JP2000056732A - Organic el display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily prepare respective light emitting colors of a display of multiple emitted colors with good balance by forming org. EL elements by each of respective kinds as one group and connecting circuits for controlling and/or driving the org. EL elements by each of the respective groups. SOLUTION: The org. EL elements by each of the respective kinds of the assemblage of >=2 kinds of the org. EL elements varying in the main wavelengths of the light released outside are formed as one group and the circuits for controlling and/or driving the org. EL elements by each of the respective groups are connected thereto. A main control means 111 of such device acts to impart the display data to be displayed to the org. EL element groups 116R, G, B, to assign the display data stored in a display data memory means 113 on to impart the timing and control data necessary for display. Scanning electrode driving means 114R, G, B drive the scanning electrodes and data electrodes of the respective org. EL element groups 116R, G, B by the driving signal from the display control means 112.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an organic EL display device having a plurality of organic EL elements connected in a matrix.

[0002]

2. Description of the Related Art In recent years, organic EL devices have been actively studied,
It is being put to practical use. In this method, a hole transport material such as triphenyldiamine (TPD) is formed into a thin film on a transparent electrode (hole injection electrode) such as tin-doped indium oxide (ITO) by vapor deposition, and then an aluminum quinolinol complex (A
1q3) as a light emitting layer, and a metal electrode (electron injection electrode) such as AgMg having a small work function is formed. The element has a basic structure of several hundreds to several 10,000 cd / m at a voltage of about 10V. ^The extremely high luminance of ² has attracted attention as electrical appliances, displays such as home appliances, automobiles, motorcycles, and aircraft.

In such an organic EL device, for example, an organic layer such as a light emitting layer has a scanning (common line) electrode serving as an electron injection electrode and a data (segment line) electrode serving as a hole injection electrode (transparent electrode). And a structure formed on a transparent (glass) substrate. In the case of a display formed as a display, a matrix display that displays dots and information as an aggregate of these dots (pixels) using scanning electrodes and data electrodes arranged in a matrix form. When,
It is roughly classified into a segment display for displaying an independently existing display having a predetermined shape and size.

In the case of a segment type display,
A static drive system in which each display is displayed separately and independently is also possible, but in the case of a matrix display, a dynamic drive system in which each scan line and data line are time-divisionally driven is usually adopted.

In organic EL display devices, such as a dot matrix type display device, which has been put into practical use as a display device having a constant luminance, attempts have been made to adjust the light emission gradation.
Satisfactory performance has not yet been obtained.

The characteristics of the organic EL element include that it is a current driving element, and that the luminous efficiency and the luminous performance differ depending on the layer structure and the organic material (particularly, fluorescent material) used. That is, unlike a liquid crystal or the like, an organic EL element emits light in accordance with a current density as a current driving element, so that differences in current density and luminous efficiency appear as variations in luminance. For this reason, it is necessary to adjust the current density to be applied according to the characteristics of the element.

In particular, when a full-color display is to be obtained, light-emitting portions indicating the main wavelengths of the respective colors which are generally recognized as R, G, and B when observed from the outside of the panel are arranged, and these are arranged in one display. It is necessary to configure the display device as a unit. However, the optical characteristics of each element corresponding to each light emission of RGB are usually different, and the current densities for obtaining a predetermined luminance are also different.

Therefore, if each pixel of RGB is driven by one driving circuit as it is, as in a conventional driving circuit of a liquid crystal display, the required light emission luminance differs for each pixel, and a desired color cannot be obtained. And the problem that gradation control becomes difficult. Further, since the operating conditions of the pixels corresponding to the respective main wavelengths are different, the lifespan and deterioration characteristics of the organic EL elements of those pixels are also different, so that even if the color balance is deteriorated with time or the color needs to be adjusted. However, there is a problem that the above-mentioned circuit cannot be easily prepared.

Further, when wiring for each of the RGB light emission colors is routed or connected to a drive circuit, the circuit pattern is complicated, which is a great limitation in designing a display.

[0010]

SUMMARY OF THE INVENTION An object of the present invention is to provide a multi-color display which can easily prepare each luminescent color in a well-balanced manner and can provide a high-quality and high-definition screen. That is, an EL display device is realized.

Further, an organic EL which can connect a wiring structure connected to each pixel and a circuit for driving each pixel simply and efficiently, has a high degree of freedom in design, and can be made more compact. That is, to realize a display device.

[0012]

The above objects can be achieved by the present invention described below. (1) An aggregate of two or more types of organic EL elements each having a different main wavelength of light emitted to the outside, wherein the organic EL elements of each type are grouped, and the organic EL elements are An organic EL display device to which a circuit for controlling and / or driving is connected. (2) The circuit for controlling and / or driving the organic EL element for each of the groups is one or two or more types of integrated circuit elements and circuits or elements associated therewith, as described in (1) above. Organic EL display device. (3) The organic EL device according to the above (1) or (2), wherein a multilayer wiring board is provided between a wiring structure connected to each group of organic EL elements and a circuit for controlling and / or driving the wiring structure. Display device. (4) The multilayer wiring board performs rearrangement for connecting each wiring structure arranged corresponding to the organic EL elements of each group to a control and / or drive circuit corresponding to each group. The organic EL display device according to any one of 1) to (3). (5) Each wiring structure on the substrate arranged corresponding to each group of the organic EL elements has a control and / or
Alternatively, the organic EL display device according to any one of the above (1) to (3), which has a rearrangement structure for connecting to a drive circuit. (6) The organic EL display device according to any one of (1) to (5), wherein the organic EL elements are arranged in a matrix. (7) The organic EL display device according to any one of (1) to (6), wherein the main wavelength of light emitted from the organic EL elements of each group to the outside corresponds to each color of red, green, and blue. . (8) The organic EL display device according to any one of the above (1) to (7), wherein the organic EL elements of each group have a color filter layer.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An organic EL display device according to the present invention is an aggregate of two or more types of organic EL elements, each of which has a main wavelength of light emitted to the outside. As a group, and a circuit for controlling and / or driving the organic EL element is connected to each group.

