CN102184892A - Manufacturing method of soft board used for flexible display - Google Patents
Manufacturing method of soft board used for flexible display Download PDFInfo
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- CN102184892A CN102184892A CN2011100664189A CN201110066418A CN102184892A CN 102184892 A CN102184892 A CN 102184892A CN 2011100664189 A CN2011100664189 A CN 2011100664189A CN 201110066418 A CN201110066418 A CN 201110066418A CN 102184892 A CN102184892 A CN 102184892A
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Abstract
The invention relates to a manufacturing method of a soft board used for a flexible display. The method comprises the following steps of coating one or more light resistors on one substrate; conducting a lithography process on the one or more light resistors to form one or more light-resisting patterns; forming one or more viscose frames at the peripheries of the light-resisting patterns; pasting one or more soft boards on the one or more viscose frames on the substrate; forming one or more thin film transistor layers on the one or more soft boards; conducting backend process including manufacturing one or more component array back plates, alignment, frame glue printing, liquid crystal dropping and assembly packaging; conducting mechanical cutting on the one or more soft boards along the inner sides of the one or more viscose frames so as to remove the part with the one or more viscose frames; soaking the one or more light-resisting patterns into a stripping solution so as to remove the light-resisting patterns; and stripping the one or more soft boards from the substrate through external force.
Description
Technical field
The present invention is the manufacture method that is relevant to a kind of flexible display, be relevant to especially a kind of flexible display the soft board manufacture method.
Background technology
Over past ten years, because the breakthrough progress of image Display Technique and flourish, traditional cathode-ray tube (CRT, cathode ray tube) overwhelming majority is replaced by so-called panel display (panel display), its be owing to panel display have that volume is little, advantage such as thin thickness, in light weight, low energy consumption, so become the main flow of display now.At present general common panel display has Thin Film Transistor-LCD or the luminous panel display of electricity slurry principle.Based on demand, there is demand for commodity to have the display of flexible base plate at present to development in science and technology.
And the manufacturing process of the display of above-mentioned flexible base plate needs soft board to peel off (debonding) processing procedure.The soft board that Fig. 1 illustrates a kind of known flexible display (10) is peeled off a kind of laser soft board of processing procedure and is peeled off (EPLaR, Electronics on Plastic by Laser Release) method.Mainly be earlier on glass substrate (12), to be coated with the last layer polyimides (PI, Polyimide) film is to form a soft board (16).Then go up and form a tft layer (18) at this soft board (16).After all processing procedure finishes, utilize laser to inject the interface (14) of glass substrate (12) and soft board (16), utilize physical characteristic high temperature to produce bubble its glass substrate (12) and soft board (16) are peeled off.
Yet the above-mentioned method of utilizing laser to inject the interface (14) of glass substrate (12) and soft board (16) need be purchased extra laser equipment, thereby has increased production cost.
Fig. 2 illustrates the soft board stripping means of the known flexible display (20) of another kind.On glass substrate (22), coat earlier a peel ply (DBL, de-bonding layer) (24).Then on this peel ply, be coated with the last layer polyimide film, to form a soft board (26).Form a tft layer (28) going up of soft board (26) afterwards.Forming tft layer (28) afterwards, utilizing machine cuts again along line of cut (29) cutting soft board (26).At this moment, between soft board (26) and glass substrate (22) only across peel ply (24), because peel ply (24) has adhesion,, soft board (26) is torn from glass substrate (22) together with tft layer (28) so need apply external force greater than the adhesion of peel ply (24).
Yet,, make that going up the tft layer (28) that forms at glass substrate (22) suffers damage easily because will apply external force.
More than two kinds of soft board manufacture methods all be to utilize the polyimides of coating solution formula (Coating Solution Type) to make soft board, be not suitable for the polyimides soft board of diaphragm type (Film Type).Therefore, need above-mentioned two kinds of polyimides soft boards all to be suitable for, and production cost is lower, and can not damages the soft board manufacture method of the tft layer that on glass substrate, forms.
Summary of the invention
Therefore, purpose of the present invention promptly is to provide the soft board manufacture method that all can be suitable for coating solution formula and diaphragm type polyimides.
