AU2000225122A1 - Method for forming thin-film conductors through the decomposition of metal-chelates in association with metal particles - Google Patents
Method for forming thin-film conductors through the decomposition of metal-chelates in association with metal particlesInfo
- Publication number
- AU2000225122A1 AU2000225122A1 AU2000225122A AU2512200A AU2000225122A1 AU 2000225122 A1 AU2000225122 A1 AU 2000225122A1 AU 2000225122 A AU2000225122 A AU 2000225122A AU 2512200 A AU2512200 A AU 2512200A AU 2000225122 A1 AU2000225122 A1 AU 2000225122A1
- Authority
- AU
- Australia
- Prior art keywords
- metal
- chelates
- decomposition
- association
- forming thin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000004020 conductor Substances 0.000 title 1
- 238000000354 decomposition reaction Methods 0.000 title 1
- 239000002923 metal particle Substances 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000010409 thin film Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/0041—Digital printing on surfaces other than ordinary paper
- B41M5/0047—Digital printing on surfaces other than ordinary paper by ink-jet printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/0041—Digital printing on surfaces other than ordinary paper
- B41M5/0064—Digital printing on surfaces other than ordinary paper on plastics, horn, rubber, or other organic polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/0041—Digital printing on surfaces other than ordinary paper
- B41M5/007—Digital printing on surfaces other than ordinary paper on glass, ceramic, tiles, concrete, stones, etc.
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/06—Coating on selected surface areas, e.g. using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
- B41M3/006—Patterns of chemical products used for a specific purpose, e.g. pesticides, perfumes, adhesive patterns; use of microencapsulated material; Printing on smoking articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M7/00—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock
- B41M7/009—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock using thermal means, e.g. infrared radiation, heat
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/14—Decomposition by irradiation, e.g. photolysis, particle radiation or by mixed irradiation sources
- C23C18/143—Radiation by light, e.g. photolysis or pyrolysis
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Computer Hardware Design (AREA)
- Thermal Sciences (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Electrodes Of Semiconductors (AREA)
- Chemically Coating (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/US2000/001432 WO2001053007A1 (en) | 2000-01-21 | 2000-01-21 | Method for forming thin-film conductors through the decomposition of metal-chelates in association with metal particles |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2000225122A1 true AU2000225122A1 (en) | 2001-07-31 |
Family
ID=21740983
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2000225122A Abandoned AU2000225122A1 (en) | 2000-01-21 | 2000-01-21 | Method for forming thin-film conductors through the decomposition of metal-chelates in association with metal particles |
AU2001224743A Abandoned AU2001224743A1 (en) | 2000-01-21 | 2001-01-05 | Direct printing of thin-film conductors using metal-chelate inks |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001224743A Abandoned AU2001224743A1 (en) | 2000-01-21 | 2001-01-05 | Direct printing of thin-film conductors using metal-chelate inks |
Country Status (6)
Country | Link |
---|---|
US (1) | US6830778B1 (en) |
EP (2) | EP1441864B1 (en) |