As described above, in a display device in which two or more types of organic EL elements each having a different main wavelength of light emitted to the outside are collected, the organic EL elements of each type are grouped into one group. By connecting and driving a circuit for controlling and / or driving each time, driving under conditions suitable for each type of organic EL element can be performed, and light emission and adjustment with appropriate luminance can be performed. It becomes possible.

The organic EL display device has, as pixels, two or more types of organic EL elements, each of which has a different main wavelength of light emitted to the outside. The light emitted to the outside is light emission observed from the outside of the organic EL element, and includes light observed through a color conversion layer such as a color filter or a fluorescent filter in addition to light emission of the element itself. The dominant wavelength is a wavelength of a side where a straight line passing through the coordinate point indicated on the chromaticity coordinates of the observed light and the white coordinate point intersects the pure color curve.
In this case, the two or more dominant wavelengths are, for example, red (R),
The main wavelength may correspond to the three primary colors of green (G) and blue (B), or a certain color and emission colors having a complementary color relationship with each other, or arbitrary emission colors. It may be. Preferably, an organic EL element having an organic EL element capable of displaying a dominant wavelength at which extracted light is considered to correspond to the three primary colors of RGB in practical use is preferable. In this case, each dominant wavelength does not necessarily need to directly give RGB, for example, a white or mixed color can be extracted with a color filter, or a color conversion material (fluorescent material, etc.)
Is converted into any one of RGB colors.

In the organic EL element which becomes a part of each pixel or the constituent screen in the display device, the same kind of emitted main wavelength constitutes one group. Then, each of the organic EL element groups is connected to and driven by a different driving circuit or control driving circuit.

The organic EL element groups are usually arranged in a matrix in a display device. For example, when a full-color display is configured, the organic EL element groups arranged in a matrix form an organic EL element corresponding to each emission color of RGB.
One set of L elements constitutes one display unit, and is further arranged in a matrix for each display unit. As the matrix, there are an active matrix using a TFT or the like and a simple matrix. Either form may be used, but a simple matrix is preferable. In addition,
Segment type display or matrix
It is also possible to apply to a display of a mixed segment type.

A circuit for driving or controlling and driving the organic EL element group has, for example, as shown in FIG. 1, main control means 111 for giving data to be displayed on a display and data relating to display. There is provided a display control means 112 for transmitting a scan electrode drive signal which is a signal for driving the scan electrode and the data electrode of the organic EL display according to the display data given from the means 111 and a data electrode drive signal. Further, the display control means 1
A display data storage unit 113 connected to the main control unit 12 for expanding display data provided from the main control unit 111 and the like into matrix data, bitmap data, and the like, and storing data of predetermined display contents and the like;
A scan electrode drive signal from the display control means 112,
Each organic EL element group (organic E
L display device main body) scanning electrode driving means 114R, G, B for driving the scanning electrodes and data electrodes of 116R, G, B;
It has data electrode driving means 115R, G, and B.

The main control means 111 includes the organic EL element group 11
The display data to be displayed on 6R, G, and B is given, the display data stored in the display data storage unit 113 is specified, and the timing and control data required for display are given. The control means 111 can be generally constituted by a general-purpose microprocessor (MPU) and a control algorithm on a storage medium (ROM, RAM, etc.) connected to the MPU.

The main control means 111 includes CISC, RIS
It can be used irrespective of the mode of the processor such as C and DSP, and may be configured by a combination of logic circuits such as ASIC. In this example, the main control unit 111 is provided independently, but the display control unit 112,
It may be integrated with the control means of the device provided with the display.

The display control means 112 analyzes display data and the like provided from the main control means 111 and the like, searches data stored in the display data storage means 113 as necessary, and stores the display data on the organic EL display. Is converted into matrix data to be displayed at a predetermined position. That is, when the image (image or character) data to be displayed is dot data in pixel units of the organic EL element given at the intersection of each matrix, a signal for driving the scanning electrode and the data electrode giving the dot coordinates is provided. appear. In addition, it also performs driving in units of frames, control of the driving ratio (duty) between the scanning electrodes and the data electrodes, and the like.

The display control means 112 includes, for example,
A processor or a complex logic circuit having a predetermined arithmetic function, a buffer for the processor or the like to exchange data with an external main control unit or the like, a timing signal to a control circuit,
A timing signal generating circuit (oscillation circuit) for giving a display timing signal and reading / writing to external storage means and a writing timing signal, a storage element control circuit for sending and receiving display data and the like from an external storage means, and reading from an external storage element Or a drive signal transmission circuit for transmitting display data, which is supplied from the outside or obtained by processing the data, as a drive signal, and stores data relating to a display function and a display to be externally supplied, control commands, and the like. It can be composed of various registers and the like.

The display data storage means 113 stores data (conversion table) for developing image data given from outside as matrix data on a display,
Data in which predetermined character data and image data are directly expanded into matrix data and the like are stored, and can be read (written) by designating a storage position (address) as necessary.
Such a display data storage means is a RAM (VR
AM), and a semiconductor storage element such as a ROM can be preferably mentioned, but the present invention is not limited to this, and a storage medium using light or magnetism may be used.

The scanning electrode driving means 114R, G, B and the data electrode driving means 115R, G, B drive the scanning electrode and the data electrode according to the scanning electrode driving signal and the data electrode driving signal given from the display control means 2. I do. The organic EL element constituting the organic EL display is a light emitting element that emits light by current driving. Therefore, the scan electrode drive signal and the data electrode drive signal, which are usually given as voltage signals, are converted into signals of a predetermined current value, and the signals are supplied to predetermined scan electrodes and data electrodes for driving.

More specifically, a scan electrode and a data electrode at a predetermined position are driven by using a voltage-current conversion element having a necessary current capacity, an amplification element (power amplification), or the like. Examples of such a driving circuit include an open drain, an open collector circuit, a totem pole connection, a push-pull connection, and the like. As the voltage-current conversion element or the amplifying element, a contact device such as a relay may be used, but in consideration of high-speed operation, reliability, etc., a bipolar transistor, a FET, and a function equivalent to these are provided. Semiconductor devices are preferred. These semiconductor elements have a scanning electrode on either the power supply side or the ground side,
Connect the data electrodes. Here, the power supply side and the ground side include not only a case where the power supply side and the ground side are directly connected to the power supply and the ground line, but also a case where the power supply side and the ground side are connected via elements such as a current limiting resistor, a protection device, and a regulator.

FIG. 2 is a block diagram showing another configuration example of a circuit for driving or controlling and driving the organic EL element group. In this example, the scanning electrode driving means 114R, G,
B, in addition to driving circuits such as data electrode driving means 115R, G, B, etc., display control means 112R, G, B, and display data storage means 113R, G, B,
They are provided separately for the L element groups 116R, 116G, and 116B, respectively, and are controlled and driven. By providing a separate control system as described above, for example, the control of the time-sharing drive time and the like can be performed separately, and the adjustment of the luminance can be performed more easily. Other configurations are the same as those in FIG. 1, and the same components are denoted by the same reference numerals and description thereof is omitted.

Note that the above circuit is used for each organic EL element (organic E
This is merely an example of a circuit configuration for driving the (L display main body), and other circuit configurations may be used as long as they have equivalent functions. Further, the display control means, the scan electrode driving means, the data electrode driving means and the like may be completely integrated without being clearly divided. These circuit devices are generally configured as one or more types of ICs (LSIs) and their peripheral circuits or circuit elements.

By the way, as shown in FIG. 3, for example, the organic EL elements arranged in the display device main body are in a state in which the organic EL elements 4 for emitting light of each color of RGB are repeatedly arranged in a predetermined order. For this reason, the extraction electrode 5 is
Assuming that the electrodes are arranged in the order of GB, the extraction electrodes 5 corresponding to RGB are arranged alternately and sequentially, as shown in the illustrated example. Then, each of the organic EL element groups corresponding to RGB is separated into a separate drive (control) circuit 7R, 7G, 7B.
In such a case, the wirings intersect as shown in the drawing, and it is necessary to form a complicated circuit pattern. This can be dealt with to some extent when the number of pixels is small. However, as the number of pixels increases, the number of complicated wirings increases, and the substrate 2 on which the display screen 3 having the extraction electrode 5 is formed is formed. In addition, it is difficult to use the substrates of the driving circuits 7R, 7G, and 7B.

Therefore, for example, as shown in FIG. 4, a rearrangement means 6 is provided between the extraction electrode 5 and the driving circuits 7R, 7G, 7B. May be separated and aggregated for each organic EL element group (R group, G group, B group in this example) and connected to the corresponding driving circuits 7R, 7G, 7B.

By providing the rearrangement means, the wiring patterns on the substrate 2 on which the extraction electrodes 5 and the display screen 3 are formed, and the circuit patterns of the drive circuits 7R, 7G, and 7B can be simplified. Further, a conventional display device can be used as it is. Further, it is possible to easily cope with a case where a driving circuit is changed or a display device having a different size is used.

As the rearrangement means, it is possible to form a multilayer (three-dimensional) wiring of the wiring structure itself formed on the substrate, or to use various wiring media such as a PC board. A wiring structure that has a circuit element in a vertical direction (a direction other than the direction parallel to the substrate surface) and a horizontal direction and uses a multilayer wiring board capable of forming a three-dimensional circuit, or a wiring structure formed on a substrate Preferred examples are those which are formed into multilayer (three-dimensional) wiring. Further, among the multilayer wiring boards, a resin multilayer board having rigidity is particularly preferable. By utilizing the multilayer wiring board, wiring patterns for relocation connection between the extraction electrode and the drive circuit can be compactly formed.

Further, the wiring structure on the substrate may be formed into a three-dimensional multilayer structure as used in a semiconductor process, so that rearrangement can be performed. In this case, a drive circuit or a control circuit element of the organic EL element is preferably mounted on a substrate by COG, and a wiring structure for connecting these circuit elements or connecting to an external circuit is performed by the multilayer wiring board. You may. That is, since these circuit elements are usually connected by a large number of parallel wirings such as bus lines, simpler and more efficient wiring can be performed by using a multilayer wiring board. The formation of a multilayer structure for reallocation on a substrate can be easily realized by applying a technique used in a known semiconductor process.

Usually, by arranging a multilayer wiring board at a position where a sealing plate or the like is not provided, a dead space can be effectively utilized, and a display can be made more compact and thin.

In this case, the pitch of the terminals on the substrate 1 is about 50 μm to 1 mm, particularly 100 μm to 500 μm.
The degree is preferred. Within this range, the terminals of the substrate and the multilayer wiring board can be connected well.

