JP2000040586A - Organic el element module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an organic EL element module of which an organic EL structure is free from damage, for which connection of input and output signals and a electric power source is made intensive or separable, in which complication of a wiring pattern is reduced to the utmost, which is hardly affected by a disturbance and a noise, in which a trouble such as leakage of an adhesive on an electrode is hardly generated, in which adhesive strength is prevented from being deteriorated, and for which airtightness is maintained for a long period. SOLUTION: This organic EL element module has an organic EL structure having one kind or more of an organic layer 12 concerned in at least luminous function between a pair of electrodes 11, 13 formed on a substrate 1, and a sealing means for sealing the organic EL structure. The sealing means has an inside sealing body 3 arranged in the position nearest to the organic EL structure and formed by a hard member, and one or more of a resin outside sealing body 6 arranged outside the inside sealing body 3 and formed to cover at least a joining part between the inside sealing body 3 and the substarte 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an organic EL device module having an organic EL structure using an organic material for a light emitting layer.

[0002]

2. Description of the Related Art An organic electroluminescence element (organic EL element) is a charge injection / recombination type EL using an organic material as a light emitting material, and is self-luminous, has high brightness, has a wide viewing angle, has low power consumption, and has a low voltage drive. Various applications are expected because they have features such as high efficiency and high efficiency. Among them, applications to various display devices have been attempted.

[0003] Since the organic EL element utilizes the light emitting action of an organic substance, there is a possibility that various emission colors (emission wavelengths) can be obtained by changing the molecular design of the organic substance. However, on the other hand, such an organic substance is easily oxidized or deteriorated by water vapor, oxygen, or a gas released from the sealant or the organic substance itself, so that the function as a light emitting element is easily damaged.

For this reason, when the organic EL element is applied to a display device or the like, considering self-luminance, high brightness, high viewing angle, low power consumption, It is important to maintain various characteristics such as voltage driving and high efficiency stably for a long period of time. Therefore, organic E
Since it is necessary to effectively prevent the L element from being exposed to various oxidizing and corrosive gases as described above and to protect the element from mechanical shocks, sealing using a hard member such as a glass material has conventionally been performed. Have been done.

FIG. 7 shows an organic EL having a conventional sealing structure.
3 shows an element module. In the illustrated organic EL element module, an organic EL structure 32 on a substrate 31 is covered with a sealing plate 33 made of glass, metal, or the like, and is fixed with an adhesive 44.
Here, the organic EL element 3 using water vapor is
In order to prevent the oxidation of No. 2, for example,
No. 81, a method of arranging a hygroscopic material, and a method of filling an inert liquid as described in JP-A-8-78159 are known. , The moisture absorbent 35 and the fluororesin-based porous thin film 3
6 shows an example fixed.

[0006] In addition, two or more layers described in Japanese Patent Application Laid-Open No. Hei 4-267097, in which a thin film is formed on an organic EL element and a photo-curable resin is applied on top of the thin film. There is also known a method of sealing with a method.

[0007] However, none of these are organic E
The sealing effect of the L element was insufficient, so that deterioration of the element could not be suppressed, and it was difficult to extend the life of the element.

On the other hand, focusing on a liquid crystal display (LCD),
With the growing demand for compact and highly reliable display modules, chip-on-glass (COG) and chip-size package (CSP) technologies can directly mount drive circuits or ICs on glass substrates of display devices. More and more. Generally, circuit elements or ICs to be COG-mounted and CSP-mounted are bare chips, and after mounting, are sealed with a thermosetting resin or the like, for example, as described in JP-A-4-337317.

FIG. 8 shows a configuration example of a liquid crystal display module mounted with COG. The liquid crystal display module in the illustrated example is
A liquid crystal display element having a liquid crystal 42 formed between a pair of electrodes 41 and 43 is formed on a substrate 31, and the liquid crystal display element is sealed and fixed with a glass sealing plate 33 and an adhesive 34. . Then, the substrate 3 outside the sealing plate
A circuit element 36 such as a circuit element or an IC is fixed on the resin 1 by a fixing resin 36.

One of the pair of electrodes 41 and 43 is made of ITO.
Etc., or a metal such as aluminum, but can be processed at a fine pitch. Accordingly, the number of contacts between the display device and the driving circuit or the IC, which are increasingly multi-terminal, can be reduced by the COG technology and the CSP technology, the processability can be improved, and the reliability can be improved.

[0011] In the future, it is conceivable that the organic EL element module will be modularized by mounting the driving device by COG mounting and CSP mounting. However, there are mainly the following problems.

(1) The organic EL element is formed by heat, organic solvent,
It is susceptible to water vapor, ultraviolet rays, etc. and deteriorates when exposed to these. For this reason, it is necessary to completely perform sealing from the external environment to prevent the deterioration of the organic EL element and the shortening of the life.

(2) The wiring layout of the panel becomes complicated, and it becomes difficult to balance with the driving circuit or the pin arrangement of the IC to be used. That is, if the driving circuit or IC is C
The substrate on which the OG mounting and the CSP mounting are performed is a transparent substrate such as a glass on which the organic EL element is arranged, or a sealing substrate for sealing the organic EL element. Routing becomes extremely difficult.

(3) When members having different expansion rates and contraction rates are used for the COG mold material, the substrate material, and the like, stress due to a temperature change acts between the two, and peeling occurs or the sealing effect is reduced. Or may be.

(4) When a thermosetting resin is used as the molding material, the heat in the thermosetting process may damage the organic EL structure. That is, when the minimum glass transition temperature of the organic material is about 80 ° C., a typical thermosetting resin has a curing temperature of about 150 to 180 ° C. May be destroyed, lose activity, or impair some functions, resulting in significant damage to the device.

(5) When a photo-curable resin is used as the molding material, if the photo-curable resin undergoes a large shrinkage in the photo-curing step, it may remain as internal stress, causing peeling or reducing the sealing effect. .

(6) It is necessary to devise input and output signals of the driving circuit or the IC and supply of the power supply voltage. That is, due to the problem of wiring routing, the connection of input / output signals and the power supply may be dispersed, the wiring may be cluttered, the circuit may become complicated, or interference between the input / output wiring, for example, noise, etc. Will be more susceptible to

(7) Various wiring patterns are present on the bonding surface of the sealing adhesive, so that the bonding effect is reduced and the sealing effect is reduced, which adversely affects the device. In particular,
As a sealing means for an organic EL element, an adhesive is generally applied onto a transparent electrode such as ITO (tin-doped indium oxide) or a metal thin film such as aluminum to bond and fix a sealing plate. In such a sealing method, there is a problem that the adhesive strength is reduced due to a problem such as wettability of the adhesive on the electrode, and the airtightness is reduced.

(8) Since the organic EL element is driven by current, noise generated by the organic EL element may cause malfunction of a driving circuit or an IC. In particular, in the case of CSP mounting in which a driving circuit or an IC is mounted on a sealing substrate of an organic EL element, a face-down method is often used, and particularly, measures against noise are required.

[0020]

SUMMARY OF THE INVENTION An object of the present invention is to provide an organic EL device module capable of maintaining a sufficient sealing effect, suppressing deterioration of the device and extending the life of the device.

Further, the wiring of the panel is facilitated,
An object of the present invention is to realize an organic EL element module that requires less wiring on a substrate and that can cope with a complicated wiring structure. .

It is another object of the present invention to provide an organic EL element module capable of preventing a stress effect due to a difference in expansion rate and contraction rate of a mold material, a substrate material, and the like, and preventing peeling and a decrease in sealing effect. .