A kind of soft board manufacture method that is used for flexible display of the present invention comprises the following steps: coating one or many photoresistances on a substrate; Implement micro-photographing process formation one or many photoresistances pattern at this photoresistance; This one or many photoresistances pattern is peripheral forms one or many viscoses frame; With one or many soft boards be attached on this substrate this one or many viscoses frame on; This one or many soft boards on form one or many tft layers; Making one or multicompartment array backboard, orientation, frame offset printing brush, liquid crystal splash into, organize upright encapsulation; Along this one or many viscoses frame inboard to this one or many soft boards carry out machine cuts, with remove have this one or the part of many viscoses frame; With this one or many photoresistances pattern be dipped in the stripper solution, with remove this one or many photoresistances pattern; And see through external force with this one or many soft boards from this strippable substrate.
The present invention still has following advantage: material used in the present invention is existing in the market material, does not need other exploitation.And the present invention makes glass substrate can reclaim the continuation use, meets the requirement of resource recovery in the market.In addition, the present invention's required externally applied forces in processing procedure is minimum, is subjected to outside destroy so can prevent the assembly that forms on soft board.
Description of drawings
The soft board that Fig. 1 illustrates a kind of known flexible display is peeled off a kind of laser soft board stripping means of processing procedure.
Fig. 2 illustrates the soft board stripping means of the known flexible display of another kind.
Fig. 3 is the flow chart of flow process of an embodiment of soft board manufacture method of the present invention.
Fig. 4 A-4D is that the flow process of application drawing 3 is in the schematic diagram of the soft board matrix with four soft boards.
Fig. 4 E is a profile that forms a tft layer on the soft board of Fig. 4 D.
Fig. 4 F is the profile of soft board after the machine cuts processing procedure of Fig. 4 E.
Fig. 4 G is the profile of soft board after glass substrate is peeled off of Fig. 4 F.
[primary clustering symbol description]
10 flexible displays
12 glass substrates
14 interfaces
16 soft boards
18 tft layers
20 flexible displays
22 glass substrates
24 peel plies
26 soft boards
28 tft layers
29 lines of cut
40 soft board matrixes
42 glass substrates
44 photoresistance districts
46 soft boards
47 viscose frames
48 lines of cut
49 tft layers
300 flow charts
The coating of 302 photoresistances
304 exposure manufacture process
306 developing manufacture process
The coating of 308 viscoses
310 soft boards attach
312 thin-film transistors form
314 back-end process
316 machine cuts
318 soak stripper solution
320 take off soft board.
Embodiment
Now the different execution mode of the present invention is described.Following description provides the specific execution details of the present invention, in order to do making the person of readding thoroughly understand the practising way of these a little embodiment.The skilled persons will in right this field must be understood the present invention and also can carry out under the condition that does not possess these details.In addition, can or not make details and describe in the literary composition some structures known or function, to avoid obscuring of unnecessary associated description between various embodiment, the term that uses in below describing will be explained even its details with the present invention's specific embodiment is described use with the rational method of broad sense.
Fig. 3 is the flow chart of flow process (300) of an embodiment of soft board manufacture method of the present invention, and Fig. 4 A-4D is that the flow process (300) of application drawing 3 is in the schematic diagram of the soft board matrix (40) with four soft boards.
As shown in Figure 3, at first carry out photoresistance coating process (step 302), for example, prior to the attaching last of one or many photoresistances district (44) on the glass substrate (42) of Fig. 4 A or many dry films photoresistance.For example, model is that minus photoresistance and the thickness of the three oblique H-Y920 of Hitachi is 15-25 μ, is preferably the dry film photoresistance of 20 μ.Above-mentioned parameter only is used for explanation, and is non-in order to limit the present invention.
Then carry out exposure manufacture process (step 304), for example, this one or many photoresistances district (44) go up and to expose with a light shield (not shown), the exposure of using always is 50-7060mj/cm
2, be preferably 60mj/cm
2As understand this operator as can be known, exposure can be based on photoresistance pattern and photoresistance thickness and is changed adjustment.
After idle a period of time (for example, 15 minutes), carry out developing manufacture process (step 306), for example, can working concentration 0.5-2%, be preferably 1% sodium carbonate or organic base and develop.Wherein, development temperature can be a 20-35 degree Celsius, is preferably 27 degree, and developing powder can be 3-4 M/min, is preferably 3.6M/min, and flushing pressure can be 1-1.5 kg, is preferably 1.2kg.As understand this operator as can be known, above-mentioned developer, temperature, developing powder are based on above-mentioned photoresistance pattern and give an example, and non-ly are familiar with this skill person in order to limit the present invention, when must be with photoresistance pattern and thickness adjustment developer and job parameter.
