CN115291477B - Semiconductor manufacturing wafer lithography equipment - Google Patents
Semiconductor manufacturing wafer lithography equipment Download PDFInfo
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- CN115291477B CN115291477B CN202211036479.5A CN202211036479A CN115291477B CN 115291477 B CN115291477 B CN 115291477B CN 202211036479 A CN202211036479 A CN 202211036479A CN 115291477 B CN115291477 B CN 115291477B
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- top surface
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 11
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
- 238000001459 lithography Methods 0.000 title claims description 8
- 239000000428 dust Substances 0.000 claims abstract description 38
- 238000001259 photo etching Methods 0.000 claims abstract description 32
- 230000005540 biological transmission Effects 0.000 claims description 41
- 239000000919 ceramic Substances 0.000 claims description 37
- 238000010438 heat treatment Methods 0.000 claims description 28
- 230000002457 bidirectional effect Effects 0.000 claims description 13
- 238000000926 separation method Methods 0.000 claims description 10
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 238000005485 electric heating Methods 0.000 claims description 7
- 238000000605 extraction Methods 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 5
- 238000000034 method Methods 0.000 description 5
- 239000000084 colloidal system Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 238000004064 recycling Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
- G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
- H01L21/67225—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention discloses a semiconductor manufacturing wafer photoetching device, which relates to the technical field of wafer photoetching and aims to provide a semiconductor manufacturing wafer photoetching device capable of absorbing dust and improving processing effect and processing efficiency.
Description
Technical Field
The invention relates to the technical field of wafer lithography, in particular to a semiconductor manufacturing wafer lithography device.
Background
In the process of processing a semiconductor, a photo-like printing technology is adopted to print a fine pattern on a mask onto a silicon wafer through light exposure.
In the prior art, a wafer is generally stuck and fixed on a ceramic disc, then a wafer block with the ceramic disc is arranged on a photoetching table, and the wafer block moves along an X axis and a Y axis under the drive of a transmission mechanism, so that ultraviolet rays can be ensured to smoothly remove a protective film on the surface of the wafer, but in the wafer processing process, dust in air can fall onto the surface of the wafer, so that the development is not clean, and reworking and re-photoetching are caused.
Disclosure of Invention
(one) solving the technical problems
Aiming at the defects of the prior art, the invention provides semiconductor manufacturing wafer photoetching equipment capable of absorbing dust and improving the processing effect and the processing efficiency.
(II) technical scheme
In order to achieve the above purpose, the present invention provides the following technical solutions: the utility model provides a semiconductor manufacturing wafer lithography apparatus, includes photoetching platform, exposure machine case, movable block and drive mechanism, and movable block sets up in the below of exposure machine case, and drive mechanism is used for driving movable block and removes along X axle and Y axle, is equipped with the wafer piece on the movable block, and the equipment still includes:
the movable cavity is formed in the photoetching platform, the movable block and the transmission mechanism are arranged in the movable cavity, and the top surface of the movable block and the top surface of the photoetching platform are positioned on the same horizontal line;
a feeding port is formed in the top surface of the photoetching table and is communicated with the movable cavity;
the clamping mechanism is fixedly installed on the movable block and comprises a transmission part and two clamping pieces, the transmission part drives the two clamping pieces to move relatively, and the two clamping pieces are used for clamping and fixing the wafer blocks.
The feeding mechanism is used for pushing the wafer blocks outside the exposure case to the top surface of the movable block;
the dust collection mechanism comprises a dust collection cover, a power motor and dust collection blades, wherein the dust collection cover is arranged on the top surface of an exposure case, the cover bottom of the dust collection cover extends to the inner cavity of the exposure case, an air outlet pipe is arranged on the outer side of the dust collection cover, the power motor is arranged on the top of the dust collection cover, an output shaft of the dust collection cover is driven to be provided with a connecting shaft, and the dust collection blades are arranged on the connecting shaft.
Preferably, the movable block comprises an X-axis block and a Y-axis block, and the transmission mechanism comprises an X-axis assembly and a Y-axis assembly;
the X-axis assembly pushes the X-axis block to slide along the X-axis at the bottom of the movable cavity, and the Y-axis assembly pushes the Y-axis block to slide along the Y-axis at the top surface of the X-axis block.
