CN116900483A - Method for monitoring a laser welding process, device for carrying out the method and use of the method - Google Patents
Method for monitoring a laser welding process, device for carrying out the method and use of the method Download PDFInfo
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- CN116900483A CN116900483A CN202310413317.7A CN202310413317A CN116900483A CN 116900483 A CN116900483 A CN 116900483A CN 202310413317 A CN202310413317 A CN 202310413317A CN 116900483 A CN116900483 A CN 116900483A
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- optical
- laser beam
- welding process
- laser welding
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Links
- 238000000034 method Methods 0.000 title claims abstract description 55
- 238000003466 welding Methods 0.000 title claims abstract description 34
- 230000008569 process Effects 0.000 title claims abstract description 28
- 238000012544 monitoring process Methods 0.000 title claims abstract description 9
- 230000003287 optical effect Effects 0.000 claims abstract description 57
- 239000000356 contaminant Substances 0.000 claims abstract description 20
- 229910052802 copper Inorganic materials 0.000 claims abstract description 15
- 239000010949 copper Substances 0.000 claims abstract description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 14
- 230000009471 action Effects 0.000 claims abstract description 8
- 238000005304 joining Methods 0.000 claims abstract description 7
- 238000001514 detection method Methods 0.000 claims description 23
- 238000012545 processing Methods 0.000 claims description 8
- 239000000446 fuel Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 238000012806 monitoring device Methods 0.000 claims 2
- 230000005855 radiation Effects 0.000 description 6
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 4
- 238000011109 contamination Methods 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 229910052708 sodium Inorganic materials 0.000 description 4
- 239000011734 sodium Substances 0.000 description 4
- 239000006059 cover glass Substances 0.000 description 2
- 230000003595 spectral effect Effects 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 239000011324 bead Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000295 emission spectrum Methods 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000002957 persistent organic pollutant Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 150000003388 sodium compounds Chemical class 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
- B23K26/24—Seam welding
- B23K26/244—Overlap seam welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
- B23K26/24—Seam welding
- B23K26/26—Seam welding of rectilinear seams
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/32—Bonding taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to investigating the properties, e.g. the weldability, of materials
- B23K31/125—Weld quality monitoring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/38—Conductors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/12—Copper or alloys thereof
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Quality & Reliability (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention describes a method for monitoring a laser welding process, wherein two copper-containing workpieces are connected to one another in the region of a joining region by the action of a laser beam, wherein the optical emission from the region of the joining location is detected and analyzed during the action of the laser beam, and wherein the optical emission in the wavelength range of less than 1 μm is detected and taken into account for determining the presence of organic contaminants in the region of the joining location.
Description
Technical Field
The invention relates to a method for monitoring a laser welding process, to a device for carrying out the method and to the use of the method according to the preamble of the independent claims.
Background
Copper bond joints are generally widely used for electrical or thermal conduction in various technical products. For the production of such copper bonded joints, laser welding is increasingly gaining acceptance as the best bonding technique. However, if the copper components to be welded are contaminated in the region of the joint region, welding defects of different criticality can occur. This is manifested, for example, by the formation of a large number of voids or the ejection of melt, in which case a reduced joint cross section occurs and the material released therefrom additionally causes short circuits in the finished product. This can lead to sudden failure of the component or even to a subsequent failure.
Such contamination may result from, for example, insulating varnish that is not completely removed in the region of the joint location, but may likewise result from the presence of entrained lubricant, abraded particles or even fingerprints. In particular organic residues on the workpiece in the region of the joint region can lead to problems.
According to the prior art, in order to solve this problem, the corresponding joining partners, for example made of copper, are to be checked on the basis of uv fluorescence. The respective component is inspected before it is supplied to the welding process.
In this connection, a method for monitoring the connection surface during laser welding of curved rod-shaped conductors containing copper is known from DE 102020113179A1, in which, after the action of a processing laser beam, the change in temperature of the produced weld bead with time is measured as a variable measurement variable.
Furthermore, a method for monitoring the quality of a laser welding process is known from US 6060685A, in which the intensity of the plasma radiation is monitored.
Disclosure of Invention
The invention relates to a method for monitoring a laser welding process, to a device for carrying out the method, and to the use of the method, having the characterizing features of the independent claims.
THE ADVANTAGES OF THE PRESENT INVENTION
In an advantageous manner, it is provided that, for monitoring the laser welding process, during the action of the laser beam, a possible optical radiation emission at the joining location is detected and evaluated, in which two joining partners, in particular comprising copper, are connected or welded together in the region of the joining location by the action of the laser beam. This is done in the wavelength range of less than 1 micron of optical emission. Determining whether an organic contaminant is present at the bonding location based on the detected optical emission.