Carry out viscose coating process (step 308) again.Shown in Fig. 4 B, on this glass substrate, this one or many photoresistances district (44) one or many photoresistances pattern periphery of staying after developing coat the silica gel adhesive agent to form one or many viscoses frame (47).Wherein, preferable silica gel adhesive agent want can be high temperature resistant to taking the photograph formula 300 degree, and can antiacid alkali.Wherein, in the silica gel adhesive agent, can add sept,, thereby one or the many soft boards (46) that attach in the subsequent step can flatly be attached on the glass substrate (42) so that photoresistance is consistent with the height of viscose frame (47).
Carry out soft board afterwards and attach processing procedure (step 310).Shown in Fig. 4 C, with one or many soft boards (46) be attached on this viscose frame (47) on this glass substrate (42), wherein utilize the stickiness of this viscose frame (47) make this one or many soft boards (46) attach on this glass substrate (42), and utilize this viscose frame (47) make this one or one or many photoresistances pattern of many soft boards (46) belows be not subjected to acid ﹠ alkali liquid influence in the successive process (for example, thin-film transistor processing procedure).The material of soft board (46) can be with the soft board of all kinds of thin-film materials, for example, polyethylene naphthalenedicarboxylate (PEN, Polyethylene Naphthalate) soft board, it can be heat-resisting to 180 degree Celsius.
Carry out thin-film transistor afterwards and form processing procedure (step 312), with this one or many soft boards (46) go up and form one or many tft layers.Fig. 4 E is that the soft board (46) of Fig. 4 D is gone up a profile that forms a tft layer (49).This processing procedure does not need to add in addition process apparatus.By profile view it, one or many photoresistances district (44) be disposed on the glass substrate (42) viscose frame (47) contiguous one or (44) both sides, many photoresistances district and be positioned on the glass substrate (42).One or many soft boards (46) drape over one's shoulders invest one or many photoresistances district (44) and viscose frame (47) on, tft layer (49) be formed at one or many soft boards (46) on.
Then, carry out back-end process (step 314), for example, making assembly array backboard, orientation, frame offset printing brush, liquid crystal splash into (for example, using ODF (One Drop Filling) technology) and the upright encapsulation of group supervisor.
Carry out the liquid crystal panel cutting again, just machine cuts processing procedure (step 316).For example, along this one or inboard or many lines of cut (48) of many viscoses frame (47), to this one or many soft boards (46) carry out machine cuts, but do not cut off below glass substrate (42), also do not undermine tft layer (49), end to above-mentioned glass substrate (42), with remove have this one or the part of many viscoses frame (47), cutting neglect the decision of design size greatly.Fig. 4 F promptly is the profile of a soft board (46) after the machine cuts processing procedure of Fig. 4 E, and the part that wherein has viscose frame (47) is cut off.At this moment, though cut this soft board (46), because the photoresistance pattern in this photoresistance district (44) has stickiness, this soft board (46) still attaches on this glass substrate (42).
So next to soak stripper solution (step 318), by soak stripper solution can remove this one or many soft boards (46) under this one or one or many photoresistances pattern of many photoresistances district (44), to eliminate the stickiness between soft board (46) and glass substrate (42).Wherein, stripper solution can be NaOH (NaOH).
See through external force at last, with this one or many soft boards (46) take off (step 320) from this glass substrate (42).Fig. 4 G promptly is the profile of soft board (46) after glass substrate (42) is peeled off of Fig. 4 F.This moment is because the photoresistance pattern that has a stickiness under the soft board (46) is removed, thus can soft board (46) be taken off with minimum external force, so can not hurt the tft layer (49) that soft board (46) and it form above.
This glass substrate (42) is reusable, as long as utilize the viscose on the brushing removal glass substrate (42).
The present invention is not confined to specific detail feature described herein.Under spirit of the present invention and category, it can be allowed to previous the description with graphic relevant many different invention change.Therefore, the present invention will define by following patent claim include its possible modification and change, but not define category of the present invention by the description of top.
Claims (9)
1. a soft board manufacture method that is used for flexible display is characterized in that, comprises the following steps:
Coating one or many photoresistances on a substrate;
This one or many photoresistances implement a micro-photographing process and form one or many photoresistances pattern;
This one or many photoresistances pattern is peripheral forms one or many viscoses frame;
With one or many soft boards be attached on this substrate this one or many viscoses frame on;
This one or many soft boards on form one or many tft layers;
Carry out back-end process, comprising: make one or multicompartment array backboard, orientation, frame offset printing brush, liquid crystal splashes into and organize upright the encapsulation;
Along this one or many viscoses frame inboard to this one or many soft boards carry out machine cuts, with remove have this one or the part of many viscoses frame;
With this one or many photoresistances pattern be dipped in the stripper solution, with remove this one or many photoresistances pattern; And
See through external force with this one or many soft boards from this strippable substrate.