In addition, the organic EL structure is not damaged by heat or the like in the thermosetting process, the organic material is destroyed, loses its activity, or some of the functions are damaged. That is, to realize an EL element module.

It is another object of the present invention to realize an organic EL element module in which connection of input / output signals and a power supply can be integrated and separated, wiring patterns can be minimized, and the influence of disturbance and noise is reduced.

It is another object of the present invention to provide an organic EL element module which hardly causes problems such as wettability of an adhesive on an electrode, prevents a decrease in adhesive strength, and can maintain airtightness for a long period of time.

Another object of the present invention is to realize an organic EL element module which is hardly affected by light and can prevent malfunction.

It is another object of the present invention to realize an organic EL element module which is hardly affected by noise or the like generated from the organic EL element and which is free from a malfunction of a driving circuit or an IC.

[0028]

That is, the above object is achieved by the following constitutions. (1) Organic E having at least one or more organic layers involved in at least a light emitting function between a pair of electrodes formed on a substrate
An L-structure, and sealing means for sealing the organic EL structure, wherein the sealing means is disposed at a position closest to the organic EL structure, and is formed by a hard member. An organic EL element module comprising: a body; and an outer sealing body of a resin disposed outside the inner sealing body and formed so as to cover at least a joint between the inner sealing body and the substrate. (2) The organic EL element module according to (1), wherein a circuit for controlling and driving the organic EL structure is formed on at least one of the substrates covered with the external sealing body. (3) The organic EL element module according to the above (1) or (2), wherein a linear expansion coefficient of the outer sealing body is 0.1 to 10 times a linear expansion coefficient of the inner sealing body and the substrate. (4) The external sealing body is a thermosetting resin, and the thermosetting temperature is a temperature obtained by adding 20 ° C. to the lowest glass transition temperature among the glass transition temperatures of the organic materials of the organic EL structure. The following organic EL element module according to any one of the above (1) to (3). (5) The organic EL element module according to (4), wherein the thermosetting resin is an epoxy resin. (6) The organic EL element module according to any one of (1) to (3), wherein the external sealing body is a photocurable resin, and has a curing shrinkage of 10% or less. (7) The organic EL element module according to (6), wherein the photocurable resin is an acrylic or epoxy resin. (8) The organic EL device module according to any one of (1) to (7), wherein the external sealing body has a light transmittance of 20% or less at any wavelength from ultraviolet to infrared. (9) There is a connecting means between the sealing means and the substrate, the connecting means electrically connecting a circuit inside the sealing means and an external circuit, and an airtightness inside the sealing means. The organic EL element module according to any one of the above (1) to (8), wherein (10) The organic EL element module according to any one of (1) to (9), further including an electromagnetic shield inside the sealing means. (11) The above (1) to (10) in which the entire thickness is 10 mm or less.
The organic EL device module according to any one of (10) and (10).

[0029]

BEST MODE FOR CARRYING OUT THE INVENTION An organic EL element module according to the present invention comprises an organic EL structure having at least one or more organic layers involved in a light emitting function between a pair of electrodes formed on a substrate; A sealing means for sealing the EL structure, wherein the sealing means is disposed at a position closest to the organic EL structure and is formed by a hard member; And a resin external sealing member disposed outside the body and formed so as to cover at least a joint between the internal sealing member and the substrate.

The internal sealing means may have a moisture absorbing material or an electromagnetic shield.

The sealing means is an internal sealing body containing the organic EL structure, and an external sealing body formed and arranged outside the internal sealing body so as to cover at least a joint with the substrate. With this configuration, it is possible to simultaneously mold the circuit element mounted on the substrate and strengthen the sealing of the organic EL structure, and moreover, by performing sealing with a plurality of sealing bodies. The sealing effect of the organic EL structure can be enhanced, the deterioration of the device can be suppressed, and the life of the device can be significantly improved.

Further, by forming a circuit for controlling and driving the organic EL structure on at least one of the substrates covered with the external encapsulant, wiring can be easily routed and input / output signals, The power supply connection and the like can be compactly integrated without dispersing.

The linear expansion coefficient of the outer sealing body is in the range of 0.1 to 10 times the linear expansion coefficient of the inner sealing body and the substrate.
Preferably it is in the range of 0.5 to 5 times. By setting the coefficient of linear expansion to this range, the adhesiveness to the internal sealing body or the substrate can be maintained, the external sealing body peels off from the internal sealing body or the substrate surface, or a gap occurs at the interface between the two. In addition, it is possible to prevent a decrease in the sealing effect due to separation of the joint between the internal sealing body and the substrate due to stress of the external sealing body.

As the material of the external sealing body, a resin that can be formed and arranged at the same time is used.

When the external sealing body is a thermosetting resin, it is necessary not to thermally damage the organic EL structure in the thermosetting step. For this reason, the thermosetting temperature is not more than the temperature obtained by adding 20 ° C. to the lowest glass transition temperature among the glass transition temperatures of the organic materials constituting the organic EL structure, and particularly, the lowest glass transition temperature is 10 ° C. It is preferable that the temperature be equal to or lower than the added temperature, and further equal to or lower than the lowest glass transition temperature.

Examples of such a thermosetting resin include an epoxy resin, a silicone resin, a phenol resin, a polyimide resin, a polyphenylene sulfide, and a urethane resin, and an epoxy resin is particularly preferable.

Further, a photo-curable resin which does not cause thermal damage to the organic EL structure may be used for the external sealing body. In this case, the shrinkage ratio during curing is preferably 10% or less, more preferably 5% or less. By setting the shrinkage ratio at the time of curing within the above range, peeling of the resin, poor sealing, and the like can be prevented.

Examples of such a photocurable resin include an acrylic resin, an epoxy resin, an ester resin, a urethane resin, a melamine resin, and an unsaturated polyester resin. Based resins are preferred.

The external sealing body preferably has a light transmittance of 20% or less, more preferably 10% or less, and further preferably 5% or less at any wavelength between ultraviolet rays and infrared rays. In addition, it is particularly important that the light transmittance of light in the infrared region is within the above range. By setting any of the light transmittances from ultraviolet light to infrared light within the above range, the influence of ultraviolet light and infrared light, particularly the sealing resin material, deterioration of the adhesive,
The effect of heat can be reduced. In order to keep the light transmittance in the above range, a dye or a pigment may be dispersed in a resin material as an external sealing body.

Further, a connection means for electrically connecting a circuit inside the sealing means and an external circuit and maintaining airtightness inside the sealing means is provided between the sealing means and the substrate. In addition, problems such as wettability of the sealing adhesive hardly occur without impairing the sealing effect, preventing a decrease in adhesive strength and maintaining airtightness for a long period of time.

Further, by providing a hygroscopic material, an electromagnetic shield or the like inside or outside the sealing means, it is possible to prevent deterioration and damage of the element due to moisture, heat, light, etc., shorten the life, and malfunction.

By setting the total thickness to preferably 10 mm or less, particularly 2 to 7 mm, a small and thin organic EL element module can be realized. Can contribute to

The material of the internal sealing body is a hard member having a shape retaining property capable of retaining a space for accommodating the organic EL structure, having an appropriate rigidity, and capable of preventing moisture and gas from entering. It is not particularly limited as long as it is a hard member such as glass, alumina, quartz or the like, preferably having a flat plate shape or a U-shaped cross section and having a space capable of accommodating the organic EL structure therein, or a material such as resin. Is mentioned.
As a glass material, for example, soda-lime glass, lead-alkali glass, borosilicate glass, aluminosilicate glass,
Glass compositions such as silica glass are preferred. Also,
An acrylic resin, a vinyl chloride resin, or the like can be used as the resin material.

