CN115291477A - Semiconductor manufacturing wafer photoetching equipment - Google Patents

Semiconductor manufacturing wafer photoetching equipment Download PDF

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Publication number
CN115291477A
CN115291477A CN202211036479.5A CN202211036479A CN115291477A CN 115291477 A CN115291477 A CN 115291477A CN 202211036479 A CN202211036479 A CN 202211036479A CN 115291477 A CN115291477 A CN 115291477A
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Prior art keywords
wafer
block
axis
semiconductor manufacturing
top surface
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CN202211036479.5A
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CN115291477B (en
Inventor
聂新明
赵波
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Jiangsu Normal University
Su Normal University Semiconductor Materials and Equipment Research Institute Pizhou Co Ltd
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Su Normal University Semiconductor Materials and Equipment Research Institute Pizhou Co Ltd
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Publication of CN115291477A publication Critical patent/CN115291477A/en
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67225—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Epidemiology (AREA)
  • Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Environmental & Geological Engineering (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

The invention discloses a semiconductor manufacturing wafer photoetching device, which relates to the technical field of wafer photoetching and aims to provide a semiconductor manufacturing wafer photoetching device capable of absorbing dust and improving the processing effect and the processing efficiency.

Description

Semiconductor manufacturing wafer photoetching equipment
Technical Field
The invention relates to the technical field of wafer photoetching, in particular to a semiconductor manufacturing wafer photoetching device.
Background
In semiconductor processing, a fine pattern on a reticle is printed on a silicon wafer by exposure to light using a technique similar to photo printing.
In the prior art, a wafer is generally adhered and fixed on a ceramic disc, a wafer block with the ceramic disc is installed on a photoetching table, and the wafer block is driven by a transmission mechanism to move along an X axis and a Y axis, so that ultraviolet rays can be guaranteed to smoothly remove a protective film on the surface of the wafer, but in the wafer processing process, dust in air can fall on the surface of the wafer, so that the development is not clean, and rework and photoetching are caused.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides the semiconductor manufacturing wafer photoetching equipment which absorbs dust and improves the processing effect and the processing efficiency.
(II) technical scheme
In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a semiconductor manufacturing wafer lithography apparatus, includes lithography stage, exposure machine case, activity piece and drive mechanism, and the activity piece sets up in the below of exposure machine case, and drive mechanism is used for driving the activity piece along X axle and Y axle removal, is equipped with the wafer piece on the activity piece, and equipment still includes:
the movable cavity is formed in the photoetching table, the movable block and the transmission mechanism are arranged in the movable cavity, and the top surface of the movable block and the top surface of the photoetching table are positioned on the same horizontal line;
the material loading port is formed in the top surface of the photoetching table and communicated with the movable cavity;
the clamping mechanism is fixedly arranged on the movable block and comprises a transmission part and two clamping pieces, the transmission part drives the two clamping pieces to move relatively, and the two clamping pieces are used for clamping and fixing the wafer block.
The feeding mechanism is used for pushing the wafer block outside the exposure case to the top surface of the movable block;
the dust collection mechanism comprises a dust collection cover, a power motor and dust collection blades, the dust collection cover is installed on the top surface of the exposure case, the bottom of the dust collection cover extends to the inner cavity of the exposure case, an air outlet pipe is installed on the outer side of the dust collection cover, the power motor is installed on the top of the dust collection cover, an output shaft of the dust collection cover drives and installs a connecting shaft, and the dust collection blades are installed on the connecting shaft.
Preferably, the movable block comprises an X-axis block and a Y-axis block, and the transmission mechanism comprises an X-axis assembly and a Y-axis assembly;
the X-axis assembly pushes the X-axis block to slide along the X-axis at the cavity bottom of the movable cavity, and the Y-axis assembly pushes the Y-axis block to slide along the Y-axis at the top surface of the X-axis block.
Preferably, the transmission part is arranged inside the Y-axis block, and the top surface of the Y-axis block is provided with a transmission hole;
the transmission part comprises a bidirectional screw rod, a transmission motor and two connecting sleeves, the transmission motor is installed on the side wall of the Y-axis block, an output shaft of the transmission motor is in driving connection with the bidirectional screw rod, the connecting sleeves are sleeved outside the bidirectional screw rod and in threaded connection with the bidirectional screw rod, and the connecting sleeves penetrate through the transmission holes to extend upwards and are provided with clamping pieces.
