ZA712698B - A method of manufacturing semi-conductor devices - Google Patents
A method of manufacturing semi-conductor devicesInfo
- Publication number
- ZA712698B ZA712698B ZA712698A ZA712698A ZA712698B ZA 712698 B ZA712698 B ZA 712698B ZA 712698 A ZA712698 A ZA 712698A ZA 712698 A ZA712698 A ZA 712698A ZA 712698 B ZA712698 B ZA 712698B
- Authority
- ZA
- South Africa
- Prior art keywords
- conductor devices
- manufacturing semi
- semi
- manufacturing
- conductor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/0198—Manufacture or treatment batch processes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P54/00—Cutting or separating of wafers, substrates or parts of devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB2455070 | 1970-05-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ZA712698B true ZA712698B (en) | 1972-01-26 |
Family
ID=10213386
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ZA712698A ZA712698B (en) | 1970-05-21 | 1971-04-26 | A method of manufacturing semi-conductor devices |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US3708870A (https=) |
| JP (1) | JPS5131072B1 (https=) |
| DE (1) | DE2124772C3 (https=) |
| FR (1) | FR2090182B1 (https=) |
| GB (1) | GB1335201A (https=) |
| NL (1) | NL7106948A (https=) |
| ZA (1) | ZA712698B (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3978578A (en) * | 1974-08-29 | 1976-09-07 | Fairchild Camera And Instrument Corporation | Method for packaging semiconductor devices |
| US5026667A (en) * | 1987-12-29 | 1991-06-25 | Analog Devices, Incorporated | Producing integrated circuit chips with reduced stress effects |
| US5306370A (en) * | 1992-11-02 | 1994-04-26 | Xerox Corporation | Method of reducing chipping and contamination of reservoirs and channels in thermal ink printheads during dicing by vacuum impregnation with protective filler material |
| FR2877142B1 (fr) * | 2004-10-21 | 2007-05-11 | Commissariat Energie Atomique | Procede de transfert d'au moins un objet de taille micrometrique ou millimetrique au moyen d'une poignee en polymere. |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3313013A (en) * | 1960-08-15 | 1967-04-11 | Fairchild Camera Instr Co | Method of making solid-state circuitry |
| FR1400084A (fr) * | 1963-07-03 | 1965-05-21 | Ibm | Procédé de revêtement de semiconducteurs |
| DE1514453A1 (de) * | 1965-04-26 | 1969-08-14 | Siemens Ag | Verfahren zum Herstellen von Halbleiterschaltungen |
| US3313661A (en) * | 1965-05-14 | 1967-04-11 | Dickson Electronics Corp | Treating of surfaces of semiconductor elements |
| US3355636A (en) * | 1965-06-29 | 1967-11-28 | Rca Corp | High power, high frequency transistor |
| GB1285708A (en) * | 1968-10-28 | 1972-08-16 | Lucas Industries Ltd | Semi-conductor devices |
| US3633269A (en) * | 1969-06-24 | 1972-01-11 | Telefunken Patent | Method of making contact to semiconductor devices |
-
1971
- 1971-04-23 GB GB2455070A patent/GB1335201A/en not_active Expired
- 1971-04-26 ZA ZA712698A patent/ZA712698B/xx unknown
- 1971-04-29 US US00138661A patent/US3708870A/en not_active Expired - Lifetime
- 1971-05-12 FR FR7118059A patent/FR2090182B1/fr not_active Expired
- 1971-05-19 NL NL7106948A patent/NL7106948A/xx unknown
- 1971-05-19 DE DE2124772A patent/DE2124772C3/de not_active Expired
- 1971-05-20 JP JP46034399A patent/JPS5131072B1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| NL7106948A (https=) | 1971-11-23 |
| FR2090182A1 (https=) | 1972-01-14 |
| US3708870A (en) | 1973-01-09 |
| JPS5131072B1 (https=) | 1976-09-04 |
| GB1335201A (en) | 1973-10-24 |
| FR2090182B1 (https=) | 1974-04-05 |
| DE2124772C3 (de) | 1981-10-22 |
| DE2124772A1 (de) | 1971-12-02 |
| DE2124772B2 (de) | 1975-08-28 |
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