The external sealing member provided outside the internal sealing member may be provided in any number as long as it is one (single) or more.

When a flat plate made of glass or the like is used for the internal sealing body, it is preferable to use a sealing adhesive and, if necessary, a spacer. In addition, metal may be used as a sealing material, but an insulating coating, an insulating coating,
It is necessary to perform an insulation treatment by performing a surface treatment or the like. As a means for forming a concave portion having a U-shaped cross section in the sealing body, the surface of the internal sealing body may be shaved by etching, sandblasting, or the like.

The height of the internal sealing body may be adjusted by using a spacer, and may be maintained at a desired height. Examples of the material of the spacer include resin beads, silica beads, glass beads, and glass fibers, and glass beads are particularly preferable. The spacer is usually a granular material having a uniform particle size, but the shape is not particularly limited,
Various shapes may be used as long as the function as a spacer is not hindered. The size is preferably a circle-converted diameter of 1 to 20 μm, more preferably 1 to 10 μm, and particularly preferably 2 to 8 μm. The particle having such a diameter is preferably about 100 μm or less in grain length, and the lower limit is not particularly limited, but is usually about 1 μm.

When a recess is formed in the internal sealing body, the spacer may or may not be used. When used, the preferred size may be in the above range, but particularly preferably in the range of 2 to 8 μm.

The spacer may be previously mixed into the sealing adhesive or may be mixed during bonding. The content of the spacer in the sealing adhesive is preferably 0.01
-30 wt%, more preferably 0.1-5 wt%.

The adhesive is not particularly limited as long as it can maintain stable adhesive strength and has good airtightness, but it is preferable to use a cationic curing type ultraviolet curing epoxy resin adhesive. .

The organic EL structure is controlled and controlled in the internal sealing body.
A circuit for driving may be formed. As a method of forming a circuit, a circuit pattern is mask-deposited by an evaporation method or the like, or a thin film process such as a method of forming a conductor layer such as Cu and etching it to obtain a desired pattern, or a method of forming a predetermined pattern. There is a method of obtaining a conductor layer by a thick film process. Then, the necessary circuit elements may be mounted on the formed circuit pattern by soldering or by bonding using a conductive paste. Note that the circuit formed in the internal sealing body is preferably formed outside the sealing body in order to avoid an adverse effect on the organic EL structure or conversely, an adverse effect from the organic EL structure and the internal atmosphere. .

The circuit pattern formed on the internal sealing body is
By forming not only the surface of the sealing body but also the end surface (side surface), the pattern formed on the end surface and the pattern on the substrate can be easily connected. In order to facilitate connection with an Apple bond or the like, the end surface of the sealing plate may be formed in a tapered shape or may have a curvature of R (R). The taper angle is preferably 60 ° or less, and R is a radius of 0.1 mm.
I just need more.

The circuit pattern preferably has at least one of Au, Al and Cu. These metals have low resistance and can be easily formed into a desired pattern by any of thin film and thick film processes. Among them, Al is preferable in terms of cost and stability.

When the circuit pattern has Au, it is preferable to form the Au-containing layer alone by a thick film process or to form a multilayer structure having an Au layer by a vapor deposition method. In the case of a multi-layer structure, the metal contained therein is T
i / Ni / Cu / Au or Cr / Ni / Cu / A
u is preferably a multilayer film formed on the substrate in the order of u. Ti and Cr improve the adhesion to the substrate, Ni prevents diffusion between metal layers, and Cu has the effect of keeping the pattern resistance low. The circuit patterns (conductor layers) containing these metals may each contain about 1% by weight or less of impurities. When the circuit pattern is formed by the thick film method, the circuit pattern may contain a substance other than the metal necessary for the thick film method such as glass.

When the circuit pattern has Al, it is preferable to form the Al-containing layer solely by vapor deposition.

When the circuit pattern has Cu, it is preferable to form the Cu-containing layer alone by plating or to form a multilayer structure having a Cu layer by vapor deposition. In the case of a multilayer structure, the metal contained is Ti / Ni
/ Cu or a multilayer film formed on the substrate in the order of Cr / Ni / Cu.

The circuit formed on the substrate in the inner sealing body and the outer sealing body is an organic EL structure, that is, an organic EL structure.
It is at least a part of a circuit for driving the display body. This circuit is formed on the opposite side of the surface of the internal sealing body facing the organic EL structure, that is, on the surface exposed to the outside. By forming it outside, it is possible to prevent the organic EL structure from contacting or destroying the organic EL structure, and it is possible to prevent the internal gas from adversely affecting electronic components.

The inner sealing body is provided to prevent moisture from entering.
It is bonded and sealed using an adhesive resin or the like. The sealing gas is A
An inert gas such as r, He, and N ₂ is preferable. Further, the moisture content of the sealing gas is preferably 100 ppm or less, more preferably 10 ppm or less, and particularly preferably 1 ppm or less. Although there is no particular lower limit for the water content, it is usually about 0.1 ppm.

The substrate is not particularly limited as long as the organic EL element can be laminated thereon. Usually, the substrate also has a function as a display surface for taking out emitted light, and is therefore made of glass, quartz or resin. It is preferable to use a transparent or translucent material such as Further, the emission color may be controlled by using a color filter film, a color conversion film containing a fluorescent substance, or a dielectric reflection film on the substrate. When the emitted light is not taken out, the substrate may be transparent or opaque. When the substrate is opaque, ceramics or the like may be used.

The size of the substrate is not particularly limited, but preferably has a maximum length, particularly a diagonal length of 10 to 350 m.
m, especially in the range of 30 to 300 mm. Maximum length is 1
There is no problem if the length is less than 0 mm or more than 350 mm, but the storage space is limited or the production becomes difficult.

The connection means is provided between the inner sealing body and the outer sealing body, preferably between the outer sealing body and the substrate, and electrically connects the circuit inside the inner sealing body and the outer sealing body to the outside circuit. And maintain the airtightness of the inside of the inner sealing body and the outer sealing body. That is, by setting a portion other than the region having the connecting means to a flat substrate surface having no irregularities such as electrodes and wiring patterns and having little unevenness, the adhesiveness is improved, and airtightness can be secured. it can. Examples of such connection means include a connector, a terminal electrode, a terminal pin and the like, but a connector is preferable, and in particular, in consideration of a sealing effect and wettability with an adhesive, wetness with an adhesive such as glass is considered. A connector in which a metal conductor is embedded in an exterior member having excellent sealing properties and sealing effect is preferable.

A hygroscopic material may be arranged inside the inner sealing body. Such a hygroscopic agent is not particularly limited as long as it can exert a hygroscopic effect under the atmosphere inside the internal sealing body, and is described in, for example, JP-A-9-148066. Sodium oxide (Na
₂ O), potassium oxide (K ₂ O), calcium oxide (Ca
O), barium oxide (BaO), magnesium oxide (M
gO), lithium sulfate (Li ₂ SO ₄ ), sodium sulfate (Na ₂ SO ₄ ), calcium sulfate (CaSO ₄ ),
Magnesium sulfate (MgSO ₄ ), cobalt sulfate (Co
SO ₄ ), gallium sulfate (Ga ₂ (SO ₄ ) ₃ ), titanium sulfate (Ti (SO ₄ ) ₂ ), nickel sulfate (NiSO
₄ ), calcium chloride (CaCl ₂ ), magnesium chloride (MgCl ₂ ), strontium chloride (SrCl
₂ ), yttrium chloride (YCl ₃ ), copper chloride (CuC
l ₂ ), cesium fluoride (CsF), tantalum fluoride (TaF ₅ ), niobium fluoride (NbF ₅ ), calcium bromide (CaBr ₂ ), cerium bromide (CeBr ₃ ), selenium bromide (SeBr ₄ ) , Vanadium bromide (VBr
_2), magnesium bromide (MgBr _2), barium iodide (BaI _2), magnesium iodide (MgI _2), barium perchlorate (Ba (ClO _{4) 2),} magnesium perchlorate (Mg (ClO _{4) 2} ) and the like.

