ZA846889B - Process for depositing metallic copper - Google Patents
Process for depositing metallic copperInfo
- Publication number
- ZA846889B ZA846889B ZA846889A ZA846889A ZA846889B ZA 846889 B ZA846889 B ZA 846889B ZA 846889 A ZA846889 A ZA 846889A ZA 846889 A ZA846889 A ZA 846889A ZA 846889 B ZA846889 B ZA 846889B
- Authority
- ZA
- South Africa
- Prior art keywords
- metallic copper
- depositing metallic
- depositing
- copper
- metallic
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
- C23C16/18—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material from metallo-organic compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
- H05K3/146—By vapour deposition
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US53302183A | 1983-09-16 | 1983-09-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
ZA846889B true ZA846889B (en) | 1985-04-24 |
Family
ID=24124131
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ZA846889A ZA846889B (en) | 1983-09-16 | 1984-09-03 | Process for depositing metallic copper |
Country Status (8)
Country | Link |
---|---|
EP (1) | EP0135179B1 (pt) |
JP (1) | JPS6066896A (pt) |
AU (1) | AU569753B2 (pt) |
BR (1) | BR8404612A (pt) |
CA (1) | CA1225363A (pt) |
DE (1) | DE3473166D1 (pt) |
IE (1) | IE55640B1 (pt) |
ZA (1) | ZA846889B (pt) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4748045A (en) * | 1986-04-09 | 1988-05-31 | Massachusetts Institute Of Technology | Method and apparatus for photodeposition of films on surfaces |
JPH0627327B2 (ja) * | 1987-06-30 | 1994-04-13 | インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン | Ib族金属の付着方法 |
FR2623820A1 (fr) * | 1987-11-30 | 1989-06-02 | Gen Electric | Depot en phase gazeuse par procede chimique a laser avec utilisation d'un faisceau a fibre optique |
JP2811004B2 (ja) * | 1988-05-23 | 1998-10-15 | 日本電信電話株式会社 | 金属薄膜成長方法および装置 |
US5316796A (en) * | 1990-03-09 | 1994-05-31 | Nippon Telegraph And Telephone Corporation | Process for growing a thin metallic film |
JPH04232271A (ja) * | 1990-07-27 | 1992-08-20 | Kali Chem Ag | 銅を含有する層の基板上への析出方法 |
DE4122449A1 (de) * | 1990-07-27 | 1992-01-30 | Kali Chemie Ag | Verfahren zur abscheidung einer kupfer enthaltenden schicht i |
JP2002057126A (ja) * | 2000-08-10 | 2002-02-22 | Fujitsu Ltd | 半導体装置とその製造方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3356527A (en) * | 1964-04-23 | 1967-12-05 | Ross W Moshier | Vapor-plating metals from fluorocarbon keto metal compounds |
IT1015238B (it) * | 1973-06-22 | 1977-05-10 | Gen Electric | Materiali magnetici stabili all a ria e loro metodo di fabbricazione |
US4226897A (en) * | 1977-12-05 | 1980-10-07 | Plasma Physics Corporation | Method of forming semiconducting materials and barriers |
CA1105093A (en) * | 1977-12-21 | 1981-07-14 | Roland F. Drew | Laser deposition of metal upon transparent materials |
JPS6021224B2 (ja) * | 1980-10-08 | 1985-05-25 | 日本電気株式会社 | レーザー薄膜形成装置 |
-
1984
- 1984-06-08 JP JP59116747A patent/JPS6066896A/ja active Pending
- 1984-08-10 CA CA000460823A patent/CA1225363A/en not_active Expired
- 1984-08-29 DE DE8484110261T patent/DE3473166D1/de not_active Expired
- 1984-08-29 EP EP84110261A patent/EP0135179B1/en not_active Expired
- 1984-08-30 IE IE2218/84A patent/IE55640B1/en not_active IP Right Cessation
- 1984-09-03 ZA ZA846889A patent/ZA846889B/xx unknown
- 1984-09-03 AU AU32667/84A patent/AU569753B2/en not_active Ceased
- 1984-09-14 BR BR8404612A patent/BR8404612A/pt unknown
Also Published As
Publication number | Publication date |
---|---|
AU569753B2 (en) | 1988-02-18 |
IE55640B1 (en) | 1990-12-05 |
AU3266784A (en) | 1985-03-21 |
CA1225363A (en) | 1987-08-11 |
BR8404612A (pt) | 1985-08-06 |
IE842218L (en) | 1985-03-16 |
EP0135179B1 (en) | 1988-08-03 |
JPS6066896A (ja) | 1985-04-17 |
EP0135179A1 (en) | 1985-03-27 |
DE3473166D1 (en) | 1988-09-08 |
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