The multilayer wiring board is preferably arranged in a region other than the portion where the sealing plate is arranged on the substrate. Therefore, it is preferable that the substrate has substantially the same shape as a region other than the portion where the sealing plate is arranged, or forms a part thereof. In practice, it may be slightly larger or smaller. Further, it is preferable that the height of the multilayer wiring board is substantially equal to the height of the sealing plate. With the same height, connection with the sealing plate becomes easy. Depending on the connection means, the height may be changed so that connection is easy.

As described above, by arranging the multilayer wiring board so as to fill the dead space in the area formed by the substrate and the sealing plate, the space can be effectively used and the display can be made more compact. be able to. Such an area varies depending on the type and size of the display, but is usually about 1 to 20 mm in width, especially about 1 to 10 mm, and about 0.5 to 5 mm in height, especially about 1 to 2 mm.

The multi-layer wiring board has a direction not horizontal to the substrate surface,
In general, there is no particular limitation as long as circuit elements that conduct in the vertical direction are formed, but a rigid resin multilayer substrate is particularly preferable. In particular, when a fine pitch is paid, a build-up substrate is preferable. By having the circuit element formed in the direction perpendicular to the substrate surface, the connection between the drive circuit and the terminal on the substrate is facilitated. Multi-layered wiring boards have been studied using various resin materials, in addition to those using ordinary printed board materials such as epoxy and glass epoxy, and those using other ceramics have also been put into practical use. I have. Among these, a resin substrate is preferable. The use of a resin substrate improves the mechanical strength of the display, functions as a protective member, and facilitates handling during manufacture.

It is preferable that such a multilayer wiring board is arranged and formed so as to surround the outer peripheral portion of the substrate. By surrounding the board with a multilayer wiring board, the board is protected from impacts, etc., and handling during manufacturing and transport is easy,
Failures are reduced.

One of the most preferable examples of such a multilayer wiring board is a resin multilayer build-up board. The resin multilayer substrate has a multi-layered conductive layer such as Ag, Cu or the like in a resin base material such as aramid non-woven cloth, and a conductive pillar called a via hole between the conductive layers of each layer. Are connected by. The via hole is usually smaller than the through hole, and can be made of a conductive material up to the inside, and a component (chip component) can be mounted on the via hole. The electronic component mounted on the wiring structure is usually a surface mount.

As a connecting means for mounting a multilayer wiring board on a substrate, for example, a method of thermocompression bonding using an anisotropic conductive film in which a conductive filler is dispersed in a resin material such as an epoxy resin, or a method of bumping A method of connection by a structure, a method of caulking, and the like can be mentioned. When a transparent glass substrate is used as the substrate, a method of irradiating a light beam from the back side of the substrate and soldering may be used.

Next, a specific method for rearrangement using a multilayer wiring board will be described with reference to the drawings. FIGS. 5A to 5E are exploded views showing pattern configuration examples for rearrangement in a multilayer wiring board. In this example,
In the example shown, each of the wiring boards 31 to 35 shown in (a) to (e) is sequentially laminated from the lower layer to constitute a multilayer wiring board.

In FIG. 5A, via holes 41 to 49 connected to the extraction electrode 5 as shown in FIGS. 3 and 4 are formed in the wiring board 31, and connected to the extraction electrode 5 on the back surface side. It has become. The via holes 41 to 49 have connection patterns 51a to 59a for connecting to a wiring board (via hole) laminated thereon.
Is connected.

In FIG. 5B, a wiring board 32 has a connection pattern 5 formed on the lower wiring board 31.
Via holes 51b to 59b connected to 1a to 59a are formed at similar positions to form a vertical circuit. Also, via holes 51b, 5 corresponding to R pixels
4b and 57b are further connected to connection patterns 61a, 62a and 63a connected to the R group rearranged via holes, respectively, so as to be connected to the uppermost R pixel drive IC 71.

In FIG. 5C, a wiring board 33 has a via hole 51b formed in the lower wiring board 32.
Via holes 51c to 59c connected to .about.59b are formed at similar positions to form vertical circuits. Also, a via hole 52 serving as a wiring corresponding to the G pixel is provided.
c, 55c, and 58c are further connected to connection patterns 64b, 65b, and 66b connected to the G group rearranged via holes, respectively, so as to be connected to the G pixel drive IC 72 in the uppermost layer. The via hole 61
via holes 61b, 6 connected to a, 62a, 63a
2b and 63b are formed at similar positions to form a vertical circuit.

In FIG. 5D, the wiring board 34 has via holes 51c formed in the lower wiring board 33.
Via holes 51d to 59d connected to ５９59c are formed at similar positions to form vertical circuits. Also, a via hole 53 serving as a wiring corresponding to the B pixel
d, 56d, and 59d are further connected to connection patterns 67c, 68c, and 69c that are connected to the B group rearranged via holes, respectively, and are connected to the uppermost B pixel drive IC 73. The via hole 61
Via holes 61c, 62c, 63c, 64c, 65 connected to b, 62b, 63b, 64b, 65b, 66b
c and 66c are formed at similar positions to form a vertical circuit.

In FIG. 5E, a wiring board 35 has a via hole 61c formed in the lower wiring board 34.
Via holes 61d to 69d connected to .about.69c are formed at similar positions to form vertical circuits. The via holes 61d to 69d which are already arranged corresponding to the respective RGB pixels are connected to the driving ICs 71, 72, 73 for each group. As described above, by forming a three-dimensional circuit using the multilayer wiring board, wiring from the extraction electrode can be reduced to wiring corresponding to each pixel (organic EL element) group such as RGB in a compact and intensive manner. Moreover, it can be easily rearranged.

