CN103700672A - Flexible assembly substrate and manufacturing method thereof - Google Patents
Flexible assembly substrate and manufacturing method thereof Download PDFInfo
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- CN103700672A CN103700672A CN201310718361.5A CN201310718361A CN103700672A CN 103700672 A CN103700672 A CN 103700672A CN 201310718361 A CN201310718361 A CN 201310718361A CN 103700672 A CN103700672 A CN 103700672A
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Abstract
The invention discloses a flexible assembly substrate, which comprises a flexible substrate, an assembly layer and a water-blocking block, wherein the flexible substrate is provided with an upper surface and a lower surface which are opposite to each other; the assembly layer is formed on the upper surface of the flexible substrate; the water blocking block is arranged on the lower surface of the flexible substrate.
Description
Technical field
The invention relates to a kind of flexible components substrate with and preparation method thereof, the flexible components substrate that espespecially a kind of water blocking layer is arranged at flexible base plate outer surface with and preparation method thereof.
Background technology
Flexible components substrate, due to the characteristic such as have compact, the deflection of similar paper and be easy to carry, therefore can be applicable to various portable electronic devices, for example: flexible display, Electronic Paper (Electronic Paper) or e-book.
In the method for traditional fabrication flexible components substrate, release layer is first to coat on hard substrate, then on release layer, forms flexible base plate, makes after thin-film transistor is formed on flexible base plate, flexible base plate can be peeled off with release layer, and then makes flexible components substrate.Yet traditional flexible base plate is consisted of plastics, therefore compare glass, there is the poor gas ability that blocks water.In order to prevent that aqueous vapor from entering thin-film transistor from flexible base plate, generally can, before forming thin-film transistor, on flexible base plate, cover watertight composition.By this, between follow-up formed thin-film transistor and flexible base plate, can there is watertight composition.
But, because release layer is consisted of the material with stickiness, and flexible base plate is whole and sticks together with release layer, therefore flexible base plate is also difficult for peeling off from release layer, and by flexible base plate when release layer is peeled off, the thin-film transistor being formed on flexible base plate is also easily subject to the destruction of stress in stripping process.Or release layer may not peeled off from flexible base plate completely, and residue in the outside of flexible base plate.Can cause the bad of flexible components substrate thus.
Summary of the invention
The object of the present invention is to provide a kind of flexible components substrate with and preparation method thereof, to avoid component layer to be subject to the destruction of stress in stripping process.
In order to achieve the above object, the invention provides a kind of flexible components substrate, comprise a flexible base plate, a component layer and block that blocks water.Flexible base plate has a upper surface respect to one another and a lower surface.Component layer is arranged on the upper surface of flexible base plate.The block that blocks water is arranged on the lower surface of flexible base plate.
In order to achieve the above object, the invention provides a kind of method of making flexible components substrate.First, provide a carrier, and carrier comprises a hard substrate and a release layer, wherein release layer is covered on hard substrate.Then, form a patterning water blocking layer on release layer, wherein patterning water blocking layer comprises a plurality of blocks that block water, and wantonly two adjacent blocking water have a gap between block.Then, on patterning water blocking layer and release layer, cover a flexible base plate.Subsequently, on flexible base plate, form a component layer.Then, carry out a cutting processing procedure, the block that will block water is cut open, and the block that will respectively block water peels off from release layer, to form a plurality of flexible components substrates.
The method that the present invention makes flexible components substrate is to form patterning water blocking layer in forming between the step of flexible base plate and the step of formation release layer, make when forming each flexible components substrate, the block that blocks water can be peeled off from release layer easily because having hydrophobic property, and then avoids component layer to be damaged in the process of peeling off from release layer.Moreover flexible base plate can protect patterning water blocking layer and release layer to avoid the chemical solution erosion that the follow-up processing procedure carrying out is used on flexible base plate, and in the processing procedure of high temperature, release layer can avoid losing stickiness.
Accompanying drawing explanation
Fig. 1 to Fig. 9 is the method schematic diagram that first embodiment of the invention is made flexible components substrate;
Figure 10 to Figure 13 is the method schematic diagram that second embodiment of the invention is made flexible components substrate.
