substrate in a vacuum atmosphere, melting the metal sealing material layer, and sealing the back substrate and the front substrate on the sealing surface. And an image display device characterized by comprising: Production method. 18. In the step of forming the protruding portion, a protruding portion protruding from the sealing surface is formed on each of the base layer and the metal sealing material layer, and the protruding portion of the metal sealing layer is formed. The method for manufacturing an image display device according to claim 17, wherein the method is formed on a protrusion of the underlayer. 19. The method according to claim 17, wherein the metal sealing material layer is formed of a low melting point metal material having a melting point of 350 ° C. or less. 20. The method according to claim 19, wherein the low melting point metal material is indium or an alloy containing indium. 21. A method according to claim 19, wherein the underlayer is made of silver, gold, aluminum,
The method according to any one of claims 17 to 18, wherein the method is performed using a metal paste containing at least one of nickel, cobalt, and copper. 22. A method according to claim 19, wherein the underlayer is made of silver, gold, aluminum,
21. The method of manufacturing an image display device according to claim 17, wherein the image display device is formed of a metal plating layer or a deposition film containing at least one of nickel, cobalt, and copper, or a glass material. 23. The image display according to claim 17, wherein the metal sealing material layer is formed to have a width equal to or less than a width of the underlayer in at least a part of the underlayer. Device manufacturing method.