In the above example, the case where three sets of wiring structures of RGB are rearranged has been described. However, even in the case of rearranging more wiring structures than this, the known multilayer wiring technique is applied. Can be performed in the same manner.

Further, all or a part of a circuit for controlling and driving the organic EL element may be formed on a sealing plate. All circuits for controlling and driving the organic EL element,
Or, forming a circuit that cannot be formed on the multilayer wiring board by forming a part on the sealing plate, or improving the yield by replacing the circuit formed on the sealing plate with this sealing plate Also, it is possible to easily cope with a change in the circuit configuration for making the display device having a different specification.

As means for connecting the multi-layer wiring board and the sealing board, connection can be made by a commonly used connection means such as soldering, wire bond, apple bond, heat sill connector, printing of conductive ink, bridge and the like. Can be.

The apple bond is used to connect between the wiring structure and the pattern of the sealing plate using only the ball portion used in the wire bonding (ball bonding method). Since the pattern between the wiring structure and the sealing plate is close to each other, it is possible to connect only the balls. In this case, the gap between the wiring structure and the sealing plate is 300
μm or less, particularly preferably about 0 to 10 μm. The size of the ball is usually about 10 to 300 μm, preferably about 50 to 100 μm. The material of the ball may be any material used for ordinary wire bonding, and examples thereof include Au and Al. Therefore, the pattern width of the connection portion is 5 to 300 μm
The degree is preferred. For Apple Bond, for example,
Nikkei Electronics 1998.4.6 (no.713) P170.

The wire bond is formed by a usual wire bonding, for example, a ball bonding method, a wedge bonding method, a stitch bonding method, a bird beak bonding method, or the like. As a wire used for wire bonding, usually, a wire diameter: 10
About 50 μm. The material is the same as the above ball. The bond area is usually about 30 to 100 μm square (□).

The wire bonding can be easily performed by a commercially available bonding apparatus. Also, the Apple Bond can be made by making a slight modification.

The substrate is not particularly limited as long as the organic EL element can be laminated thereon. Usually, the substrate also has a function as a display surface for extracting emitted light. It is preferable to use a transparent or translucent material such as Further, the emission color may be controlled by using a color filter film, a color conversion film containing a fluorescent substance, or a dielectric reflection film on the substrate. When the emitted light is not taken out, the substrate may be transparent or opaque. When the substrate is opaque, ceramics or the like may be used.

The size of the substrate is not particularly limited, but preferably has a maximum length, particularly a diagonal length of 10 to 350 m.
m, especially in the range of 30 to 300 mm. Maximum length is 1
There is no problem if the length is less than 0 mm or more than 350 mm, but the storage space is limited or the production becomes difficult.

As a material of the sealing plate, a hard member such as glass, alumina, quartz or the like, preferably having a flat plate shape or a U-shaped cross section and having a space capable of accommodating the organic EL structure therein, or a material such as resin is preferable. Is mentioned. As the glass material, for example, a glass composition such as soda-lime glass, lead-alkali glass, borosilicate glass, aluminosilicate glass, and silica glass is preferable. As the resin material, an epoxy material, Teflon, silicon or the like is preferable. The linear expansion coefficient of these sealing plate materials is 0.01 to the linear expansion coefficient of the substrate.
It is preferably 100 times, especially about 0.1 to 10 times. Also,
When a flat plate such as glass is used, a sealing adhesive and, if necessary, a spacer may be used. In addition, a metal may be used as the sealing material, but it is necessary to perform an insulating treatment by applying an insulating coating, an insulating coating, a surface treatment, or the like to the surface. As a means for forming a concave portion having a U-shaped cross section in the sealing plate 3, the surface of the sealing plate 3 may be shaved by etching, sandblasting or the like.

The height of the sealing plate may be adjusted to a desired height by using a spacer. Examples of the material of the spacer include resin beads, silica beads, glass beads, and glass fibers, and glass beads are particularly preferable. The spacer is usually a granular material having a uniform particle size, but the shape is not particularly limited, and may be various shapes as long as it does not hinder the function as the spacer. As the size, the diameter in terms of a circle is 1 to 20 μm, more preferably 1 to 10 μm, particularly 2 to
8 μm is preferred. Those having such a diameter have a grain length of 10
It is preferably about 0 μm or less, and the lower limit is not particularly limited, but is usually about 1 μm.

When a recess is formed in the sealing plate,
Spacers may or may not be used. The preferred size when used is within the above range,
Particularly, the range of 2 to 8 μm is preferable.

The spacer may be previously mixed in the sealing adhesive or may be mixed during bonding. The content of the spacer in the sealing adhesive is preferably 0.01
-30 wt%, more preferably 0.1-5 wt%.

The adhesive is not particularly limited as long as it can maintain stable adhesive strength and has good airtightness, but it is preferable to use a cationic curing type ultraviolet curing epoxy resin adhesive. .

As a method of forming a circuit on a sealing plate,
A circuit pattern is mask-deposited by an evaporation method or the like.
And a method of obtaining a desired pattern by etching the conductor layer after forming the same, and a method of obtaining a conductor layer of a predetermined pattern by a thick film process. Then, the necessary circuit elements may be mounted on the formed circuit pattern by soldering or by bonding using a conductive paste.

The circuit pattern preferably has at least one of Au, Al and Cu. These metals have low resistance and can be easily formed into a desired pattern by any of thin film and thick film processes. Among them, Al is preferable in terms of cost and stability.

The organic EL structure is as follows. The light emitting layer has a hole (hole) and electron injection function,
They have a transport function and a function of generating excitons by recombination of holes and electrons. It is preferable to use a relatively electronically neutral compound for the light emitting layer.

