ZA77893B - Additive for improved electroplating process - Google Patents

Additive for improved electroplating process

Info

Publication number
ZA77893B
ZA77893B ZA770893A ZA77893A ZA77893B ZA 77893 B ZA77893 B ZA 77893B ZA 770893 A ZA770893 A ZA 770893A ZA 77893 A ZA77893 A ZA 77893A ZA 77893 B ZA77893 B ZA 77893B
Authority
ZA
South Africa
Prior art keywords
additive
electroplating process
improved electroplating
improved
electroplating
Prior art date
Application number
ZA770893A
Other languages
English (en)
Inventor
E Harbulak
Original Assignee
M & T Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by M & T Chemicals Inc filed Critical M & T Chemicals Inc
Publication of ZA77893B publication Critical patent/ZA77893B/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C25D3/14—Electroplating: Baths therefor from solutions of nickel or cobalt from baths containing acetylenic or heterocyclic compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Electroplating Methods And Accessories (AREA)
ZA770893A 1976-06-17 1977-02-15 Additive for improved electroplating process ZA77893B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/697,033 US4046647A (en) 1976-06-17 1976-06-17 Additive for improved electroplating process

Publications (1)

Publication Number Publication Date
ZA77893B true ZA77893B (en) 1977-12-28

Family

ID=24799513

Family Applications (1)

Application Number Title Priority Date Filing Date
ZA770893A ZA77893B (en) 1976-06-17 1977-02-15 Additive for improved electroplating process

Country Status (20)

Country Link
US (1) US4046647A (es)
JP (1) JPS52153834A (es)
AR (1) AR218244A1 (es)
AU (1) AU508247B2 (es)
BE (1) BE855424A (es)
BR (1) BR7703142A (es)
CA (1) CA1081649A (es)
DE (1) DE2718285A1 (es)
DK (1) DK267977A (es)
ES (1) ES457169A1 (es)
FR (1) FR2355095A1 (es)
GB (1) GB1518780A (es)
IT (1) IT1117000B (es)
MX (1) MX4388E (es)
NL (1) NL7706721A (es)
NO (1) NO147994C (es)
NZ (1) NZ183709A (es)
PL (1) PL198916A1 (es)
SE (1) SE419774B (es)
ZA (1) ZA77893B (es)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4129482A (en) * 1977-06-24 1978-12-12 M&T Chemicals Inc. Electroplating iron group metal alloys
DE3726518A1 (de) * 1987-08-10 1989-03-09 Hille & Mueller Kaltband mit elektrolytisch aufgebrachter nickelbeschichtung hoher diffusionstiefe und verfahren zur herstellung des kaltbandes
US5011581A (en) * 1988-09-28 1991-04-30 Matsushita Electric Industrial Co., Ltd. Process for producing a thin alloy film having high saturation magnetic flux density
DK0780386T3 (da) * 1995-12-20 2003-02-03 Hoffmann La Roche Matrixmetalloproteaseinhibitorer
US20030159941A1 (en) * 2002-02-11 2003-08-28 Applied Materials, Inc. Additives for electroplating solution
US9611561B2 (en) * 2007-09-10 2017-04-04 Enpirion, Inc. Electroplating cell and tool
US8002961B2 (en) * 2007-09-10 2011-08-23 Enpirion, Inc. Electrolyte and method of producing the same
US9234292B2 (en) * 2009-11-18 2016-01-12 Jx Nippon Mining & Metals Corporation Nickel-iron alloy plating solution
CN103088376B (zh) * 2012-12-25 2016-02-10 江苏省宜兴电子器件总厂 一种陶瓷封装外壳镍钴电镀工艺
JP6411042B2 (ja) * 2014-03-19 2018-10-24 日立造船株式会社 水溶液電解用電極の製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL259716A (es) *
US2467580A (en) * 1943-08-21 1949-04-19 Udylite Corp Electrodeposition of nickel
US2654704A (en) * 1950-09-16 1953-10-06 Udylite Corp Electroplating of nickel
US2662853A (en) * 1950-11-07 1953-12-15 Harshaw Chem Corp Electrodeposition of nickel
US2800442A (en) * 1955-10-04 1957-07-23 Udylite Res Corp Electrodeposition of nickel
US3000799A (en) * 1960-02-10 1961-09-19 Harshaw Chem Corp Nickel plating solutions
NL263657A (es) * 1960-04-22
US3220940A (en) * 1962-02-07 1965-11-30 Udylite Res Corp Electrodeposition of nickel
FR1418245A (fr) * 1964-10-08 1965-11-19 Pernix Enthone Nouveaux agents brillanteurs pour bains galvaniques, notamment pour bains de nickelage
US3804726A (en) * 1973-04-23 1974-04-16 M & T Chemicals Inc Electroplating processes and compositions
US3943040A (en) * 1974-09-20 1976-03-09 The Harshaw Chemical Company Microcracked chromium from a bath using an organic sulfur compound

Also Published As

Publication number Publication date
FR2355095B1 (es) 1982-07-02
CA1081649A (en) 1980-07-15
BE855424A (fr) 1977-10-03
IT1117000B (it) 1986-02-10
GB1518780A (en) 1978-07-26
NO147994C (no) 1983-07-20
DK267977A (da) 1977-12-18
SE7703058L (sv) 1977-12-18
MX4388E (es) 1982-04-22
NO772115L (no) 1977-12-20
AU508247B2 (en) 1980-03-13
NL7706721A (nl) 1977-12-20
NO147994B (no) 1983-04-11
ES457169A1 (es) 1978-03-01
US4046647A (en) 1977-09-06
SE419774B (sv) 1981-08-24
NZ183709A (en) 1978-12-18
DE2718285A1 (de) 1977-12-29
PL198916A1 (pl) 1978-02-27
AR218244A1 (es) 1980-05-30
BR7703142A (pt) 1978-11-21
FR2355095A1 (fr) 1978-01-13
JPS52153834A (en) 1977-12-21
AU2348677A (en) 1978-09-28

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