Further, an electromagnetic shield may be provided inside and outside the internal sealing body. As the electromagnetic shield, various members conventionally used as an electromagnetic shielding agent can be used. Specifically, Al, Ni, Cr, Co, C
one or more metal thin films such as u, Zn, Sn, Fe, Ag, Au, etc., various magnetic materials such as ferrite, the above-mentioned metal particles, conductive coatings in which carbon particles, etc. are dispersed in a resin, etc. Can be mentioned.

The electromagnetic shield may be formed on the internal sealing body or the external sealing body by direct sputtering, vapor deposition, coating, or the like, or may be formed on a film and adhered thereto. The thickness of these thin films is usually about 1 μm to 1 mm.

The electromagnetic shield is provided at an appropriate position according to the purpose of use, for example, when preventing noise from the organic EL structure from leaking to the outside, or when protecting a driving circuit or an electronic component such as an IC from external noise. It is good to form it.

Next, a specific configuration of the present invention will be described with reference to the drawings. FIG. 1 is a schematic sectional view showing a first configuration example of the present invention. In the figure, an organic EL element module according to the present invention includes an organic EL structure including a lower electrode 11 formed on a substrate 1, an upper electrode 13, and an organic layer 12 interposed between the lower electrode 11 and the light emitting function. Have. Here, usually, the lower electrode 11 is formed by a transparent electrode such as ITO as a hole injection electrode, and the upper electrode is formed by a metal thin film having a low work function and a low resistance as an electron injection electrode. Depending on the application, the configuration is reversed, and various modifications and improvements are made. The organic layer 12 is formed of a functional thin film containing an organic substance involved in a light emitting function, such as a hole injection transport layer, a light emitting layer, and an electron injection transport layer.

The internal sealing body 3 is arranged so as to cover the organic EL structure, and is fixed and sealed by the adhesive 4.

Further, at the outside of the internal sealing body 3, at least a joint (the sealing adhesive 4, the wiring patterns 11, 22, etc.) between the internal sealing body 3 and the substrate 1 is provided so as to surround the same. ) Is formed and arranged so as to cover (including) and sealed. No space is formed inside the outer sealing body 6, that is, on the side where the inner sealing body 3 is arranged. As described above, the hard member and the soft member
And the space between the inner sealing body 3 and the outer sealing body 6 is not formed, so that the organic EL structure is not affected by the atmosphere between them, The organic EL structure can be strongly protected from corrosive gas and the like, and the life of the organic EL structure can be significantly improved.

Further, the inner sealing body 3 and the outer sealing body 6
A control / drive circuit connected to the lower electrode 11 and the upper electrode 13 is formed on the substrate covered with the above. A control circuit element or IC, a drive circuit element or IC And the like are mounted by COG,
Are located.

As described above, by forming and arranging the circuits 21 and 22 for controlling and driving the organic EL structure on the substrate 1, the organic EL structures 11, 12 and 13 and the organic EL structures are controlled and driven. A relatively short distance between the circuits 21 and 22;
The connection can be efficiently performed with a simple circuit configuration, the reliability can be improved, the number of components can be reduced, and the entire apparatus can be made compact.

At least a part of the control / drive circuit for driving the organic EL structure is connected to the connection means 9, and external circuits such as a host computer, a main controller, and the like are connected via the connection means 9. It is connected to a remote control panel, another display, a power supply circuit, and the like. The connection means 9 is composed of, for example, a connector or the like having a plurality of metal pieces serving as contact terminals on a glass base material (outer packaging material), has good wettability with an adhesive, is unlikely to cause a deterioration phenomenon of an adhesive effect, and It is made of a material having a high effect of blocking the external atmosphere. As a result, the outer sealing body 6 is fixed on a portion other than the connecting means 9 on a smooth surface having no terminals or the like, and the sealing effect is further improved.

FIG. 2 is a schematic sectional view showing a second configuration example of the present invention. In this example, in the first configuration example, the outer sealing body 6 formed and arranged so as to cover the entire inner sealing body 3 is replaced with the side including the joint between the inner sealing body 3 and the substrate 1. Formed in close contact with (contact with) only the portion, and the internal sealing body 3
Is provided with a hygroscopic material 5 inside. Internal sealing body 3
In the case where the inner sealing body 3 is a hard member such as glass or metal, the upper part of the sealing member does not significantly affect the sealing effect even if it is not covered with the outer sealing body 6. Therefore, the thickness of the organic EL module can be further reduced by covering the side of the internal sealing body 3 important for the sealing effect with the external sealing body 6 and omitting the external sealing body 6 on the upper surface. .

Further, the inside of the internal sealing body 3, ie, the organic EL
Since the moisture absorbent 5 is disposed on the space side where the structure is disposed, moisture in the space where the organic EL structure is disposed is removed, the life of the organic EL structure is improved, and light emission is performed. The characteristic is prevented from deteriorating. Other configurations are almost the same as those in FIG. 1, and the same components are denoted by the same reference numerals and description thereof is omitted.

FIG. 3 is a schematic sectional view showing a third configuration example of the present invention. In this example, in the first configuration example, a portion 21a of the circuit component 21 mounted on the substrate 1
Is mounted on the internal sealing body 3 by CSP. For this reason, the circuit pattern (conductor) 22 a is also provided on the internal sealing body 3.
Is formed, and the conductor pattern 22a is
And is connected to the circuit 22 on the substrate. In this case, known means such as solder, apple bond, anisotropic conductive film, and anisotropic conductive resin adhesive can be used for connection. Other configurations are substantially the same as those of the first or second configuration example, and the same components are denoted by the same reference numerals and description thereof will be omitted.

FIG. 4 is a schematic sectional view showing a fourth configuration example of the present invention. In this example, in the first configuration example, C
A part 21a of the circuit element 21 mounted by OG is mounted on the internal sealing body 3, and further, an electromagnetic shield 23 for blocking the electromagnetic wave generated from the organic EL structure is formed on the circuit element 21a.・ It is arranged. Thereby, the electromagnetic waves generated from the organic EL structure are blocked or attenuated,
Control circuit element or IC / Drive circuit element or IC
And other circuit elements are protected. Therefore, as the circuit element 21a mounted on the internal sealing body 3, a control IC (LSI) for driving and controlling the organic EL structure which is relatively weak to electromagnetic noise may be disposed.

The electromagnetic shield 23 is formed on the surface of the inner sealing body 3 on the side of the outer sealing body 6 in the illustrated example.
It may be formed on the structure side. Also, the electromagnetic shield 23
And a wiring structure connectable to a frame ground or a ground terminal of the device, the shielding effect is improved. Other configurations are substantially the same as those of the first or second configuration example, and the same components are denoted by the same reference numerals and description thereof will be omitted.

FIG. 5 is a schematic sectional view showing a fifth configuration example of the present invention. In this example, in the first configuration example, C
A part 21a of the circuit element 21 mounted by OG is mounted on the internal sealing body 3 by MCM (Multi Chip Module). That is, the control / drive electric circuit wiring 22a is formed on the internal sealing body 3, and the
To realize high-density mounting.