The hole injecting / transporting layer has a function of facilitating the injection of holes from the hole injecting electrode, a function of stably transporting holes, and a function of hindering electrons.
The electron injection transport layer has a function of facilitating injection of electrons from the electron injection electrode, a function of stably transporting electrons, and a function of preventing holes. These layers increase and confine holes and electrons injected into the light emitting layer, optimize the recombination region, and improve luminous efficiency.

The thickness of the light emitting layer, the thickness of the hole injecting and transporting layer, and the thickness of the electron injecting and transporting layer are not particularly limited, and vary depending on the forming method.
It is preferable that the thickness be in the range of 10 to 300 nm.

The thickness of the hole injecting / transporting layer and the thickness of the electron injecting / transporting layer depend on the design of the recombination / light emitting region, but may be about the same as the thickness of the light emitting layer or about 1/10 to 10 times. When the hole or electron injection layer and the transport layer are separated from each other, it is preferable that the injection layer has a thickness of 1 nm or more and the transport layer has a thickness of 1 nm or more. At this time, the upper limit of the thickness of the injection layer and the transport layer is usually about 500 nm for the injection layer and 500 nm for the transport layer.
It is about. Such a film thickness is the same when two injection / transport layers are provided.

The light emitting layer of the organic EL device contains a fluorescent substance which is a compound having a light emitting function. Examples of such a fluorescent substance include, for example, JP-A-63-26469.
No. 2 discloses at least one compound selected from compounds such as quinacridone, rubrene, and styryl dyes. Also, Tris (8
Quinolinol derivatives such as metal complex dyes having 8-quinolinol or a derivative thereof as a ligand, such as (quinolinolato) aluminum; tetraphenylbutadiene, anthracene, perylene, coronene, and 12-phthaloperinone derivatives. Further, phenylanthracene derivatives described in JP-A-8-12600 (Japanese Patent Application No. 6-110569), tetraarylethene derivatives described in JP-A-8-12969 (Japanese Patent Application No. 6-114456), and the like are used. be able to.

Further, it is preferable to use in combination with a host substance capable of emitting light by itself, and it is preferable to use it as a dopant. In such a case, the content of the compound in the light emitting layer is 0.01 to 20% by weight, and more preferably 0.1 to 20% by weight.
It is preferably 1 to 15% by weight. When used in combination with a host substance, the emission wavelength characteristics of the host substance can be changed, light emission shifted to a longer wavelength becomes possible, and the luminous efficiency and stability of the device are improved.

The host substance is preferably a quinolinolato complex, and more preferably an aluminum complex having 8-quinolinol or a derivative thereof as a ligand. Such an aluminum complex is disclosed in JP-A-63-26469.
No. 2, JP-A-3-255190, JP-A-5-7073
3, JP-A-5-258859, JP-A-6-2158
No. 74 and the like.

Specifically, first, tris (8-quinolinolato) aluminum, bis (8-quinolinolato) magnesium, bis (benzo {f} -8-quinolinolato) zinc, bis (2-methyl-8-quinolinolato) aluminum Oxide, tris (8-quinolinolato) indium,
Tris (5-methyl-8-quinolinolato) aluminum, 8-quinolinolatolithium, tris (5-chloro-
8-quinolinolato) gallium, bis (5-chloro-8-
Quinolinolato) calcium, 5,7-dichloro-8-quinolinolatoaluminum, tris (5,7-dibromo-
8-hydroxyquinolinolato) aluminum and poly [zinc (II) -bis (8-hydroxy-5-quinolinyl) methane].

Other host materials are disclosed in
Phenylanthracene derivative described in JP-A-12600 (Japanese Patent Application No. 6-110569) and JP-A-8-1296
No. 9 (Japanese Patent Application No. 6-114456) is also preferable.

The light emitting layer may also serve as an electron injection / transport layer. In such a case, it is preferable to use tris (8-quinolinolato) aluminum or the like. These fluorescent substances may be deposited.

The light emitting layer is preferably a mixed layer of at least one kind of hole injecting and transporting compound and at least one kind of electron injecting and transporting compound, if necessary.
Further, it is preferable that a dopant is contained in the mixed layer. The content of the compound in such a mixed layer is preferably 0.01 to 20% by weight, more preferably 0.1 to 15% by weight.

In the mixed layer, a hopping conduction path of carriers is formed, so that each carrier moves in a material having a favorable polarity, and injection of a carrier having the opposite polarity is unlikely to occur, so that the organic compound is less likely to be damaged. This has the advantage that the element life is extended. Further, by including the above-described dopant in such a mixed layer, the emission wavelength characteristics of the mixed layer itself can be changed, the emission wavelength can be shifted to a longer wavelength, and the emission intensity is increased, The stability of the device can be improved.

The hole injecting and transporting compound and the electron injecting and transporting compound used in the mixed layer may be selected from the compounds for the hole injecting and transporting layer and the compounds for the electron injecting and transporting layer described below, respectively. Among them, compounds for the hole injection transport layer include amine derivatives having strong fluorescence,
For example, it is preferable to use a triphenyldiamine derivative which is a hole transport material, a styrylamine derivative, or an amine derivative having an aromatic condensed ring.

As the electron injecting and transporting compound, it is preferable to use a quinoline derivative, furthermore a metal complex having 8-quinolinol or a derivative thereof as a ligand, particularly tris (8-quinolinolato) aluminum (Alq3). It is also preferable to use the above-mentioned phenylanthracene derivatives and tetraarylethene derivatives.

As the compound for the hole injecting and transporting layer, an amine derivative having strong fluorescence, for example, a triphenyldiamine derivative which is the above-described hole transporting material, a styrylamine derivative, or an amine derivative having an aromatic condensed ring is used. Is preferred.