A particular advantage of this is that the organic contaminants in the region of the joining point, when they decompose under the action of high-energy radiation, such as, for example, a laser beam, produce a characteristic optical spectrum which can be distributed particularly effectively to the organic contaminants, in particular in the wavelength range of less than 1 μm. In this way, the copper-containing workpieces used can be controlled with respect to organic contaminants which may be present themselves during the laser welding process, and prior control of the copper-containing workpieces prior to their use in the context of the laser welding process is avoided in this way. This results in a significant reduction in the corresponding outlay.
Further advantageous embodiments of the invention are the subject matter of the dependent claims.
It is then advantageous to analyze the optical emission of the detected joining location during the laser welding process as follows: whether there is emission, in particular linear emission, in the range of the wavelength of 589 nm. At a wavelength of 589 nm, sodium shows a characteristic emission spectrum, the presence of which indicates: sodium or sodium compounds are present in the region of the junction site. Since substantially all organic contaminants of the joint are contaminated with sodium, it is possible in this way to determine very precisely whether such contaminants are present in the region of the joint.
It is furthermore advantageous if, during the laser welding process, the overall brightness is determined on the basis of the emitted optical emissions in relation to the position of the joining location or the surroundings of the joining location. Since a higher brightness is overall caused by the corresponding combustion process in the presence of organic contaminants than in the case of a laser welding process using a joining partner without organic contaminants, it can be deduced in this way that: it can be assumed that organic contaminants are present at the joint location with an increase in overall brightness.
It is furthermore advantageous if a corresponding warning is issued in the presence of an optical emission which is classified as the presence of organic contaminants in the region of the connection point. This can be achieved, for example: and selecting the copper-containing workpiece correspondingly polluted by the organic pollutant.
It is furthermore advantageous to analyze the optical emission of the bonding site during the laser welding process at least two discrete wavelengths of the optical spectrum, if necessary with a corresponding detection range of a few (a few) nanometers around the discrete wavelength. Here, 589 nm is preferably chosen as one of the discrete wavelengths. In this way, false alarms can be avoided, since in the case of simultaneous increases or decreases in the optical emission, for example, contamination of the cover glass or the like upstream of the spectrometer can also be assumed, in which case no organic contaminants have to be present in the region of the joining point during the laser welding process.
Furthermore, according to the invention, a device for carrying out the method according to the invention is provided. The device is suitable for carrying out a laser welding process and thus comprises a laser source and a device for providing a copper-containing workpiece for the respective laser welding process. Furthermore, an optical detection device is provided, which is arranged in the following manner: a method of the above type is carried out.
In this case, it is advantageous if the optical detection device is arranged in a laser processing chamber in which a laser welding process takes place. The optical detection device can be arranged in the laser processing chamber in such a way that the optical detection device, although focused onto the joining location, is not arranged in the laser processing axis defined by the laser beam.
An advantageous alternative embodiment provides that the optical detection device is integrated into the laser processing optics providing the laser beam and thus detects the axial optical emission of the joining location. In this case, the optical detection device advantageously comprises a color beam splitter that couples out possible optical emissions of the joint location from the beam path of the laser radiation towards the detector of the optical detection device. Both embodiments ensure an effective detection and analysis of the possible optical emissions of the joint location.
The method according to the invention or the device according to the invention can be used in an advantageous manner for producing electric motors, electric drive shafts, fuel cells, junction connections in the field of electronics or power electronics, or cell connectors of battery packs.
Drawings
Embodiments of the invention are illustrated in the accompanying drawings and described in detail in the following description. Wherein:
fig. 1 shows an apparatus for performing a laser welding process according to an embodiment of the present invention.
Detailed Description
Fig. 1 shows an apparatus for performing a laser welding process according to an embodiment of the present invention. The device 10 here comprises a laser welding chamber 12, in which laser welding chamber 12 a device 14 for generating a laser beam is located. During the execution of the laser welding process, the means 14 for generating a laser beam emits a laser beam 16, which laser beam 16 impinges on a joining location 18, which joining location 18 is formed, for example, by a first copper-containing workpiece 20 and, for example, by a second copper-containing workpiece 22. If organic contaminants are present in the region of the joining location 18, impingement of the laser beam 16 on the joining location 18 may result in burning of the organic contaminants, which is indicated in fig. 1 by flame symbol 24. In order to detect such burning out of organic contaminants, the laser processing chamber 12 preferably further comprises an optical detection device 30, which optical detection device 30 comprises, for example, a photodiode 32 for detecting the optical emission, and an optical focusing device 34 and/or an optical filter 36 are arranged in front of the photodiode 32.
In order to be able to detect the characteristic spectral line of 589 nm, which occurs for example when organic contaminants burn out (this characteristic spectral line of 589 nm is classified as sodium emission), the optical filter can be designed, for example, as a bandpass filter for 589 nm radiation.
