CN100544053C - A kind of method of preparing anisotropic organic field effect tube combined with stamp technology - Google Patents
A kind of method of preparing anisotropic organic field effect tube combined with stamp technology Download PDFInfo
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- CN100544053C CN100544053C CNB2006100120526A CN200610012052A CN100544053C CN 100544053 C CN100544053 C CN 100544053C CN B2006100120526 A CNB2006100120526 A CN B2006100120526A CN 200610012052 A CN200610012052 A CN 200610012052A CN 100544053 C CN100544053 C CN 100544053C
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CNB2006100120526A CN100544053C (en) | 2006-05-31 | 2006-05-31 | A kind of method of preparing anisotropic organic field effect tube combined with stamp technology |
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CNB2006100120526A CN100544053C (en) | 2006-05-31 | 2006-05-31 | A kind of method of preparing anisotropic organic field effect tube combined with stamp technology |
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CN101083302A CN101083302A (en) | 2007-12-05 |
CN100544053C true CN100544053C (en) | 2009-09-23 |
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Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN100585904C (en) * | 2007-12-12 | 2010-01-27 | 中国科学院微电子研究所 | Method for preparing OFET |
CN107451520A (en) * | 2017-04-05 | 2017-12-08 | 王开安 | The preparation method of ultrasonic fingerprint recognizer component electrode pattern |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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US20040029041A1 (en) * | 2002-02-27 | 2004-02-12 | Brewer Science, Inc. | Novel planarization method for multi-layer lithography processing |
JP2004351693A (en) * | 2003-05-28 | 2004-12-16 | Daikin Ind Ltd | Imprint processing die and its manufacturing method |
CN1722366A (en) * | 2004-06-01 | 2006-01-18 | 株式会社半导体能源研究所 | Method for manufacturing semiconductor device |
CN1744343A (en) * | 2004-09-02 | 2006-03-08 | 财团法人工业技术研究院 | Method for making organic film transistor by high-precision printing |
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- 2006-05-31 CN CNB2006100120526A patent/CN100544053C/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040029041A1 (en) * | 2002-02-27 | 2004-02-12 | Brewer Science, Inc. | Novel planarization method for multi-layer lithography processing |
JP2004351693A (en) * | 2003-05-28 | 2004-12-16 | Daikin Ind Ltd | Imprint processing die and its manufacturing method |
CN1722366A (en) * | 2004-06-01 | 2006-01-18 | 株式会社半导体能源研究所 | Method for manufacturing semiconductor device |
CN1744343A (en) * | 2004-09-02 | 2006-03-08 | 财团法人工业技术研究院 | Method for making organic film transistor by high-precision printing |
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CN101083302A (en) | 2007-12-05 |
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Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHA Free format text: FORMER OWNER: INST OF MICROELECTRONICS, C. A. S Effective date: 20130418 Owner name: INST OF MICROELECTRONICS, C. A. S Effective date: 20130418 |
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Free format text: CORRECT: ADDRESS; FROM: 100029 CHAOYANG, BEIJING TO: 201203 PUDONG NEW AREA, SHANGHAI |
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Effective date of registration: 20130418 Address after: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee after: Semiconductor Manufacturing International (Shanghai) Corporation Patentee after: Institute of Microelectronics, Chinese Academy of Sciences Address before: 100029 Beijing city Chaoyang District Beitucheng West Road No. 3 Patentee before: Institute of Microelectronics, Chinese Academy of Sciences |