In this case as well, the electromagnetic shield in each of the above configuration examples may be formed to protect the circuit element 21 from electromagnetic waves, or to cover the ultraviolet light to infrared light of the external sealing body, particularly light in the infrared region. The organic EL structure and the like may be protected from light and thermal stress by setting the transmittance to 10% or less. Other configurations are substantially the same as those of the first or second configuration example, and the same components are denoted by the same reference numerals and description thereof will be omitted.

In each of the above configuration examples, the inner sealing body is
Although an example is shown in which one external sealing body is included and one external sealing body is included therein, a plurality of external sealing bodies may be provided, and a configuration in which a sealing body is further provided outside each of the above configuration examples. You may.

The circuit for driving the organic EL structure (display main body) has, for example, as shown in FIG. 6, a main control means 111 for giving data to be displayed on the display and data relating to the display. There is provided a display control means 112 for transmitting a scan electrode drive signal which is a signal for driving the scan electrode and the data electrode of the organic EL display according to the display data given from the means 111 and a data electrode drive signal. Further, it is connected to the display control means 112, and is used for expanding display data provided from the main control means 111 and the like into matrix data, bitmap data, etc., and display data for storing data of predetermined display contents and the like. Storage means 113
Scanning electrode driving means 114 for driving a scanning electrode and a data electrode of an organic EL structure (organic EL display main body) 116 by a scanning electrode driving signal and a data electrode driving signal from a display control means 112; 115.

The main control means 111 includes the organic EL structure 11
6, display data to be displayed, or designation of display data stored in the display data storage unit 113,
Gives timing and control data necessary for display.
The control means 111 can be generally constituted by a general-purpose microprocessor (MPU) and a control algorithm on a storage medium (ROM, RAM, etc.) connected to the MPU. The control means 11 includes CISC, RI
It can be used irrespective of the mode of the processor such as SC and DSP, and may be configured by a combination of logic circuits such as ASIC. In this example, the main control unit 111 is provided independently, but the display control unit 112,
It may be integrated with the control means of the device provided with the display.

The display control means 112 analyzes display data and the like provided from the main control means 111 and the like, searches data stored in the display data storage means 113 as necessary, and stores the display data on the organic EL display. Is converted into matrix data to be displayed at a predetermined position. That is, when the image (image or character) data to be displayed is dot data in pixel units of the organic EL element given at the intersection of each matrix, a signal for driving the scanning electrode and the data electrode giving the dot coordinates is provided. appear. In addition, driving in units of frames as described above, driving ratio (duty) control between the scanning electrodes and the data electrodes, and the like are also performed.

The display control means 112 includes, for example,
A processor or a complex logic circuit having a predetermined arithmetic function, a buffer for the processor or the like to exchange data with an external main control unit or the like, a timing signal to a control circuit,
A timing signal generating circuit (oscillation circuit) for giving a display timing signal and reading / writing to external storage means and a writing timing signal, a storage element control circuit for sending and receiving display data and the like from an external storage means, and reading from an external storage element Or a drive signal transmission circuit for transmitting display data, which is supplied from the outside or obtained by processing the data, as a drive signal, and stores data relating to a display function and a display to be externally supplied, control commands, and the like. It can be composed of various registers and the like.

The display data storage means 113 stores data (conversion table) for developing image data supplied from the outside as matrix data on a display,
Data in which predetermined character data and image data are directly expanded into matrix data and the like are stored, and can be read (written) by designating a storage position (address) as necessary.
Such a display data storage means is a RAM (VR
AM), and a semiconductor storage element such as a ROM can be preferably mentioned, but the present invention is not limited to this, and a storage medium using light or magnetism may be used.

The scanning electrode driving means 114 and the data electrode driving means 115 drive the scanning electrode and the data electrode according to the scanning electrode driving signal and the data electrode driving signal given from the display control means 112. The organic EL element constituting the organic EL display is a light emitting element that emits light by current driving. Therefore, the scan electrode drive signal and the data electrode drive signal, which are usually given as voltage signals, are converted into signals of a predetermined current value, and the signals are supplied to predetermined scan electrodes and data electrodes for driving.

More specifically, a scanning electrode and a data electrode at a predetermined position are driven by using a voltage-current conversion element having a necessary current capacity or an amplification element (power amplification). Examples of such a driving circuit include an open drain, an open collector circuit, a totem pole connection, a push-pull connection, and the like. A contact device such as a relay may be used as the voltage-current conversion element or the amplifying element. However, in consideration of high-speed operation and reliability, transistors, FETs, and semiconductors having functions equivalent to these are used. Elements are preferred. These semiconductor elements are
The scanning electrode and the data electrode are connected to either the power supply side or the ground side. Here, the power supply side and the ground side include not only a case where the power supply side and the ground side are directly connected to the power supply and the ground line, but also a case where the power supply side and the ground side are connected via elements such as a current limiting resistor, a protection device, and a regulator.

In the present invention, among the above-mentioned circuit components, in particular, the display control means 112 and the display data storage means 11
3. It is preferable that the scanning electrode driving means 114 and the data electrode driving means 115 are formed as a circuit element and peripheral circuits in a portion between the internal sealing body and the external sealing body. Connection to other circuits is made using external connection means (not shown) such as a flat cable, an FPC (flexible printed circuit board), anisotropic conductive rubber, and a connector for a board. In this case, the number of signal lines is usually sufficient to transfer data necessary for processing by a control unit such as a processor, and the connectors and cables need to be small, and there is no need to use cables having a large diameter. The reliability is also good.

The above circuit is merely an example of a circuit configuration for driving the organic EL structure (organic EL display main body), and other circuit configurations may be employed as long as they have equivalent functions. Further, the display control means, the scan electrode driving means, the data electrode driving means and the like may be completely integrated without being clearly divided. Although the above example mainly describes a simple matrix type display, a TFT or the like is used.
It may be an active matrix type display. Incidentally, these circuit devices are usually one type or two types.
It is configured as more than one kind of IC and its peripheral parts.

The organic EL structure of the present invention has, for example, a plurality of scan electrodes (electron injection electrodes) and data electrodes (hole injection electrodes) arranged in a matrix on a substrate. It has a structure in which a hole injection / transport layer, a light emission and electron injection / transport layer, which is a layer, and a protective layer as required, are laminated, and a sealing plate such as glass is disposed thereon.

The circuit formed on the sealing plate is electrically connected to the circuit on the substrate by ball bonding or wire bonding, and is connected to a scanning electrode (electron injection electrode) and a data electrode (hole injection electrode), respectively. . This allows
The scanning electrode driving means (circuit) and the data electrode driving means (circuit) on the sealing plate are connected to the scanning electrode (electron injection electrode) and the data electrode (hole injection electrode).

The organic EL structure is as follows. The light emitting layer has a hole (hole) and electron injection function,
They have a transport function and a function of generating excitons by recombination of holes and electrons. It is preferable to use a relatively electronically neutral compound for the light emitting layer.

The hole injecting and transporting layer has a function of facilitating the injection of holes from the hole injecting electrode, a function of stably transporting holes, and a function of preventing electrons.
The electron injection transport layer has a function of facilitating injection of electrons from the electron injection electrode, a function of stably transporting electrons, and a function of preventing holes. These layers increase and confine holes and electrons injected into the light emitting layer, optimize the recombination region, and improve luminous efficiency.

The thickness of the light emitting layer, the thickness of the hole injecting and transporting layer, and the thickness of the electron injecting and transporting layer are not particularly limited, and vary depending on the forming method.
It is preferable that the thickness be in the range of 10 to 300 nm.