2. the soft board manufacture method that is used for flexible display according to claim 1 is characterized in that: described this substrate comprises glass substrate.
3. the soft board manufacture method that is used for flexible display according to claim 1 is characterized in that: described viscose frame material comprises the silica gel adhesive agent.
4. the soft board manufacture method that is used for flexible display according to claim 1, it is characterized in that: the material of described soft board is a polyethylene naphthalenedicarboxylate.
5. the soft board manufacture method that is used for flexible display according to claim 3, it is characterized in that: wherein in this silica gel adhesive agent, add sept, so that this one or many photoresistances consistent with the height of this viscose frame, thereby make in subsequent step, attach this one or many soft boards can flatly be attached on this substrate.
6. the soft board manufacture method that is used for flexible display according to claim 1 is characterized in that: described one or many photoresists be dry film photoresistance or coating solution formula photoresistance.
7. the soft board manufacture method that is used for flexible display according to claim 1 is characterized in that: wherein see through external force with this one or many soft boards after this strippable substrate, remove on this substrate this one or many viscoses frame, to reuse this substrate.
8. the soft board manufacture method that is used for flexible display according to claim 1, it is characterized in that: described stripper solution comprises NaOH.
9. the soft board manufacture method that is used for flexible display according to claim 1 is characterized in that: described one or many photoresistances pattern be to develop with sodium carbonate or organic base.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100664189A CN102184892A (en) | 2011-03-19 | 2011-03-19 | Manufacturing method of soft board used for flexible display |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100664189A CN102184892A (en) | 2011-03-19 | 2011-03-19 | Manufacturing method of soft board used for flexible display |
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| CN102184892A true CN102184892A (en) | 2011-09-14 |
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| CN2011100664189A Pending CN102184892A (en) | 2011-03-19 | 2011-03-19 | Manufacturing method of soft board used for flexible display |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102738078A (en) * | 2012-06-21 | 2012-10-17 | 京东方科技集团股份有限公司 | Method for manufacturing flexible display substrate |
| CN103700672A (en) * | 2013-12-24 | 2014-04-02 | 华映视讯（吴江）有限公司 | Flexible assembly substrate and manufacturing method thereof |
| CN106450027A (en) * | 2016-10-31 | 2017-02-22 | 昆山维信诺科技有限公司 | Flexible organic light-emitting display screen and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2004040649A1 (en) * | 2002-11-01 | 2004-05-13 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing semiconductor device |
| CN1809918A (en) * | 2003-04-02 | 2006-07-26 | 皇家飞利浦电子股份有限公司 | Method of manufacturing a flexible electronic device and flexible device |
| CN101916022A (en) * | 2010-07-06 | 2010-12-15 | 友达光电股份有限公司 | Flexible display panel and manufacturing method thereof |
-
2011
- 2011-03-19 CN CN2011100664189A patent/CN102184892A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004040649A1 (en) * | 2002-11-01 | 2004-05-13 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing semiconductor device |
| CN1809918A (en) * | 2003-04-02 | 2006-07-26 | 皇家飞利浦电子股份有限公司 | Method of manufacturing a flexible electronic device and flexible device |
| CN101916022A (en) * | 2010-07-06 | 2010-12-15 | 友达光电股份有限公司 | Flexible display panel and manufacturing method thereof |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102738078A (en) * | 2012-06-21 | 2012-10-17 | 京东方科技集团股份有限公司 | Method for manufacturing flexible display substrate |
| CN102738078B (en) * | 2012-06-21 | 2014-11-12 | 京东方科技集团股份有限公司 | Method for manufacturing flexible display substrate |
| US9241412B2 (en) | 2012-06-21 | 2016-01-19 | Boe Technology Group Co., Ltd. | Manufacturing method of flexible display substrate |
| CN103700672A (en) * | 2013-12-24 | 2014-04-02 | 华映视讯（吴江）有限公司 | Flexible assembly substrate and manufacturing method thereof |
| CN106450027A (en) * | 2016-10-31 | 2017-02-22 | 昆山维信诺科技有限公司 | Flexible organic light-emitting display screen and preparation method thereof |
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Application publication date: 20110914 |