Preferably, the feeding mechanism comprises a pushing cylinder, a pushing plate is mounted at the movable end of the pushing cylinder, and the pushing plate pushes the wafer block to move to the top of the Y-axis block.
Preferably, the feeding mechanism further comprises a rotating disc and a lifting cylinder;
the rotating disc is driven to rotate by the power part, at least two limiting holes are formed in the rotating disc and used for placing the wafer block, and the rotating disc drives the wafer block to slide along the top surface of the photoetching table;
the lifting mechanism is arranged on the top wall of the exposure case, the telescopic end of the lifting cylinder is provided with a lifting plate, and the material pushing cylinder is arranged on the lifting plate.
Preferably, the wafer block comprises a wafer and a ceramic disc, and the wafer is connected with the ceramic disc through viscose;
a splitting mechanism for separating the wafer from the ceramic disc is arranged in the exposure box body;
the disassembling mechanism comprises a heating part, an extracting part and a wiping part, wherein the heating part is used for heating the ceramic disc to melt the viscose, the extracting part is used for stripping the wafer, and the wiping part is used for wiping the viscose on the surface of the ceramic disc;
preferably, the photoetching table is provided with a blanking area, a heating area, a separation area and a feeding area, the number of the limiting holes is four, and the four limiting holes correspond to the feeding area, the blanking area, the heating area and the separation area respectively;
the separation area and the feeding area are located outside the exposure box body, and the blanking area and the heating area are located inside the exposure box body.
Preferably, the heating part is arranged on the top surface of the photoetching table, the heating part is an electric heating layer, and the electric heating layer is electrified to heat the ceramic disc;
the extracting component comprises a mechanical wall and an absorbing part, the absorbing part absorbs the wafer, and the mechanical wall drives the wafer to leave the ceramic disc;
the wiping part comprises a wiping part, the wiping part is a wiping wheel, the wiping wheel is rotatably arranged above the rotating disc, and the bottom of the wiping wheel is abutted to the bottom of the rotating disc.
Preferably, the drive member comprises a power shaft and a drive tooth;
the bottom end of the power shaft is rotatably connected with the photoetching table, the rotating disc is fixedly connected with the power shaft, the top surface of the power shaft is provided with driven teeth, and the driven teeth are meshed with the driving teeth;
the driving tooth is a fan-shaped tooth, the fan-shaped tooth is arranged on the connecting shaft, and the driving tooth is used for driving the driven tooth to rotate.
Preferably, the X-axis assembly comprises a first cylinder, a sliding rod and a sliding rail;
the first cylinder is arranged on the side wall of the movable cavity, the telescopic end of the first cylinder is fixedly connected with the side wall of the X-axis block, the two ends of the sliding rod are fixedly connected with the two side walls of the movable cavity, the sliding rail is arranged at the bottom of the movable cavity, and the first cylinder pushes the X-axis block to move along the sliding rod and the sliding rail;
the Y-axis assembly comprises a second cylinder and a guide rail, the second cylinder is fixedly mounted on the wall of the movable cavity, the telescopic end of the second cylinder is fixedly connected with the side wall of the Y-axis block, the guide rail is arranged at the top of the X-axis block, and the second cylinder drives the Y-axis block to slide along the guide rail.
(III) advantageous effects
Compared with the prior art, the invention provides a semiconductor manufacturing wafer photoetching device which has the following beneficial effects:
1. set up dust absorption mechanism in exposure machine case, absorb the dust in the air, prevent that it from dropping to the surface of wafer piece, thereby improve wafer processing effect, avoid the wafer because of the surface is unclean to cause the rework, improve the whole machining efficiency of wafer, and simultaneously, set up movable chamber in the inside of photoetching platform, install movable block and drive mechanism in movable chamber, make feed mechanism can promote outside wafer piece to the top surface of movable block, realize the quick material loading of wafer piece, further improve work efficiency.
2. The wafer cleaning device is characterized in that a rotating disc is arranged, a wafer block is placed in a limiting hole of a rotating table, the rotating disc rotates to drive the wafer block to rotate, the wafer block passes through different areas in the rotating process, the wafer block is separated from a ceramic disc, and the ceramic disc is cleaned, so that the ceramic disc is reused.