Preferably, the transmission part is arranged in the Y-axis block, and a transmission hole is formed in the top surface of the Y-axis block;
the transmission part comprises a bidirectional screw, a transmission motor and two connecting sleeves, the transmission motor is arranged on the side wall of the Y-axis block, an output shaft of the transmission motor is in driving connection with the bidirectional screw, the connecting sleeves are sleeved with threads of the bidirectional screw outside the bidirectional screw, and the connecting sleeves extend upwards through the transmission holes and are provided with clamping pieces.
Preferably, the feeding mechanism comprises a pushing cylinder, a pushing plate is mounted at the movable end of the pushing cylinder, and the pushing plate pushes the wafer block to move to the top of the Y-axis block.
Preferably, the feeding mechanism further comprises a rotating disc and a lifting cylinder;
the rotating disc is driven to rotate by the power piece, at least two limiting holes are formed in the rotating disc, the limiting holes are used for placing wafer blocks, and the rotating disc drives the wafer blocks to slide along the top surface of the photoetching table;
the elevating system is installed at the roof of exposure machine case, and the lifter plate is installed to the flexible end of lift cylinder, pushes away the material cylinder and installs on the lifter plate.
Preferably, the wafer block comprises a wafer and a ceramic disc, and the wafer is connected with the ceramic disc through adhesive;
a splitting mechanism for separating the wafer from the ceramic disc is arranged in the exposure case;
the splitting mechanism comprises a heating part, an extracting part and a wiping part, wherein the heating part is used for heating the ceramic disc to melt the adhesive, the extracting part is used for stripping the wafer, and the wiping part is used for wiping the adhesive on the surface of the ceramic disc;
preferably, the photoetching table is provided with a blanking zone, a heating zone, a separation zone and a loading zone, the number of the limiting holes is four, and the four limiting holes correspond to the loading zone, the blanking zone, the heating zone and the separation zone respectively;
wherein, separation zone and charging zone are located the outside of exposure machine case, and unloading zone and heating zone are located the inside of exposure machine case.
Preferably, the heating component is arranged on the top surface of the photoetching table, the heating component is an electric heating layer, and the electric heating layer is electrified to heat the ceramic disc;
the extraction component comprises a mechanical wall and a suction part, the suction part sucks the wafer, and the mechanical wall drives the wafer to leave the ceramic disc;
the wiping part comprises a wiping part, the wiping part is a wiping wheel, the wiping wheel is rotatably arranged above the rotating disc, and the bottom of the wiping wheel is abutted against the bottom of the rotating disc.
Preferably, the power member includes a power shaft and drive teeth;
the bottom end of the power shaft is rotationally connected with the photoetching table, the rotating disc is fixedly connected with the power shaft, the top surface of the power shaft is provided with driven teeth, and the driven teeth are meshed with the driving teeth;
the driving teeth are sector teeth which are arranged on the connecting shaft and are used for driving the driven teeth to rotate.
Preferably, the X-axis assembly comprises a first cylinder, a sliding rod and a sliding rail;
the first cylinder is arranged on the side wall of the movable cavity, the telescopic end of the first cylinder is fixedly connected with the side wall of the X-axis block, the two ends of the sliding rod are fixedly connected with the two side walls of the movable cavity, the sliding rail is arranged at the bottom of the movable cavity, and the first cylinder pushes the X-axis block to move along the sliding rod and the sliding rail;
the Y-axis assembly comprises a second air cylinder and a guide rail, wherein the second air cylinder is fixedly arranged on the cavity wall of the movable cavity, the telescopic end of the second air cylinder is fixedly connected with the side wall of the Y-axis block, the guide rail is arranged at the top of the X-axis block, and the second air cylinder drives the Y-axis block to slide along the guide rail.
(III) beneficial effects
Compared with the prior art, the invention provides a semiconductor manufacturing wafer photoetching device, which comprises the following components
The beneficial effects are that:
1. set up dust extraction in exposing machine incasement, the dust in the absorption air prevents that it from dropping to the surface of wafer piece, thereby improve wafer processing effect, avoid the wafer to cause the reworking because of the surface is unclean, improve the whole machining efficiency of wafer, simultaneously, set up movable chamber in the inside of photoetching platform, install movable block and driving mechanism at movable intracavity, make feed mechanism can promote the top surface of outside wafer piece to movable block, realize the quick-witted material loading of wafer piece, further improve work efficiency.
