ZA924881B - Heat radiating component and semiconductor device provided with the same - Google Patents
Heat radiating component and semiconductor device provided with the sameInfo
- Publication number
- ZA924881B ZA924881B ZA924881A ZA924881A ZA924881B ZA 924881 B ZA924881 B ZA 924881B ZA 924881 A ZA924881 A ZA 924881A ZA 924881 A ZA924881 A ZA 924881A ZA 924881 B ZA924881 B ZA 924881B
- Authority
- ZA
- South Africa
- Prior art keywords
- semiconductor device
- same
- device provided
- heat radiating
- radiating component
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01042—Molybdenum [Mo]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3160210A JPH0513843A (en) | 1991-07-01 | 1991-07-01 | Heat dissipating parts and semiconductor laser equipped with said heat dissipating parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ZA924881B true ZA924881B (en) | 1993-03-31 |
Family
ID=15710134
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ZA924881A ZA924881B (en) | 1991-07-01 | 1992-07-01 | Heat radiating component and semiconductor device provided with the same |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPH0513843A (en) |
| ZA (1) | ZA924881B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2842762B2 (en) * | 1993-06-30 | 1999-01-06 | シャープ株式会社 | Infrared data transfer device |
| JPH07202322A (en) * | 1993-12-29 | 1995-08-04 | Nec Corp | Thermistor |
| JP4815065B2 (en) | 2001-05-30 | 2011-11-16 | 株式会社トクヤマ | Heat sink and manufacturing method thereof |
| WO2013175697A1 (en) * | 2012-05-22 | 2013-11-28 | パナソニック株式会社 | Nitride semiconductor light emitting device |
-
1991
- 1991-07-01 JP JP3160210A patent/JPH0513843A/en active Pending
-
1992
- 1992-07-01 ZA ZA924881A patent/ZA924881B/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0513843A (en) | 1993-01-22 |
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