Drawings
FIG. 1 is a schematic side cross-sectional view of one embodiment of the present invention;
FIG. 2 is a schematic cross-sectional front view of one embodiment of the present invention;
FIG. 3 is a top half-sectional schematic view of one embodiment of the present invention.
In the figure: 1. a lithography stage; 2. an exposure cabinet; 3. an activity chunk; 4. a wafer block; 5. a movable cavity; 6. a feeding port; 7. a transmission member; 8. a clamping member; 9. a dust hood; 10. a power motor; 11. a dust-collecting blade; 12. an air outlet pipe; 13. a connecting shaft; 14. an X-axis block; 15. a Y-axis block; 16. a drive hole; 17. a bidirectional screw; 18. a drive motor; 19. connecting sleeves; 20. a material pushing cylinder; 21. a material pushing plate; 22. rotating the disc; 23. a lifting cylinder; 24. a guide rail; 25. a limiting hole; 26. a lifting plate; 27. a wafer; 28. a ceramic pan; 29. a heating member; 30. an extraction component; 31. a wiping member; 32. a blanking area; 33. a heating zone; 34. a separation zone; 35. a feeding area; 36. an electric heating layer; 37. a machine wall; 38. a suction part; 39. a wiping wheel; 40. a power shaft; 41. a drive tooth; 42. a driven tooth; 43. a first cylinder; 44. a slide bar; 45. a slide rail; 46. a second cylinder.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
Referring to fig. 1, a semiconductor manufacturing wafer lithography apparatus includes a lithography stage 1, an exposure cabinet 2, a movable block 3 and a transmission mechanism, the movable block 3 is disposed below the exposure cabinet 2, the transmission mechanism is used to drive the movable block 3 to move along an X axis and a Y axis, a wafer block 4 is disposed on the movable block 3, and the apparatus further includes:
the movable cavity 5 is formed in the photoetching table 1, the movable block 3 and the transmission mechanism are arranged in the movable cavity 5, and the top surface of the movable block 3 and the top surface of the photoetching table 1 are positioned on the same horizontal line;
a feeding port 6, wherein the feeding port 6 is formed on the top surface of the photoetching table 1, and the feeding port 6 is communicated with the movable cavity 5;
the clamping mechanism is fixedly installed on the movable block 3 and comprises a transmission part 7 and two clamping pieces 8, the transmission part 7 drives the two clamping pieces 8 to move relatively, and the two clamping pieces 8 are used for clamping and fixing the wafer block 4.
The feeding mechanism is used for pushing the wafer block 4 outside the exposure case 2 to the top surface of the movable block 3;
the dust collection mechanism comprises a dust collection cover 9, a power motor 10 and dust collection blades 11, the dust collection cover 9 is installed on the top surface of the exposure case 2, the bottom of the dust collection cover 9 extends to the inner cavity of the exposure case 2, an air outlet pipe 12 is installed on the outer side of the dust collection cover 9, the power motor 10 is installed on the top of the dust collection cover 9, an output shaft of the dust collection cover 9 drives and is provided with a connecting shaft 13, and the dust collection blades 11 are installed on the connecting shaft 13.
In the invention, the dust absorption mechanism is arranged in the exposure case 2 to absorb dust in air and prevent the dust from falling to the surface of the wafer block 4, thereby improving the wafer processing effect, avoiding rework of the wafer due to unclean surface and improving the overall processing efficiency of the wafer, meanwhile, the movable cavity 5 is arranged in the photoetching table 1, and the movable block 3 and the transmission mechanism are arranged in the movable cavity 5, so that the feeding mechanism can push the external wafer block 4 to the top surface of the movable block 3, thereby realizing the rapid feeding of the wafer block 4 and further improving the working efficiency.
Specifically, the movable block 3 comprises an X-axis block 14 and a Y-axis block 15, and the transmission mechanism comprises an X-axis assembly and a Y-axis assembly;
the X-axis assembly pushes the X-axis block 14 to slide along the X-axis at the bottom of the active cavity 5, and the Y-axis assembly pushes the Y-axis block 15 to slide along the Y-axis at the top of the X-axis block 14.
Specifically, the X-axis assembly includes a first cylinder 43, a slide rod 44, and a slide rail 45;
the first cylinder 43 is installed on the side wall of the movable cavity 5, the telescopic end of the first cylinder 43 is fixedly connected with the side wall of the X-axis block 14, the two ends of the sliding rod 44 are fixedly connected with the two side walls of the movable cavity 5, the sliding rail 45 is arranged at the bottom of the movable cavity 5, and the first cylinder 43 pushes the X-axis block 14 to move along the sliding rod 44 and the sliding rail 45;
the Y-axis assembly comprises a second air cylinder 46 and a guide rail 24, the second air cylinder 46 is fixedly mounted on the wall of the movable cavity 5, the telescopic end of the second air cylinder 46 is fixedly connected with the side wall of the Y-axis block 15, the guide rail 24 is arranged at the top of the X-axis block 14, and the second air cylinder 46 drives the Y-axis block 15 to slide along the guide rail 24.
When the equipment works, the ultraviolet light source is not moved, the X-axis assembly and the Y-axis assembly respectively drive the X-axis block 14 and the Y-axis block 15 to move, so that the wafer block 4 can be moved in the X-axis direction and the Y-axis direction, and smooth exposure is ensured.
Specifically, the transmission component 7 is arranged inside the Y-axis block 15, and the top surface of the Y-axis block 15 is provided with a transmission hole 16;
the transmission part 7 comprises a bidirectional screw 17, a transmission motor 18 and two connecting sleeves 19, the transmission motor 18 is installed on the side wall of the Y-axis block 15, an output shaft of the transmission motor 18 is in driving connection with the bidirectional screw 17, the connecting sleeves 19 are in threaded sleeve connection with the bidirectional screw 17 outside the bidirectional screw 17, and the connecting sleeves 19 penetrate through the transmission holes 16 to extend upwards and install the clamping pieces 8.
In the specific embodiment of the clamping mechanism, the transmission motor 18 is used as a power source to drive the bidirectional screw 17 to rotate, so that the connecting sleeve 19 has a rotation trend and is limited by the transmission hole 16, and finally the connecting sleeve 19 moves along the axial direction of the bidirectional screw 17;
it should be noted that, in this embodiment, the transmission motor 18 is a forward and reverse rotation motor, which can ensure that the clamping members 8 move towards each other.
Specifically, the feeding mechanism comprises a material pushing cylinder 20, a material pushing plate 21 is installed at the movable end of the material pushing cylinder 20, and the material pushing plate 21 pushes the wafer block 4 to move to the top of the Y-axis block 15.
In the invention, the specific structure of the feeding mechanism is provided, the pushing cylinder 20 is directly utilized to push the external wafer block 4 to the top of the Y-axis block 15, and the feeding mechanism is simple and convenient.
Example 2
When the wafer is processed, in order to prevent the wafer from being damaged due to the fact that the clamping mechanism directly applies pressure to the wafer, the wafer needs to be firstly pasted on the ceramic disc 28, and then pressure is applied to the ceramic disc 28, so that the stability of the wafer during working can be guaranteed;
in the above embodiment, although the fast loading of the wafer block 4 is realized, the ceramic disk 28 cannot be separated from the wafer 27, and thus cannot be reused in the processing process, so that the present invention provides another embodiment:
specifically, referring to fig. 1 to 3, the feeding mechanism further includes a rotating disc 22 and a lifting cylinder 23;
the rotating disc 22 is driven to rotate by a power part, at least two limiting holes 25 are formed in the rotating disc 22, the limiting holes 25 are used for placing the wafer block 4, and the rotating disc 22 drives the wafer block 4 to slide along the top surface of the photoetching table 1;
the lifting mechanism is arranged on the top wall of the exposure cabinet 2, the telescopic end of the lifting cylinder 23 is provided with a lifting plate 26, and the material pushing cylinder 20 is arranged on the lifting plate 26.