2. The rotary disc is arranged, the wafer blocks are placed in the limiting holes of the rotary table, the rotary disc rotates to drive the wafer blocks to rotate, the wafer blocks are separated from the ceramic disc through different areas in the rotation process, and the ceramic disc is wiped, so that the recycling of the ceramic disc is realized.
Drawings
FIG. 1 is a schematic side cross-sectional view of one embodiment of the present invention;
FIG. 2 is a schematic front cross-sectional view of one embodiment of the present invention;
FIG. 3 is a schematic top half-sectional view of one embodiment of the present invention.
In the figure: 1. a photolithography station; 2. an exposure cabinet; 3. an active block; 4. a wafer block; 5. a movable cavity; 6. a feeding port; 7. a transmission member; 8. a clamping member; 9. a dust hood; 10. a power motor; 11. dust collection blades; 12. an air outlet pipe; 13. a connecting shaft; 14. an X-axis block; 15. a Y-axis block; 16. a transmission hole; 17. a bidirectional screw; 18. a drive motor; 19. connecting sleeves; 20. a pushing cylinder; 21. a pushing plate; 22. a rotating disc; 23. a lifting cylinder; 24. a guide rail; 25. a limiting hole; 26. a lifting plate; 27. a wafer; 28. a ceramic disc; 29. a heating member; 30. an extraction component; 31. a wiping member; 32. a blanking area; 33. a heating zone; 34. a separation zone; 35. a feeding area; 36. an electric heating layer; 38. a suction part; 39. a wiping wheel; 40. a power shaft; 41. a drive tooth; 42. driven teeth; 43. a first cylinder; 44. a slide bar; 45. a slide rail; 46. and a second cylinder.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Example 1
Referring to fig. 1, a semiconductor manufacturing wafer lithography apparatus includes a lithography stage 1, an exposure box 2, a movable block 3, and a transmission mechanism, where the movable block 3 is disposed below the exposure box 2, the transmission mechanism is used to drive the movable block 3 to move along an X axis and a Y axis, and a wafer block 4 is disposed on the movable block 3, and the apparatus further includes:
the movable cavity 5 is formed in the photoetching table 1, the movable block 3 and the transmission mechanism are arranged in the movable cavity 5, and the top surface of the movable block 3 and the top surface of the photoetching table 1 are positioned on the same horizontal line;
the feeding port 6 is formed in the top surface of the photoetching table 1, and the feeding port 6 is communicated with the movable cavity 5;
the clamping mechanism is fixedly installed on the movable block 3 and comprises a transmission part 7 and two clamping pieces 8, the transmission part 7 drives the two clamping pieces 8 to move relatively, and the two clamping pieces 8 are used for clamping and fixing the wafer block 4.
The feeding mechanism is used for pushing the wafer block 4 outside the exposure case 2 to the top surface of the movable block 3;
the dust collection mechanism comprises a dust collection cover 9, a power motor 10 and dust collection blades 11, wherein the dust collection cover 9 is arranged on the top surface of the exposure machine case 2, the cover bottom of the dust collection cover 9 extends to the inner cavity of the exposure machine case 2, an air outlet pipe 12 is arranged on the outer side of the dust collection cover 9, the power motor 10 is arranged on the top of the dust collection cover 9, an output shaft of the dust collection cover 9 drives a connecting shaft 13, and the dust collection blades 11 are arranged on the connecting shaft 13.
In the invention, the dust collection mechanism is arranged in the exposure case 2 to absorb dust in air and prevent the dust from falling onto the surface of the wafer block 4, thereby improving the wafer processing effect, avoiding reworking of the wafer caused by unclean surface and improving the processing efficiency of the whole wafer, and meanwhile, the movable cavity 5 is arranged in the photoetching table 1, and the movable block 3 and the transmission mechanism are arranged in the movable cavity 5, so that the feeding mechanism can push the external wafer block 4 to the top surface of the movable block 3, thereby realizing the rapid feeding of the wafer block 4 and further improving the working efficiency.