The photodiode 32 can be designed, for example, as a diode with a high resolution time course or as a diode with a deceleration response mode, the measured value of which then corresponds to an integrated measured value over the entire welding process. Furthermore, it is alternatively possible to use two diodes, which are each able to selectively detect radiation of a specific wavelength. By computationally comparing the two measurement signals, it is possible, for example, to calculate interference effects on the measurement, such as, for example, contamination of the cover glass or contamination of the optical filter. Instead of the photodiode 32, a camera can also be used, in front of the light-sensitive chip of which a different optical filter 36 is placed side by side in the beam path of the optical detection device 30.
According to the embodiment in fig. 1, the optical axis of the optical detection means 30 is arranged at an angle to the axis of the processing laser beam defined by the laser beam 16. Alternatively, however, it is also possible to structurally combine the optical detection device 30 with the device 14 for generating the laser beam and to thereby orient the optical axis of the optical detection device 30 parallel to the beam path of the laser beam 16. In this case, the optical detection device 30 is additionally equipped with a color beam splitter, which couples out the optical emission of the joining location 18 from the beam path of the laser beam and supplies the optical emission of the joining location 18 to the photodiode 32.
The emission data obtained by means of the optical detection device 30 are provided, for example, to an evaluation device 40, which evaluation device 40 displays the corresponding analysis results on an optical display device 42. The evaluation device 40 comprises, for example, a stored characteristic map in which emission data of a comparable welding process with and without organic contaminants are stored. In this way, the emission data obtained with the optical detection device 30 can be compared with the stored emission data of the evaluation device 40, and reliable measurement results can be produced in this way. If the emission data of the optical detection device 30 is classified as a laser welding process which leads to burning out of organic contaminants, a warning can be correspondingly output on the display device 42, which warning enables the removal of the possibly defective first and second workpieces 20, 22 of such a joint.
Claims (10)
1. Method for monitoring a laser welding process, wherein two workpieces, in particular containing copper, are connected to each other in the region of a joining zone by the action of a laser beam, characterized in that the optical emission from the region of a joining location is detected and analyzed during the action of the laser beam, wherein the optical emission in the wavelength range of less than 1 micrometer is detected and taken into account for determining the presence of organic contaminants in the region of the joining location.
2. The method according to claim 1, characterized in that the following analysis is performed on the optical emissions detected during the laser welding process: whether there is an especially linear emission in the wavelength range of 589 nm.
3. The method according to claim 1 or 2, characterized in that the overall brightness of the optical emission emanating from the joint position is determined during the laser welding.
4. A method according to any of the preceding claims, characterized in that a warning is issued when there is an optical emission of organic contaminants indicative of the bonding location.
5. A method according to any one of the preceding claims, characterized in that the analysis of the optical emission from the joining location is examined in respect of two discrete wavelength ranges, which have a respective width of up to 10 nanometers.
6. Device for carrying out the method according to any one of the preceding claims, wherein the device comprises a laser beam source (14) and means, in particular for providing a laser welding process with copper-containing workpieces (20, 22), characterized in that an optical monitoring device (30) is provided for detecting and analyzing the optical emission of the joining location (18) during the laser welding process, the optical monitoring device (30) comprising means for carrying out the method according to any one of the preceding claims.
7. The device according to claim 6, characterized in that the optical detection device (30) is positioned outside the laser beam axis formed by the laser beam (16) and focused onto the engagement location (18).
8. The apparatus according to claim 6, characterized in that the optical detection means (30) are integrated into laser processing optics providing the laser beam (16).
9. The device according to claim 8, characterized in that the optical detection device (30) comprises a color beam splitter that couples out the optical emission of the joining location (18) from the beam path of the laser beam (16) towards a detector (32) of the optical detection device (30).
10. Use of the method according to any one of claims 1 to 5 or the device according to any one of claims 6 to 9 for manufacturing an electric motor, an electric drive shaft, a fuel cell, a junction location in the field of electronics or power electronics or a cell connection in the field of battery packs.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102022203837.1A DE102022203837A1 (en) | 2022-04-19 | 2022-04-19 | Method for monitoring a laser welding process, device for carrying out the same and its use |
| DE102022203837.1 | 2022-04-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116900483A true CN116900483A (en) | 2023-10-20 |
Family
ID=88191846
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310413317.7A Pending CN116900483A (en) | 2022-04-19 | 2023-04-18 | Method for monitoring a laser welding process, device for carrying out the method and use of the method |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN116900483A (en) |
| DE (1) | DE102022203837A1 (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6060685A (en) | 1997-10-23 | 2000-05-09 | Trw Inc. | Method for monitoring laser weld quality via plasma light intensity measurements |
| DE102020113179A1 (en) | 2020-05-15 | 2021-11-18 | Trumpf Laser- Und Systemtechnik Gmbh | Method for monitoring a connection surface during laser welding of bent rod conductors containing copper |
-
2022
- 2022-04-19 DE DE102022203837.1A patent/DE102022203837A1/en active Pending
-
2023
- 2023-04-18 CN CN202310413317.7A patent/CN116900483A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| DE102022203837A1 (en) | 2023-10-19 |
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