The rotating disc 22 can drive the wafer block 4 in the limiting hole 25 to move and return to the initial position, and after the wafer 27 is processed, the rotating disc can be matched with a splitting mechanism for separating the wafer 27 and the ceramic disc 28, and after the wafer 27 and the ceramic disc 28 are separated, the ceramic disc 28 can be reused;
specifically, the detaching mechanism comprises a heating component 29, an extracting component 30 and a wiping component 31, wherein the heating component 29 is used for heating the ceramic disc 28 to melt the adhesive, the extracting component 30 is used for peeling the wafer 27, and the wiping component 31 is used for wiping the adhesive on the surface of the ceramic disc 28;
specifically, the photoetching table 1 is provided with a blanking area 32, a heating area 33, a separation area 34 and a feeding area 35, the number of the limiting holes 25 is four, and the four limiting holes 25 correspond to the feeding area 35, the blanking area 32, the heating area 33 and the separation area 34 respectively;
wherein, the separation area 34 and the feeding area 35 are positioned outside the exposure box body, and the blanking area 32 and the heating area 33 are positioned inside the exposure box body;
wherein, the separation area 34 and the loading area 35 are positioned outside the exposure box body, and the blanking area 32 and the heating area 33 are positioned inside the exposure box body.
After the photoetching of the wafer 27 is completed, the material pushing cylinder 20 drives the processed wafer block 4 to return to the blanking area 32, the rotating disc 22 rotates to drive the wafer block to enter the heating area 33, the heating area 33 is provided with the heating component 29, the heating component 29 is arranged on the top surface of the photoetching table 1, the heating component 29 is an electric heating layer 36, the electric heating layer 36 is electrified to heat the ceramic disc 28, so that colloid is melted, the wafer 27 located in the blanking area 32 is processed after the colloid is melted, the material pushing cylinder 20 drives the wafer block to return to the blanking area 32, the rotating disc 22 continues to rotate, the heated and melted ceramic disc 28 leaves the exposure case 2, the extracting component 30 peels the wafer 27, generally, the extracting component 30 comprises a mechanical wall 37 and an absorbing part 38, the absorbing part 38 absorbs the wafer 27, the mechanical wall 37 drives the wafer 27 to leave the ceramic disc 28, then, the rotating disc 22 continues to drive the ceramic disc 28 to move, the wiping component 31 wipes residual colloid on the surface of the ceramic disc 28 in the moving process, the wiped ceramic disc 28 enters the material loading area 35, and the ceramic disc 28 is placed on the ceramic disc 28, so that the ceramic disc 28 can be reused.
It should be noted that, if the top surface of the ceramic disc 28 is located below the top surface of the rotating disc 22, the wiping member 31 needs to include a wiping portion for wiping off the colloid and a lifting portion for lifting and lowering the wiping portion, which is a complicated structure, therefore, in the present invention, it is defined that the top surfaces of the ceramic disc 28 and the rotating disc 22 are located on the same horizontal line, the wiping member 31 includes a wiping portion, which is a wiping wheel 39, the wiping wheel 39 is rotatably installed above the rotating disc 22, and the bottom of the wiping wheel 39 abuts against the bottom of the rotating disc 22.
Example 3
In the above embodiment, the rotation of the rotary disk 22 requires a separate power source, and since the wafer block 4 needs to stay through four areas, the power source needs to be continuously turned on and off, and the apparatus is worn, further, the present invention provides another embodiment:
specifically, referring to fig. 1-3, the drive member includes a power shaft 40 and drive teeth 41;
the bottom end of the power shaft 40 is rotatably connected with the photoetching table 1, the rotating disc 22 is fixedly connected with the power shaft 40, the top surface of the power shaft 40 is provided with a driven tooth 42, and the driven tooth 42 is meshed with the driving tooth 41;
the driving gear 41 is a sector gear, the sector gear is installed on the connecting shaft 13, and the driving gear 41 is used for driving the driven gear 42 to rotate.
In the embodiment, the power motor 10 of the dust suction mechanism is used as a power source, and the sector teeth drive the driven teeth 42 to rotate discontinuously, so that the wafer block 4 stays in different areas for processing, and the processing cost is reduced.
The above is only a specific embodiment of the present invention, but the technical features of the present invention are not limited thereto. Any simple changes, equivalent substitutions or modifications based on the present invention to solve the same technical problems and achieve the same technical effects are all covered by the protection scope of the present invention.