JP (1) | JP5247962B2 (en) |
AU (2) | AU2000225122A1 (en) |
DE (2) | DE60043359D1 (en) |
WO (2) | WO2001053007A1 (en) |
Families Citing this family (56)
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US20030148024A1 (en) * | 2001-10-05 | 2003-08-07 | Kodas Toivo T. | Low viscosity precursor compositons and methods for the depositon of conductive electronic features |
KR100893564B1 (en) * | 2001-10-05 | 2009-04-17 | 캐보트 코포레이션 | Low viscosity precursor compositions and methods for the deposition of conductive electronic features |
US6951666B2 (en) * | 2001-10-05 | 2005-10-04 | Cabot Corporation | Precursor compositions for the deposition of electrically conductive features |
WO2003035279A1 (en) * | 2001-10-19 | 2003-05-01 | Superior Micropowders Llc | Tape compositions for the deposition of electronic features |
JP3920802B2 (en) * | 2003-03-28 | 2007-05-30 | Jsr株式会社 | Wiring, electrode and method for forming them |
WO2004112151A2 (en) * | 2003-06-12 | 2004-12-23 | Patterning Technologies Limited | Transparent conducting structures and methods of production thereof |
JP4932150B2 (en) * | 2003-10-21 | 2012-05-16 | 株式会社半導体エネルギー研究所 | Manufacturing method of semiconductor element |
US20050129843A1 (en) | 2003-12-11 | 2005-06-16 | Xerox Corporation | Nanoparticle deposition process |
KR20060035052A (en) * | 2004-10-20 | 2006-04-26 | 삼성전자주식회사 | Method of an electrode, display devices and method of manufacturing the same |
US7931941B1 (en) | 2004-10-29 | 2011-04-26 | Pchem Associates, Inc. | Synthesis of metallic nanoparticle dispersions capable of sintering at low temperatures |
EP1820005B1 (en) * | 2004-11-24 | 2019-01-09 | Sensirion Holding AG | Method for applying selectively a layer to a structured substrate by the usage of a temperature gradient in the substrate |
US8334464B2 (en) | 2005-01-14 | 2012-12-18 | Cabot Corporation | Optimized multi-layer printing of electronics and displays |
US8167393B2 (en) | 2005-01-14 | 2012-05-01 | Cabot Corporation | Printable electronic features on non-uniform substrate and processes for making same |
US7824466B2 (en) | 2005-01-14 | 2010-11-02 | Cabot Corporation | Production of metal nanoparticles |
US8383014B2 (en) | 2010-06-15 | 2013-02-26 | Cabot Corporation | Metal nanoparticle compositions |
US7749299B2 (en) | 2005-01-14 | 2010-07-06 | Cabot Corporation | Production of metal nanoparticles |
US20070144305A1 (en) * | 2005-12-20 | 2007-06-28 | Jablonski Gregory A | Synthesis of Metallic Nanoparticle Dispersions |
EP2032290A2 (en) * | 2006-06-19 | 2009-03-11 | Cabot Corporation | Security features and processes for forming same |
US20080003364A1 (en) * | 2006-06-28 | 2008-01-03 | Ginley David S | Metal Inks |
DE102006029947B4 (en) * | 2006-06-29 | 2013-01-17 | Basf Se | Method for applying a metallic cover layer to a high-temperature superconductor |
EP2944383A3 (en) * | 2006-11-09 | 2016-02-10 | Alliance for Sustainable Energy, LLC | Precursors for formation of copper selenide, indium selenide, copper indium diselenide, and/or copper indium gallium diselenide films |
US8057850B2 (en) * | 2006-11-09 | 2011-11-15 | Alliance For Sustainable Energy, Llc | Formation of copper-indium-selenide and/or copper-indium-gallium-selenide films from indium selenide and copper selenide precursors |
CA2680201A1 (en) | 2007-03-01 | 2008-09-25 | Pchem Associates, Inc. | Shielding based on metallic nanoparticle compositions and devices and methods thereof |
US8759144B2 (en) * | 2007-11-02 | 2014-06-24 | Alliance For Sustainable Energy, Llc | Fabrication of contacts for silicon solar cells including printing burn through layers |
