ZA882547B - Heat-dissipating socket connector for leaded modules - Google Patents

Heat-dissipating socket connector for leaded modules

Info

Publication number
ZA882547B
ZA882547B ZA882547A ZA882547A ZA882547B ZA 882547 B ZA882547 B ZA 882547B ZA 882547 A ZA882547 A ZA 882547A ZA 882547 A ZA882547 A ZA 882547A ZA 882547 B ZA882547 B ZA 882547B
Authority
ZA
South Africa
Prior art keywords
heat
socket connector
leaded
modules
dissipating socket
Prior art date
Application number
ZA882547A
Other languages
English (en)
Inventor
Paul L Rishworth
L Rishworth Paul
Alan S Walse
S Walse Alan
Original Assignee
Molex Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Molex Inc filed Critical Molex Inc
Publication of ZA882547B publication Critical patent/ZA882547B/xx

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/02Arrangements of circuit components or wiring on supporting structure
    • H05K7/10Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1015Plug-in assemblages of components, e.g. IC sockets having exterior leads
    • H05K7/103Plug-in assemblages of components, e.g. IC sockets having exterior leads co-operating by sliding, e.g. DIP carriers
    • H05K7/1046J-shaped leads
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S439/00Electrical connectors
    • Y10S439/923Separation or disconnection aid

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Connecting Device With Holders (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
ZA882547A 1987-06-04 1988-04-12 Heat-dissipating socket connector for leaded modules ZA882547B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/058,068 US4755146A (en) 1987-06-04 1987-06-04 Heat-dissipating socket connector for leaded modules

Publications (1)

Publication Number Publication Date
ZA882547B true ZA882547B (en) 1988-11-30

Family

ID=22014464

Family Applications (1)

Application Number Title Priority Date Filing Date
ZA882547A ZA882547B (en) 1987-06-04 1988-04-12 Heat-dissipating socket connector for leaded modules

Country Status (6)

Country Link
US (1) US4755146A (xx)
EP (1) EP0294111B1 (xx)
JP (1) JPH0665101B2 (xx)
BR (1) BR8802630A (xx)
DE (1) DE3868539D1 (xx)
ZA (1) ZA882547B (xx)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4949221A (en) * 1989-02-03 1990-08-14 Motorola, Inc. Encased electronic component
US4961125A (en) * 1989-08-18 1990-10-02 Thermalloy Incorporated Apparatus and method of attaching an electronic device package and a heat sink to a circuit board
US5007844A (en) * 1990-01-17 1991-04-16 Hewlett-Packard Company Surface mount method and device
US5243757A (en) * 1991-07-16 1993-09-14 Amp Incorporated Method of making contact surface for contact element
EP0678232B1 (en) * 1991-09-30 1997-10-29 Ceridian Corporation Plated compliant lead
US5283716A (en) * 1992-10-16 1994-02-01 Rosemount Inc. Electrical component support structure
US5514917A (en) * 1992-12-24 1996-05-07 The Whitaker Corporation Heat dissipating housing for current
GB9320867D0 (en) * 1993-10-11 1993-12-01 Simpson Gareth Adapter
DK0938836T3 (da) * 1996-11-06 2001-04-17 Tellabs Denmark As Kortmagasin til printkort
DE29622501U1 (de) * 1996-12-20 1997-02-20 Wickmann Werke Gmbh Geräte-Sicherungshalter
DE20013435U1 (de) * 2000-08-04 2001-12-13 Weidmueller Interface Anschlußklemme für Leiterplatten
US6711021B1 (en) * 2003-01-15 2004-03-23 Hewlett-Packard Development Company, L.P. Systems and methods that use at least one component to remove the heat generated by at least one other component
JP2004304604A (ja) * 2003-03-31 2004-10-28 Mitsumi Electric Co Ltd 小型カメラモジュールのソケットへの取付け構造
ATE488953T1 (de) * 2004-07-12 2010-12-15 Research In Motion Ltd Struktur zur montage einer kameraeinheit auf eine leiterplatte
US7918671B2 (en) 2004-07-13 2011-04-05 Research In Motion Limited Mounting structure with springs biasing towards a latching edge
US7423400B2 (en) * 2006-06-21 2008-09-09 Flextronics Automotive Inc. System and method for controlling velocity and detecting obstructions of a vehicle lift gate
US7586280B2 (en) * 2006-06-21 2009-09-08 Flextronics Automotive Inc. System and method for establishing a reference angle for controlling a vehicle rotational closure system
US7592762B2 (en) * 2006-06-21 2009-09-22 Flextronics Automotive Inc. System and method for establishing a reference angle for controlling a vehicle rotational closure system
JP4910538B2 (ja) * 2006-07-25 2012-04-04 ミツミ電機株式会社 モジュール用コネクタ
DE102007005436B4 (de) * 2007-01-30 2014-08-07 Platinum Gmbh Trägermodul für einen Wechselrichter
US9716327B2 (en) * 2012-09-28 2017-07-25 Intel Corporation System, circuit module, and circuit module connector
JP7163812B2 (ja) * 2019-02-15 2022-11-01 住友電装株式会社 コネクタ

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3697815A (en) * 1971-08-23 1972-10-10 Aerotronic Associates Inc Cooling hood for supporting printed circuit boards during burn-in
US3846734A (en) * 1973-02-06 1974-11-05 Amp Inc Frames for adapting a multi-contact electrical connector to electrically connect with various styles of substrates
US4222622A (en) * 1978-06-12 1980-09-16 Gte Products Corporation Electrical connector for circuit board
JPS5899788U (ja) * 1981-12-28 1983-07-07 富士通株式会社 Icソケツト
WO1983002689A1 (en) * 1982-01-27 1983-08-04 Burroughs Corp Integrated circuit package connector
WO1984001859A1 (en) * 1982-11-05 1984-05-10 Western Electric Co Module mounting assembly
US4558397A (en) * 1983-12-19 1985-12-10 Amp Incorporated Interposer connector for surface mounting a ceramic chip carrier to a printed circuit board
DE3587933T2 (de) * 1984-02-27 1995-05-11 Whitaker Corp Verfahren, um einen Schaltungsträgerkontakt in ein Gehäuse einzusetzen.
JPS625580U (xx) * 1985-06-27 1987-01-13

Also Published As

Publication number Publication date
EP0294111A2 (en) 1988-12-07
DE3868539D1 (de) 1992-04-02
US4755146A (en) 1988-07-05
JPH0665101B2 (ja) 1994-08-22
EP0294111B1 (en) 1992-02-26
BR8802630A (pt) 1988-12-27
EP0294111A3 (en) 1989-02-08
JPS63310583A (ja) 1988-12-19

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