Claims (10)

1. The utility model provides a semiconductor manufacturing wafer lithography apparatus, includes lithography stage (1), exposure machine case (2), activity chunk (3) and drive mechanism, and activity chunk (3) set up in the below of exposure machine case (2), and drive mechanism is used for driving activity chunk (3) and removes along X axle and Y axle, is equipped with wafer piece (4) on activity chunk (3), its characterized in that, equipment still includes:
the movable cavity (5) is formed in the photoetching table (1), the movable block (3) and the transmission mechanism are arranged in the movable cavity (5), and the top surface of the movable block (3) and the top surface of the photoetching table (1) are positioned on the same horizontal line;
the feeding port (6), the feeding port (6) is arranged on the top surface of the photoetching table (1), and the feeding port (6) is communicated with the movable cavity (5);
the clamping mechanism is fixedly arranged on the movable block (3) and comprises a transmission part (7) and two clamping pieces (8), the transmission part (7) drives the two clamping pieces (8) to move relatively, and the two clamping pieces (8) are used for clamping and fixing the wafer block (4);
the feeding mechanism is used for pushing the wafer block (4) outside the exposure cabinet (2) to the top surface of the movable block (3);
the dust collection mechanism comprises a dust collection cover (9), a power motor (10) and dust collection blades (11), wherein the dust collection cover (9) is installed on the top surface of an exposure case (2), the bottom of the dust collection cover (9) extends to the inner cavity of the exposure case (2), an air outlet pipe (12) is installed on the outer side of the dust collection cover (9), the power motor (10) is installed at the top of the dust collection cover (9), the output shaft of the dust collection cover (9) drives and is provided with a connecting shaft (13), and the dust collection blades (11) are installed on the connecting shaft (13).
2. The semiconductor manufacturing wafer lithographic apparatus of claim 1, wherein: the movable block (3) comprises an X-axis block (14) and a Y-axis block (15), and the transmission mechanism comprises an X-axis assembly and a Y-axis assembly;
the X-axis assembly pushes the X-axis block (14) to slide along the X axis at the bottom of the movable cavity (5), and the Y-axis assembly pushes the Y-axis block (15) to slide along the Y axis at the top of the X-axis block (14).
3. A semiconductor manufacturing wafer lithographic apparatus as claimed in claim 2, wherein: the transmission component (7) is arranged inside the Y-axis block (15), and the top surface of the Y-axis block (15) is provided with a transmission hole (16);
the transmission part (7) comprises a bidirectional screw (17), a transmission motor (18) and two connecting sleeves (19), the transmission motor (18) is installed on the side wall of the Y-axis block (15), an output shaft of the transmission motor (18) is in driving connection with the bidirectional screw (17), the connecting sleeves (19) are in threaded sleeve connection with the bidirectional screw (17) outside the bidirectional screw, and the connecting sleeves (19) penetrate through the transmission holes (16) to extend upwards and are provided with the clamping parts (8).
4. A semiconductor manufacturing wafer lithographic apparatus as claimed in claim 3, wherein: the feeding mechanism comprises a pushing cylinder (20), a pushing plate (21) is installed at the movable end of the pushing cylinder (20), and the pushing plate (21) pushes the wafer block (4) to move to the top of the Y-axis block (15).
5. A semiconductor manufacturing wafer lithographic apparatus as claimed in claim 3, wherein: the feeding mechanism also comprises a rotating disc (22) and a lifting cylinder (23);
the rotary disc (22) is driven to rotate through a power part, at least two limiting holes (25) are formed in the rotary disc (22), the limiting holes (25) are used for placing the wafer block (4), and the rotary disc (22) drives the wafer block (4) to slide along the top surface of the photoetching table (1);
the lifting mechanism is arranged on the top wall of the exposure cabinet (2), the telescopic end of the lifting cylinder (23) is provided with a lifting plate (26), and the material pushing cylinder (20) is arranged on the lifting plate (26).
6. The semiconductor manufacturing wafer lithographic apparatus of claim 5, wherein: the wafer block (4) comprises a wafer (27) and a ceramic disc (28), and the wafer (27) is connected with the ceramic disc (28) through viscose;
a splitting mechanism for separating the wafer (27) and the ceramic disc (28) is arranged in the exposure box body;
the disassembling mechanism comprises a heating part (29), an extracting part (30) and a wiping part (31), wherein the heating part (29) is used for heating the ceramic disc (28) to melt the adhesive, the extracting part (30) is used for peeling the wafer (27), and the wiping part (31) is used for wiping the adhesive on the surface of the ceramic disc (28).