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| 16a | | 16b | Gap | ||
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| | Tft layer | 20b | |
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| 22 | The first | 22a | Grid | ||
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| | Semiconductor island | 28 | The second |
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| 36 | Separation material | L | Line of cut |
embodiment
Please refer to Fig. 1 to Fig. 9, Fig. 1 to Fig. 9 is the method schematic diagram that first embodiment of the invention is made flexible components substrate, wherein Fig. 3 for form patterning water blocking layer on look schematic diagram, and the generalized section of Fig. 9 flexible components substrate that is first embodiment of the invention.First, as shown in Figure 1, provide a carrier 10, wherein carrier 10 comprises a hard substrate 12 and a release layer 14, and release layer 14 is to be coated with and to be covered on hard substrate 12.In the present embodiment, hard substrate 12 can comprise glass, quartz or other hard base material, to support flexible base plate and the component layer of made in the process in making flexible components substrate.Release layer 14 be used in the process of making flexible components substrate by the flexible components substrate made of wish engage with hard substrate 12, firmly to make flexible components substrate.The material of release layer 14 can comprise that epoxy resin, polysilicone, acrylate (acrylic ester) or other have the glue material of stickiness, and can see through high temperature, low temperature, ultraviolet ray is irradiated or the method such as laser cutting is peeled off, but is not limited to this.
As shown in Figure 2 and Figure 3, next on release layer 14, form a patterning water blocking layer 16, wherein patterning water blocking layer 16 comprises a plurality of block 16a that block water, and wantonly two adjacent blocking water between block 16a apart from there being a gap 16b, the block 16a that makes to block water does not contact, and patterning water blocking layer 16 exposes part release layer 14.In the present embodiment, the step that forms patterning water blocking layer 16 can comprise carries out screen printing processing, to see through the web plate of patterning, directly ink is coated on release layer 14, and to form patterning water blocking layer 16, but the present invention is not limited to this.In other embodiment, the step that forms patterning water blocking layer can comprise first carries out physical vapour deposition (PVD) processing procedure or chemical vapor deposition process, on release layer, cover a material water-proof material, then see through micro-shadow and etch process patterning material water-proof material, to form patterning water blocking layer.In addition, the patterning water blocking layer 16 of the present embodiment is to have hydrophobic property, and easily from release layer 14, peel off, and can comprise organic material, inorganic material or above-mentioned composite material, wherein organic material can comprise polyacrylonitrile (Polyacrylonitrile, PAN), polyvinyl alcohol (PVA), ethylene-vinyl acetate copolymer (ethylene-vinyl acetate copolymer) or cyclic olefine copolymer (Cyclic Olefin Copolymer, COC), and inorganic material can comprise silica (SiOx), silicon nitride (SiNx) or aluminium oxide (AlxOy).
As shown in Figure 4, after forming patterning water blocking layer 16, on patterning water blocking layer 16 and the release layer 14 exposing, cover a flexible base plate 18.It is worth mentioning that, because flexible base plate 18 still binds mutually with the release layer 14 of part, therefore in successive process, flexible base plate 18 still can firmly be attached on carrier 10, and can from carrier 10, not peel off because of the cause that patterning water blocking layer 16 has a hydrophobic property.In the present embodiment, flexible base plate 18 can comprise polyimides, plastics or other flexible substrate.It should be noted that; due to the comprehensive overlay pattern water blocking layer 16 of flexible base plate 18 and release layer 14; therefore flexible base plate 18 can be protected patterning water blocking layer 16 and release layer 14; avoid the chemical solution erosion that the follow-up processing procedure carrying out is used on flexible base plate 18, and can avoid release layer 14 to lose stickiness because running into high temperature.
Subsequently, on flexible base plate 18, form a component layer 20.In the present embodiment, component layer 20 comprises tft layer 20a.Specifically, the step that forms component layer 20 is described as follows, and following tft layer is to take single thin-film transistor to explain as example, but tft layer of the present invention is not limited to single thin-film transistor, and can comprise plurality of films transistor or other circuit unit.As shown in Figure 5, first on flexible base plate 18, form one first metal pattern layer 22, and the first metal pattern layer 22 comprises a plurality of grid 22a.As shown in Figure 6, then in the first metal pattern layer 22, cover a gate insulator 24.As shown in Figure 7, then on gate insulator 24, form semiconductor patterned layer 26, and on semiconductor pattern layer 26, form one second metal pattern layer 28, wherein semiconductor pattern layer 26 comprises a plurality of semiconductor island 26a, and the second metal pattern layer 28 comprises a plurality of source electrode 28a and a plurality of drain electrode 28b, and each source electrode 28a arranges with the both sides of corresponding each grid of each drain electrode 28b 22a.So far complete the tft layer 20a of the present embodiment, but the invention is not restricted to this.In other embodiment, component layer also can be according to actual demand, and can also include OLED, protective layer or other assembly, but not as limit.