The mixing ratio in this case depends on the respective carrier mobility and carrier concentration. In general, the weight ratio of the compound of the hole injection / transport compound / the compound having the electron injection / transport function is from 1/99 to less. 99/1, more preferably 10/90 to 90/10, particularly preferably 20/80
It is preferable to set it to about 80/20.

The thickness of the mixed layer is preferably not less than the thickness corresponding to one molecular layer and less than the thickness of the organic compound layer. Specifically, the thickness is preferably 1 to 85 nm, more preferably 5 to 60 nm, particularly preferably 5 to 50 nm.

As a method for forming a mixed layer, co-evaporation in which evaporation is performed from different evaporation sources is preferable. However, when the vapor pressures (evaporation temperatures) are approximately the same or very close, they are mixed in advance in the same evaporation board. Alternatively, it can be deposited. In the mixed layer, it is preferable that the compounds are uniformly mixed, but in some cases, the compounds may exist in an island shape. The light-emitting layer is generally formed to a predetermined thickness by vapor-depositing an organic fluorescent substance or by dispersing and coating the resin in a resin binder.

The hole injecting and transporting layer is described in, for example,
JP-A-3-295695, JP-A-2-191694, JP-A-3-792, JP-A-5-234681
JP, JP-A-5-239455, JP-A-5-5-2
JP-A-99174, JP-A-7-126225, JP-A-7-126226, JP-A-8-100172
Various organic compounds described in JP-A No. 06509555 A1 and the like can be used. For example, a tetraarylbendicine compound (triaryldiamine or triphenyldiamine: TPD), an aromatic tertiary amine,
Examples include hydrazone derivatives, carbazole derivatives, triazole derivatives, imidazole derivatives, oxadiazole derivatives having an amino group, and polythiophene. These compounds may be used alone or in combination of two or more. When two or more kinds are used in combination, they may be stacked as separate layers or mixed.

When the hole injecting and transporting layer is divided into a hole injecting layer and a hole transporting layer, a preferred combination can be selected from the compounds for the hole injecting and transporting layer. At this time, it is preferable to laminate the compounds in order from the hole injecting electrode (ITO or the like) with the smallest ionization potential. Further, it is preferable to use a compound having a good thin film property on the surface of the hole injection electrode. Such a stacking order is the same when two or more hole injection transport layers are provided. With such a stacking order, the driving voltage is reduced, and the occurrence of current leakage and the occurrence and growth of dark spots can be prevented. In addition, in the case of forming an element, since a thin film of about 1 to 10 nm can be made uniform and pinhole-free because evaporation is used,
Even if a compound having a small ionization potential and having absorption in the visible region is used for the hole injection layer, it is possible to prevent a change in the color tone of the emission color and a decrease in efficiency due to reabsorption. The hole injecting and transporting layer can be formed by vapor deposition of the above compound in the same manner as the light emitting layer and the like.

A quinoline derivative such as an organometallic complex having 8-quinolinol such as tris (8-quinolinolato) aluminum (Alq3) or a derivative thereof as a ligand, an oxadiazole derivative, a perylene derivative, etc. A pyridine derivative, a pyrimidine derivative, a quinoxaline derivative, a diphenylquinone derivative, a nitro-substituted fluorene derivative, or the like can be used. The electron injection / transport layer may also serve as the light emitting layer. In such a case, it is preferable to use tris (8-quinolinolato) aluminum or the like. The electron injecting and transporting layer may be formed by vapor deposition or the like, similarly to the light emitting layer.

In the case where the electron injecting and transporting layer is divided into an electron injecting layer and an electron transporting layer, a preferable combination can be selected from the compounds for the electron injecting and transporting layer. At this time, it is preferable to stack the compounds in descending order of the electron affinity value from the electron injection electrode side. Such a stacking order is the same when two or more electron injection / transport layers are provided.

For forming the hole injection transport layer, the light emitting layer and the electron injection transport layer, a uniform thin film can be formed.
It is preferable to use a vacuum deposition method. When vacuum deposition is used, the amorphous state or the crystal grain size is 0.2 μm
The following homogeneous thin film is obtained. When the crystal grain size exceeds 0.2 μm, the light emission becomes non-uniform, the driving voltage of the device must be increased, and the hole injection efficiency is significantly reduced.

The conditions for vacuum deposition are not particularly limited.
The degree of vacuum is 0 ^-4 Pa or less, and the deposition rate is 0.01 to 1 nm /
It is preferable to set it to about sec. Further, it is preferable to form each layer continuously in a vacuum. If they are formed continuously in a vacuum, impurities can be prevented from adsorbing at the interface between the layers, so that high characteristics can be obtained. Further, the driving voltage of the element can be reduced, and the occurrence and growth of dark spots can be suppressed.

In the case where a plurality of compounds are contained in one layer when a vacuum evaporation method is used for forming each of these layers, it is preferable to co-deposit each boat containing the compounds by individually controlling the temperature.

The organic EL structure has, in addition to the organic layer, a substrate and a functional thin film such as a hole injection electrode or an electron injection electrode formed on the substrate so as to sandwich the organic layer.

As the electron injection electrode, a substance having a low work function is preferable. For example, K, Li, Na, Mg, La, C
e, Ca, Sr, Ba, Al, Ag, In, Sn, Z
It is preferable to use a single metal element such as n or Zr, or a two-component or three-component alloy system containing them for improving the stability. As an alloy system, for example, Ag · Mg (A
g: 0.1 to 50 at%), Al.Li (Li: 0.01)
１４14 at%), In · Mg (Mg: 50 to 80 at%),
Al.Ca (Ca: 0.01 to 20 at%) and the like. Note that the electron injection electrode can also be formed by an evaporation method or a sputtering method.