The thickness of the hole injecting / transporting layer and the thickness of the electron injecting / transporting layer depend on the design of the recombination / light emitting region, but may be about the same as the thickness of the light emitting layer or about 1/10 to 10 times. When the hole or electron injection layer and the transport layer are separated from each other, it is preferable that the injection layer has a thickness of 1 nm or more and the transport layer has a thickness of 1 nm or more. At this time, the upper limit of the thickness of the injection layer and the transport layer is usually about 500 nm for the injection layer and 500 nm for the transport layer.
It is about. Such a film thickness is the same when two injection / transport layers are provided.

The light emitting layer of the organic EL device contains a fluorescent substance which is a compound having a light emitting function. Examples of such a fluorescent substance include, for example, JP-A-63-26469.
No. 2 discloses at least one compound selected from compounds such as quinacridone, rubrene, and styryl dyes. Also, Tris (8
Quinolinol derivatives such as metal complex dyes having 8-quinolinol or a derivative thereof as a ligand, such as (quinolinolato) aluminum; tetraphenylbutadiene, anthracene, perylene, coronene, and 12-phthaloperinone derivatives. Further, phenylanthracene derivatives described in JP-A-8-12066 (Japanese Patent Application No. 6-110569), tetraarylethene derivatives described in JP-A-8-12969 (Japanese Patent Application No. 6-114456), and the like are described. Can be used.

Further, it is preferable to use in combination with a host substance capable of emitting light by itself, and it is preferable to use it as a dopant. In such a case, the content of the compound in the light emitting layer is 0.01 to 20% by weight, and more preferably 0.1 to 20% by weight.
It is preferably 1 to 15% by weight. When used in combination with a host substance, the emission wavelength characteristics of the host substance can be changed, light emission shifted to a longer wavelength becomes possible, and the luminous efficiency and stability of the device are improved.

The host substance is preferably a quinolinolato complex, and more preferably an aluminum complex having 8-quinolinol or a derivative thereof as a ligand. Such an aluminum complex is disclosed in JP-A-63-26469.
No. 2, JP-A-3-255190, JP-A-5-7073
3, JP-A-5-258859, JP-A-6-2158
No. 74 and the like.

Specifically, first, tris (8-quinolinolato) aluminum, bis (8-quinolinolato) magnesium, bis (benzo {f} -8-quinolinolato) zinc, bis (2-methyl-8-quinolinolato) aluminum Oxide, tris (8-quinolinolato) indium,
Tris (5-methyl-8-quinolinolato) aluminum, 8-quinolinolatolithium, tris (5-chloro-
8-quinolinolato) gallium, bis (5-chloro-8-
Quinolinolato) calcium, 5,7-dichloro-8-quinolinolatoaluminum, tris (5,7-dibromo-
8-hydroxyquinolinolato) aluminum and poly [zinc (II) -bis (8-hydroxy-5-quinolinyl) methane].

Other host materials are disclosed in
Phenylanthracene derivative described in JP-A-12600 (Japanese Patent Application No. 6-110569) and JP-A-8-129.
Also preferred are the tetraarylethene derivatives described in JP-A-69 (Japanese Patent Application No. 6-114456).

The light emitting layer may also serve as an electron injection / transport layer. In such a case, it is preferable to use tris (8-quinolinolato) aluminum or the like. These fluorescent substances may be deposited.

The light emitting layer is preferably a mixed layer of at least one kind of hole injecting and transporting compound and at least one kind of electron injecting and transporting compound, if necessary.
Further, it is preferable that a dopant is contained in the mixed layer. The content of the compound in such a mixed layer is preferably 0.01 to 20% by weight, more preferably 0.1 to 15% by weight.

In the mixed layer, a carrier hopping conduction path is formed, so that each carrier moves in a substance having a favorable polarity, and injection of a carrier having the opposite polarity is less likely to occur, so that the organic compound is less likely to be damaged. This has the advantage that the element life is extended. Further, by including the above-described dopant in such a mixed layer, the emission wavelength characteristics of the mixed layer itself can be changed, the emission wavelength can be shifted to a longer wavelength, and the emission intensity is increased, The stability of the device can be improved.

The hole injecting / transporting compound and the electron injecting / transporting compound used in the mixed layer may be selected from the compounds for the hole injecting / transporting layer and the compounds for the electron injecting / transporting layer described below, respectively. Among them, compounds for the hole injection transport layer include amine derivatives having strong fluorescence,
For example, it is preferable to use a triphenyldiamine derivative which is a hole transport material, a styrylamine derivative, or an amine derivative having an aromatic condensed ring.

As the compound capable of injecting and transporting electrons, it is preferable to use a quinoline derivative, furthermore a metal complex having 8-quinolinol or a derivative thereof as a ligand, particularly tris (8-quinolinolato) aluminum (Alq3). It is also preferable to use the above-mentioned phenylanthracene derivatives and tetraarylethene derivatives.

As the compound for the hole injecting and transporting layer, an amine derivative having strong fluorescence, for example, a triphenyldiamine derivative as the above-described hole transporting material, a styrylamine derivative, or an amine derivative having an aromatic condensed ring is used. Is preferred.

The mixing ratio in this case depends on the respective carrier mobilities and carrier concentrations. In general, the weight ratio of the compound of the hole injecting / transporting compound / the compound having the electron injecting / transporting function is from 1/99 to less. 99/1, more preferably 10/90 to 90/10, particularly preferably 20/80
It is preferable to set it to about 80/20. The thickness of the mixed layer is preferably equal to or greater than the thickness of one molecular layer and less than the thickness of the organic compound layer. Specifically, the thickness is preferably 1 to 85 nm, more preferably 5 to 85 nm.
６０60 nm, particularly preferably 5-50 nm.

As a method for forming a mixed layer, co-evaporation in which evaporation is performed from different evaporation sources is preferable. However, when the vapor pressures (evaporation temperatures) are approximately the same or very close, they are mixed in the same evaporation board in advance. Alternatively, it can be deposited. In the mixed layer, it is preferable that the compounds are uniformly mixed, but in some cases, the compounds may exist in an island shape. The light-emitting layer is generally formed to a predetermined thickness by vapor-depositing an organic fluorescent substance or by dispersing and coating the resin in a resin binder.

The hole injecting and transporting layer is described in, for example,
JP-A-3-295695, JP-A-2-191694, JP-A-3-792, JP-A-5-234681
JP, JP-A-5-239455, JP-A-5-5-2
JP-A-99174, JP-A-7-126225, JP-A-7-126226, JP-A-8-100172
Various organic compounds described in JP-A No. 06509555 A1 and the like can be used. For example, a tetraarylbendicine compound (triaryldiamine or triphenyldiamine: TPD), an aromatic tertiary amine,
Examples include hydrazone derivatives, carbazole derivatives, triazole derivatives, imidazole derivatives, oxadiazole derivatives having an amino group, and polythiophene. These compounds may be used alone or in combination of two or more. When two or more kinds are used in combination, they may be stacked as separate layers or mixed.

When the hole injecting and transporting layer is divided into a hole injecting layer and a hole transporting layer, a preferable combination can be selected from the compounds for the hole injecting and transporting layer. At this time, it is preferable to laminate the compounds in order from the hole injecting electrode (ITO or the like) with the smallest ionization potential. Further, it is preferable to use a compound having a good thin film property on the surface of the hole injection electrode. Such a stacking order is the same when two or more hole injection transport layers are provided. With such a stacking order, the driving voltage is reduced, and the occurrence of current leakage and the occurrence and growth of dark spots can be prevented. In addition, in the case of forming an element, since a thin film of about 1 to 10 nm can be made uniform and pinhole-free because evaporation is used,
Even if a compound having a small ionization potential and having absorption in the visible region is used for the hole injection layer, it is possible to prevent a change in the color tone of the emission color and a decrease in efficiency due to reabsorption. The hole injecting and transporting layer can be formed by vapor deposition of the above compound in the same manner as the light emitting layer and the like.