As shown in Figure 8, after forming component layer 20, along line of cut L, carry out a cutting processing procedure, the block 16a that will block water cuts open, and wherein line of cut L is the edge of the corresponding block 16a that respectively blocks water, and the block 16a that makes respectively to block water can be cut into single.Then, carry out a separated processing procedure, the block 16a that will respectively block water is separated with release layer 14, to form the flexible components substrate 30 of a plurality of the present embodiment, as shown in Figure 9.In the present embodiment, the area of block 16a of respectively blocking water is identical with the area of each flexible components substrate 30, and the position of corresponding each flexible components substrate 30 of block 16a that respectively blocks water arranges, and the block 16a that therefore will respectively block water cuts open, is that each flexible components substrate 30 is cut open.And when the block 16a that will respectively block water cuts open, flexible base plate 18 can be cut and remove with the part that release layer 14 binds mutually, the release layer 14 therefore staying only contacts with the block 16a that blocks water, and can not engage by flexible base plate 18.By this, see through the hydrophobic property of the block 16a that blocks water, release layer 14 and hard substrate 12 both can be separated with the block 16a that blocks water easily, the component layer 20 that makes to be arranged on flexible base plate 18 can not be damaged at separated processing procedure.
To further illustrate the structure of the flexible components substrate of the present embodiment below, and please continue to refer to Fig. 9.In the present embodiment, flexible base plate 18 has a upper surface 18a and a lower surface 18b, and upper surface 18a and lower surface 18b are toward each other.Component layer 20 comprises tft layer, and is arranged on the upper surface 18a of flexible base plate 18.The tft layer of the present embodiment can comprise at least one grid 22a, a gate insulator 24, at least one semiconductor island 26a, at least one source electrode 28a and at least one drain electrode 28b.Wherein, grid 22a is arranged on the upper surface 18a of flexible base plate 18; Gate insulator 24 is arranged on grid 22a; Semiconductor island 26a is arranged on gate insulator 24; Source electrode 28a and drain electrode 28b are arranged at semiconductor island 26a above, and the both sides of corresponding grid 22a arrange.And the block 16a that blocks water is arranged on the lower surface 18b of flexible base plate 18.It is worth mentioning that; block water block 16a and the component layer 20 of the present embodiment are arranged at respectively flexible base plate 18 lower surface 18b respect to one another and upper surface 18a; the block 16a that makes to block water not only can provide component layer 20 to avoid the impact of aqueous vapor; also can allow flexible components substrate 30 separated with carrier 10 easily, to protect component layer 20 to avoid, be subject to the destruction of separation stresses.
Flexible components substrate of the present invention and its manufacture method are not limited with above-described embodiment.Below will continue to disclose other embodiments of the invention or change shape, so for the purpose of simplifying the description and highlight each embodiment or change the difference between shape, hereinafter use same numeral mark same components, and no longer counterweight again part repeat.
Please refer to Figure 10 to Figure 13, Figure 10 to Figure 13 is the method schematic diagram that second embodiment of the invention is made flexible components substrate.The place that the manufacture method of the flexible components substrate of the present embodiment is different from the manufacture method of the flexible components substrate of above-mentioned the first embodiment is, the formed component layer 20 of the present embodiment comprises color filter layers 20b.And the method that the present embodiment was made flexible components substrate before the step that forms component layer is identical with above-mentioned the first embodiment, as shown in Figures 1 to 4, therefore at this, do not repeat.In the present embodiment, after forming flexible base plate 18, on flexible base plate 18, be to form a color filter layers 20b.Specifically, the step that forms color filter layers 20b is described as follows, and following color filter layers 20b take single pixel region to explain as example, but the present invention is not limited to this.As shown in figure 10, first on flexible base plate 18, form a black-matrix layer 32, for example: black photoresistance, and black-matrix layer 32 has plurality of openings 32a, exposes part flexible base plate 18.As shown in figure 11, then on the flexible base plate 18 of opening 32a, form respectively a plurality of colored filters 34, wherein each colored filter 34 covers the flexible base plate 18 that each opening 32a exposes.The colored filter 34 of the present embodiment can have different colours, but is not limited to this.As shown in figure 12, then in black-matrix layer 32, form a plurality of separation materials 36.So far complete the color filter layers 20b of the present embodiment, but the invention is not restricted to this.In other embodiment, component layer also can be according to actual demand, and can also comprise transparency conducting layer or other assembly, but not as limit.After forming color filter layers 20b, the manufacture method of the present embodiment is identical with the first embodiment.Namely carry out a cutting processing procedure, along the line of cut L block 16a that will respectively block water, cut open, then carry out separated processing procedure, the block 16a that will respectively block water is separated with release layer 14, to form the flexible components substrate 40 of a plurality of the present embodiment, as shown in figure 13.