US20100209594A1 (en) * | 2007-11-02 | 2010-08-19 | Alliance For Sustainable Energy, Llc | Printing aluminum films and patterned contacts using organometallic precursor inks |
US8308993B2 (en) | 2008-01-30 | 2012-11-13 | Basf Se | Conductive inks |
US8383011B2 (en) | 2008-01-30 | 2013-02-26 | Basf Se | Conductive inks with metallo-organic modifiers |
US7736546B2 (en) | 2008-01-30 | 2010-06-15 | Basf Se | Glass frits |
US20100015462A1 (en) * | 2008-02-29 | 2010-01-21 | Gregory Jablonski | Metallic nanoparticle shielding structure and methods thereof |
DE102008032554A1 (en) * | 2008-07-10 | 2010-01-14 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Metal-containing composition, process for the production of electrical contact structures on electronic components and electronic component |
DE102008051469A1 (en) * | 2008-10-13 | 2010-04-15 | Malibu Gmbh & Co. Kg | Method for contacting thin-film solar cells and thin-film solar module |
KR101142416B1 (en) * | 2008-12-31 | 2012-05-07 | 주식회사 잉크테크 | Method for manufacturing metal film |
CN102473778A (en) * | 2009-08-04 | 2012-05-23 | 普瑞凯瑟安质提克斯公司 | Methods for photovoltaic absorbers with controlled stoichiometry |
US8721930B2 (en) * | 2009-08-04 | 2014-05-13 | Precursor Energetics, Inc. | Polymeric precursors for AIGS silver-containing photovoltaics |
WO2011017236A2 (en) * | 2009-08-04 | 2011-02-10 | Precursor Energetics, Inc. | Polymeric precursors for cis and cigs photovoltaics |
EP2462151A2 (en) * | 2009-08-04 | 2012-06-13 | Precursor Energetics, Inc. | Polymeric precursors for caigas aluminum-containing photovoltaics |
EP2499277B1 (en) | 2009-11-09 | 2017-09-27 | Carnegie Mellon University | Metal ink compositions, conductive patterns, methods, and devices |
WO2011084171A1 (en) * | 2009-12-17 | 2011-07-14 | Precursor Energetics, Inc. | Molecular precursors for optoelectronics |
WO2011146115A1 (en) | 2010-05-21 | 2011-11-24 | Heliovolt Corporation | Liquid precursor for deposition of copper selenide and method of preparing the same |
WO2012023973A2 (en) | 2010-08-16 | 2012-02-23 | Heliovolt Corporation | Liquid precursor for deposition of indium selenide and method of preparing the same |
US20120073637A1 (en) | 2010-09-15 | 2012-03-29 | Precursor Energetics, Inc. | Deposition processes and photovoltaic devices with compositional gradients |
US20120132272A1 (en) | 2010-11-19 | 2012-05-31 | Alliance For Sustainable Energy, Llc. | Solution processed metal oxide thin film hole transport layers for high performance organic solar cells |
US8643389B2 (en) | 2011-01-06 | 2014-02-04 | General Electric Company | Corrosion sensor and method for manufacturing a corrosion sensor |
US8359728B2 (en) | 2011-01-06 | 2013-01-29 | General Electric Company | Method for manufacturing a corrosion sensor |
US9297742B2 (en) | 2011-01-06 | 2016-03-29 | General Electric Company | Method for manufacturing a corrosion sensor |
JP2013058562A (en) | 2011-09-07 | 2013-03-28 | Semiconductor Energy Lab Co Ltd | Photoelectric conversion device |
WO2013063320A1 (en) | 2011-10-28 | 2013-05-02 | Liquid X Printed Metals, Inc. | Transparent conductive- and ito-replacement materials and structures |
US20130202901A1 (en) * | 2012-02-03 | 2013-08-08 | Empire Technology Development Llc | Printable electronics substrate |
US20130236656A1 (en) | 2012-02-27 | 2013-09-12 | Liquid X Printed Metals, Inc. | Self-reduced metal complex inks soluble in polar protic solvents and improved curing methods |
US10590295B2 (en) | 2012-02-29 | 2020-03-17 | Singapore Asahi Chemical & Solder Ind. Pte. Ltd | Inks containing metal precursors nanoparticles |
US9105797B2 (en) | 2012-05-31 | 2015-08-11 | Alliance For Sustainable Energy, Llc | Liquid precursor inks for deposition of In—Se, Ga—Se and In—Ga—Se |
CA2925436C (en) | 2013-03-07 | 2021-10-26 | Alliance For Sustainable Energy, Llc | Methods for producing thin film charge selective transport layers |
US9406533B2 (en) | 2013-06-27 | 2016-08-02 | STATS ChipPAC Pte. Ltd. | Methods of forming conductive and insulating layers |
US9508635B2 (en) | 2013-06-27 | 2016-11-29 | STATS ChipPAC Pte. Ltd. | Methods of forming conductive jumper traces |
US10918356B2 (en) | 2016-11-22 | 2021-02-16 | General Electric Company | Ultrasound transducers having electrical traces on acoustic backing structures and methods of making the same |
DE102019219615A1 (en) | 2019-12-13 | 2021-06-17 | Heraeus Deutschland GmbH & Co. KG | Manufacturing process for precious metal electrodes |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4599277A (en) * | 1984-10-09 | 1986-07-08 | International Business Machines Corp. | Control of the sintering of powdered metals |
US5316796A (en) * | 1990-03-09 | 1994-05-31 | Nippon Telegraph And Telephone Corporation | Process for growing a thin metallic film |
US5281635A (en) * | 1991-05-17 | 1994-01-25 | Johnson Matthey Public Limited Company | Precious metal composition |
US5474800A (en) * | 1991-06-20 | 1995-12-12 | Tokyo Gas Company, Ltd. | Method for preparing anode for solid oxide fuel cells |
US5176744A (en) * | 1991-08-09 | 1993-01-05 | Microelectronics Computer & Technology Corp. | Solution for direct copper writing |
EP0598472B1 (en) * | 1992-08-20 | 1997-06-18 | Mitsuboshi Belting Ltd. | Ultra-fine-particles-dispersed glassy material and method for making the same |
JP3195072B2 (en) * | 1992-09-29 | 2001-08-06 | 三井金属鉱業株式会社 | Fibrous conductive filler and method for producing the same |
US5882722A (en) * | 1995-07-12 | 1999-03-16 | Partnerships Limited, Inc. | Electrical conductors formed from mixtures of metal powders and metallo-organic decompositions compounds |
JP3137035B2 (en) * | 1997-05-26 | 2001-02-19 | 昭栄化学工業株式会社 | Nickel powder and method for producing the same |
EP1027723B1 (en) * | 1997-10-14 | 2009-06-17 | Patterning Technologies Limited | Method of forming an electric capacitor |
-
2000
- 2000-01-21 WO PCT/US2000/001432 patent/WO2001053007A1/en active Application Filing
- 2000-01-21 AU AU2000225122A patent/AU2000225122A1/en not_active Abandoned
- 2000-01-21 DE DE60043359T patent/DE60043359D1/en not_active Expired - Lifetime
- 2000-01-21 EP EP00903364A patent/EP1441864B1/en not_active Expired - Lifetime
-
2001
- 2001-01-05 DE DE60125174T patent/DE60125174T2/en not_active Expired - Lifetime
- 2001-01-05 EP EP01900331A patent/EP1295344B1/en not_active Expired - Lifetime
- 2001-01-05 US US10/088,760 patent/US6830778B1/en not_active Expired - Fee Related
- 2001-01-05 JP JP2001553593A patent/JP5247962B2/en not_active Expired - Fee Related
- 2001-01-05 AU AU2001224743A patent/AU2001224743A1/en not_active Abandoned
- 2001-01-05 WO PCT/US2001/000430 patent/WO2001054203A2/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
EP1295344B1 (en) | 2006-12-13 |
EP1295344A2 (en) | 2003-03-26 |
WO2001054203A3 (en) | 2003-01-23 |
EP1441864B1 (en) | 2009-11-18 |
JP2004500711A (en) | 2004-01-08 |
AU2001224743A1 (en) | 2001-07-31 |
DE60043359D1 (en) | 2009-12-31 |
EP1441864A4 (en) | 2004-08-04 |
WO2001053007A1 (en) | 2001-07-26 |
WO2001054203A2 (en) | 2001-07-26 |
DE60125174D1 (en) | 2007-01-25 |
DE60125174T2 (en) | 2007-10-25 |
EP1441864A1 (en) | 2004-08-04 |
US6830778B1 (en) | 2004-12-14 |
JP5247962B2 (en) | 2013-07-24 |
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