In the electron injecting and transporting layer, quinoline derivatives such as organometallic complexes having 8-quinolinol such as tris (8-quinolinolato) aluminum (Alq3) or derivatives thereof as ligands, oxadiazole derivatives, perylene derivatives, A pyridine derivative, a pyrimidine derivative, a quinoxaline derivative, a diphenylquinone derivative, a nitro-substituted fluorene derivative, or the like can be used. The electron injection / transport layer may also serve as the light emitting layer. In such a case, it is preferable to use tris (8-quinolinolato) aluminum or the like. The electron injecting and transporting layer may be formed by vapor deposition or the like, similarly to the light emitting layer.

In the case where the electron injecting and transporting layer is divided into an electron injecting layer and an electron transporting layer, a preferable combination can be selected from the compounds for the electron injecting and transporting layer. At this time, it is preferable to stack the compounds in descending order of the electron affinity value from the electron injection electrode side. Such a stacking order is the same when two or more electron injection / transport layers are provided.

The hole injecting and transporting layer, the light emitting layer and the electron injecting and transporting layer can be formed because a uniform thin film can be formed.
It is preferable to use a vacuum deposition method. When vacuum deposition is used, the amorphous state or the crystal grain size is 0.1 μm
The following homogeneous thin film is obtained. If the crystal grain size exceeds 0.1 μm, non-uniform light emission occurs, the driving voltage of the device must be increased, and the hole injection efficiency is significantly reduced.

The conditions for vacuum deposition are not particularly limited.
The degree of vacuum is 0 ^-4 Pa or less, and the deposition rate is 0.01 to 1 nm /
It is preferable to set it to about sec. Further, it is preferable to form each layer continuously in a vacuum. If they are formed continuously in a vacuum, impurities can be prevented from adsorbing at the interface between the layers, so that high characteristics can be obtained. Further, the driving voltage of the element can be reduced, and the occurrence and growth of dark spots can be suppressed.

In the case where a plurality of compounds are contained in one layer when a vacuum evaporation method is used for forming each of these layers, it is preferable to co-deposit each boat containing the compounds by individually controlling the temperature.

Further, in addition to the organic layer, the organic EL structure has a substrate and a functional thin film such as a hole injection electrode or an electron injection electrode formed so as to sandwich the organic layer on the substrate.

As the electron injection electrode, a substance having a low work function is preferable. For example, K, Li, Na, Mg, La, C
e, Ca, Sr, Ba, Al, Ag, In, Sn, Z
It is preferable to use a single metal element such as n or Zr, or a two-component or three-component alloy system containing them for improving the stability. As an alloy system, for example, Ag · Mg (A
g: 0.1 to 50 at%), Al.Li (Li: 0.01)
１２12 at%), In · Mg (Mg: 50 to 80 at%),
Al.Ca (Ca: 0.01 to 20 at%) and the like. Note that the electron injection electrode can also be formed by an evaporation method or a sputtering method.

The thickness of the electron injecting electrode thin film may be a certain thickness or more for sufficiently injecting electrons.
The thickness is preferably 1 nm or more, more preferably 3 nm or more. The upper limit is not particularly limited, but the thickness may be generally about 3 to 500 nm. An auxiliary electrode or a protection electrode may be further provided on the electron injection electrode.

The pressure during the deposition is preferably 1 × 10 ⁻⁸ to 1
The heating temperature of the evaporation source is 100 to 1400 ° C. for a metal material and 100 to 50 ° C. for an organic material at × 10 ⁻⁵ Torr.
About 0 ° C. is preferable.

The hole injection electrode is preferably a transparent or translucent electrode for extracting emitted light. As the transparent electrode, ITO (tin-doped indium oxide), IZO
(Zinc-doped indium oxide), ZnO, SnO ₂ , I
Examples include n ₂ O ₃ , and preferably ITO (tin-doped indium oxide) and IZO (zinc-doped indium oxide). ITO usually contains In ₂ O ₃ and SnO in a stoichiometric composition, but the amount of O may slightly deviate from this. When transparency is not required, the hole injection electrode may be made of a known opaque metal material.

The hole injection electrode has an emission wavelength band, usually 3
50-800 nm, especially 80% light transmittance for each emitted light.
%, Particularly preferably 90% or more. The emitted light is usually extracted through the hole injection electrode,
When the transmittance is low, the light emission itself from the light emitting layer is attenuated, and the luminance required for the light emitting element tends not to be obtained. However, the light transmittance of the electrode on the side from which the emitted light is extracted may be 80% or more of the emitted light.

The thickness of the hole injecting electrode may be a certain thickness or more which can sufficiently inject holes, and is preferably 5 or more.
The range is preferably from 0 to 500 nm, more preferably from 50 to 300 nm. The upper limit is not particularly limited, but if the thickness is too large, there is a fear of peeling or the like. If the thickness is too small, there is a problem in the film strength at the time of manufacturing, the hole transport ability, and the resistance value.

The hole injection electrode layer can be formed by a vapor deposition method or the like.
It is preferable to form by the C sputtering method.

After forming each layer of the organic EL structure, the Si
Inorganic materials O _X such as Teflon, a protective film may be formed using an organic material such as fluorocarbon polymers containing chlorine.
The protective film may be transparent or opaque, and the thickness of the protective film is about 50 to 1200 nm. The protective film can be formed by a general sputtering method, a vapor deposition method,
It may be formed by an ECVD method or the like.

The light emission color may be controlled by using a color filter film, a color conversion film containing a fluorescent substance, or a dielectric reflection film on the substrate.

The organic EL structure is driven by a direct current or a pulse, and can be driven by an alternating current. The applied voltage is usually about 2 to 30V.

The organic EL element module of the present invention can be used not only as a display but also as an optical pickup used for memory read / write, etc., a relay device in an optical communication transmission line, a photocoupler, etc. It can be used for application devices.

[0126]

EXAMPLE On a glass substrate on which a predetermined pattern was formed so that COG mounting was possible, an ITO transparent electrode (hole injection electrode) was formed to a thickness of about 100 nm by sputtering. The obtained ITO thin film was patterned and etched by a photolithographic technique to form a hole injection electrode layer constituting a 240 × 320 dot (pixel) pattern.

After the surface of the substrate on which ITO transparent electrodes, electrode wirings, etc. are formed is subjected to UV / O ₃ cleaning, a mask for vapor deposition is mounted, and the substrate is fixed to a substrate holder of a vacuum vapor deposition apparatus. The pressure was reduced.

Depositing polythiophene to a thickness of 10 nm;
A hole injecting layer was formed, and then N,
N'-diphenyl-N, N'-m-tolyl-4,4'-
Diamino-1,1'-biphenyl (hereinafter referred to as TPD)
Evaporation was performed to a thickness of 5 nm to form a hole transport layer. Further, while maintaining the reduced pressure, tris (8-quinolinolato) aluminum (hereinafter, Alq3) was deposited to a thickness of 50 nm to form an electron injection transport / light emitting layer.