In sum, the method that the present invention makes flexible components substrate is to form patterning water blocking layer in forming between the step of flexible base plate and the step of formation release layer, make when forming each flexible components substrate, blocking water block can be separated with on release layer easily because having hydrophobic property, and then avoids component layer to be damaged in the process separated with release layer.Moreover flexible base plate can protect patterning water blocking layer and release layer to avoid the chemical solution erosion that the follow-up processing procedure carrying out is used on flexible base plate, and in the processing procedure of high temperature, release layer can avoid losing stickiness.
The foregoing is only preferred embodiment of the present invention, all equalizations of doing according to the present patent application the scope of the claims change and modify, and all should belong to covering scope of the present invention.
Claims (13)
1. a flexible components substrate, comprising:
One flexible base plate, has a upper surface respect to one another and a lower surface;
One component layer, is arranged on this upper surface of this flexible base plate; And
One block that blocks water, is arranged on this lower surface of this flexible base plate.
2. flexible components substrate as claimed in claim 1, is characterized in that, this component layer comprises a tft layer.
3. flexible components substrate as claimed in claim 2, is characterized in that, this tft layer comprises:
At least one grid, is arranged on this upper surface of this flexible base plate;
One gate insulator, is arranged on this grid;
At least one semiconductor island, is arranged on this gate insulator; And
At least one source electrode and at least one drain electrode, be arranged on this semiconductor island, and both sides that should grid are arranged.
4. flexible components substrate as claimed in claim 1, is characterized in that, this component layer comprises a color filter layers.
5. flexible components substrate as claimed in claim 4, is characterized in that, this color filter layers comprises:
One black-matrix layer, has plurality of openings;
A plurality of colored filters, are arranged at respectively on this flexible base plate of this opening respectively; And
A plurality of separation materials, are arranged in this black-matrix layer.
6. flexible components substrate as claimed in claim 1, is characterized in that, this block that blocks water comprises organic material, inorganic material or above-mentioned composite material.
7. a method of making flexible components substrate, is characterized in that, comprises the following steps:
Provide a carrier, and this carrier comprises a hard substrate and a release layer, wherein this release layer is covered on this hard substrate;
On this release layer, form a patterning water blocking layer, wherein this patterning water blocking layer comprises a plurality of blocks that block water, and wantonly two adjacent these block water and between block, have a gap;
On this patterning water blocking layer and this release layer, cover a flexible base plate;
On this flexible base plate, form a component layer; And
Carry out a cutting processing procedure, these blocks that block water are cut open, and respectively this block that blocks water is separated with this release layer, to form a plurality of flexible components substrates.
8. the method for making flexible components substrate as claimed in claim 7, is characterized in that, the step that forms this patterning water blocking layer comprises carries out a screen printing processing.
9. the method for making flexible components substrate as claimed in claim 7, is characterized in that, the step that forms this patterning water blocking layer comprises carries out a physical vapour deposition (PVD) processing procedure or a chemical vapor deposition process.
10. the method for making flexible components substrate as claimed in claim 7, is characterized in that, the step that forms this component layer comprises:
On this flexible base plate, form one first metal pattern layer;
In this first metal pattern layer, cover a gate insulator; And
On this gate insulator, form semiconductor patterned layer, and form one second metal pattern layer on this semiconductor pattern layer.
The method of 11. making flexible components substrates as claimed in claim 7, is characterized in that, the step that forms this component layer comprises:
On this flexible base plate, form a black-matrix layer, there is plurality of openings;
On this flexible base plate of these openings, form respectively a plurality of colored filters; And
In this black-matrix layer, form a plurality of separation materials.
The method of 12. making flexible components substrates as claimed in claim 7, is characterized in that, respectively the area of this block that blocks water is identical with the area of this flexible components substrate respectively.
The method of 13. making flexible components substrates as claimed in claim 7, is characterized in that, this patterning water blocking layer comprises organic material, inorganic material or above-mentioned composite material.
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| CN201310718361.5A CN103700672A (en) | 2013-12-24 | 2013-12-24 | Flexible assembly substrate and manufacturing method thereof |
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| CN201310718361.5A CN103700672A (en) | 2013-12-24 | 2013-12-24 | Flexible assembly substrate and manufacturing method thereof |
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| CN105374829A (en) * | 2015-12-01 | 2016-03-02 | 上海天马有机发光显示技术有限公司 | Flexible display substrate and preparation method thereof |
| CN106648196A (en) * | 2015-10-29 | 2017-05-10 | 达鸿先进科技股份有限公司 | Flexible touch panel, manufacturing method thereof and touch display panel |
| CN110265575A (en) * | 2019-06-26 | 2019-09-20 | 京东方科技集团股份有限公司 | A kind of display panel and preparation method thereof, display device |
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| CN102184892A (en) * | 2011-03-19 | 2011-09-14 | 福州华映视讯有限公司 | Manufacturing method of soft board used for flexible display |
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