ZA914745B - Stripping method for removing resist from a printed circuit board - Google Patents
Stripping method for removing resist from a printed circuit boardInfo
- Publication number
- ZA914745B ZA914745B ZA914745A ZA914745A ZA914745B ZA 914745 B ZA914745 B ZA 914745B ZA 914745 A ZA914745 A ZA 914745A ZA 914745 A ZA914745 A ZA 914745A ZA 914745 B ZA914745 B ZA 914745B
- Authority
- ZA
- South Africa
- Prior art keywords
- circuit board
- printed circuit
- stripping method
- removing resist
- resist
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
- B24C1/08—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for polishing surfaces, e.g. smoothing a surface by making use of liquid-borne abrasives
- B24C1/086—Descaling; Removing coating films
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
- B24C1/04—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for treating only selected parts of a surface, e.g. for carving stone or glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C11/00—Selection of abrasive materials or additives for abrasive blasts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C3/00—Abrasive blasting machines or devices; Plants
- B24C3/32—Abrasive blasting machines or devices; Plants designed for abrasive blasting of particular work, e.g. the internal surfaces of cylinder blocks
- B24C3/322—Abrasive blasting machines or devices; Plants designed for abrasive blasting of particular work, e.g. the internal surfaces of cylinder blocks for electrical components
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/288—Removal of non-metallic coatings, e.g. for repairing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/541,009 US5145717A (en) | 1990-01-31 | 1990-06-20 | Stripping method for removing resist from a printed circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
ZA914745B true ZA914745B (en) | 1993-02-24 |
Family
ID=24157823
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ZA914745A ZA914745B (en) | 1990-06-20 | 1991-06-20 | Stripping method for removing resist from a printed circuit board |
Country Status (11)
Country | Link |
---|---|
US (1) | US5145717A (fi) |
EP (1) | EP0462550A3 (fi) |
JP (1) | JPH07212006A (fi) |
KR (1) | KR930011603B1 (fi) |
CN (1) | CN1059066A (fi) |
BR (1) | BR9102504A (fi) |
CA (1) | CA2044693A1 (fi) |
FI (1) | FI913015A (fi) |
IE (1) | IE911984A1 (fi) |
IL (1) | IL98380A0 (fi) |
ZA (1) | ZA914745B (fi) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5507978A (en) * | 1995-05-08 | 1996-04-16 | Ocg Microelectronic Materials, Inc. | Novolak containing photoresist stripper composition |
US5561105A (en) * | 1995-05-08 | 1996-10-01 | Ocg Microelectronic Materials, Inc. | Chelating reagent containing photoresist stripper composition |
US5601430A (en) * | 1995-09-15 | 1997-02-11 | Kreativ, Inc. | Process for the removal of soft tooth decay using a unique abrasive fluid stream |
US5865902A (en) * | 1996-05-09 | 1999-02-02 | Church & Dwight Co., Inc. | Method for cleaning electronic hardware components |
US5759973A (en) * | 1996-09-06 | 1998-06-02 | Olin Microelectronic Chemicals, Inc. | Photoresist stripping and cleaning compositions |
US5780406A (en) * | 1996-09-06 | 1998-07-14 | Honda; Kenji | Non-corrosive cleaning composition for removing plasma etching residues |
US5817610A (en) * | 1996-09-06 | 1998-10-06 | Olin Microelectronic Chemicals, Inc. | Non-corrosive cleaning composition for removing plasma etching residues |
US6030932A (en) * | 1996-09-06 | 2000-02-29 | Olin Microelectronic Chemicals | Cleaning composition and method for removing residues |
JPH1128667A (ja) * | 1997-07-10 | 1999-02-02 | Tokyo Ohka Kogyo Co Ltd | サンドブラスト用プラスチック研磨材およびそれを用いたプラズマディスプレイパネル基板のサンドブラスト加工法、並びにサンドブラスト廃材の処理方法 |
EP0936506A3 (en) * | 1998-02-11 | 1999-12-08 | E.I. Du Pont De Nemours And Company | Dry process for the development and stripping of photoresists |
US6413923B2 (en) | 1999-11-15 | 2002-07-02 | Arch Specialty Chemicals, Inc. | Non-corrosive cleaning composition for removing plasma etching residues |