Specifically, the movable block 3 comprises an X-axis block 14 and a Y-axis block 15, and the transmission mechanism comprises an X-axis assembly and a Y-axis assembly;
the X-axis assembly pushes the X-axis block 14 to slide along the X-axis at the bottom of the movable cavity 5, and the Y-axis assembly pushes the Y-axis block 15 to slide along the Y-axis at the top surface of the X-axis block 14.
Specifically, the X-axis assembly includes a first cylinder 43, a slide rod 44, and a slide rail 45;
the first air cylinder 43 is arranged on the side wall of the movable cavity 5, the telescopic end of the first air cylinder 43 is fixedly connected with the side wall of the X-axis block 14, the two ends of the sliding rod 44 are fixedly connected with the two side walls of the movable cavity 5, the sliding rail 45 is arranged at the bottom of the movable cavity 5, and the first air cylinder 43 pushes the X-axis block 14 to move along the sliding rod 44 and the sliding rail 45;
the Y-axis assembly comprises a second air cylinder 46 and a guide rail 24, wherein the second air cylinder 46 is fixedly arranged on the cavity wall of the movable cavity 5, the telescopic end of the second air cylinder 46 is fixedly connected with the side wall of the Y-axis block 15, the guide rail 24 is arranged at the top of the X-axis block 14, and the second air cylinder 46 drives the Y-axis block 15 to slide along the guide rail 24.
When the equipment works, the ultraviolet light source is not moved, and the X-axis component and the Y-axis component drive the X-axis block 14 and the Y-axis block 15 to move respectively, so that the wafer block 4 can move in the X-axis direction and the Y-axis direction, and smooth exposure is ensured.
Specifically, the transmission part 7 is installed in the Y-axis block 15, and a transmission hole 16 is formed in the top surface of the Y-axis block 15;
the transmission part 7 comprises a bidirectional screw 17, a transmission motor 18 and two connecting sleeves 19, the transmission motor 18 is arranged on the side wall of the Y-axis block 15, an output shaft of the transmission motor 18 is in driving connection with the bidirectional screw 17, the connecting sleeves 19 are in threaded sleeve connection with the bidirectional screw 17 outside the bidirectional screw 17, and the connecting sleeves 19 extend upwards through the transmission holes 16 and are provided with clamping pieces 8.
This is a specific embodiment of the clamping mechanism, and the transmission motor 18 is used as a power source to drive the bi-directional screw 17 to rotate, so that the connecting sleeve 19 has a rotation trend and is limited by the transmission hole 16, and finally the connecting sleeve 19 moves along the axial direction of the bi-directional screw 17;
in this embodiment, the driving motor 18 is a forward/reverse motor, so that the clamping member 8 can be ensured to move toward each other.
Specifically, the feeding mechanism comprises a pushing cylinder 20, a pushing plate 21 is mounted at the movable end of the pushing cylinder 20, and the pushing plate 21 pushes the wafer block 4 to move to the top of the Y-axis block 15.
In the invention, a specific structure of the feeding mechanism is provided, and the pushing cylinder 20 is directly utilized to push the external wafer blocks 4 to the top of the Y-axis block 15, so that the feeding mechanism is simple and convenient.
Example 2
When the wafer is processed, in order to prevent the wafer from being damaged due to the fact that the clamping mechanism directly applies pressure to the wafer, the wafer needs to be stuck on the ceramic disc 28 first, and then the pressure is applied to the ceramic disc 28, so that the stability of the wafer during operation can be ensured;
in the above embodiment, although the rapid loading of the wafer block 4 is realized, the ceramic disc 28 cannot be separated from the wafer 27, and thus cannot be reused in the processing process, and thus the present invention provides another embodiment:
specifically, referring to fig. 1 to 3, the feeding mechanism further includes a rotating disc 22 and a lifting cylinder 23;
the rotating disc 22 is driven to rotate by a power piece, at least two limiting holes 25 are formed in the rotating disc 22, the limiting holes 25 are used for placing the wafer blocks 4, and the rotating disc 22 drives the wafer blocks 4 to slide along the top surface of the photoetching table 1;
the lifting mechanism is arranged on the top wall of the exposure machine case 2, the lifting plate 26 is arranged at the telescopic end of the lifting cylinder 23, and the pushing cylinder 20 is arranged on the lifting plate 26.