7. The semiconductor manufacturing wafer lithographic apparatus of claim 6, wherein: the photoetching table (1) is provided with a blanking area (32), a heating area (33), a separation area (34) and a feeding area (35), the number of the limiting holes (25) is four, and the four limiting holes (25) respectively correspond to the feeding area (35), the blanking area (32), the heating area (33) and the separation area (34);
wherein, the separation area (34) and the feeding area (35) are positioned outside the exposure box body, and the blanking area (32) and the heating area (33) are positioned inside the exposure box body.
8. The semiconductor manufacturing wafer lithographic apparatus of claim 6, wherein: the heating component (29) is arranged on the top surface of the photoetching table (1), the heating component (29) is an electric heating layer (36), and the electric heating layer (36) is electrified to heat the ceramic disc (28);
the extraction part (30) comprises a mechanical wall (37) and a suction part (38), the suction part (38) sucks the wafer (27), and the mechanical wall (37) drives the wafer (27) to leave the ceramic disc (28);
the wiping component (31) comprises a wiping part which is a wiping wheel (39), the wiping wheel (39) is rotatably arranged above the rotating disc (22), and the bottom of the wiping wheel (39) is abutted against the bottom of the rotating disc (22).
9. The semiconductor manufacturing wafer lithographic apparatus of claim 6, wherein: the driving piece comprises a power shaft (40) and a driving tooth (41);
the bottom end of a power shaft (40) is rotatably connected with the photoetching table (1), a rotating disc (22) is fixedly connected with the power shaft (40), a driven tooth (42) is arranged on the top surface of the power shaft (40), and the driven tooth (42) is meshed with a driving tooth (41);
the driving gear (41) is a sector gear, the sector gear is arranged on the connecting shaft (13), and the driving gear (41) is used for driving the driven gear (42) to rotate.
10. A semiconductor manufacturing wafer lithographic apparatus according to claim 2, wherein: the X shaft assembly comprises a first air cylinder (43), a sliding rod (44) and a sliding rail (45);
the first air cylinder (43) is installed on the side wall of the movable cavity (5), the telescopic end of the first air cylinder (43) is fixedly connected with the side wall of the X-axis block (14), the two ends of the sliding rod (44) are fixedly connected with the two side walls of the movable cavity (5), the sliding rail (45) is arranged at the bottom of the movable cavity (5), and the first air cylinder (43) pushes the X-axis block (14) to move along the sliding rod (44) and the sliding rail (45);
the Y-axis assembly comprises a second air cylinder (46) and a guide rail (24), the second air cylinder (46) is fixedly mounted on the wall of the movable cavity (5), the telescopic end of the second air cylinder (46) is fixedly connected with the side wall of the Y-axis block (15), the guide rail (24) is arranged at the top of the X-axis block (14), and the second air cylinder (46) drives the Y-axis block (15) to slide along the guide rail (24).
CN202211036479.5A 2022-08-26 2022-08-26 Semiconductor manufacturing wafer lithography equipment Active CN115291477B (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115903396A (en) * 2022-11-15 2023-04-04 江苏华兴激光科技有限公司 Micro-nano structure and preparation method thereof
CN117817135A (en) * 2024-03-05 2024-04-05 鑫业诚智能装备(无锡)有限公司 Automatic laser marking device and marking method
CN117817135B (en) * 2024-03-05 2024-05-31 鑫业诚智能装备(无锡)有限公司 Automatic laser marking device and marking method

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CN102460677A (en) * 2009-04-16 2012-05-16 休斯微技术股份有限公司 Improved apparatus for temporary wafer bonding and debonding
CN112198769A (en) * 2020-10-27 2021-01-08 广东莱宝智能装备股份有限公司 Parallel light source non-contact single-side automatic photoetching machine

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CN117817135B (en) * 2024-03-05 2024-05-31 鑫业诚智能装备(无锡)有限公司 Automatic laser marking device and marking method

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