The thickness of the electron injecting electrode thin film may be a certain thickness or more for sufficiently injecting electrons.
The thickness is preferably 1 nm or more, more preferably 3 nm or more. The upper limit is not particularly limited, but the thickness may be generally about 3 to 500 nm. An auxiliary electrode or a protection electrode may be further provided on the electron injection electrode.

The pressure during the deposition is preferably 1 × 10 ⁻⁸ to 1
The heating temperature of the evaporation source is 100 to 1400 ° C. for a metal material and 100 to 50 ° C. for an organic material at × 10 ⁻⁵ Torr.
About 0 ° C. is preferable.

The hole injection electrode is preferably a transparent or translucent electrode for extracting emitted light. As the transparent electrode, ITO (tin-doped indium oxide), IZO
(Zinc-doped indium oxide), ZnO, SnO ₂ , I
Examples include n ₂ O ₃ , and preferably ITO (tin-doped indium oxide) and IZO (zinc-doped indium oxide). ITO usually contains In ₂ O ₃ and SnO in a stoichiometric composition, but the amount of O may slightly deviate from this. When transparency is not required, the hole injection electrode may be made of a known opaque metal material.

The thickness of the hole injecting electrode may be a certain value or more so as to sufficiently inject holes, and is preferably 5 or more.
The range is preferably from 0 to 500 nm, more preferably from 50 to 300 nm. The upper limit is not particularly limited, but if the thickness is too large, there is a fear of peeling or the like. If the thickness is too small, there is a problem in the film strength at the time of manufacturing, the hole transport ability, and the resistance value.

The hole injecting electrode layer can be formed by a vapor deposition method or the like, but is preferably a sputtering method, particularly a pulse D method.
It is preferable to form by the C sputtering method.

After forming each layer of the organic EL structure, the Si
Inorganic materials O _X such as Teflon, a protective film may be formed using an organic material such as fluorocarbon polymers containing chlorine.
The protective film may be transparent or opaque, and the thickness of the protective film is about 50 to 1200 nm. The protective film can be formed by a general sputtering method, a vapor deposition method,
It may be formed by an ECVD method or the like.

The luminescent color may be controlled by using a color filter film, a color conversion film containing a fluorescent substance, or a dielectric reflection film on the substrate.

The organic EL structure is driven by a direct current or a pulse, and can be driven by an alternating current. The applied voltage is usually about 2 to 30V.

[0097]

As described above, according to the present invention, even in a display with multiple light emission colors, each light emission color is well balanced,
In addition, an organic EL display device that can be easily prepared and can provide a high-quality and high-definition screen can be realized.

Further, an organic EL which can connect a wiring structure connected to each pixel and a circuit for driving each pixel simply and efficiently, has a high degree of design freedom, and can be made more compact. A display device can be realized.

[Brief description of the drawings]

FIG. 1 is a block diagram showing a basic configuration example of a circuit for driving or controlling and driving an organic EL element group.

FIG. 2 is a block diagram showing another basic configuration example of a circuit for driving or controlling and driving an organic EL element group.

FIG. 3 is a suspicion diagram showing a wiring structure of the organic EL display device.

FIG. 4 is a conceptual diagram showing a configuration example in which rearrangement means is provided in the organic EL display device of FIG.

FIG. 5 is an assembly diagram showing a configuration example of a multilayer wiring board as a more specific configuration of the rearrangement means.

[Explanation of symbols]

 2 substrate 3 screen 4 pixel (RGB) 5 wiring electrode (terminal) 6 rearranging means 7R, 7G, 7B drive circuit

 ────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Hiroshi Yamamoto 1-13-1 Nihonbashi, Chuo-ku, Tokyo TDK Corporation F term (reference) 3K007 AB00 AB03 AB04 AB18 BA06 BB00 BB01 BB06 DA00 DB03 EB00 FA01 FA03 GA00 GA04 5C080 AA06 AA07 BB05 CC03 DD05 EE30 FF09 GG02 JJ01 JJ02 JJ06

Claims (8)

[Claims] 1. An assembly of two or more types of organic EL elements each having a different main wavelength of light emitted to the outside, wherein the organic EL elements of each type are grouped, and an organic EL element is provided for each group. An organic EL display device to which a circuit for controlling and / or driving an element is connected. 2. A circuit for controlling and / or driving an organic EL element for each group is one or more kinds of integrated circuit elements and circuits or elements associated therewith. Organic EL display device. 3. The organic EL display according to claim 1, further comprising a multilayer wiring board between a wiring structure connected to each group of organic EL elements and a circuit for controlling and / or driving the wiring structure. apparatus. 4. The multi-layer wiring board according to claim 1, wherein each of said groups comprises an organic EL.
The organic EL display device according to any one of claims 1 to 3, wherein each wiring structure arranged corresponding to the elements is rearranged for connection to a control and / or drive circuit corresponding to each group. 5. The wiring structure on a substrate arranged corresponding to each group of organic EL elements has a rearrangement structure for connection to a control and / or drive circuit corresponding to each group. An organic EL display device according to any one of 1 to 3. 6. The organic EL display according to claim 1, wherein the organic EL elements are arranged in a matrix. 7. The organic EL display device according to claim 1, wherein a main wavelength of light emitted from the organic EL elements of each group to the outside corresponds to each of red, green, and blue. 8. The organic EL display device according to claim 1, wherein each of the groups of organic EL elements has a color filter layer.