The rotating disc 22 can drive the wafer blocks 4 in the limiting holes 25 to move and return to the initial position, and after the processing of the wafer 27 is completed, a splitting mechanism for separating the wafer 27 from the ceramic disc 28 can be matched, and after the wafer 27 and the ceramic disc 28 are separated, the recycling of the ceramic disc 28 is realized;
specifically, the splitting mechanism includes a heating component 29, an extracting component 30, and a wiping component 31, where the heating component 29 is used to heat the ceramic disc 28 to melt the adhesive, the extracting component 30 is used to peel off the wafer 27, and the wiping component 31 is used to wipe the adhesive on the surface of the ceramic disc 28;
specifically, the photolithography table 1 is provided with a blanking zone 32, a heating zone 33, a separation zone 34 and a loading zone 35, the number of the limiting holes 25 is four, and the four limiting holes 25 respectively correspond to the loading zone 35, the blanking zone 32, the heating zone 33 and the separation zone 34;
wherein the separation zone 34 and the feeding zone 35 are located outside the exposure cabinet, and the blanking zone 32 and the heating zone 33 are located inside the exposure cabinet.
After the photoetching of the wafer 27 is finished, the pushing cylinder 20 drives the processed wafer block 4 to return to the blanking area 32, the rotating disc 22 rotates to drive the wafer block 4 to enter the heating area 33, the heating area 33 is provided with the heating part 29, the heating part 29 is arranged on the top surface of the photoetching table 1, the heating part 29 is an electric heating layer 36, the electric heating layer 36 is electrified to heat the ceramic disc 28, so that colloid is melted, after the colloid is melted, the wafer 27 positioned in the blanking area 32 finishes processing, the pushing cylinder 20 drives the wafer block to return to the blanking area 32, the rotating disc 22 continues to rotate, the heated and melted ceramic disc 28 leaves the exposure machine box 2, the extracting part 30 strips the wafer 27, generally, the extracting part 30 comprises a mechanical wall and a suction part 38, the suction part 38 sucks the wafer 27, the mechanical wall drives the wafer 27 to leave the ceramic disc 28, then the rotating disc 22 continues to drive the ceramic disc 28 to move, and in the moving process of the ceramic disc 28, the wiping part 31 wipes the residual colloid on the surface of the ceramic disc 28, and the ceramic disc 28 enters the feeding area 35, so that the repeated utilization of the ceramic disc 28 is realized.
It should be noted that, if the top surface of the ceramic disc 28 is located below the top surface of the rotating disc 22, the wiping member 31 needs to include a wiping portion for wiping the gel and a lifting portion for driving the wiping portion to lift and descend, and this structure is complex.
Example 3
In the above embodiment, the rotation of the rotating disc 22 needs to be separately provided with a power source, and since the wafer block 4 needs to stay through four areas, the power source needs to be continuously turned on and off, and the apparatus is lost, so further another embodiment is provided in the present invention:
1-3, the power member includes a power shaft 40 and drive teeth 41;
the bottom end of the power shaft 40 is rotationally connected with the photoetching table 1, the rotating disc 22 is fixedly connected with the power shaft 40, the top surface of the power shaft 40 is provided with driven teeth 42, and the driven teeth 42 are meshed with the driving teeth 41;
the driving teeth 41 are sector-shaped teeth, which are mounted on the connecting shaft 13, and the driving teeth 41 are used for driving the driven teeth 42 to rotate.
In this embodiment, the power motor 10 of the dust collection mechanism is used as a power source, and the driven teeth 42 are driven by the fan-shaped teeth to rotate intermittently, so that the wafer blocks 4 stay in different areas for processing, and the processing cost is reduced.
The above is only a specific embodiment of the present invention, but the technical features of the present invention are not limited thereto. Any simple changes, equivalent substitutions or modifications and the like made on the basis of the present invention to solve the substantially same technical problems and achieve the substantially same technical effects are included in the scope of the present invention.
