ZA882547B - Heat-dissipating socket connector for leaded modules - Google Patents
Heat-dissipating socket connector for leaded modulesInfo
- Publication number
- ZA882547B ZA882547B ZA882547A ZA882547A ZA882547B ZA 882547 B ZA882547 B ZA 882547B ZA 882547 A ZA882547 A ZA 882547A ZA 882547 A ZA882547 A ZA 882547A ZA 882547 B ZA882547 B ZA 882547B
- Authority
- ZA
- South Africa
- Prior art keywords
- heat
- socket connector
- leaded
- modules
- dissipating socket
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1015—Plug-in assemblages of components, e.g. IC sockets having exterior leads
- H05K7/103—Plug-in assemblages of components, e.g. IC sockets having exterior leads co-operating by sliding, e.g. DIP carriers
- H05K7/1046—J-shaped leads
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S439/00—Electrical connectors
- Y10S439/923—Separation or disconnection aid
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Connecting Device With Holders (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Connector Housings Or Holding Contact Members (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/058,068 US4755146A (en) | 1987-06-04 | 1987-06-04 | Heat-dissipating socket connector for leaded modules |
Publications (1)
Publication Number | Publication Date |
---|---|
ZA882547B true ZA882547B (en) | 1988-11-30 |
Family
ID=22014464
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ZA882547A ZA882547B (en) | 1987-06-04 | 1988-04-12 | Heat-dissipating socket connector for leaded modules |
Country Status (6)
Country | Link |
---|---|
US (1) | US4755146A (xx) |
EP (1) | EP0294111B1 (xx) |
JP (1) | JPH0665101B2 (xx) |
BR (1) | BR8802630A (xx) |
DE (1) | DE3868539D1 (xx) |
ZA (1) | ZA882547B (xx) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4949221A (en) * | 1989-02-03 | 1990-08-14 | Motorola, Inc. | Encased electronic component |
US4961125A (en) * | 1989-08-18 | 1990-10-02 | Thermalloy Incorporated | Apparatus and method of attaching an electronic device package and a heat sink to a circuit board |
US5007844A (en) * | 1990-01-17 | 1991-04-16 | Hewlett-Packard Company | Surface mount method and device |
US5243757A (en) * | 1991-07-16 | 1993-09-14 | Amp Incorporated | Method of making contact surface for contact element |
EP0678232B1 (en) * | 1991-09-30 | 1997-10-29 | Ceridian Corporation | Plated compliant lead |
US5283716A (en) * | 1992-10-16 | 1994-02-01 | Rosemount Inc. | Electrical component support structure |
US5514917A (en) * | 1992-12-24 | 1996-05-07 | The Whitaker Corporation | Heat dissipating housing for current |
GB9320867D0 (en) * | 1993-10-11 | 1993-12-01 | Simpson Gareth | Adapter |
DK0938836T3 (da) * | 1996-11-06 | 2001-04-17 | Tellabs Denmark As | Kortmagasin til printkort |
DE29622501U1 (de) * | 1996-12-20 | 1997-02-20 | Wickmann Werke Gmbh | Geräte-Sicherungshalter |
DE20013435U1 (de) * | 2000-08-04 | 2001-12-13 | Weidmueller Interface | Anschlußklemme für Leiterplatten |
US6711021B1 (en) * | 2003-01-15 | 2004-03-23 | Hewlett-Packard Development Company, L.P. | Systems and methods that use at least one component to remove the heat generated by at least one other component |
JP2004304604A (ja) * | 2003-03-31 | 2004-10-28 | Mitsumi Electric Co Ltd | 小型カメラモジュールのソケットへの取付け構造 |
ATE488953T1 (de) * | 2004-07-12 | 2010-12-15 | Research In Motion Ltd | Struktur zur montage einer kameraeinheit auf eine leiterplatte |
US7918671B2 (en) | 2004-07-13 | 2011-04-05 | Research In Motion Limited | Mounting structure with springs biasing towards a latching edge |
US7423400B2 (en) * | 2006-06-21 | 2008-09-09 | Flextronics Automotive Inc. | System and method for controlling velocity and detecting obstructions of a vehicle lift gate |
US7586280B2 (en) * | 2006-06-21 | 2009-09-08 | Flextronics Automotive Inc. | System and method for establishing a reference angle for controlling a vehicle rotational closure system |
US7592762B2 (en) * | 2006-06-21 | 2009-09-22 | Flextronics Automotive Inc. | System and method for establishing a reference angle for controlling a vehicle rotational closure system |
JP4910538B2 (ja) * | 2006-07-25 | 2012-04-04 | ミツミ電機株式会社 | モジュール用コネクタ |
DE102007005436B4 (de) * | 2007-01-30 | 2014-08-07 | Platinum Gmbh | Trägermodul für einen Wechselrichter |
US9716327B2 (en) * | 2012-09-28 | 2017-07-25 | Intel Corporation | System, circuit module, and circuit module connector |
JP7163812B2 (ja) * | 2019-02-15 | 2022-11-01 | 住友電装株式会社 | コネクタ |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3697815A (en) * | 1971-08-23 | 1972-10-10 | Aerotronic Associates Inc | Cooling hood for supporting printed circuit boards during burn-in |
US3846734A (en) * | 1973-02-06 | 1974-11-05 | Amp Inc | Frames for adapting a multi-contact electrical connector to electrically connect with various styles of substrates |
US4222622A (en) * | 1978-06-12 | 1980-09-16 | Gte Products Corporation | Electrical connector for circuit board |
JPS5899788U (ja) * | 1981-12-28 | 1983-07-07 | 富士通株式会社 | Icソケツト |
WO1983002689A1 (en) * | 1982-01-27 | 1983-08-04 | Burroughs Corp | Integrated circuit package connector |
WO1984001859A1 (en) * | 1982-11-05 | 1984-05-10 | Western Electric Co | Module mounting assembly |
US4558397A (en) * | 1983-12-19 | 1985-12-10 | Amp Incorporated | Interposer connector for surface mounting a ceramic chip carrier to a printed circuit board |
DE3587933T2 (de) * | 1984-02-27 | 1995-05-11 | Whitaker Corp | Verfahren, um einen Schaltungsträgerkontakt in ein Gehäuse einzusetzen. |
JPS625580U (xx) * | 1985-06-27 | 1987-01-13 |
-
1987
- 1987-06-04 US US07/058,068 patent/US4755146A/en not_active Expired - Fee Related
-
1988
- 1988-04-12 ZA ZA882547A patent/ZA882547B/xx unknown
- 1988-05-06 JP JP63110339A patent/JPH0665101B2/ja not_active Expired - Lifetime
- 1988-05-27 EP EP88304806A patent/EP0294111B1/en not_active Expired - Lifetime
- 1988-05-27 DE DE8888304806T patent/DE3868539D1/de not_active Expired - Lifetime
- 1988-05-31 BR BR8802630A patent/BR8802630A/pt unknown
Also Published As
Publication number | Publication date |
---|---|
EP0294111A2 (en) | 1988-12-07 |
DE3868539D1 (de) | 1992-04-02 |
US4755146A (en) | 1988-07-05 |
JPH0665101B2 (ja) | 1994-08-22 |
EP0294111B1 (en) | 1992-02-26 |
BR8802630A (pt) | 1988-12-27 |
EP0294111A3 (en) | 1989-02-08 |
JPS63310583A (ja) | 1988-12-19 |
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