US8192555B2 (en) * | 2002-12-31 | 2012-06-05 | Micron Technology, Inc. | Non-chemical, non-optical edge bead removal process |
US7175876B2 (en) * | 2003-06-27 | 2007-02-13 | 3M Innovative Properties Company | Patterned coating method employing polymeric coatings |
US20070148337A1 (en) * | 2005-12-22 | 2007-06-28 | Nichols Jonathan A | Flame-perforated aperture masks |
CN102612276A (zh) * | 2012-03-13 | 2012-07-25 | 惠州中京电子科技股份有限公司 | 多层 hdi线路板的微孔制作工艺 |
US10604836B2 (en) * | 2015-05-15 | 2020-03-31 | Materion Corporation | Methods for surface preparation of sputtering target |
CN112893326A (zh) * | 2021-01-21 | 2021-06-04 | 芜湖芯通半导体材料有限公司 | 一种半导体刻蚀机台内衬的清洗方法 |
EP4271145A1 (en) * | 2022-04-28 | 2023-11-01 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Manufacturing a component carrier using a protection layer |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3930857A (en) * | 1973-05-03 | 1976-01-06 | International Business Machines Corporation | Resist process |
US4088490A (en) * | 1976-06-14 | 1978-05-09 | International Business Machines Corporation | Single level masking process with two positive photoresist layers |
US4302530A (en) * | 1977-12-08 | 1981-11-24 | University Of Pennsylvania | Method for making substance-sensitive electrical structures by processing substance-sensitive photoresist material |
DE2948380A1 (de) * | 1979-12-01 | 1981-07-09 | Alexandr Vladimirovič Saratov Lizin | Verfahren zur beseitigung von graten |
ES250536Y (es) * | 1980-05-06 | 1981-01-16 | Arnes perfeccionado para tablas deslizadoras a vela | |
US4731125A (en) * | 1984-04-19 | 1988-03-15 | Carr Lawrence S | Media blast paint removal system |
FR2574570A1 (fr) * | 1984-12-07 | 1986-06-13 | Thomson Csf | Procede de photolithographie d'une couche epaisse de pate deposee sur un substrat |
US4631250A (en) * | 1985-03-13 | 1986-12-23 | Research Development Corporation Of Japan | Process for removing covering film and apparatus therefor |
JPS61225092A (ja) * | 1985-03-29 | 1986-10-06 | Toyo Ink Mfg Co Ltd | レジスト形成法 |
US4698294A (en) * | 1986-09-12 | 1987-10-06 | E. I. Du Pont De Nemours And Company | Lamination of photopolymerizable film onto a substrate employing an intermediate nonphotosensitive liquid layer |
US4912020A (en) * | 1986-10-21 | 1990-03-27 | Westinghouse Electric Corp. | Printed circuit boards and method for manufacturing printed circuit boards |
US4759774A (en) * | 1986-10-23 | 1988-07-26 | E. I. Du Pont De Nemours And Company | Process for cleaning substrates |
JP2636247B2 (ja) * | 1987-07-14 | 1997-07-30 | 正博 山元 | 焼酎蒸留廃液からの発酵生成物の製造方法 |
JPH0234984A (ja) * | 1988-04-13 | 1990-02-05 | Mitsubishi Electric Corp | プリント回路基板の製造方法 |
JPH02106091A (ja) * | 1988-10-15 | 1990-04-18 | Hitake Seiko Kk | 両面パターンの形成方法 |
-
1990
- 1990-06-20 US US07/541,009 patent/US5145717A/en not_active Expired - Fee Related
-
1991
- 1991-06-05 IL IL98380A patent/IL98380A0/xx unknown
- 1991-06-12 IE IE198491A patent/IE911984A1/en unknown
- 1991-06-14 CA CA002044693A patent/CA2044693A1/en not_active Abandoned
- 1991-06-18 EP EP19910109924 patent/EP0462550A3/en not_active Withdrawn
- 1991-06-18 BR BR919102504A patent/BR9102504A/pt unknown
- 1991-06-19 KR KR1019910010178A patent/KR930011603B1/ko not_active IP Right Cessation
- 1991-06-19 JP JP3147047A patent/JPH07212006A/ja active Pending
- 1991-06-19 FI FI913015A patent/FI913015A/fi unknown
- 1991-06-20 ZA ZA914745A patent/ZA914745B/xx unknown
- 1991-06-20 CN CN91104637A patent/CN1059066A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
JPH07212006A (ja) | 1995-08-11 |
KR930011603B1 (ko) | 1993-12-13 |
EP0462550A3 (en) | 1992-07-01 |
KR920002000A (ko) | 1992-01-30 |
IL98380A0 (en) | 1992-07-15 |
IE911984A1 (en) | 1992-01-01 |
CN1059066A (zh) | 1992-02-26 |
EP0462550A2 (en) | 1991-12-27 |
FI913015A (fi) | 1991-12-21 |
US5145717A (en) | 1992-09-08 |
FI913015A0 (fi) | 1991-06-19 |
CA2044693A1 (en) | 1991-12-21 |
BR9102504A (pt) | 1992-01-21 |
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