Claims (1)
1. The utility model provides a semiconductor manufacturing wafer lithography apparatus, includes photoetching platform (1), exposure machine case (2), movable block (3) and drive mechanism, and movable block (3) set up in the below of exposure machine case (2), and drive mechanism is used for driving movable block (3) along X axle and Y axle removal, is equipped with wafer piece (4) on movable block (3), its characterized in that, equipment still includes:
the movable cavity (5), the movable cavity (5) is opened in the photoetching platform (1), the movable block (3) and the transmission mechanism are arranged in the movable cavity (5), and the top surface of the movable block (3) and the top surface of the photoetching platform (1) are positioned on the same horizontal line;
the feeding port (6) is formed in the top surface of the photoetching table (1), and the feeding port (6) is communicated with the movable cavity (5);
the clamping mechanism is fixedly arranged on the movable block (3) and comprises a transmission part (7) and two clamping pieces (8), the transmission part (7) drives the two clamping pieces (8) to move relatively, and the two clamping pieces (8) are used for clamping and fixing the wafer block (4);
the feeding mechanism is used for pushing the wafer blocks (4) outside the exposure machine case (2) to the top surface of the movable block (3);
the dust collection mechanism comprises a dust collection cover (9), a power motor (10) and dust collection blades (11), wherein the dust collection cover (9) is arranged on the top surface of the exposure case (2), the cover bottom of the dust collection cover (9) extends to the inner cavity of the exposure case (2), an air outlet pipe (12) is arranged on the outer side of the dust collection cover (9), the power motor (10) is arranged on the top of the dust collection cover (9), the output shaft of the dust collection cover (9) drives a connecting shaft (13), and the dust collection blades (11) are arranged on the connecting shaft (13); the movable block (3) comprises an X-axis block (14) and a Y-axis block (15), and the transmission mechanism comprises an X-axis assembly and a Y-axis assembly;
the X-axis assembly pushes the X-axis block (14) to slide along the X-axis at the bottom of the movable cavity (5), and the Y-axis assembly pushes the Y-axis block (15) to slide along the Y-axis at the top surface of the X-axis block (14); the transmission part (7) is arranged in the Y-axis block (15), and a transmission hole (16) is formed in the top surface of the Y-axis block (15);
the transmission component (7) comprises a bidirectional screw (17), a transmission motor (18) and two connecting sleeves (19), the transmission motor (18) is arranged on the side wall of the Y-axis block (15), an output shaft of the transmission motor (18) is in driving connection with the bidirectional screw (17), the connecting sleeves (19) are in threaded sleeve connection with the bidirectional screw (17) outside the bidirectional screw, and the connecting sleeves (19) extend upwards through the transmission holes (16) and are provided with clamping pieces (8); the feeding mechanism comprises a pushing cylinder (20), a pushing plate (21) is mounted at the movable end of the pushing cylinder (20), and the pushing plate (21) pushes the wafer block (4) to move to the top of the Y-axis block (15); the feeding mechanism further comprises a rotating disc (22) and a lifting cylinder (23);
the rotating disc (22) is driven to rotate through the power piece, at least two limiting holes (25) are formed in the rotating disc (22), the limiting holes (25) are used for placing the wafer blocks (4), and the rotating disc (22) drives the wafer blocks (4) to slide along the top surface of the photoetching table (1);
the lifting mechanism is arranged on the top wall of the exposure machine box (2), the telescopic end of the lifting cylinder (23) is provided with a lifting plate (26), and the pushing cylinder (20) is arranged on the lifting plate (26); the wafer block (4) comprises a wafer (27) and a ceramic disc (28), and the wafer (27) is connected with the ceramic disc (28) through adhesive;
a splitting mechanism for separating the wafer (27) from the ceramic disc (28) is arranged in the exposure machine box (2);
the splitting mechanism comprises a heating component (29), an extracting component (30) and a wiping component (31), wherein the heating component (29) is used for heating the ceramic disc (28) to melt the adhesive, the extracting component (30) is used for stripping the wafer (27), and the wiping component (31) is used for wiping the adhesive on the surface of the ceramic disc (28); the photoetching table (1) is provided with a blanking zone (32), a heating zone (33), a separation zone (34) and a loading zone (35), the number of the limiting holes (25) is four, and the four limiting holes (25) respectively correspond to the loading zone (35), the blanking zone (32), the heating zone (33) and the separation zone (34);
