AU5410399A - Electronic component and method for the production thereof - Google Patents
Electronic component and method for the production thereofInfo
- Publication number
- AU5410399A AU5410399A AU54103/99A AU5410399A AU5410399A AU 5410399 A AU5410399 A AU 5410399A AU 54103/99 A AU54103/99 A AU 54103/99A AU 5410399 A AU5410399 A AU 5410399A AU 5410399 A AU5410399 A AU 5410399A
- Authority
- AU
- Australia
- Prior art keywords
- production
- electronic component
- electronic
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C2045/1486—Details, accessories and auxiliary operations
- B29C2045/14967—Injecting through an opening of the insert
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Infusion, Injection, And Reservoir Apparatuses (AREA)
- Led Device Packages (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19833039 | 1998-07-22 | ||
DE1998133039 DE19833039A1 (en) | 1998-07-22 | 1998-07-22 | Opto-electronic components encapsulated in transparent plastic to make e.g. displays, are rear-injected individually through holes in substrate to prevent undesirable segment cross-illumination |
PCT/EP1999/004839 WO2000005758A1 (en) | 1998-07-22 | 1999-07-09 | Electronic component and method for the production thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
AU5410399A true AU5410399A (en) | 2000-02-14 |
Family
ID=7874966
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU54103/99A Abandoned AU5410399A (en) | 1998-07-22 | 1999-07-09 | Electronic component and method for the production thereof |
Country Status (4)
Country | Link |
---|---|
AU (1) | AU5410399A (en) |
DE (1) | DE19833039A1 (en) |
TW (1) | TW417260B (en) |
WO (1) | WO2000005758A1 (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10012880A1 (en) * | 2000-03-16 | 2001-09-27 | Infineon Technologies Ag | Process for encapsulating semiconductor chips comprises applying an adhering film on the lower side of the system carrier before injecting a pressed composition |
US6743069B2 (en) * | 2001-07-12 | 2004-06-01 | Intel Corporation | Facilitating the spread of encapsulant between surfaces of electronic devices |
EP1795323A1 (en) * | 2005-12-09 | 2007-06-13 | Siemens Schweiz AG | Method for producing a signal plate and traffic signal with such a signal plate |
KR101349605B1 (en) | 2007-09-27 | 2014-01-09 | 삼성전자주식회사 | Method for forming the light emitting device package |
EP3100915B2 (en) | 2015-06-03 | 2022-09-28 | WEIDPLAS GmbH | Component |
US10759332B2 (en) | 2016-01-14 | 2020-09-01 | Weidplas Gmbh | Component comprising a flat decorative element and housing |
WO2018104045A1 (en) * | 2016-12-09 | 2018-06-14 | Weidplas Gmbh | Component comprising a cover layer and method for producing a component of this kind |
CN107399041B (en) * | 2017-06-05 | 2019-04-16 | 湖北久祥电子科技有限公司 | A kind of LED packaging technology of riveted sealing |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2542095A1 (en) * | 1975-09-20 | 1977-03-24 | Licentia Gmbh | SEMI-CONDUCTOR ARRANGEMENT FOR THE NUMERAL DISPLAY |
DE3039796A1 (en) * | 1980-10-22 | 1982-05-06 | Battenfeld Maschinenfabriken Gmbh, 5882 Meinerzhagen | Composite thermoplastic injection mouldings prodn. - by injecting first polymer and enlarging cavity for injecting second polymer on it |
JPS611067A (en) * | 1984-06-13 | 1986-01-07 | Stanley Electric Co Ltd | Molding method of led chip mounted on printed board |
JPS61237485A (en) * | 1985-04-12 | 1986-10-22 | Takiron Co Ltd | Manufacture of light-emission display body |
JPS62160216A (en) * | 1986-01-08 | 1987-07-16 | Mazda Motor Corp | Method and device for in-mold coat |
JPH0343750U (en) * | 1989-09-04 | 1991-04-24 | ||
US5200362A (en) * | 1989-09-06 | 1993-04-06 | Motorola, Inc. | Method of attaching conductive traces to an encapsulated semiconductor die using a removable transfer film |
JP2503782B2 (en) * | 1990-12-21 | 1996-06-05 | 住友化学工業株式会社 | Molding method for multi-layer molded products |
WO1992020205A1 (en) * | 1991-04-26 | 1992-11-12 | Motorola, Inc. | Tapered semiconductor device package |
US5254501A (en) * | 1992-09-11 | 1993-10-19 | Cypress Semiconductor Corporation | Same-side gated process for encapsulating semiconductor devices |
EP0632511A3 (en) * | 1993-06-29 | 1996-11-27 | Mitsubishi Cable Ind Ltd | A light emitting diode aggregate module and a method for manufacturing a light emitting diode aggregate module. |
JPH08227637A (en) * | 1994-02-23 | 1996-09-03 | Matsushita Electric Works Ltd | Control switch and manufactur thereof |
DE19508509A1 (en) * | 1995-03-09 | 1996-09-12 | Juergen Sooth | Mould for successive injections |
-
1998
- 1998-07-22 DE DE1998133039 patent/DE19833039A1/en not_active Withdrawn
-
1999
- 1999-07-09 AU AU54103/99A patent/AU5410399A/en not_active Abandoned
- 1999-07-09 WO PCT/EP1999/004839 patent/WO2000005758A1/en active Application Filing
- 1999-07-21 TW TW88112400A patent/TW417260B/en active
Also Published As
Publication number | Publication date |
---|---|
DE19833039A1 (en) | 2000-01-27 |
WO2000005758A1 (en) | 2000-02-03 |
TW417260B (en) | 2001-01-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |