ZA732151B - An improvement in or relating to encapsulated solid state electronic devices having a sealed lead-encapsulant interface - Google Patents

An improvement in or relating to encapsulated solid state electronic devices having a sealed lead-encapsulant interface

Info

Publication number
ZA732151B
ZA732151B ZA732151A ZA732151A ZA732151B ZA 732151 B ZA732151 B ZA 732151B ZA 732151 A ZA732151 A ZA 732151A ZA 732151 A ZA732151 A ZA 732151A ZA 732151 B ZA732151 B ZA 732151B
Authority
ZA
South Africa
Prior art keywords
relating
improvement
electronic devices
solid state
state electronic
Prior art date
Application number
ZA732151A
Other languages
English (en)
Inventor
J Szedon
J Jackson
D Phillips
Original Assignee
Westinghouse Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westinghouse Electric Corp filed Critical Westinghouse Electric Corp
Publication of ZA732151B publication Critical patent/ZA732151B/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/44—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for electrophoretic applications
    • C09D5/4419—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for electrophoretic applications with polymers obtained otherwise than by polymerisation reactions only involving carbon-to-carbon unsaturated bonds
    • C09D5/4461—Polyamides; Polyimides
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
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    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
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    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
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    • H01L23/3142—Sealing arrangements between parts, e.g. adhesion promotors
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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    • H01L23/495—Lead-frames or other flat leads
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Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Molecular Biology (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Details Of Resistors (AREA)
  • Paints Or Removers (AREA)
ZA732151A 1972-04-19 1973-03-28 An improvement in or relating to encapsulated solid state electronic devices having a sealed lead-encapsulant interface ZA732151B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US00245416A US3821099A (en) 1972-04-19 1972-04-19 Process for producing encapsulated solid state electronic devices having a sealed lead- encapsulant interface

Publications (1)

Publication Number Publication Date
ZA732151B true ZA732151B (en) 1974-06-26

Family

ID=22926564

Family Applications (1)

Application Number Title Priority Date Filing Date
ZA732151A ZA732151B (en) 1972-04-19 1973-03-28 An improvement in or relating to encapsulated solid state electronic devices having a sealed lead-encapsulant interface

Country Status (12)

Country Link
US (1) US3821099A (pt)
JP (1) JPS5222371B2 (pt)
BE (1) BE798379A (pt)
BR (1) BR7302853D0 (pt)
CA (1) CA962371A (pt)
ES (1) ES413891A1 (pt)
FR (1) FR2181017B1 (pt)
GB (1) GB1428179A (pt)
HK (1) HK72976A (pt)
IN (1) IN138750B (pt)
IT (1) IT984017B (pt)
ZA (1) ZA732151B (pt)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2535074A1 (de) * 1974-11-29 1976-08-12 Ibm Korrosionsfestes elektrisches bauteil mit integrierten schaltungen
JPH0776440B2 (ja) * 1986-10-29 1995-08-16 三井東圧化学株式会社 金属の被覆方法
US5045151A (en) * 1989-10-17 1991-09-03 Massachusetts Institute Of Technology Micromachined bonding surfaces and method of forming the same
CN102816441B (zh) * 2012-08-16 2014-05-28 西安近代化学研究所 一种用于火炮塑性测压器的测压油脂及其制备方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3486084A (en) * 1968-03-19 1969-12-23 Westinghouse Electric Corp Encapsulated semiconductor device

Also Published As

Publication number Publication date
HK72976A (en) 1976-12-03
JPS5222371B2 (pt) 1977-06-17
ES413891A1 (es) 1976-06-16
CA962371A (en) 1975-02-04
JPS49108977A (pt) 1974-10-16
US3821099A (en) 1974-06-28
FR2181017B1 (pt) 1978-08-04
IN138750B (pt) 1976-03-27
FR2181017A1 (pt) 1973-11-30
BR7302853D0 (pt) 1974-07-11
GB1428179A (en) 1976-03-17
IT984017B (it) 1974-11-20
BE798379A (fr) 1973-10-18

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