wherein the separation zone (34) and the feeding zone (35) are positioned outside the exposure machine box (2), and the blanking zone (32) and the heating zone (33) are positioned inside the exposure machine box (2); the heating component (29) is arranged on the top surface of the photoetching table (1), the heating component (29) is an electric heating layer (36), and the electric heating layer (36) is electrified to heat the ceramic disc (28);
the extraction part (30) comprises a mechanical wall and a suction part (38), the suction part (38) sucks the wafer (27), and the mechanical wall drives the wafer (27) to leave the ceramic disc (28);
the wiping part (31) comprises a wiping part, the wiping part is a wiping wheel (39), the wiping wheel (39) is rotatably arranged above the rotating disc (22), and the bottom of the wiping wheel (39) is abutted against the bottom of the rotating disc (22); the power piece comprises a power shaft (40) and driving teeth (41);
the bottom end of the power shaft (40) is rotationally connected with the photoetching table (1), the rotating disc (22) is fixedly connected with the power shaft (40), the top surface of the power shaft (40) is provided with driven teeth (42), and the driven teeth (42) are meshed with the driving teeth (41);
the driving teeth (41) are sector teeth, the sector teeth are arranged on the connecting shaft (13), and the driving teeth (41) are used for driving the driven teeth (42) to rotate; the X-axis assembly comprises a first air cylinder (43), a sliding rod (44) and a sliding rail (45);
the first air cylinder (43) is arranged on the side wall of the movable cavity (5), the telescopic end of the first air cylinder (43) is fixedly connected with the side wall of the X-axis block (14), the two ends of the sliding rod (44) are fixedly connected with the two side walls of the movable cavity (5), the sliding rail (45) is arranged at the bottom of the movable cavity (5), and the first air cylinder (43) pushes the X-axis block (14) to move along the sliding rod (44) and the sliding rail (45);
the Y-axis assembly comprises a second air cylinder (46) and a guide rail (24), wherein the second air cylinder (46) is fixedly arranged on the cavity wall of the movable cavity (5), the telescopic end of the second air cylinder (46) is fixedly connected with the side wall of the Y-axis block (15), the guide rail (24) is arranged at the top of the X-axis block (14), and the second air cylinder (46) drives the Y-axis block (15) to slide along the guide rail (24).
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211036479.5A CN115291477B (en) | 2022-08-26 | 2022-08-26 | Semiconductor manufacturing wafer lithography equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211036479.5A CN115291477B (en) | 2022-08-26 | 2022-08-26 | Semiconductor manufacturing wafer lithography equipment |
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| CN115291477A CN115291477A (en) | 2022-11-04 |
| CN115291477B true CN115291477B (en) | 2023-07-25 |
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| CN202211036479.5A Active CN115291477B (en) | 2022-08-26 | 2022-08-26 | Semiconductor manufacturing wafer lithography equipment |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115903396B (en) * | 2022-11-15 | 2023-08-04 | 江苏华兴激光科技有限公司 | Micro-nano structure and preparation method thereof |
| CN117817135A (en) * | 2024-03-05 | 2024-04-05 | 鑫业诚智能装备(无锡)有限公司 | Automatic laser marking device and marking method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07249559A (en) * | 1994-03-09 | 1995-09-26 | Tokyo Electron Ltd | Rotary processor |
| JP2006147693A (en) * | 2004-11-17 | 2006-06-08 | Tokyo Electron Ltd | Processing system |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004063645A (en) * | 2002-07-26 | 2004-02-26 | Enzan Seisakusho:Kk | Protection member exfoliation apparatus of semiconductor wafer |
| WO2010121068A2 (en) * | 2009-04-16 | 2010-10-21 | Suss Microtec, Inc. | Improved apparatus for temporary wafer bonding and debonding |
| CN112198769A (en) * | 2020-10-27 | 2021-01-08 | 广东莱宝智能装备股份有限公司 | Parallel light source non-contact single-side automatic photoetching machine |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07249559A (en) * | 1994-03-09 | 1995-09-26 | Tokyo Electron Ltd | Rotary processor |
| JP2006147693A (en) * | 2004-11-17 | 2006-06-08 | Tokyo Electron Ltd | Processing system |
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