Then, while maintaining the reduced pressure, the EL element structure substrate was transferred from the vacuum evaporation apparatus to the sputtering apparatus, and the AlLi electron injection electrode (Li concentration: 7.2 at%) was formed to a thickness of 50 nm at a sputtering pressure of 1.0 Pa. Then, a film was formed. At that time, Ar was used as a sputtering gas, the input power was 100 W, the size of the target was 4 inches in diameter, and the distance between the substrate and the target was 90 mm. Further, while maintaining the reduced pressure, the EL
The element substrate was transferred to another sputtering apparatus, and the Al protective electrode was set to 200 nm by DC sputtering using an Al target.
Was formed to a thickness of The mask was removed when all film formation was completed.

A glass sealing plate was bonded as an internal sealing body, and a circuit element, that is, an element for driving an organic EL structure was mounted on a predetermined area of the substrate by COG.

Next, a resin material as an external sealing body was applied to a thickness of about 1 mm so as to cover the internal sealing body and the circuit element. At this time, the case where only the inner sealing body was used (Comparative Sample 1), the case where the inner sealing body and the outer sealing body (epoxy resin) were double-sealed (Sample 1), the inner sealing body and the outer sealing body were used. One in which the sealing body (epoxy resin) is double-sealed and a moisture absorbent (zeolite) is disposed inside the inner sealing body (sample 2), and the outer sealing body is a linear expansion of the inner sealing body and the substrate. Resin (epoxy resin) with a linear expansion coefficient about 5 times (3 × 10 ⁻⁵ ) of the coefficient (both are 6 × 10 ^{−6 for} glass)
(Sample 3), a resin (epoxy resin) having a linear expansion coefficient of 20 times the linear expansion coefficient of the inner sealing body and the substrate as the outer sealing body (Comparative Sample 2),
The thermosetting temperature of the external sealing body (epoxy resin) is 100 ° C
(Sample 4) The thermosetting temperature of the external sealing body (epoxy resin) was 150 ° C (the minimum glass transition temperature of the organic EL material was 95 ° C). Sample (Comparative Sample 3), an external encapsulant made of a photocurable resin (epoxy resin) with a curing shrinkage of 3% (Sample 5), and an external encapsulant made of a photocurable resin (acrylic resin) Resin) and its cure shrinkage is 1
5% (Comparative Sample 4) were prepared.

Each of the obtained organic EL devices was heated at a temperature of 60 ° C.
Under accelerated conditions of 95% humidity, the device was continuously driven at a current density of 10 mA / m ² , the non-light-emitting area ratio of each pixel was observed, and those exceeding 30% were judged to be defective and evaluated.

As a result, Comparative Sample 1 was less than 300 hours, Comparative Sample 2 was less than 200 hours, Comparative Sample 3 was defective in initial light emission, and Comparative Sample 4 was defective in less than 100 hours. On the other hand, in the sample of the present invention, sample 1 was 500 hours or more, and sample 2 was 10 hours.
A defective pixel could not be confirmed even when 00 hours or more, Sample 3 was 500 hours or more, Sample 4 was 500 hours or more, and Sample 5 was 400 hours or more.

[0134]

As described above, according to the present invention, it is possible to realize an organic EL device module capable of maintaining a sufficient sealing effect, suppressing deterioration of the device and extending the life of the device.

Further, the wiring of the panel is facilitated,
An organic EL element module that requires less wiring on the substrate and that can form a complicated wiring structure can be realized.

Further, it is possible to realize an organic EL element module capable of preventing a stress effect due to a difference in expansion rate and contraction rate of a mold material, a substrate material, and the like, and preventing peeling and a decrease in sealing effect. .

The organic EL structure is not damaged due to heat or the like in the heat curing step, the organic material is destroyed, loses its activity, or impairs some functions. An EL element module can be realized.

Further, the connection of input / output signals and power supply can be integrated and separated, the wiring pattern can be minimized, and an organic EL element module which is hardly affected by disturbance and noise can be realized.

Further, it is possible to realize an organic EL element module in which problems such as wettability of the adhesive on the electrode hardly occur, a decrease in adhesive strength can be prevented, and airtightness can be maintained for a long period of time.

Further, it is possible to realize an organic EL element module which is hardly affected by noise or the like generated by the organic EL element and which is free from a malfunction of a driving circuit or an IC.

[Brief description of the drawings]

FIG. 1 is a schematic sectional view showing a first configuration example of the present invention.

FIG. 2 is a schematic sectional view showing a second configuration example of the present invention.

FIG. 3 is a schematic sectional view showing a third configuration example of the present invention.

FIG. 4 is a schematic sectional view showing a fourth configuration example of the present invention.

FIG. 5 is a schematic sectional view showing a fifth configuration example of the present invention.

FIG. 6 is a block diagram showing a configuration example of a circuit for driving the organic EL structure of the present invention.

FIG. 7 is a schematic sectional view showing a configuration example of a display module using a conventional organic EL element.

FIG. 8 is a schematic sectional view showing a configuration example of a liquid crystal display module mounted with COG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 3 Internal sealing body 4 Sealing adhesive 5 Hygroscopic agent / moisture-proof agent 6 External sealing body 7 Sealing adhesive 8 Hygroscopic agent / moisture-proof agent 9 Connecting means 11 Lower electrode 12 Organic layer 13 Upper electrode 21 Circuit Element 22 Circuit pattern 23 Electromagnetic shield

Continuation of the front page (72) Inventor Hiroshi Yamamoto 1-13-1 Nihonbashi, Chuo-ku, Tokyo Inside TDK Corporation (72) Inventor Shun 1-13-1 Nihonbashi, Chuo-ku, Tokyo Inside TDK Corporation F term (reference) 3K007 AB00 AB04 AB12 AB13 AB14 BA06 BB00 BB01 BB05 BB06 CA01 CA02 CA05 CB01 DA00 DB03 EB00 FA01 GA00

Claims (11)

[Claims] An organic EL structure having at least one or more organic layers involved in a light emitting function between a pair of electrodes formed on a substrate, and a sealing unit for sealing the organic EL structure. Wherein the sealing means is disposed at a position closest to the organic EL structure and is formed of a hard member, and an inner sealing member is disposed outside the inner sealing member, and at least the inner sealing member is formed. An organic EL element module having a resin external sealing member formed so as to cover a joint between a stationary body and a substrate. 2. The organic EL element module according to claim 1, wherein a circuit for controlling and driving the organic EL structure is formed on at least one of the substrates covered with the external sealing body. 3. The organic EL element module according to claim 1, wherein a linear expansion coefficient of the outer sealing body is 0.1 to 10 times a linear expansion coefficient of the inner sealing body and the substrate. 4. The external sealing body is a thermosetting resin, and the thermosetting temperature is set to the lowest glass transition temperature among the glass transition temperatures of the organic materials of the organic EL structure.
The organic EL element module according to claim 1, wherein the temperature is equal to or lower than a temperature obtained by adding 0 ° C. 5. 5. The organic EL element module according to claim 4, wherein said thermosetting resin is an epoxy resin. 6. The organic EL element module according to claim 1, wherein the external sealing body is a photo-curable resin, and has a shrinkage rate of 10% or less during curing. 7. The organic EL element module according to claim 6, wherein said photocurable resin is an acrylic or epoxy resin. 8. The organic EL element module according to claim 1, wherein the external sealing body has a light transmittance of 20% or less at any wavelength from ultraviolet to infrared. 9. A connecting means between the sealing means and the substrate, the connecting means electrically connecting a circuit inside the sealing means and an external circuit, and connecting the circuit inside the sealing means. The organic EL element module according to any one of claims 1 to 8, which maintains airtightness. 10. The organic EL element module according to claim 1, further comprising an electromagnetic shield inside said sealing means. 11. The organic EL element module according to claim 1, wherein the total thickness is 10 mm or less.